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Novellus Systems Inc patents

Recent patent applications related to Novellus Systems Inc. Novellus Systems Inc is listed as an Agent/Assignee. Note: Novellus Systems Inc may have other listings under different names/spellings. We're not affiliated with Novellus Systems Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Novellus Systems Inc-related inventors




Date Novellus Systems Inc patents (updated weekly) - BOOKMARK this page
11/02/17Methods for depositing films on sensitive substrates
09/28/17Tungsten feature fill
06/22/17Cross flow manifold for electroplating apparatus
05/25/17Methods and wetting pretreatment for through resist metal plating
05/25/17Plasma activated conformal dielectric film deposition
05/18/17Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
05/18/17Protecting anodes from passivation in alloy plating systems
04/06/17Dynamic current distribution control wafer electroplating
02/02/17Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
01/12/17Temperature controlled showerhead
01/12/17Cleaning electroplating substrate holders using reverse current deplating
12/29/16Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
12/01/16Hybrid ceramic showerhead
11/24/16Apparatus for advanced packaging applications
11/10/16Diagnostic and control substrate processing systems using dc self-bias voltage
10/27/16Electroplating apparatus and process for wafer level packaging
10/06/16Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region
10/06/16Soft landing nanolaminates for advanced patterning
09/29/16Methods and wetting pretreatment for through resist metal plating
09/29/16Purging of porogen from uv cure chamber
08/11/16Apparatuses and methods for depositing sic/sicn films via cross-metathesis reactions with organometallic co-reactants
08/04/16Front referenced anode
07/14/16Contoured showerhead for improved plasma shaping and control
06/30/16Lipseals and contact elements for semiconductor electroplating apparatuses
06/30/16Monitoring leveler concentrations in electroplating solutions
06/30/16Tungsten feature fill
06/02/16Methods for depositing films on sensitive substrates
05/26/16Automated cleaning of wafer plating assembly
04/28/16Electroplating tailored uniformity profile
04/28/16Plating cup with contoured cup bottom
04/28/16Low tempature tungsten film deposition for small critical dimension contacts and interconnects
04/14/16Low copper/high halide electroplating solutions for fill and defect control
03/31/16Method to obtain sic class of films of desired composition and film properties
03/10/16Tungsten feature fill with nucleation inhibition
01/21/16Variable showerhead flow by varying internal baffle conductance
11/19/15Ultra low silicon loss high dose implant strip
11/12/15Pecvd deposition of smooth silicon films
11/05/15Electrolyte concentration control system for high rate electroplating
10/29/15Hybrid impedance matching for inductively coupled plasma system
10/22/15Conformal deposition of silicon carbide films
10/01/15Method for producing ultra-thin tungsten layers with improved step coverage
09/24/15Wet etching methods for copper removal and planarization in semiconductor processing
09/17/15Method for depositing a chlorine-free conformal sin film
09/10/15Method and apparatuses for reducing porogen accumulation from a uv-cure chamber
09/03/15Wafer position correction with a dual, side-by-side wafer transfer robot
08/06/15Temperature controlled showerhead for high temperature operations
08/06/15Lipseals and contact elements for semiconductor electroplating apparatuses
08/06/15Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
07/30/15Front referenced anode
07/23/15Plasma activated conformal dielectric film deposition
06/25/15Wetting pretreatment for enhanced damascene metal filling
06/18/15Apparatuses and methods for depositing sic/sicn films via cross-metathesis reactions with organometallic co-reactants
06/11/15Through silicon via filling using an electrolyte with a dual state inhibitor
05/07/15Soft landing nanolaminates for advanced patterning
04/30/15Multi-station sequential curing of dielectric films
04/23/15Systems for modulating step coverage during conformal film deposition
04/09/15Apparatus for wetting pretreatment for enhanced damascene metal filling
03/19/15Flow balancing in gas distribution networks
03/19/15Polysilicon etch with high selectivity
03/19/15Plasma generator apparatus
03/05/15Electroplating tailored uniformity profile
02/26/15Tungsten feature fill
02/12/15Apparatuses and methods for maintaining ph in nickel electroplating baths
