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Orthodyne Electronics Corporation patents

Recent patent applications related to Orthodyne Electronics Corporation. Orthodyne Electronics Corporation is listed as an Agent/Assignee. Note: Orthodyne Electronics Corporation may have other listings under different names/spellings. We're not affiliated with Orthodyne Electronics Corporation, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Orthodyne Electronics Corporation-related inventors




Date Orthodyne Electronics Corporation patents (updated weekly) - BOOKMARK this page
10/13/16Methods and systems for aligning tooling elements of ultrasonic bonding systems
08/20/15Ribbon bonding tools and methods of using the same
05/28/15Wire loop forming systems and methods of using the same
01/15/15Systems and methods for processing solar substrates
04/17/14Wire bonding tool
02/20/14Ultrasonic bonding systems and methods of using the same
11/21/13Ultrasonic bonding systems and methods of using the same
11/14/13Ultrasonic bonding systems and methods of using the same
11/07/13Systems and methods for processing ribbon and wire in ultrasonic bonding systems
09/05/13Methods and systems for aligning tooling elements of ultrasonic bonding systems
08/08/13Wire loop forming systems and methods of using the same
06/06/13Ultrasonic bonding systems and methods of using the same
05/16/13Ribbon bonding tools and methods of using the same
05/09/13Ultrasonic bonding systems including workholder and ribbon feeding system
02/21/13Ultrasonic bonding systems and methods of using the same
01/24/13Support system for a semiconductor device
11/01/12Solar substrate ribbon bonding system
11/01/12Support structures and clamping systems for semiconductor devices during wire and ribbon bonding operations
08/16/12Solar substrate ribbon bonding system
04/12/12Solar substrate ribbon bonding system
04/05/12Solar substrate ribbon bonding system
12/22/11Systems and methods for processing solar substrates
12/01/11Ribbon bonding tools and methods of using the same
11/03/11Cutting blade for a wire bonding system
09/01/11Semiconductor device support for bonding
08/26/10Ribbon bonding in an electronic package
12/03/09Ribbon bonding tool and process







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Orthodyne Electronics Corporation in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Orthodyne Electronics Corporation with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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