Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Similar
Filing Names

Osram Opto Semiconductors Gmbh
Osram Opto Semiconductors Gmbh A Corporation Of Germany
Osram Opto Semiconductors Gmbh A Germany Corporation
Osram Opto Semiconductors Gmbh_20100107
Osram Opto Semiconductors Gmbh_20100121
Osram Opto Semiconductors Gmbh_20131212
Osram Opto Semiconductors Gmbh_20100128

Osram Opto Semiconductors Gmbh patents


Recent patent applications related to Osram Opto Semiconductors Gmbh. Osram Opto Semiconductors Gmbh is listed as an Agent/Assignee. Note: Osram Opto Semiconductors Gmbh may have other listings under different names/spellings. We're not affiliated with Osram Opto Semiconductors Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "O" | Osram Opto Semiconductors Gmbh-related inventors


Phosphor particles with a protective layer, and producing the phosphor particles with the protective layer

Phospher particles with a Protective Layer and a method for producing phosphor particles with a protective layer are disclosed. In an embodiment the method includes treating Si-containing and/or Al-containing phosphor with an acid solution, wherein a pH value of the acid solution is maintained within a range of pH 3.5... Osram Opto Semiconductors Gmbh

Method for singulating an assemblage into semiconductor chips, and semiconductor chip

A method for singulating an assemblage into a plurality of semiconductor chips is specified, wherein an assemblage comprising a carrier, a semiconductor layer sequence and a metallic layer is provided. Separating trenches are formed in the carrier. The assemblage is subjected to mechanical loading, with the result that the metallic... Osram Opto Semiconductors Gmbh

Method for producing an optoelectronic component and an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In embodiments, the method includes A) providing an auxiliary carrier; B) applying a sacrificial layer on the auxiliary carrier; C) applying a converter layer on the sacrificial layer, which includes quantum dots embedded in a matrix material... Osram Opto Semiconductors Gmbh

Radiation body and producing a radiation body

A radiation body and a method for producing a radiation body are disclosed. In an embodiment, the radiation body includes a basic body configured to generate or absorb electromagnetic radiation, at least one main side having a rough structure of first elevations and at least one structured radiation surface structured... Osram Opto Semiconductors Gmbh

Method for producing a multiplicity of conversion elements, conversion element, and optoelectronic device

The invention relates to a method for producing a plurality of conversion elements (6) comprising the following steps: providing a substrate (1); applying a first mask layer (4) to the substrate (1), the first mask layer (4) being structured with through-holes (3) which completely penetrate the first mask layer (4);... Osram Opto Semiconductors Gmbh

Edge-emitting semiconductor laser and the production thereof

An edge-emitting semiconductor laser includes a semiconductor structure laterally bounded by first and second facets and having a central section and a first edge section, a layer sequence offset relative to the central section in the growth direction in the first edge section such that, in the first edge section,... Osram Opto Semiconductors Gmbh

Method of producing an electronic component

A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating... Osram Opto Semiconductors Gmbh

Method for structuring a nitride layer, structured dielectric layer, optoelectronic component, etching etching layers, and an environment sensor

The invention relates to a method for structuring a nitride layer (2), comprising the following steps: A) providing a nitride layer (2) formed with silicon nitride of a first type, B) defining regions (40) of said nitride layer (2) to be transformed, and C) inserting the nitride layer (2) into... Osram Opto Semiconductors Gmbh

Method for producing a semiconductor body

A method for producing a semiconductor body is disclosed. In an embodiment the method includes providing a semiconductor body, applying a first mask layer and a second mask layer to the semiconductor body and forming at least one second mask opening in the second mask layer and at least one... Osram Opto Semiconductors Gmbh

Optoelectronic semiconductor body and producing an optoelectronic semiconductor body

An optoelectronic semiconductor body includes a carrier, a semiconductor layer sequence having a first layer of a first conductivity type, a second layer of a second conductivity type and an active layer, wherein the first layer faces the carrier and the active layer generates or absorbs electromagnetic radiation when operated... Osram Opto Semiconductors Gmbh

Optoelectronic semiconductor component

An optoelectronic semiconductor component comprising a connection carrier with a mounting face and an electrically insulating base member. An optoelectronic semiconductor chip is arranged on the mounting face of the connection carrier. A radiation-transmissive body having four side faces is provided. The radiation-transmissive body surrounds the semiconductor chip in such... Osram Opto Semiconductors Gmbh

