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Mitsubishi Materials Corporation patents


Recent patent applications related to Mitsubishi Materials Corporation. Mitsubishi Materials Corporation is listed as an Agent/Assignee. Note: Mitsubishi Materials Corporation may have other listings under different names/spellings. We're not affiliated with Mitsubishi Materials Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "M" | Mitsubishi Materials Corporation-related inventors


 new patent  Drill bit insert and drill bit

In a drill bit insert of the present invention, an insert body of the drill bit insert includes: a rear end portion forming a columnar shape or a disk-like shape; an intermediate portion having an outer diameter smaller than that of the rear end portion; and an end portion having... Mitsubishi Materials Corporation

 new patent  Method for producing insulated electric wire

A method for producing an insulated electric wire of the present invention is a method for forming an insulating coating film on a surface of an electric wire by performing baking treatment after forming an insulating layer on the surface of the electric wire by an electrodeposition method using an... Mitsubishi Materials Corporation

 new patent  Resistor and manufacturing resistor

The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the... Mitsubishi Materials Corporation

Superconducting wire and superconducting coil

The present invention is a superconducting wire including: a wire formed of a superconducting material; and a superconducting stabilization material disposed in contact with the wire, in which the superconducting stabilization material is formed of a copper material which contains: one or more types of additive elements selected from Ca,... Mitsubishi Materials Corporation

Tool holder

An object is to provide a tool holder that can efficiently supply a coolant to a flank and a cutting edge by preventing the leakage of a coolant and can accurately and stably supply a coolant so as to correspond to the shapes of various cutting edges or the types... Mitsubishi Materials Corporation

Threading tool and threading

A threading tool includes: a tool main body; and a cutting edge portion, which is provided on a tip portion of the tool main body and has a rake face and a flank face. The cutting edge portion includes: a primary cutting edge extending in a tooth width direction of... Mitsubishi Materials Corporation

Superconducting stabilization material, superconducting wire, and superconducting coil

The present invention is a superconducting stabilization material used for a superconducting wire, which is formed of a copper material which contains: one or more types of additive elements selected from Ca, La, and Ce in a total of 3 ppm by mass to 400 ppm by mass; and a... Mitsubishi Materials Corporation

Cubic boron nitride-based sintered material and cutting tool made of cubic boron nitride-based sintered material

A cubic boron nitride-based sintered material includes cubic boron nitride particles of 70 to 95 vol %, in which in a structure of a cross-section of the sintered material, a binder phase with a width of 1 nm to 30 nm is present between the adjacent cubic boron nitride particles,... Mitsubishi Materials Corporation

Composite sintered body cutting tool and surface coated composite sintered body cutting tool

A composite sintered body cutting tool is made of a composite sintered body comprising a TiCN-based cermet layer; and a WC-based cemented carbide layer. The angle between the rake face and the flank face of the cutting tool is 90°. The rake face including a cutting edge of the cutting... Mitsubishi Materials Corporation

Radius end mill, ball end mill, and end mill

The present invention includes an end mill body which is formed of ceramic, a chip discharge flute which is formed on an outer periphery of the end mill body, a peripheral cutting edge which is formed on an intersection ridge line between a wall surface facing a tool rotation direction... Mitsubishi Materials Corporation

Surface coated cutting tool

A surface-coated cutting tool with a hard coating layer is provided. The hard coating layer includes at least a complex nitride or carbonitride layer (2) expressed by a composition formula: (Ti1-x-yAlxMey)(CzN1-z), Me being an element selected from Si, Zr, B, V, and Cr. The average content ratio Xavg, the average... Mitsubishi Materials Corporation

Porous aluminum body and manufacturing method therefor

A porous aluminum body having high porosity and a manufacturing method therefor are provided, wherein the porous aluminum body can be manufactured by continuous manufacturing steps. In the present invention, this porous aluminum body includes a plurality of aluminum fibers connected to each other. The aluminum fibers each have a... Mitsubishi Materials Corporation

Method for leaching precious metal contained in decopperized anode slime

A method of leaching a precious metal contained in decopperized anode slime includes, agitating and circulating a slurry at the same time, in carrying out hydrochloric acid oxidation leaching of the precious metal contained in the decopperized anode slime by adding a hydrochloric acid and an oxidant to the slurry... Mitsubishi Materials Corporation

