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Omnivision Technologies Inc patents


Recent patent applications related to Omnivision Technologies Inc. Omnivision Technologies Inc is listed as an Agent/Assignee. Note: Omnivision Technologies Inc may have other listings under different names/spellings. We're not affiliated with Omnivision Technologies Inc, we're just tracking patents.

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Lane departure warning system and associated methods

A lane departure warning system includes a memory and a processor for validating a candidate region as including an image of a lane marker on the road is disclosed. The candidate region is identified within a latest road image of a temporal sequence of road images captured from the front... Omnivision Technologies Inc

Panel carrier and attaching a liquid-crystal-on-silicon panel thereto

A panel carrier includes a substrate, a die-attach region, a short sidewall, and a conductor. The die-attach region is on a top substrate surface of the substrate for supporting the LCoS panel. The short sidewall is on a first side of the die-attach region and has a top sidewall surface... Omnivision Technologies Inc

Camera and method with widescreen image on nearly-square aspect ratio photosensor array

A digital widescreen camera has an anamorphic lens focusing a field of view nearly twice as wide as tall on a photosensor array having nearly square aspect ratio. In embodiments, the photosensor array has an 8-pixel tiling unit organized as four pairs of adjacent left and right pixels, a first... Omnivision Technologies Inc

Linear-logarithmic image sensor

A pixel array for use in a high dynamic range image sensor includes a plurality of pixels arranged in a plurality of rows and columns in the pixel array. Each one of the pixels includes a linear subpixel and a log subpixel disposed in a semiconductor material. The linear subpixel... Omnivision Technologies Inc

Biased deep trench isolation

An image sensor includes a plurality of photodiodes disposed in a semiconductor material, and a through-semiconductor-via coupled to a negative voltage source. Deep trench isolation structures are disposed between individual photodiodes in the plurality of photodiodes to electrically and optically isolate the individual photodiodes. The deep trench isolation structures include... Omnivision Technologies Inc

Vertical gate guard ring for single photon avalanche diode pitch minimization

A photon detection device includes a single photon avalanche diode (SPAD) including a multiplication junction defined at an interface between n doped and p doped layers of the SPAD in a first region of a semiconductor layer. A vertical gate structure surrounds the SPAD in the semiconductor layer to isolate... Omnivision Technologies Inc

Image sensor floating diffusion boosting by transfer gates

A shared pixel includes a plurality of transfer gates coupled between respective photodiodes and a shared floating diffusion. Each transfer gate is coupled to receive a transfer control signal to independently control a transfer of the image charge from the corresponding photodiodes to the shared floating diffusion. Each transfer control... Omnivision Technologies Inc

High dynamic range image sensor with virtual high-low sensitivity pixels

An image sensor includes a plurality of photodetectors that are identically sized and fabricated in semiconductor material with identical semiconductor processing conditions. The photodetectors are organized into virtual high-low sensitivity groupings, each including a first photodetector and a second photodetector. A plurality of attenuators is disposed over the semiconductor material.... Omnivision Technologies Inc

Stacked-chip backside-illuminated spad sensor with high fill-factor

A photon detection device includes a single photon avalanche diode (SPAD) disposed in a semiconductor layer. A guard ring structure is disposed in the semiconductor layer surrounding the SPAD to isolate the SPAD. A well region is disposed in the semiconductor layer surrounding the guard ring structure and disposed along... Omnivision Technologies Inc

Visible and infrared image sensor

A method of image sensor fabrication includes forming a second semiconductor layer on a back side of a first semiconductor layer. The method also includes forming one or more groups of pixels disposed in a front side of the first semiconductor layer. The one or more groups of pixels include... Omnivision Technologies Inc

Emi shield with a lens-sized aperture for camera modules and camera modules including the same

An EMI shield for a camera module subassembly includes a first conductive portion covering an optical unit and a top surface of a circuit substrate of the camera module subassembly and a second conductive portion covering a bottom surface of the circuit substrate, such that the two portions are in... Omnivision Technologies Inc

Photogate for front-side-illuminated infrared image sensor and manufacturing the same

An image sensor includes a substrate and a plurality of infrared pixels formed in a front side of the substrate and configured to detect infrared light incident on the front side of the substrate. Each of the infrared pixels includes a photodiode, a region free of implants located above the... Omnivision Technologies Inc

