Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Similar
Filing Names

Novellus Systems Inc
Novellus Systems Inc_20100114
Novellus Systems Inc_20131212
Novellus Systems Inc_20100121

Novellus Systems Inc patents


Recent patent applications related to Novellus Systems Inc. Novellus Systems Inc is listed as an Agent/Assignee. Note: Novellus Systems Inc may have other listings under different names/spellings. We're not affiliated with Novellus Systems Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "N" | Novellus Systems Inc-related inventors


Soft landing nanolaminates for advanced patterning

Methods for depositing nanolaminate protective layers over a core layer to enable deposition of high quality conformal films over the core layer for use in advanced multiple patterning schemes are provided. In certain embodiments, the methods involve depositing a thin silicon oxide or titanium oxide film using plasma-based atomic layer deposition techniques with a low high frequency radio frequency (hfrf) plasma power, followed by depositing a conformal titanium oxide film or spacer with a high hfrf plasma power.. ... Novellus Systems Inc

Wetting pretreatment for enhanced damascene metal filling

Disclosed are pre-wetting apparatus designs and methods. These apparatus designs and methods are used to pre-wet a wafer prior to plating a metal on the surface of the wafer. ... Novellus Systems Inc

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

Methods and apparatus for electroplating material onto a substrate are provided. In many cases the material is metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. ... Novellus Systems Inc

Dynamic current distribution control apparatus and method for wafer electroplating

Methods, systems, and apparatus for plating a metal onto a work piece are described. In one aspect, an apparatus includes a plating chamber, a substrate holder, an anode chamber housing an anode, an ionically resistive ionically permeable element positioned between a substrate and the anode chamber during electroplating, an auxiliary cathode located between the anode and the ionically resistive ionically permeable element, and an insulating shield with an opening in its central region. ... Novellus Systems Inc

Configuration and method of operation of an electrodeposition system for improved process stability and performance

In one aspect, an apparatus includes a plating cell, a degassing device configured to remove oxygen from the plating solution prior to the plating solution flowing into the plating cell; an oxidation station configured to increase an oxidizing strength of the plating solution after the plating solution flows out of the plating cell; and a controller. The controller includes program instructions for causing a process that includes operations of: reducing an oxygen concentration of the plating solution where the plating solution contains a plating accelerator; then, contacting a wafer substrate with the plating solution having reduced oxygen concentration and electroplating a metal such that the electroplating causes a net conversion of the accelerator to a less-oxidized accelerator species within the plating cell; then increasing the oxidizing strength of the plating solution causing a net re-conversion of the less-oxidized accelerator species back to the accelerator outside the plating cell.. ... Novellus Systems Inc

Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte

Apparatus and methods for electroplating metal onto substrates are disclosed. The electroplating apparatus comprise an electroplating cell and at least one oxidization device. ... Novellus Systems Inc

Methods and apparatus for wetting pretreatment for through resist metal plating

Disclosed are pre-wetting apparatus designs and methods. In some embodiments, a pre-wetting apparatus includes a degasser, a process chamber, and a controller. ... Novellus Systems Inc

Remote plasma based deposition of oxygen doped silicon carbide films

Disclosed are methods and systems for providing oxygen doped silicon carbide. A layer of oxygen doped silicon carbide can be provided under process conditions that employ one or more silicon-containing precursors that have one or more silicon-hydrogen bonds and/or silicon-silicon bonds. ... Novellus Systems Inc

Tungsten feature fill

Described herein are methods of filling features with tungsten and related systems and apparatus. The methods include inside-out fill techniques as well as conformal deposition in features. ... Novellus Systems Inc

Cross flow manifold for electroplating apparatus

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. ... Novellus Systems Inc

Protecting anodes from passivation in alloy plating systems

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of sn—ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.. . ... Novellus Systems Inc

Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath

Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.. . ... Novellus Systems Inc

Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating

The embodiments herein relate to methods and apparatus for electroplating one or more materials onto a substrate. In many cases the material is a metal and the substrate is a semiconductor wafer, though the embodiments are no so limited. ... Novellus Systems Inc

Cleaning electroplating substrate holders using reverse current deplating

Provided are cleaning methods and systems to remove unintended metallic deposits from electroplating apparatuses using reverse current deplating techniques. Such cleaning involves positioning a cleaning (deplating) disk in an electroplating cup similar to a regular processed substrate. ... Novellus Systems Inc

01/12/17 / #20170009344

Temperature controlled showerhead

A temperature controlled showerhead for chemical vapor deposition (cvd) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. ... Novellus Systems Inc








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Novellus Systems Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Novellus Systems Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###