Drill bit button insert and drill bit

A drill bit button insert of the present invention that is attached to a button inserts mounted in a drill bit and performs a drilling, includes a tip body and an abrasive layer formed of a diamond sintered body harder than the tip body coated at least at the button... Mitsubishi Materials Corporation

Surface coated cutting tool

The hard coating layer includes at least a complex nitride or carbonitride layer (2) expressed by a composition formula: (Ti1-x-yAlxMey)(CzN1-z), Me being an element selected from Si, Zr, B, V, and Cr. The average content ratio X, the average content ratio Y, and the average content ratio Z satisfy 0.60≦xavg,... Mitsubishi Materials Corporation

Surface-coated cutting tool

In a surface-coated cutting tool in which a hard coating layer having a total layer thickness of 0.5 to 10 μm is deposited on a surface of a tool body made of WC-based cemented carbide or TiCN-based cermet, the hard coating layer has an alternately laminated structure of A layers... Mitsubishi Materials Corporation

Insulated electric wire and manufacturing same

An insulated electric wire and a method of producing the electric wire are provided. The insulated electric wire includes: a copper wire; and an insulating coating formed on a surface of the copper wire by an electrodeposition method. A cross section shape of the insulated electric wire including the insulating... Mitsubishi Materials Corporation

Radius end mill

Disclosed is a radius end mill equipped with end cutting edges formed such that rotational locus thereof around an axial line draw a protruded curved face. That is, the protruded curved face is formed so as to have a protruded curved face where a curvature radius in an inner portion... Mitsubishi Materials Corporation

Infrared light shielding laminate and infrared light shielding material using same

This infrared light shielding laminate includes: an ITO particle-containing layer; and an overcoat layer which covers an upper surface of the ITO particle-containing layer, wherein core shell particles are present in a state of being in contact with each other in the ITO particle-containing layer, and the core shell particle... Mitsubishi Materials Corporation

Power-module substrate with cooler and producing the same

Preventing a deformation when a metal layer made of copper or copper alloy is brazed on an aluminum-made cooler, a power-module substrate with cooler having low thermal resistance and high bonding reliability is provided: a circuit layer made of copper or copper alloy is bonded on one surface of a... Mitsubishi Materials Corporation

Surface-coated cutting tool in which hard coating layer exhibits excellent chipping resistance

A surface-coated cutting tool has a hard coating layer on a tool body. The hard coating layer includes a (Ti1−xAlx)(CyN1−y) layer (the average amount Xavg of Al and the average amount Yavg of C satisfy 0.60≦Xavg≦0.95 and 0≦Yavg≦0.005). Crystal grains having an NaCl type face-centered cubic structure in the layer... Mitsubishi Materials Corporation

Sputtering target and manufacturing same

A sputtering target, which has a component composition including: 30.0-67.0 atomic % of Ga; and the Cu balance containing inevitable impurities, wherein the sputtering target is a sintered material having a structure in which θ phases made of Cu—Ga alloy are dispersed in a matrix of the γ phases made... Mitsubishi Materials Corporation

Surface-coated cutting tool in which hard coating layer exhibits excellent chipping resistance

Provided is a coated tool in which a hard coating layer has excellent hardness and toughness and exhibits chipping resistance and defect resistance during long-term use. The hard coating layer includes at least a layer of a complex nitride or complex carbonitride expressed by the composition formula: (Ti1-x-yAlxMey) (CzN1-x) (here,... Mitsubishi Materials Corporation

Tin-plated copper-alloy terminal material and producing the same

A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based... Mitsubishi Materials Corporation

Casting mold material and cu-cr-zr alloy material

A casting mold material of the present invention includes, as a composition: 0.3 mass % to less than 0.5 mass % of Cr, 0.01 mass % to 0.15 mass % of Zr, and a balance consisting of Cu and inevitable impurities, and the casting mold material has acicular precipitates or... Mitsubishi Materials Corporation

Power module substrate with ag underlayer and power module

A power module substrate with a Ag underlayer of the invention includes: a circuit layer that is formed on one surface of an insulating layer; and a Ag underlayer that is formed on the circuit layer, in which the Ag underlayer is composed of a glass layer that is formed... Mitsubishi Materials Corporation

Surface-coated cutting tool and manufacturing the same

This surface-coated cutting tool includes a cutting tool body made of tungsten carbide-based cemented carbide and a hard coating layer deposited on a surface of the cutting tool body, in which the hard coating layer has at least one (Ti1-xAlx)N layer (0.4≦X≦0.7, X is an atomic ratio) with an average... Mitsubishi Materials Corporation