Image sensor with big and small pixels and manufacture

An image sensor includes a substrate, a first set of sensor pixels formed on the substrate, and a second set of sensor pixels formed on the substrate. The sensor pixels of the first set are arranged in rows and columns and are configured to detect light within a first range... Omnivision Technologies Inc

Resonant-filter image sensor and associated fabrication method

A resonant-filter image sensor includes a pixel array including a plurality of pixels and a microresonator layer above the pixel array. The microresonator layer includes a plurality of microresonators formed of a first material with an extinction coefficient less than 0.02 at a free-space wavelength of five hundred nanometers. Each... Omnivision Technologies Inc

1-16 & 1.5-7.5 frequency divider for clock synthesizer in digital systems

A frequency divider unit has a digital frequency divider configured to divide by an odd integer, and a dual-edge-triggered one-shot coupled to double frequency of an output of the digital frequency divider. The frequency divider unit is configurable to divide an input frequency by a configurable ratio selectable from at... Omnivision Technologies Inc

Bezels for die level packaging of camera modules, and associated camera modules and methods

A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing... Omnivision Technologies Inc

Image sensor pixel noise measurement

An image sensor pixel noise measurement circuit includes a pixel array on an integrated circuit chip. The pixel array includes a plurality of pixels including a first pixel to output a first image data signal, and a second pixel to output a second image data signal. A noise amplification circuit... Omnivision Technologies Inc

Global shutter pixel with hybrid transfer storage gate-storage diode storage node

An image sensor pixel having a hybrid transfer storage gate-storage diode storage node is disclosed herein. An example image sensor includes a photodiode, a storage diode, a transfer gate, and a buried storage well. The photodiode, storage diode, and buried storage well are all disposed in a semiconductor material. The... Omnivision Technologies Inc

Graded-semiconductor image sensor

An image sensor includes a semiconductor material having an illuminated surface and a non-illuminated surface. A plurality of photodiodes is disposed in the semiconductor material to receive image light through the illuminated surface. The semiconductor material includes silicon and germanium, and the germanium concentration increases in a direction of the... Omnivision Technologies Inc

Systems and methods for detecting light-emitting diode without flickering

An image sensor for detecting light-emitting diode (LED) without flickering includes a pixel array with pixels. Each pixel including subpixels including a first and a second subpixel, dual floating diffusion (DFD) transistor, and a capacitor coupled to the DFD transistor. First subpixel includes a first photosensitive element to acquire a... Omnivision Technologies Inc

Clock generator and reducing electromagnetic interference from digital systems

A spread-spectrum clock generator has a phase-locked loop locked to a reference signal that gives a stable-frequency output to a variable phase shifter. The variable phase shifter provides a spread-spectrum clock output because its phase-shift is determined by a pseudorandom sequence generator and the pseudorandom sequence generator changes its output... Omnivision Technologies Inc

Method and system for implementing h-banding cancellation in an image sensor

A method for implementing H-Banding cancellation in an image sensor starts with a pixel array capturing image data. Pixel array includes a plurality of pixels to generate pixel data signals, respectively. ADC circuitry acquires the pixel data signals. ADC circuitry includes a comparator circuitry. In one embodiment, comparator circuitry 310... Omnivision Technologies Inc

Edge reflection reduction

An image sensor package includes an image sensor with a pixel array disposed in a semiconductor material. A first transparent shield is adhered to the semiconductor material, and the pixel array is disposed between the semiconductor material and the first transparent shield. The image sensor package further includes a second... Omnivision Technologies Inc

Compact three-surface wafer-level lens systems

A compact three-surface wafer-level lens system for imaging a scene onto an image plane includes a one-sided wafer-level lens and a two-sided wafer-level lens disposed between the one-sided wafer-level lens and the image plane. The total track length of the wafer-level lens system is no more than 2.2 millimeters. The... Omnivision Technologies Inc

Ultra-small camera module with wide field of view, and associate lens systems and methods

An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters... Omnivision Technologies Inc

Slim imager, associated system-in-package, and associated method

In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a... Omnivision Technologies Inc

