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Novell Inc patents


Recent patent applications related to Novell Inc. Novell Inc is listed as an Agent/Assignee. Note: Novell Inc may have other listings under different names/spellings. We're not affiliated with Novell Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Novell Inc-related inventors


Soft landing nanolaminates for advanced patterning

Methods for depositing nanolaminate protective layers over a core layer to enable deposition of high quality conformal films over the core layer for use in advanced multiple patterning schemes are provided. In certain embodiments, the methods involve depositing a thin silicon oxide or titanium oxide film using plasma-based atomic layer deposition techniques with a low high frequency radio frequency (hfrf) plasma power, followed by depositing a conformal titanium oxide film or spacer with a high hfrf plasma power.. ... Novell Inc

Wetting pretreatment for enhanced damascene metal filling

Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. ... Novell Inc

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatus for electroplating material onto a substrate are provided. In many cases the material is metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. ... Novell Inc

Dynamic current distribution control apparatus and method for wafer electroplating

Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. ... Novell Inc

Configuration and method of operation of an electrodeposition system for improved process stability and performance

In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.. ... Novell Inc

Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. ... Novell Inc

Methods and apparatus for wetting pretreatment for through resist metal plating

Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. ... Novell Inc

Remote plasma based deposition of oxygen doped silicon carbide films

Disclosed are methods and systems for providing oxygen doped silicon carbide. A layer of oxygen doped silicon carbide can be provided under process conditions that employ one or more silicon-containing precursors that have one or more silicon-hydrogen bonds and/or silicon-silicon bonds. ... Novell Inc

Systems, devices, kits and methods for indirect transfection of multiple sets of nucleic-acids and transfer of molecules

The present disclosure provides systems, kits, devices and methods for indirect transfer of multiple sets of nucleic-acid and other molecules to cells as exemplified by indirect transfection of sets of nucleic-acid molecules to viable cells.. . ... Novell Inc

Systems, devices, kits and methods for seeding cells or sets of molecules in an array on a substrate

The present disclosure provides systems, devices and methods for seeding cells or sets of molecules on a substrate by utilizing a seeding mesh, to obtain an essentially homogenous patterned seeding of the cells or sets of molecules on the mesh.. . ... Novell Inc

Tungsten feature fill

Described herein are methods of filling features with tungsten and related systems and apparatus. The methods include inside-out fill techniques as well as conformal deposition in features. ... Novell Inc

Cross flow manifold for electroplating apparatus

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. ... Novell Inc

Methods and systems for determining oncogenic index of patient specific mutations

Methods for determining various oncogenic-related indexes of patient specific mutations are provided. The methods provided allow determination and grading of various patient specific mutations and qualitative and quantitative determination of various related oncogenic indexes.. ... Novell Inc

Methods for determining drug response of patient specific mutations

Methods for identifying and determining drug response of patient specific oncogenic mutations are provided. The methods provided identify specific (personalized) drug treatment based on the effect of drug on the patient derived markers associated with aberrant signal transduction pathways, in biological samples of a cancer patient.. ... Novell Inc

05/18/17 / #20170137960

Protecting anodes from passivation in alloy plating systems

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of sn—ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.. . ... Novell Inc

05/18/17 / #20170137958

Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.. . ... Novell Inc

03/02/17 / #20170060955

Generating and merging keys for grouping and differentiating volumes of files

Methods and apparatus teach a digital spectrum of a file. The digital spectrum is used to map a file's position in a multi-dimensional space. ... Novell Inc

02/02/17 / #20170029973

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. ... Novell Inc

01/12/17 / #20170009370

Cleaning electroplating substrate holders using reverse current deplating

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. ... Novell Inc

01/12/17 / #20170009344

Temperature controlled showerhead

A temperature controlled showerhead for chemical vapor deposition (cvd) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. ... Novell Inc

01/05/17 / #20170004321

Mechanisms to secure data on hard reset of device

Mechanisms to secure data on a hard reset of a device are provided. A hard reset request is detected on a handheld device. ... Novell Inc








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