Unknown

A light-emitting component includes at least two radiation-emitting semiconductor chips of a first type configured to emit electromagnetic radiation during operation, and a light exit surface at a light exit side of the light-emitting component, wherein each of the radiation-emitting semiconductor chips of the first type includes a semiconductor layer... Osram Opto Semiconductors Gmbh

Semiconductor illuminating device

A semiconductor illuminating device is disclosed. The device includes an LED configured for emitting blue primary radiation and an LED phosphor arranged and configured such that it emits secondary light that forms at least one component of the illumination light, wherein the LED phosphor comprises a red phosphor for emitting... Osram Opto Semiconductors Gmbh

Semiconductor illuminating device

A semiconductor illuminating device is disclosed. The device includes an LED configured for emitting blue primary radiation and an LED phosphor arranged and configured such that it emits secondary light that forms at least one component of the illumination light, wherein the LED phosphor comprises a red phosphor for emitting... Osram Opto Semiconductors Gmbh

Method of producing a light-emitting device, and light-emitting device

A method of producing a light-emitting device includes providing a carrier having a carrier top face and at least one light-emitting semiconductor chip arranged on the carrier top face, wherein the semiconductor chip has a radiation emission face and is arranged on the carrier top face such that the radiation... Osram Opto Semiconductors Gmbh

Electronic component including a material comprising epoxysilane-modified polyorganosiloxane

The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one... Osram Opto Semiconductors Gmbh

Optoelectronic semiconductor component

An optoelectronic semiconductor device includes a carrier having a carrier top side, at least one optoelectronic semiconductor chip arranged at the carrier top side and having a radiation main side remote from the carrier top side, at least one bonding wire, at least one covering body on the radiation main... Osram Opto Semiconductors Gmbh

Leadframe and chip package comprising a leadframe

A leadframe includes first and second parts separated from each other, and each comprises at least one anchoring hole. The first part comprises a mounting area, the second part comprises an edge line facing the first part which is curved, and the first part comprises first, second and third portions... Osram Opto Semiconductors Gmbh

Device for converting the wavelength of electromagnetic radiation

A device for converting the wavelength of electromagnetic radiation is disclosed. In an embodiment the device includes a carrier, a conversion layer configured to at least partly convert a wavelength of the electromagnetic radiation and an intermediate layer, wherein the conversion layer is connected to the carrier via the intermediate... Osram Opto Semiconductors Gmbh

Method and device for inspecting an optoelectronic component

A method and a device for inspecting an optoelectronic component are disclosed. In an embodiment, the method includes exciting at least one electromagnetic resonant circuit, formed by the at least one optoelectronic component and the connection board, such that the at least one optoelectronic component emits electromagnetic radiation, wherein exciting... Osram Opto Semiconductors Gmbh

Optoelectronic component

An optoelectronic component is disclosed. In an embodiment the optical component includes an optoelectronic semiconductor chip including a radiation emission face, a deflection element configured to deflect electromagnetic radiation emitted by the optoelectronic semiconductor chip in a main emission direction which forms an angle deviating from 90° with the radiation... Osram Opto Semiconductors Gmbh

Laser component

A laser component includes a housing, a laser chip arranged in the housing, and a conversion element for radiation conversion arranged in the housing wherein the conversion element is irradiatable with laser radiation of the laser chip. A method of producing such a laser component includes providing component parts of... Osram Opto Semiconductors Gmbh

Method of adapting emitted radiation from light-emitting diodes in pixels of a display apparatus, and display apparatus

A method of adapting emitted radiation from light-emitting diodes in pixels of a display apparatus, wherein the display apparatus has a multiplicity of pixels each arranged for adjustable emitted radiation of mixed light, the pixels each include at least two light-emitting diodes and, in operation, the light-emitting diodes emit in... Osram Opto Semiconductors Gmbh

Bin insert for binning of light emitting devices, binning arrangement for binning of light emitting devices, and use of a binning arrangement for binning of light emitting devices

A bin insert for binning of light emitting devices comprises a hollow structural section (1). The hollow structural section (1) further comprises a top opening (13) and a bottom opening (14) at a top and a bottom end (11, 12) of the hollow structural section (1), respectively. A wall (15)... Osram Opto Semiconductors Gmbh

Optoelectronic semiconductor device and producing an optoelectronic semiconductor device