02/12/15Flowable oxide film with tunable wet etch rate
01/29/15Pedestal bottom clean for improved fluorine utilization and integrated symmetric foreline
Patent Packs
01/15/15In-situ deposition of film stacks
01/08/15Multi-plenum, dual-temperature showerhead
01/01/15Electroplating and post-electrofill systems with integrated process edge imaging and metrology systems
12/04/14Apparatus for advanced packaging applications
11/27/14Vacuum robot with linear translation carriage
10/09/14Methods and dielectric deposition
08/28/14Ceramic showerhead with embedded rf electrode for capacitively coupled plasma reactor
08/21/14Methods and wetting pretreatment for through resist metal plating
08/21/14Purging of porogen from uv cure chamber
08/07/14Metal and silicon containing capping layers for interconnects
08/07/14Plasma activated conformal dielectric film deposition
08/07/14Method and purging and plasma suppression in a process chamber
07/31/14Plasma activated deposition of a conformal film on a substrate surface
07/31/14Plasma activated conformal film deposition
07/03/14High dose implantation strip (hdis) in h2 base chemistry
Patent Packs
07/03/14Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
06/12/14Temperature controlled showerhead
06/12/14Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects
05/22/14Methods for depositing films on sensitive substrates
05/15/14Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
05/15/14Conformal film deposition for gapfill
05/08/14Electrostatic chucks and methods for refurbishing same
05/01/14Low damage photoresist strip low-k dielectrics
04/10/14Electrofill vacuum plating cell
04/03/14Carbon deposition-etch-ash gap fill process
04/03/14Enhancing adhesion of cap layer films
03/27/14High temperature electrode connections
03/20/14Multi-station sequential curing of dielectric films
03/06/14Reduced isotropic etchant material consumption and waste generation
02/27/14Plasma clean deposition chamber
02/27/14Methods and plasma-based deposition
02/20/14Flow balancing in gas distribution networks
01/30/14High pressure, high power plasma activated conformal film deposition
01/23/14Systems and methods for at least partially converting films to silicon oxide and/or improving film quality using ultraviolet curing in steam and densification of films using uv curing in ammonia
01/16/14Photoresist-free metal deposition
12/26/13Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region
12/12/13Hardmask materials
12/05/13Plasma-activated deposition of conformal films
11/28/13Rf-powered, temperature-controlled gas diffuser
11/21/13Systems and methods for modulating step coverage during conformal film deposition
10/17/13Carousel reactor for multi-station, sequential processing systems
10/03/13Continuous plasma and rf bias to regulate damage in a substrate processing system
09/05/13Sequential cascading of reaction volumes as a chemical reuse strategy
08/15/13Precursors for plasma activated conformal film deposition
06/27/13Purging of porogen from uv cure chamber
Social Network Patent Pack
04/18/13Mechanical suppression of parasitic plasma in substrate processing chamber
01/03/13Pedestal with edge gas deflector for edge profile control
01/03/13Systems and methods for controlling etch selectivity of various materials
10/18/12Pedestal covers
10/11/12Increasing etch selectivity of carbon films with lower absorption co-efficient and stress
10/04/12Systems and methods for inhibiting oxide growth in substrate handler vacuum chambers
09/13/12Reduction of a process volume of a processing chamber using a nested dynamic inert volume
05/24/12Methods and apparatuses for determining thickness of a conductive layer
05/17/12Fault detection apparatuses and methods for fault detection of semiconductor processing tools
04/26/12Gas flow distribution receptacles, plasma generator systems, and methods for performing plasma stripping processes
Patent Packs
10/20/11Gas and liquid injection methods and apparatus
09/29/11Electroplating cup assembly
09/08/11Shields for substrate processing systems
07/28/11Rapidly cleanable electroplating cup seal
05/12/11Precursor vapor generation and delivery system with filters and filter monitoring system
04/14/11Electrolyte concentration control system for high rate electroplating
03/31/11Methods for multi-step copper plating on a continuous ruthenium film in recessed features
03/10/11Method for improving adhesion of low resistivity tungsten/tungsten nitride layers
03/03/11Plasma ignition performance for low pressure physical vapor deposition (pvd) processes
02/03/11Monitoring of electroplating additives
