Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Nitta Haas Incorporated patents


Recent patent applications related to Nitta Haas Incorporated. Nitta Haas Incorporated is listed as an Agent/Assignee. Note: Nitta Haas Incorporated may have other listings under different names/spellings. We're not affiliated with Nitta Haas Incorporated, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Nitta Haas Incorporated-related inventors


Polishing pad

The present invention is a polishing pad formed by foamed polyurethane, with a content of s phase in the foamed polyurethane, as determined by pulsed nmr measurement at 25° c., exceeding 70%.. . ... Nitta Haas Incorporated

Polishing composition and polishing method

The present invention relates to a polishing composition including water and silica, wherein the silica has a bet specific surface area of 30 m2/g or more and an nmr specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the bet specific surface area falling within the above-described range, and additionally having the nmr specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.. ... Nitta Haas Incorporated

Method for polishing semiconductor substrate

Proposed is a method for polishing a semiconductor substrate including an intermediate polishing step of polishing in such a way that the number of surface defects having heights of less than 3 nm is 45% or more of the total number of the surface defects on the surface of a semiconductor substrate, and a final polishing step of finish-polishing the semiconductor substrate after the intermediate polishing step.. . ... Nitta Haas Incorporated

Polishing composition

Proposed is a polishing composition including hydroxyethyl cellulose, water and abrasive grains, wherein the hydroxyethyl cellulose has a molecular weight of 500,000 or more and 1,500,000 or less, and the mass ratio of the hydroxyethyl cellulose to the abrasive grains is 0.0075 or more and 0.025 or less.. . ... Nitta Haas Incorporated

Polishing composition

Proposed is a polishing composition including hydroxyethyl cellulose, water and abrasive grains, wherein the hydroxyethyl cellulose has a molecular weight of 500,000 or more and 1,500,000 or less, and the proportion of the hydroxyethyl cellulose adsorbed to the abrasive grains is 30% or more and 90% or less.. . ... Nitta Haas Incorporated

Method of controlling selectivity using composition for polishing silicon nitride

A composition for polishing silicon nitride according to the present invention includes colloidal silica, a polishing aid including a phosphoric acid compound and a sulfuric acid compound. By further including an oxidizing agent, a first selectivity representing the ratio of a polishing speed for a metal layer to a polishing speed for a silicon nitride layer and a second selectivity representing the ratio of a polishing speed for an oxide insulating layer to a polishing speed for a silicon nitride are controlled.. ... Nitta Haas Incorporated








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Nitta Haas Incorporated in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Nitta Haas Incorporated with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###