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Nippon Micrometal Corporation patents


Recent patent applications related to Nippon Micrometal Corporation. Nippon Micrometal Corporation is listed as an Agent/Assignee. Note: Nippon Micrometal Corporation may have other listings under different names/spellings. We're not affiliated with Nippon Micrometal Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Nippon Micrometal Corporation-related inventors


Bonding wire for semiconductor device

The present invention provides a bonding wire capable of simultaneously satisfying ball bonding reliability and wedge bondability required of bonding wires for memories, the bonding wire including a core material containing one or more of ga, in, and sn for a total of 0.1 to 3.0 at % with a balance being made up of ag and incidental impurities; and a coating layer formed over a surface of the core material, containing one or more of pd and pt, or ag and one or more of pd and pt, with a balance being made up of incidental impurities, wherein the coating layer is 0.005 to 0.070 μm in thickness.. . ... Nippon Micrometal Corporation

Lead-free solder bump joining structure

In a lead-free solder bump, diffusion of cu from intermetallic compound layers, which are respectively formed at joining interfaces with cu electrodes is suppressed, so that the in metallic compound layers are not likely to disappear. Correspondingly, with the use of the intermetallic compound layers, cu is not likely to diffuse from the cu electrodes into the lead-free solder bump. ... Nippon Micrometal Corporation

Solder ball and electronic member

Provided are a solder ball having extremely excellent drop impact resistance and an electronic member comprising the solder ball. The solder ball of the present invention contains ni in an amount of from 0.04 to 0.2% by mass and the balance is sn and incidental impurities, and cu is not more than a detection limit of the icp analysis. ... Nippon Micrometal Corporation

Bonding wire for semiconductor device

The present invention provides a bonding wire which can satisfy bonding reliability, spring performance, and chip damage performance required in high-density packaging. A bonding wire contains one or more of in, ga, and cd for a total of 0.05 to 5 at %, and a balance being made up of ag and incidental impurities.. ... Nippon Micrometal Corporation

Nippon Micrometal Corporation

. . ... Nippon Micrometal Corporation








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