Trenched device wafer, stepped-sidewall device die, and associated method

A trenched device wafer includes a device substrate layer having a top surface; a plurality of devices in the device substrate layer, and a trench in the top surface. The trench extends into the device substrate layer, and is located between a pair of adjacent devices of the plurality of... Omnivision Technologies Inc

Interposer and chip-scale packaging for wafer-level camera

A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such... Omnivision Technologies Inc

Image sensor contact enhancement

A method of image sensor fabrication includes providing a plurality of photodiodes disposed in a semiconductor material and a floating diffusion disposed in the semiconductor material. The method also includes providing peripheral circuitry disposed in the semiconductor material, including a first electrical contact to the semiconductor material, and forming a... Omnivision Technologies Inc

Horizontal banding reduction with ramp generator isolation in an image sensor

A readout circuit for use in an image sensor includes a system ramp generator coupled to generate a system ramp signal. A plurality of analog-to-digital converters is coupled to a plurality of column bitlines from a pixel array to receive corresponding analog column image signals. An isolation ramp buffer is... Omnivision Technologies Inc

Flare-reducing imaging system and associated image sensor

An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected... Omnivision Technologies Inc

Biased deep trench isolation

An image sensor includes a plurality of photodiodes disposed in a semiconductor material, and a through-semiconductor-via coupled to a negative voltage source. Deep trench isolation structures are disposed between individual photodiodes in the plurality of photodiodes to electrically and optically isolate the individual photodiodes. The deep trench isolation structures include... Omnivision Technologies Inc

Phase-detection auto-focus pixel array and associated imaging system

A phase-detection auto-focus (PDAF) pixel array includes a first pixel and a second pixel. The first pixel, located at a first distance from a center of the PDAF pixel array, includes a first inner photodiode and a first outer photodiode with respect to the center. The first inner photodiode and... Omnivision Technologies Inc

Image sensor with peripheral 3a-control sensors and associated imaging system

An imaging system includes a primary imager and plurality of 3A-control sensors. The primary imager has a first field of view and includes a primary image sensor and a primary imaging lens with a first optical axis. The primary image sensor has a primary pixel array and control circuitry communicatively... Omnivision Technologies Inc

Enhanced high dynamic range

An imaging system includes an image sensor configured to capture a sequence of images including at least one low dynamic range (LDR) image and at least one high dynamic range (HDR) image. The imaging system also includes readout circuitry. The readout circuitry is coupled to read out image data captured... Omnivision Technologies Inc

09/07/17 / #20170256666

Back side illuminated image sensor with guard ring region reflecting structure

An imaging sensor system includes a pixel array having a plurality of pixel cells disposed in a first semiconductor layer, where each one of the plurality of pixel cells has a single photon avalanche diode (SPAD) disposed proximate to a front side of a first semiconductor layer. Each of the... Omnivision Technologies Inc

08/03/17 / #20170221951

Through-semiconductor-via capping layer as etch stop layer

A method of image sensor fabrication includes providing a semiconductor material, an insulation layer, and a logic layer, where the semiconductor material includes a plurality of photodiodes. A through-semiconductor-via is formed which extends from the semiconductor material, through the insulation layer, and into the logic layer. The through-semiconductor-via is capped... Omnivision Technologies Inc

07/27/17 / #20170213863

High dynamic range image sensor with reduced sensitivity to high intensity light

An image sensor includes first and second pluralities of photodiodes interspersed among each other in a semiconductor substrate. Incident light is to be directed through a surface of the semiconductor substrate into the first and second pluralities of photodiodes. The first plurality of photodiodes has greater sensitivity to the incident... Omnivision Technologies Inc

07/27/17 / #20170213864

Trenched-bonding-dam device and manufacturing same

Trenched-bonding-dam devices and corresponding methods of manufacture are provided. A trenched-bonding-dam device includes a bonding dam structure positioned upon a top surface of a substrate. The bonding dam structure has a bottom surface attached to a top surface of the substrate, an inner dam surrounded by an outer dam, and... Omnivision Technologies Inc

07/20/17 / #20170205653

Method for forming an alignment layer of a liquid crystal display device and display device manufactured thereby

A novel method of forming an alignment layer of a liquid crystal display device includes the steps of providing a substrate (e.g., a processed silicon wafer, etc.) having an alignment layer material deposited thereon and applying a series of pulses from a pulse laser to anneal portions of the alignment... Omnivision Technologies Inc