Additive for high-purity copper electrolytic refining and producing high-purity copper

The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene... Mitsubishi Materials Corporation

Additive for high-purity copper electrolytic refining and producing high-purity copper

The additive for high-purity copper electrolytic refining of the present invention is an additive which is added to a copper electrolyte in electrolytic refining for high-purity copper and is formed of a non-ionic surfactant that includes a hydrophobic group containing an aromatic ring and a hydrophilic group containing a polyoxyalkylene... Mitsubishi Materials Corporation

Drill and drill head

A drill comprising: a drill main body; a chip discharge flute; and a tip cutting edge. The tip cutting edge includes: a first tip cutting edge which extends toward the axially posterior end as it goes toward the outside in a radial direction; and a second tip cutting edge which... Mitsubishi Materials Corporation

Insulated wire with soldered portion and manufacturing same

This insulated wire includes an insulating coating formed on a surface of a conductive wire body, and a soldered portion for electric conduction. The soldered portion is formed by attaching dicarboxylic acid onto a surface of the insulating coating, and by performing solder plating in a state where the dicarboxylic... Mitsubishi Materials Corporation

Surface-coated cutting tool having excellent chipping resistance and wear resistance

In a surface-coated cutting tool, an A layer made of an (Al1-xTix)N layer (0.35≦x≦0.6 by an atom ratio) and a B layer made of a (Al1-y-zTiySiz)N layer (0.35≦y≦0.6 and 0.01≦z≦0.1 by an atom ratio) are layered on a surface of a tool body in which at least a cutting edge... Mitsubishi Materials Corporation

Electrodeposition coated article and producing same

A method for producing an electrodeposition coated article, in which an insulating film is formed by forming an insulating layer on a surface of an article to be coated according to an electrodeposition method by using an electrodeposition coating material, and then by performing a baking treatment, the electrodeposition coating... Mitsubishi Materials Corporation

Bonded body, power module substrate with heat sink, heat sink, manufacturing bonded body, manufacturing power module substrate with heat sink, and manufacturing heat sink

The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a Si concentration is set to be... Mitsubishi Materials Corporation

Bonded body, power module substrate with heat sink, heat sink, manufacturing bonded body, manufacturing power module substrate with heat sink, and manufacturing heat sink

The present invention is a bonded body in which an aluminum member constituted by an aluminum alloy, and a metal member constituted by copper, nickel, or silver are bonded to each other. The aluminum member is constituted by an aluminum alloy in which a solidus temperature is set to be... Mitsubishi Materials Corporation

09/14/17 / #20170263933

Positive electrode for lithium-ion secondary cell, and lithium-ion secondary cell

A cathode for a lithium ion secondary battery of the present invention is provided with a current collector and an active material layer formed on a surface of the current collector. The active material layer has holes in its surface and has an active material density of 68 to 83%... Mitsubishi Materials Corporation

09/07/17 / #20170256777

Positive electrode for lithium-ion secondary cell, and lithium-ion secondary cell

A cathode for lithium ion secondary battery of the present invention includes a cathode including a current collector and active material supported on the current collector. The current collector is made of porous metal. The cathode has holes in its surface, and active material density is 50 to 80% of... Mitsubishi Materials Corporation

08/31/17 / #20170246011

Vertebral body spacer

A vertebral body spacer of the present invention is used by being inserted between a vertebral body and a vertebral body (intervertebral space). The vertebral body spacer has a block body constituted of titanium or a titanium alloy as a main component thereof, and provided with a pair of contact... Mitsubishi Materials Corporation

08/31/17 / #20170247265

Filter medium, producing filter medium, water treatment module, and water treatment device

The filter medium is a filter medium which uses a liquid containing oil and water as a separation target, and has a channel for the liquid. The filter medium includes a base constituting the channel, and one or more of nitrogen-containing fluorine compounds which are provided on at least a... Mitsubishi Materials Corporation

08/24/17 / #20170239729

Porous copper sintered material, porous copper composite part, producing porous copper sintered material, and producing porous copper composite part

A porous copper sintered material (10) includes: a plurality of copper fibers (11) sintered each other, wherein the copper fibers (11) are made of copper or copper alloy, a diameter R of the copper fibers (11) is in a range of 0.02 mm or more and 1.0 mm or less,... Mitsubishi Materials Corporation

08/17/17 / #20170233863

Ag alloy sputtering target, manufacturing ag alloy sputtering target, ag alloy film, and forming ag alloy film