An optoelectronic semiconductor component is specified, comprising a multiplicity of radiation generating elements (14) arranged at a distance from one another on a surface (22) of a carrier element (20), wherein each of the radiation generating elements has a diameter of less than 10 μm in a direction perpendicular to... Osram Opto Semiconductors Gmbh

Method for producing a plurality of semiconductor chips and semiconductor chip

According to the present disclosure, a method for producing a plurality of semiconductor chips is provided with the following steps: a) providing a composite assembly, including a carrier, a semiconductor layer sequence and a functional layer; b) severing the functional layer by means of coherent radiation along a singulation pattern;... Osram Opto Semiconductors Gmbh

Optoelectronic semiconductor component, optoelectronic arrangement and producing an optoelectronic semiconductor component

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip; and an electrical connection point that contacts the optoelectronic semiconductor chip, wherein the electrical connection point covers the optoelectronic semiconductor chip on the bottom thereof at least in some areas, the electrical connection point includes a contact layer facing toward the... Osram Opto Semiconductors Gmbh

Lead frame and producing a chip housing

A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins... Osram Opto Semiconductors Gmbh

Optoelectronic module and a process for the production of an optoelectronic module

An optoelectronic module (100) is defined, comprising at least one semiconductor chip (10) provided for emitting electromagnetic radiation and at least one holding device (20) which is adapted to fix in place a device (50) for encoding at least one optical or electronic parameter of the optoelectronic module (100). Furthermore,... Osram Opto Semiconductors Gmbh

Optoelectronic semiconductor component and producing same

An optoelectronic semiconductor component and a method for producing the same are disclosed. In an embodiment the semiconductor component includes a semiconductor chip, which emits electromagnetic radiation of a first wavelength range from a radiation emission surface. The semiconductor component further includes a first conversion layer located on a lateral... Osram Opto Semiconductors Gmbh

Optoelectronic component

An optoelectronic component is disclosed. In an embodiment the optoelectronic component includes an active zone configured to produce electromagnetic radiation, wherein the active zone has at least two quantum films, wherein the first quantum film is arranged between a first barrier layer and a second barrier layer, wherein the second... Osram Opto Semiconductors Gmbh

Lead frame

A lead frame is disclosed. In an embodiment, the lead frame includes a frame having a plurality of lead frame sections, wherein the lead frame sections are connected to the frame, wherein the frame has at least two longitudinal sides and at least two transverse sides, wherein at least in... Osram Opto Semiconductors Gmbh

Semiconductor chip, producing a plurality of semiconductor chips and producing an electronic or optoelectronic device and electronic or optoelectronic device

A method for producing a multiplicity of semiconductor chips (13) is provided, comprising the following steps: providing a wafer (1) comprising a multiplicity of semiconductor bodies (2), wherein separating lines (9) are arranged between the semiconductor bodies (2), depositing a contact layer (10) on the wafer (1), wherein the material... Osram Opto Semiconductors Gmbh

Optoelectronic arrangement having a radiation conversion element and producing a radiation conversion element

An optoelectronic arrangement having a radiation conversion element and a method for producing a radiation conversion element are disclosed. In an embodiment, an optoelectronic arrangement includes a semiconductor chip having an active region configured to generate radiation, a radiation conversion element arranged downstream of the semiconductor chip in an emission... Osram Opto Semiconductors Gmbh

Optoelectronic element and optoelectronic component

The invention relates to an optoelectronic element comprising a semiconductor chip (12) that emits a blue-green light (4) during operation and has at least one light passage surface (12a) through which the blue-green light (4) emitted during operation passes and comprising a conversion element (3) which comprises fluorescent particles (31),... Osram Opto Semiconductors Gmbh

12/21/17 / #20170365752

Conversion element, optoelectronic semiconductor device and producing conversion elements

Disclosed is a conversion element (100). The conversion element (100) comprises: a conversion coating (16), which contains a wavelength-converting conversion material; a first encapsulation coating (30) on a first main surface (20) of the conversion coating, said first encapsulation coating having a thickness of between 10 μm and 500 μm;... Osram Opto Semiconductors Gmbh

12/21/17 / #20170365982

Edge-emitting semiconductor laser and operating a semiconductor laser

An edge-emitting semiconductor laser and a method for operating a semiconductor laser are disclosed. In an embodiment, the edge-emitting semiconductor laser includes an active zone within a semiconductor layer sequence and a stress layer. The active zone is configured for being energized only in a longitudinal strip perpendicular to a... Osram Opto Semiconductors Gmbh