07/20/17 / #20170207269

Image sensor contact enhancement

An image sensor includes a photodiode disposed in semiconductor material. The photodiode is one of a plurality of photodiodes formed in an array. The image sensor also includes a floating diffusion disposed in the semiconductor material, and the floating diffusion is disposed adjacent to the photodiode in the plurality of... Omnivision Technologies Inc

07/20/17 / #20170208276

Method and system for implementing dynamic ground sharing in an image sensor with pipeline architecture

A method of implementing dynamic ground sharing in an image sensor with pipeline architecture starts with a pixel array capturing image data. Pixel array includes pixels to generate pixel data signals, respectively. A readout circuitry acquires the image data from a row in the pixel array. An analog-to-digital conversion (ADC)... Omnivision Technologies Inc

07/13/17 / #20170199348

Four-surface narrow field-of-view compound lens

A four-surface narrow field-of-view compound lens includes a first biplanar substrate between a first lens and a second lens, the first lens being plano-convex and the second lens being plano-concave. The compound lens also includes a second biplanar substrate between a third lens and a fourth lens, the third lens... Omnivision Technologies Inc

07/13/17 / #20170200755

Flip-chip image sensor package

A flip-chip image-sensor package includes a substrate, a coverglass, a conductive layer, and an image sensor. The substrate has an aperture therethrough and a first region and a second region each at least partially surrounding the aperture. The aperture has a first width defined by a boundary of the first... Omnivision Technologies Inc

07/13/17 / #20170200760

Plasmonic-nanostructure sensor pixel

A first plasmonic-nanostructure sensor pixel includes a semiconductor substrate and a plurality of metal pillars. The semiconductor substrate has a top surface and a photodiode region therebeneath. The plurality of metal pillars is at least partially embedded in the substrate and extends from the top surface in a direction substantially... Omnivision Technologies Inc

07/13/17 / #20170201681

Imaging systems and methods with image data path delay measurement

An imaging system with image data path delay measurement includes (a) a first image sensor chip that includes a pixel array for generating a first image in response to light incident upon the pixel array, and a time mark generator for, upon receiving a time mark command, encoding a signature... Omnivision Technologies Inc

07/06/17 / #20170193895

Low latency display system and method

A novel display system includes a host and a display. In a particular embodiment the host includes a data scaler and a dual frame buffer. Frames of image data are down-scaled before being transferred to the display, and is up-scaled while being loaded into the frame buffer or the display.... Omnivision Technologies Inc

07/06/17 / #20170195590

Method and system for reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter

A method of reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter (ADC) starts with a pixel array capturing image data. The pixel array includes pixels to generate pixel data signals, respectively. An ADC circuitry acquires the pixel data signals. The ADC circuitry includes ADC... Omnivision Technologies Inc

07/06/17 / #20170195597

Method and system for reducing analog-to-digital conversion time for dark signals

A method for reducing ADC time for dark signals starts with pixel array capturing image data of frames including first frame and second frame. Pixel array includes visible pixels and black pixels (OPB). Scanning circuitry then selects OPB of first frame to be readout. OPB generate a dark signal when... Omnivision Technologies Inc

07/06/17 / #20170195604

Method and system of implementing an uneven timing gap between each image capture in an image sensor

Stacked chip imaging system comprising pixel array partitioned into pixel sub-arrays (PSAs) disposed in first semiconductor die and ADC circuitry including ADC circuits disposed in second semiconductor die. Each PSA is arranged into pixel groups. Each pixel group generates pixel data signals. Pixel array captures image data of first frame... Omnivision Technologies Inc

07/06/17 / #20170195607

Method and system for reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter

A method of reducing noise in an image sensor using a parallel multi-ramps merged comparator analog-to-digital converter (ADC) starts with a pixel array capturing image data. The pixel array includes pixels to generate pixel data signals, respectively. An ADC circuitry acquires the pixel data signals. The ADC circuitry includes ADC... Omnivision Technologies Inc

06/22/17 / #20170177951

Lane detection system and method

A lane detection system includes a non-volatile memory storing machine-readable instructions and an image processor capable of receiving a road image. The image processor, when executing the machine-readable instructions, is capable of: (i) processing the road image to identify a lane candidate within a lane-existing region of the road image,... Omnivision Technologies Inc

