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Nantong Fujitsu Microelectronics Co Ltd patents


Recent patent applications related to Nantong Fujitsu Microelectronics Co Ltd. Nantong Fujitsu Microelectronics Co Ltd is listed as an Agent/Assignee. Note: Nantong Fujitsu Microelectronics Co Ltd may have other listings under different names/spellings. We're not affiliated with Nantong Fujitsu Microelectronics Co Ltd, we're just tracking patents.

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Fabricating wafer-level packaging

The present disclosure discloses a fabrication method for wafer-level packaging, comprising: forming a first photoresist on a first chip and a plurality of first openings at the first photoresist to expose a functional surface of the first chip, forming an under-bump metal layer on the functional surface exposed through the... Nantong Fujitsu Microelectronics Co Ltd

Structure and reinforcing a conductor soldering point of semiconductor device

The present invention provides a structure and a method of reinforcing a conductor soldering point of a semiconductor device. The structure includes an inner frame lead, a soldering area arranged on the surface of the inner frame lead, a conductor soldered in the soldering area, and a locking card including... Nantong Fujitsu Microelectronics Co Ltd

System-level packaging structures

A system-level packaging method includes providing a packaging substrate having a first functional surface and a second surface with wiring arrangement within the packaging substrate and between the first functional surface and the second surface. The method also includes forming at least two package layers on the first functional surface... Nantong Fujitsu Microelectronics Co Ltd








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