An Ag alloy sputtering target of the present invention includes, as a composition, 0.1 at % to 3.0 at % of Sn, 1.0 at % to 10.0 at % of Cu, and a balance of Ag and inevitable impurities. In addition, an Ag alloy film of the present invention includes,... Mitsubishi Materials Corporation

08/17/17 / #20170234075

Drilling tool

A drilling tool of the present invention includes: a casing pipe; a ring bit having a larger diameter and disposed coaxially on a tip side of the casing pipe; and a pilot bit inserted into the ring bit through the inside of the casing pipe. An outer peripheral part at... Mitsubishi Materials Corporation

08/17/17 / #20170236695

Cu-ga sputtering target and production cu-ga sputtering target

A Cu—Ga sputtering target made of a composition containing: as metal components excluding fluorine, 5 atomic % or more and 60 atomic % or less of Ga and 0.01 atomic % or more and 5 atomic % or less of K; and the Cu balance containing inevitable impurities is provided.... Mitsubishi Materials Corporation

08/10/17 / #20170229320

Producing power-module substrate

To prevent braze stain and improve solder bondability of a semiconductor chip without deteriorating bondability between a metal plate and a ceramic substrate: a producing method of a power-module substrate by braze-bonding a metal plate which is blanked by press working on a metal raw-plate on one surface of a... Mitsubishi Materials Corporation

08/03/17 / #20170216930

Surface-coated cutting tool having excellent chip resistance

A surface-coated cutting tool has a hard coating layer and a tool body, which is coated with a lower layer including a TiCN layer having at least an NaCl type face-centered cubic crystal structure and an upper layer formed of a TiAlCN layer having a single phase crystal structure of... Mitsubishi Materials Corporation

08/03/17 / #20170219287

Fluidized calciner

The present invention provides a fluidized calciner which can perform sufficient calcination by reducing a rate of unburned fuel at an outlet of the fluidized calciner while preventing occlusion in a preheater. In the present invention, plural pulverized coal blowing lines (3), raw material chute (4) of cement raw material,... Mitsubishi Materials Corporation

08/03/17 / #20170222127

Composition for forming mn-doped pzt-based piezoelectric film and mn-doped pzt-based piezoelectric film

A composition for forming a PZT-based piezoelectric film formed of Mn-doped composite metal oxides is provided, the composition including: PZT-based precursors containing metal atoms configuring the composite metal oxides; a diol; and polyvinylpyrrolidone, in which when a metal atom ratio in the composition is shown as Pb:Mn:Zr:Ti, the PZT-based precursors... Mitsubishi Materials Corporation

07/27/17 / #20170210643

Oil-water separation apparatus and drainage system

The oil-water separation apparatus includes an oil-water-separating member configured to separate a liquid mixture containing water and oil into moisture and oil, and a liquid reservoir subdivided into an upper region and a lower region by the oil-water-separating member. The oil-water separation apparatus filters the liquid mixture by gravity. The... Mitsubishi Materials Corporation

07/27/17 / #20170210912

Hydrophilic oil repellent and production same, surface coating material, coating film, resin composition, oil-water separation filter material, and porous body

The hydrophilic oil repellent includes one or more types of nitrogen-containing fluorine-based compounds. The nitrogen-containing fluorine-based compound includes any one hydrophilicity imparting group selected from the group consisting of anion type hydrophilicity imparting groups, cation type hydrophilicity imparting groups, and amphoteric type hydrophilicity imparting groups in the molecule.... Mitsubishi Materials Corporation

07/27/17 / #20170210916

Surface coating material, coating film, and hydrophilic oil repellent member

A surface coating material is provided for forming a hydrophilic oil repellent layer on at least a part of the surface of a substrate, and the surface coating material includes one or more fluorine-based compounds represented by the following formulas (1) to (4), a binder, and a solvent.... Mitsubishi Materials Corporation

07/27/17 / #20170213711

Copper alloy sputtering target and manufacturing copper alloy sputtering target

Ca; casting the molten metal so as to obtain an ingot; and performing stress relieving annealing after performing hot rolling to the ingot.... Mitsubishi Materials Corporation

07/13/17 / #20170197264

Sectional hob

This sectional hob is provided with: a cylindrical hob body; a plate-shaped blade having a saw-toothed cutting edge, the blade being disposed in at least one attachment seat formed in an outer peripheral part of the hob body such that a direction of the cutting edge is parallel to a... Mitsubishi Materials Corporation