06/22/17 / #20170178552

Frame timing

A display system includes a processor coupled to receive image data from an image source and a frame timing circuit. The processor is coupled to output the image data and first sync signals, where each one of the first sync signals is output after M number of pixel values of... Omnivision Technologies Inc

06/22/17 / #20170180662

Image sensor color correction

An image sensor includes a plurality of photodiodes disposed in a semiconductor material and a plurality of transfer transistors. Individual transfer transistors in the plurality of transfer transistors are coupled to individual photodiodes in the plurality of photodiodes. A floating diffusion is also coupled to the plurality of transfer transistors... Omnivision Technologies Inc

06/22/17 / #20170180663

High speed rolling image sensor with adm architecture and implementing thereof

High speed rolling image sensor includes pixel array disposed in first semiconductor die, readout circuits disposed in second semiconductor die and conductors. Pixel array is partitioned into pixel sub-arrays (PSAs). Each of the PSAs includes a plurality of pixels. Pixel groups include pixels that are non-contiguous, non-overlapping and distinct. Each... Omnivision Technologies Inc

06/15/17 / #20170167978

Methods for high-throughput fluorescence imaging with sample heating capability

A method for high-throughput assay processing includes (a) modulating temperature of a plurality of samples disposed in a respective plurality of fluidic channels on an image sensor wafer, including a plurality of image sensors, by heating the image sensor wafer using a heating module thermally coupled with the image sensor... Omnivision Technologies Inc

06/15/17 / #20170168104

Image sensor power supply noise detection

A power supply noise measurement circuit includes a multiphase filter coupled to receive a power supply signal. The multiphase filter is coupled to output a first filtered power supply signal for a first phase, and a second filtered power supply signal for a second phase. A multiphase amplifier is coupled... Omnivision Technologies Inc

06/15/17 / #20170168270

Spacer wafer for wafer-level camera and manufacturing same

A spacer wafer for a wafer-level camera, a wafer-level camera including the spacer wafer and a method of manufacturing a spacer wafer include a layer of photoresist being formed over a substrate, the layer of photoresist being exposed to radiation through a mask that defines a spacer geometry for at... Omnivision Technologies Inc

06/08/17 / #20170160534

Microscope attachment

A microscope attachment includes a lens apparatus with one or more lenses, a light source, and a sample holder. The sample holder is disposed between the lens apparatus and the light source and is positioned to transmit light from the light source through the sample holder and through the lens... Omnivision Technologies Inc

06/08/17 / #20170162621

Light channels with multi-step etch

An image sensor includes a plurality of photodiodes disposed in a semiconductor layer, a first isolation layer, and a dielectric filler. The dielectric filler is disposed in a trench in the first isolation layer, and the first isolation layer is disposed between the semiconductor layer and the dielectric filler. At... Omnivision Technologies Inc

06/08/17 / #20170163912

Global shutter correction

A pixel circuit includes a photodiode disposed in a semiconductor material to accumulate image charge in response to incident light directed into the photodiode, and a transfer transistor coupled to the photodiode. The circuit also includes a noise correction circuit coupled to receive a transfer control signal and the noise... Omnivision Technologies Inc

05/18/17 / #20170139086

Stacked-lens assembly and fabrication same

A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top... Omnivision Technologies Inc

05/18/17 / #20170142355

Global shutter control signal generator with reduced driving requirements

A pixel cell includes a photodiode disposed in a semiconductor material to accumulate image charge in response to light. A global shutter transistor is disposed in the semiconductor material and is selectively resets the image charge in the photodiode in response to a global shutter control signal. A global shutter... Omnivision Technologies Inc

05/18/17 / #20170142356

Image sensor global shutter supply circuit with variable bandwidth

A pixel cell includes a photodiode to accumulate image charge. A global shutter transistor is coupled to the photodiode to reset the image charge in the photodiode in response to a global shutter control signal. A global shutter control signal generator circuit generates the global shutter control signal to have... Omnivision Technologies Inc