01/27/11System for depositing a film by modulated ion-induced atomic layer deposition (mii-ald)
12/16/10Remote plasma processing of interface surfaces
12/16/10Heat shield for heater in semiconductor processing apparatus
12/16/10Remote plasma processing of interface surfaces
11/04/10Magnetic rotational hardstop for robot
10/28/10Method for improving uniformity and adhesion of low resistivity tungsten film
10/14/10Uv treatment for carbon-containing low-k dielectric repair in semiconductor processing
09/09/10Plating methods for low aspect ratio cavities
09/02/10Magnetically actuated chuck for edge bevel removal
08/12/10Process for through silicon via filling
07/29/10Diffusion barrier layers
07/08/10Method and modulation of precursor exposure during a pulsed deposition process
06/24/10Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics
06/17/10Method for improved thickness repeatability of pecvd deposited carbon films
06/17/10Electroplating apparatus with vented electrolyte manifold
06/10/10Methods for depositing tungsten films having low resistivity for gapfill applications
05/13/10Method and electroplating
05/13/10Partial contact wafer retaining ring apparatus
04/22/10Method for improving process control and film conformality of pecvd film
03/04/10Method for reducing tungsten roughness and improving reflectivity
Patent Packs
03/04/10Modulated ion-induced atomic layer deposition (mii-ald)
03/04/10Apparatus and edge bevel removal of copper from silicon wafers
02/25/10Method and electroplating
02/18/10Process for through silicon via filing
02/11/10Method and electroplating including remotely positioned second cathode
02/11/10High resistance ionic current source
02/11/10Method and electroplating
02/11/10Methods for growing low-resistivity tungsten film
02/04/10Modulated metal removal using localized wet etching
01/21/10Wet etching methods for copper removal and planarization in semiconductor processing
01/14/10Electrostatic chuck assembly with capacitive sense feature, and related operating method
01/14/10Conformal films on semiconductor substrates
12/10/09Method for purifying acetylene gas for use in semiconductor processes
11/26/09Gas-purged vacuum valve
11/19/09Protective layer to enable damage free gap fill
11/19/09Edge profiling for process chamber shields
11/19/09Fabrication of semiconductor interconnect structure
11/12/09Photoresist stripping method and apparatus
11/12/09Photoresist-free metal deposition
11/12/09Pad-assisted electropolishing
Social Network Patent Pack
11/12/09Topography reduction and control by selective accelerator removal
11/12/09Photoresist-free metal deposition
11/12/09Topography reduction and control by selective accelerator removal
10/29/09Pad-assisted electropolishing
10/22/09Showerhead for chemical vapor deposition
10/22/09Methods and apparatuses for determining thickness of a conductive layer
10/08/09Plasma generator systems and methods of forming plasma
09/24/09Gas flow distribution receptacles, plasma generator systems, and methods for performing plasma stripping processes
09/24/09Methods for producing low stress porous and cdo low-k dielectric materials using precursors with organic functional groups
08/27/09Convenient replacement of anode in semiconductor electroplating apparatus
07/16/09Detecting the presence of a workpiece relative to a carrier head
06/25/09Methods for forming all tungsten contacts and lines
06/18/09Fault detection apparatuses and methods for fault detection of semiconductor processing tools
06/11/09Method for improving uniformity and adhesion of low resistivity tungsten film
06/04/09Loadlock designs and methods for using same
06/04/09High throughput in transit wafer position correction in system using multiple robots
05/21/09Apparatus and methods for precompiling program sequences for wafer processing
05/07/09Method and teaching a workpiece transfer robot
04/30/09Rapidly cleanable electroplating cup assembly
04/30/09Closed contact electroplating cup assembly
Social Network Patent Pack
04/16/09Temperature controlled showerhead
04/16/09Temperature controlled showerhead
04/16/09Temperature controlled showerhead
03/26/09Chemical mechanical polishing assembly with altered polishing pad topographical components
03/05/09Enhanced stripping of low-k films using downstream gas mixing
02/26/09High dose implantation strip (hdis) in h2 base chemistry
12/12/13Hardmask materials
01/21/10Wet etching methods for copper removal and planarization in semiconductor processing
01/14/10Conformal films on semiconductor substrates







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