07/13/17 / #20170198400

Surface-coated cutting tool having hard coating layer that exhibits excellent chipping resistance

The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (Ti1-xAlx)(CyN1-y). The average Al content ratio xavg the average C content ratio yavg satisfy 0.60≦xavg≦0.95 and 0≦yavg≦0.005, respectively, each of the xavg and yavg is in atomic ratio. The crystal grains... Mitsubishi Materials Corporation

07/06/17 / #20170191154

Ag alloy sputtering target and ag alloy film manufacturing method

A sputtering target, which has a composition comprising: one or more elements selected from Cu, Sn, Sb, Mg, In, and Ti in a range of 0.1 atomic % or more and 15.0 atomic % or less in total; S in a range of 0.5 atomic ppm or more and 200... Mitsubishi Materials Corporation

06/29/17 / #20170182567

Surface-coated cutting tool

In a surface-coated cutting tool, a hard coating layer composed of a lower layer and an upper layer is deposited on a surface of a tool body made of a WC-based cemented carbide or a TiCN-based cermet. The lower layer has at least one Ti compound layer made of a... Mitsubishi Materials Corporation

06/22/17 / #20170178761

Copper alloy for electronic/electric device, copper alloy plastic working material for electronic/electric device, and component and terminal for electronic/electric device

This copper alloy for an electronic/electric device includes Mg at an amount of 3.3 atom % to 6.9 atom % with a remainder substantially being Cu and inevitable impurities, wherein a strength ratio TSTD/TSLD is more than 1.02, and the strength ratio TSTD/TSLD is calculated from a strength TSTD measured... Mitsubishi Materials Corporation

06/22/17 / #20170178876

Cu-ga alloy sputtering target and manufacturing same

A Cu—Ga alloy sputtering target includes, as a component composition, Ga: 0.1 to 40.0 at % and a balance including Cu and inevitable impurities, in which a porosity is 3.0% or lower, an average diameter of circumscribed circles of pores is 150 μm or less, and an average crystal grain... Mitsubishi Materials Corporation

06/15/17 / #20170165758

Surface-coated cutting tool in which hard coating layer exhibits excellent chipping resistance

The hard coating layer includes at least a complex nitride or complex carbonitride layer expressed by the composition formula (Ti1-xAlx)(CyN1-y). The average Al content ratio xavg the average C content ratio yavg satisfy 0.60≦xavg≦0.95 and 0≦yavg≦0.005, respectively, each of the xavg and yavg is in atomic ratio. The crystal grains... Mitsubishi Materials Corporation

06/01/17 / #20170153072

Porous aluminum heat exchanger

A porous aluminum heat exchanger including: a porous aluminum body in which aluminum substrates are sintered each other; and a bulk body, which is an aluminum bulk body made of aluminum or aluminum alloy is provided. Pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum... Mitsubishi Materials Corporation

06/01/17 / #20170154855

Power-module substrate unit and power module

In a power-module substrate unit, a circuit layer is structured by a plurality of small circuit layers; a ceramic substrate layer is structured by at least one plate; the small circuit layers are formed to have a layered structure having a first aluminum layer bonded on one surface of the... Mitsubishi Materials Corporation

05/25/17 / #20170145039

Fluorine-containing silane compound

A novel fluorine-containing silane compound is provided. The fluorine-containing silane compound is capable of providing excellent water repellency and oil repellency, and is useful as a fluorine-containing silane coupling agent with applicability to a wide variety of applications, even if it has a chemical structure, which is free of a... Mitsubishi Materials Corporation

05/18/17 / #20170137931

Film formation device for cutting tool provided with coating film, and film formation cutting tool provided with coating film

A deposition apparatus for cutting tools with a coating film capable of depositing the coating film in an appropriate temperature condition is provided. The deposition apparatus includes: a deposition chamber in which a coating film is formed on the cutting tools; a pre-treatment chamber and post-treatment chamber, each of which... Mitsubishi Materials Corporation

05/18/17 / #20170141010

Method for producing ceramic-aluminum bonded body, producing power module substrate, ceramic-aluminum bonded body, and power module substrate

A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the... Mitsubishi Materials Corporation

05/18/17 / #20170141011

Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing device

A joined body manufacturing method includes: a laminating step for forming a laminated body in which either a copper circuit substrate (first member) or a ceramic substrate (second member) is coated beforehand with a temporary fixing material the main ingredient of which is a saturated fatty acid, the copper circuit... Mitsubishi Materials Corporation