05/18/17 / #20170142360

Liquid crystal display and infrared image sensor on silicon

A novel head mounted display includes a display/image sensor. In a particular embodiment the display/image sensor is formed on a single silicon die, which includes display pixels and light sensor pixels. The display pixels and light sensor pixels are each arranged in rows and columns, and the arrays of light... Omnivision Technologies Inc

Patent Packs
05/11/17 / #20170131554

Pupillary adjustable head mounted device

Embodiments of the present disclosure related to a head mounted display (HMD) that enable adjustment of lenses for a particular consumer. In some example embodiments, the HMD enables up to three-degrees of freedom of lens alignment with a consumer's pupils. For example, the HMD includes an actuation device or rotatable... Omnivision Technologies Inc

05/04/17 / #20170123190

Wafer-level hybrid compound lens and fabricating same

A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate... Omnivision Technologies Inc

05/04/17 / #20170124429

System and evaluating a classifier implemented within an image signal processor

A system for evaluating a classifier of an image signal processor (ISP) includes (i) a microprocessor and (ii) memory storing training images, the microprocessor being capable of sending each training image to the ISP. The system includes machine-readable instructions stored within the memory and executed by the microprocessor capable of:... Omnivision Technologies Inc

05/04/17 / #20170125467

Chip-scale packaged image sensor packages with black masking and associated packaging methods

A chip-scale image sensor packaging method with black masking includes (a) cutting a composite wafer having a plurality of image sensors bonded to a common glass substrate to form slots in the common glass substrate, wherein the slots define a cover glass for each of the image sensors, respectively, (b)... Omnivision Technologies Inc

05/04/17 / #20170127003

Imaging systems including row-period compensators and associated methods

An imaging system includes an image sensor and a row-period compensator. The image sensor includes an array of photosensitive pixels and electrical circuitry for controlling the array of photosensitive pixels and for reading accumulated electrical charge therefrom. The electrical circuitry is at least partially powered from a positive power rail... Omnivision Technologies Inc

04/27/17 / #20170115436

Multi-layer color filter for low color error and high snr

Embodiments are described of a color filter array including a plurality of tiled minimal repeating units. Each minimal repeating unit includes an invisible-wavelength filter layer including a plurality of filters and a visible-wavelength filter layer positioned on the invisible-wavelength filter layer and having a plurality of filters such that each... Omnivision Technologies Inc

04/20/17 / #20170109115

Multi-projector display box

A novel multi-display projection box includes a housing that is short and wide, a set of display panels, a set of projectors, and a controller. In a particular embodiment the set of display panels includes two display panels, each coupled to opposite sides of the housing. The set of projectors... Omnivision Technologies Inc

04/20/17 / #20170110608

Quantum dot image sensor

A photodetector includes a first doped region disposed in a semiconductor material and a second doped region disposed in the semiconductor material. The second doped region is electrically coupled to the first doped region, and the second doped region is of an opposite majority charge carrier type as the first... Omnivision Technologies Inc

04/20/17 / #20170111560

Notched-spacer camera module and fabricating same

A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the... Omnivision Technologies Inc

04/06/17 / #20170097491

Two-surface narrow field-of-view compounds lens

A two-surface narrow field-of-view (FOV) compound lens for producing an image of an object at an image plane of an imaging system includes a biplanar substrate between a plano-convex lens and a plano-concave lens having a common optical axis. The plano-convex lens has a first planar surface on a first... Omnivision Technologies Inc

04/06/17 / #20170097497

Three-surface wide field-of-view lens system

A three-surface wafer-level lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first wafer-level lens with (i) a first substrate having a first planar surface facing the image plane, and (ii) a first lens element bonded to the first planar surface and having a... Omnivision Technologies Inc

04/06/17 / #20170097499

Near-infrared hybrid lens systems with wide field of view

A near-infrared hybrid lens system for imaging a wide field-of-view scene onto an image plane includes (a) a first cast lens positioned closest to the scene and at least partly transmissive to near-infrared light, (b) a second cast lens positioned closest to the image plane and at least partly transmissive... Omnivision Technologies Inc

03/02/17 / #20170062511

Dual-mode image sensor with a signal-separating color filter array, and same

A dual-mode image sensor with a signal-separating CFA includes a substrate including a plurality of photodiode regions and a plurality of tall spectral filters having a uniform first height and for transmitting a first electromagnetic wavelength range. Each of the tall spectral filters is disposed on the substrate and aligned... Omnivision Technologies Inc