05/11/17 / #20170129815

Composition for forming mn and nb co-doped pzt-based piezoelectric film

A composition used for forming a PZT-based piezoelectric film formed of Mn and Nb co-doped composite metal oxides is provided, in which the composition includes PZT-based precursors so that a metal atom ratio (Pb:Mn:Nb:Zr:Ti) in the composition satisfies (1.00 to 1.25):(0.002 to 0.056):(0.002 to 0.056):(0.40 to 0.60):(0.40 to 0.60), a... Mitsubishi Materials Corporation

Patent Packs
05/11/17 / #20170130309

Copper alloy for electronic equipment, producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment

This copper alloy for electronic devices includes Mg at a content of 3.3 at % or more and 6.9 at % or less, with a remainder substantially being Cu and unavoidable impurities. When a concentration of Mg is given as X at %, an electrical conductivity σ (% IACS) is... Mitsubishi Materials Corporation

05/04/17 / #20170120344

Composite part and cutting tool

A composite part includes: a cutting edge part made of cubic boron nitride sintered material or WC-based cemented carbide; a cutting tool body made of cemented carbide; and a bonding part between the cutting edge part and the cutting tool body. A primarily TiC layer containing 50 area % or... Mitsubishi Materials Corporation

04/27/17 / #20170113285

Surface-coated cutting tool and producing the same

A surface-coated cutting tool of the present invention includes: a cutting tool body; and a hard coating layer provided on a surface of the cutting tool body, in which the hard coating layer includes a complex nitride or carbonitride layer, which is expressed by a composition formula: (Ti1-xAlx)(CyN1-y), the average... Mitsubishi Materials Corporation

04/27/17 / #20170113287

Rotating-cutting-edge-type milling tool and cutting method using same

A virtual plane obtained by a locus when a tangent line, which passes through a tool distal end edge, of a virtual circle formed when a tool distal end edge of a cutting edge is rotated in a tool circumferential direction is moved parallel to a tool axial line is... Mitsubishi Materials Corporation

04/20/17 / #20170106454

Rotary cutting tool including polycrystalline diamond material

A rotary cutting tool including a polycrystalline diamond material of the invention includes: a tool body rotated about an axis with a carbide substrate made of cemented carbide and a flute provided at a tip portion thereof; a PCD layer sintered integrally with the carbide substrate, provided on an inside... Mitsubishi Materials Corporation

04/20/17 / #20170107156

Ce-doped pzt-based piezoelectric film

A Ce-doped PZT-based piezoelectric film is provided which is formed of Ce-doped composite metal oxides represented by a general formula: PbzCexZryTi1-yO3. x, y, and z in the general formula satisfy a relationship of 0.005≦x≦0.05, a relationship of 0.40≦y≦0.55, and a relationship of 0.95≦z≦1.15, respectively. It is preferable that the hysteresis... Mitsubishi Materials Corporation

04/20/17 / #20170110648

Composition for forming ce-doped pzt-based piezoelectric film

A composition for forming a Ce-doped PZT-based piezoelectric film contains: PZT-based precursors containing metal atoms configuring the composite metal oxides; a diol; and polyvinylpyrrolidone. The PZT-based precursors are contained so that a metal atom ratio (Pb:Ce:Zr:Ti) in the composition satisfies (1.00 to 1.28):(0.005 to 0.05):(0.40 to 0.55):(0.60 to 0.45) and... Mitsubishi Materials Corporation

04/13/17 / #20170101346

Cubic boron nitride sintered body cutting tool

A cBN sintered material cutting tool is provided. The cBN cutting tool includes a cutting tool body, which is a sintered material including cBN grains and a binder phase, wherein the sintered material comprises: the cubic boron nitride grains in a range of 40 volume % or more and less... Mitsubishi Materials Corporation

04/13/17 / #20170103824

Conductive paste

A conductive paste includes: a silver-coated resin; and an organic vehicle that includes a thermosetting resin composition, a curing agent, and a solvent, in which the thermosetting resin composition is an epoxy resin composition which is solid at room temperature and has a melt viscosity of 0.5 Pa·s or lower... Mitsubishi Materials Corporation

04/13/17 / #20170103825

High strength and high conductivity copper alloy rod or wire

A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0≦([Co]−0.007)/([P]−0.008)≦6.2 is satisfied between a content [Co]... Mitsubishi Materials Corporation