02/23/17 / #20170054931

Readout circuitry to mitigate column fixed pattern noise of an image sensor

Techniques and mechanisms to mitigate fixed pattern noise in image sensor data. In an embodiment, readout circuitry includes an adaptive analog-to-digital converter (ADC) comprising a differential amplifier and a feedback path coupled across the differential amplifier, where the ADC is to receive a ramp signal, a control signal associated with... Omnivision Technologies Inc

02/16/17 / #20170047370

Cmos image sensor with peninsular ground contracts and manufacturing the same

A complementary metal oxide semiconductor (CMOS) image sensor with peninsular ground contacts includes (a) a substrate having a plurality of pixel units arranged in rows of pixel units and (b) a plurality of ground contacts for grounding the pixel units, wherein the ground contacts are formed in respective peninsular regions... Omnivision Technologies Inc

Patent Packs
02/09/17 / #20170036407

Optical spacer including controlled located aperture and manufacturing the same

A method of manufacturing an optical spacer includes dispensing thermal glue within a mold; pressing the thermal glue using an optical spacer substrate to generate an optical spacer including an aperture; and, releasing the mold from the optical spacer. The thermal glue may be cured prior to releasing the mold... Omnivision Technologies Inc

02/09/17 / #20170041525

Image sensor with symmetric multi-pixel phase-difference detectors, and associated methods

An imaging system with on-chip phase-detection includes an image sensor with symmetric multi-pixel phase-difference detectors. Each symmetric multi-pixel phase-difference detector includes (a) a plurality of pixels forming an array and each having a respective color filter thereon, each color filter having a transmission spectrum and (b) a microlens at least... Omnivision Technologies Inc

02/09/17 / #20170041562

Method and system to implement a stacked chip high dynamic range image sensor

Method of implementing stacked chip HDR algorithm in image sensor starts with pixel array capturing first frame with first exposure time and second frame with a second exposure time that is longer or shorter than the first exposure time. Pixel array is disposed in first semiconductor die and is partitioned... Omnivision Technologies Inc

01/26/17 / #20170023614

Image sensor testing probe card

A method of increasing uniformity in light from a light source at a plurality of targets of the light includes locating a plurality of movable aperture elements between the light source and the targets. Each aperture element defines an aperture through which the light passes from the light source to... Omnivision Technologies Inc

01/26/17 / #20170025468

Photosensitive capacitor pixel for image sensor

A method of fabricating a pixel array includes forming a transistor network along a frontside of a semiconductor substrate. A contact element is formed for every pixel in the pixel array that is electrically coupled to a transistor within the transistor network. An interconnect layer is formed upon the frontside... Omnivision Technologies Inc

01/19/17 / #20170018583

Isolated global shutter pixel storage structure

An imaging system includes a pixel array of pixel cells with each one of the pixel cells including a photodiode disposed in a semiconductor material, a global shutter gate transistor, disposed in the semiconductor material and coupled to the photodiode, a storage transistor disposed in the semiconductor material, an optical... Omnivision Technologies Inc

01/05/17 / #20170005133

Fractal-edge thin film and manufacture

A method of manufacturing a fractal-edge thin film includes determining an area shape to be covered by the fractal-edge thin film. The method also includes generating a thin-film perimeter based upon the area shape, the thin-film perimeter having a fractal dimension exceeding one. The method also includes determining a photomask... Omnivision Technologies Inc

01/05/17 / #20170006207

High dynamic range imaging with reduced frame buffer

A system and method for high dynamic range (HDR) imaging includes writing a first, second, and third sub-frame to a memory at a first, second, and third readout time, respectively, the first, second, and third sub-frame being generated by a same first sub-array of the array of image pixels. Subsequent... Omnivision Technologies Inc

01/05/17 / #20170006266

Color filter array with reference pixel to reduce spectral crosstalk

A color filter array includes a plurality of tiled minimal repeating units, each minimal repeating unit comprising an M×N set of individual filters. Each minimal repeating unit includes a plurality of imaging filters including individual filters having at least first, second, and third photoresponses, and at least one reference filter... Omnivision Technologies Inc








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