04/06/17 / #20170095835

Method for forming lanio3 thin film

A method for forming a LaNiO3 thin film is provided, the method including: a step of forming a coating film by coating a substrate surface which is coated with a Pt electrode with a LaNiO3 thin film-forming liquid composition and drying the LaNiO3 thin film-forming liquid composition in a state... Mitsubishi Materials Corporation

03/30/17 / #20170087641

Surface coating cutting tool

A surface-coated cutting tool of the invention is a surface-coated cutting tool in which a surface of a tool body is coated with a lower layer and an upper layer, in which at least one layer of the lower layer is made of a TiCN layer, the upper layer has... Mitsubishi Materials Corporation

03/30/17 / #20170088468

Precious metal clay regeneration solution and regenerating precious metal clay

A precious metal clay regeneration solution contains water and a liquid paraffin, in which an amount of the liquid paraffin is more than or equal to 0.12 parts by mass and less than or equal to 60 parts by mass with respect to 100 parts by mass of the water.... Mitsubishi Materials Corporation

03/30/17 / #20170088963

Additive for high-purity copper electrolytic refining, producing high-purity copper, and high-purity electrolytic copper

The present invention provides an additive for high-purity copper electrolytic refining, a method of producing high-purity copper, and a high-purity electrolytic copper. This additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in copper electrolytic refining. The additive includes a silver and... Mitsubishi Materials Corporation

03/23/17 / #20170081923

Drilling tool

The drilling tool includes a circular-cylindrical casing pipe; an annular ring bit disposed at a leading end of the casing pipe so as to be coaxial with the casing pipe and rotatable around a central axis of the casing pipe; and a pilot bi inserted into the casing pipe and... Mitsubishi Materials Corporation

Patent Packs
03/09/17 / #20170066062

Drill

A drill including: a drill main body that rotates about an axis of the drill main body; a chip discharge groove formed on an outer periphery of a tip portion of the drill main body; and a cutting edge formed on the tip portion of the drill main body, a... Mitsubishi Materials Corporation

03/02/17 / #20170058412

Additive for high-purity copper electrolytic refining and producing high-purity copper

The present invention provides an additive for high-purity copper electrolytic refining and a method of producing high-purity copper using the additive. The additive of the present invention for high-purity copper electrolytic refining can be added to a copper electrolyte in electrolytic refining for producing high-purity copper. The additive includes a... Mitsubishi Materials Corporation

03/02/17 / #20170062305

Bonded body, power module substrate, power module and producing bonded body

There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu... Mitsubishi Materials Corporation

02/23/17 / #20170053852

Power-module substrate unit and power module

A power-module substrate unit having at least one power-module substrate including one ceramic substrate, a circuit layer formed on one surface of the ceramic substrate, and a metal layer formed on another surface of the ceramic substrate, and a heat sink on which the metal layer of the power-module substrate... Mitsubishi Materials Corporation

02/16/17 / #20170043398

Porous aluminum sintered compact and producing porous aluminum sintered compact

A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the... Mitsubishi Materials Corporation

02/16/17 / #20170043401

Porous aluminum complex and producing porous aluminum complex

A high quality porous aluminum body, which has excellent joint strength between the porous aluminum body and the aluminum bulk body, and a method of producing the porous aluminum complex, are provided. The porous aluminum complex includes: a porous aluminum body made of aluminum or aluminum alloy; and an aluminum... Mitsubishi Materials Corporation

02/16/17 / #20170044072

Process for producing bonded body and process for producing power module substrate

Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member... Mitsubishi Materials Corporation

02/16/17 / #20170047268

Power-module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module

A power-module substrate including a circuit layer having a first aluminum layer bonded on one surface of a ceramic substrate and a first copper layer bonded on the first aluminum layer by solid-phase-diffusion bonding, and a metal layer having a second aluminum layer made from a same material as the... Mitsubishi Materials Corporation

02/02/17 / #20170028473

Porous aluminum sintered compact and producing porous aluminum sintered compact

A high-quality porous aluminum sintered compact, which can be produced efficiently at a low cost; has an excellent dimensional accuracy with a low shrinkage ratio during sintering; and has sufficient strength, and a method of producing the porous aluminum sintered compact are provided. The porous aluminum sintered compact is the... Mitsubishi Materials Corporation

02/02/17 / #20170028481

Drill insert and indexable drill

Provided is a drill insert to ensure sufficient chipping resistance with respect to a large cutting load, which is detachably attached to a distal portion of a drill body which is rotated around an axis, in which a polygon face of a polygonal plate-shaped insert body is a rake face,... Mitsubishi Materials Corporation

02/02/17 / #20170029328

Method for controlling nox concentration in exhaust gas in combustion facility using pulverized coal

A method for controlling an NOx concentration in an exhaust gas in a combustion facility by: measuring a reaction velocity ki of each of a plurality of chars, each corresponding to a plurality of types of pulverized coals; determining a relationship between the NOx concentration in the exhaust gas and... Mitsubishi Materials Corporation

02/02/17 / #20170034905

Power module substrate, power module substrate with heat sink, power module, manufacturing power module substrate, and copper member-bonding paste

This power module substrate includes a copper plate that is formed of copper or a copper alloy and is laminated on a surface of a ceramic substrate 11; a nitride layer 31 that is formed on the surface of the ceramic substrate 11 between the copper plate and the ceramic... Mitsubishi Materials Corporation

01/26/17 / #20170023411

Method for measuring temperature of object in atmosphere having dust

A first radiance meter that is provided so as to face an object in an atmosphere in which there is dust and measures the radiance of the object and a second radiance meter that is provided so as not to oppose the object and measures the radiance of the dust... Mitsubishi Materials Corporation

01/19/17 / #20170015561

Liquid composition for forming silica porous film and silica porous film formed from such liquid composition

A liquid composition for forming a silica porous film of the invention is prepared by mixing a hydrolyzate of tetramethoxysilane or tetraethoxysilane as a silicon alkoxide with a silica sol in which fumed silica particles having primary particles having a mean particle diameter of 40 nm or less and secondary... Mitsubishi Materials Corporation

01/12/17 / #20170008093

Surface-coated titanium carbonitride-based cermet cutting tool having excellent chipping resistance

A surface-coated titanium carbonitride-based cermet cutting tool is a surface-coated TiCN-based cermet cutting tool in which a Ti compound layer that is a hard coating layer is deposited as a first layer on the surface of a TiCN-based cermet body containing W and Mo, and a Mo-enriched layer having an... Mitsubishi Materials Corporation

01/12/17 / #20170008663

Packing box, packing method and unpacking method

A packing box including lattice members which are arranged in a stacked state into stages, a stage-partition plate which is arranged between the stages of the lattice members, two or more inner tubular-trunk frames which are provided in a stacking direction of the lattice members to surround one or more... Mitsubishi Materials Corporation

01/12/17 / #20170008772

Synthetic amorphous silica powder and process for manufacturing same

The purpose of the present invention is to provide: a synthetic amorphous silica powder which is suitable as a raw material for a synthetic silica glass product used in a high-temperature and reduced-pressure environment, which can yield a synthetic silica product such that the occurrence or expansion of air bubbles... Mitsubishi Materials Corporation

01/12/17 / #20170009078

Method of producing stannous oxide, stannous oxide, sn plating solution, and removing impurities from sn plating solution

The method of producing stannous oxide includes: a Sn ion-containing acid solution forming step (S01); a first neutralizing step (S02), which is a step of forming Sn precipitates by adding one or more of alkaline solutions of ammonium carbonate, ammonium bicarbonate, and aqueous ammonia to the Sn ion-containing acid solution... Mitsubishi Materials Corporation

01/12/17 / #20170010190

Sampling location displaying apparatus and sampling method

According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed... Mitsubishi Materials Corporation

01/12/17 / #20170011895

Cu-ga alloy sputtering target and producing same

According to the present invention, a Cu—Ga alloy sputtering target which is a sintered body has a composition with 29.5 atom % to 43.0 atom % of Ga and a balance of Cu and inevitable impurities. A Cu—Ga alloy crystal particle in the sintered body has a structure in which... Mitsubishi Materials Corporation

01/05/17 / #20170001912

Mn and nb co-doped pzt-based piezoelectric film

A Mn and Nb co-doped PZT-based piezoelectric film formed of Mn and Nb co-doped composite metal oxides is provided, in which a metal atom ratio (Pb:Mn:Nb:Zr:Ti) in the film satisfies (0.98 to 1.12):(0.002 to 0.056):(0.002 to 0.056):(0.40 to 0.60):(0.40 to 0.60), a rate of Mn is from 0.20 to 0.80... Mitsubishi Materials Corporation








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