12/14/17 / #20170358718

Optoelectronic semiconductor chip, producing an optoelectronic semiconductor chip, conversion element and phosphor for a conversion element

An optoelectronic semiconductor chip having a semiconductor body (1) that is suitable for emitting electromagnetic radiation in a first wavelength range from a radiation exit face (3) is specified. Furthermore, the semiconductor chip comprises a ceramic or monocrystalline conversion platelet (6) that is suitable for converting electromagnetic radiation in the... Osram Opto Semiconductors Gmbh

12/14/17 / #20170358719

Semiconductor layering sequence for generating visible light and light emitting diode

In at least one embodiment, the semiconductor layering sequence (1) is designed for generating light and comprises semiconductor columns (2). The semiconductor columns (2) have a respective core (21) made of a semiconductor material of a first conductivity type, and a core shell (23) surrounding the core (21) made of... Osram Opto Semiconductors Gmbh

12/07/17 / #20170352535

Method of producing an optoelectronic semiconductor chip and optoelectronic semiconductor chip

A method of producing an optoelectronic semiconductor chip includes in order: A) creating a nucleation layer on a growth substrate, B) applying a mask layer on to the nucleation layer, C) growing a coalescence layer, wherein the coalescence layer is grown starting from regions of the nucleation layer not covered... Osram Opto Semiconductors Gmbh

12/07/17 / #20170352700

Display device and producing a display device

A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. The active region is arranged between a first semiconductor layer and a second semiconductor layer. The semiconductor layer sequence includes a recess,... Osram Opto Semiconductors Gmbh

11/30/17 / #20170345966

Method of producing a semiconductor body

A method of producing a semiconductor body includes providing a semiconductor wafer having at least two chip regions and at least one separating region arranged between the chip regions, wherein the semiconductor wafer includes a layer sequence, an outermost layer of which has at least within the separating region a... Osram Opto Semiconductors Gmbh

11/30/17 / #20170345977

Conversion element and production method thereof

A method for the production of a conversion element (3) is disclosed, which comprises the following steps: A) provision of a first covering member (1) which has a first connecting surface (1a) and of a second covering member (2), B) insertion of at least one cavity (10) into the first... Osram Opto Semiconductors Gmbh

11/23/17 / #20170337031

Optoelectronic lighting device, video wall module and signal transmitter for a light signaling installation

An optoelectronic lighting device includes a carrier, a plurality of light-emitting optoelectronic components arranged on an upper side of the carrier, and at least one layer of a hydrophobic aerogel that protects the plurality of light-emitting optoelectronic components from influences of moisture. A video wall module includes the optoelectronic light... Osram Opto Semiconductors Gmbh

11/23/17 / #20170338217

Optoelectronic semiconductor chip and fabrication thereof

An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a first semiconductor layer sequence having a plurality of microdiodes, and a second semiconductor layer sequence having an active region. The first semiconductor layer sequence and the second semiconductor layer sequence are based on a nitride... Osram Opto Semiconductors Gmbh

11/23/17 / #20170338384

Semiconductor device and producing a plurality of semiconductor devices

A semiconductor device and a method for producing a plurality of semiconductor devices are disclosed. In an embodiment an optoelectronic semiconductor device includes a semiconductor chip having a semiconductor layer sequence with an active region, a radiation exit surface arranged parallel to the active region and a plurality of side... Osram Opto Semiconductors Gmbh

11/23/17 / #20170338626

Laser diode chip

A laser diode chip is described. In an embodiment the laser diode chip includes an n-type semiconductor region, a p-type semiconductor region and an active layer arranged between the n-type semiconductor region and the p-type semiconductor region, wherein the active layer is in the form of a single quantum well... Osram Opto Semiconductors Gmbh

11/16/17 / #20170325729

Pulse oximetry device and operating a pulse oximetry device

A pulse oximetry device includes a light emission device configured to emit light with a wavelength in a first wavelength interval and light with a wavelength in a second wavelength interval, a first light detector configured to detect light with a wavelength in the first wavelength interval, but not to... Osram Opto Semiconductors Gmbh

11/16/17 / #20170330757

Method for producing a semiconductor chip and semiconductor chip

A method for producing a semiconductor chip (100) is provided, in which, during a growth process for growing a first semiconductor layer (1), an inhomogeneous lateral temperature distribution is created along at least one direction of extent of the growing first semiconductor layer (1), such that a lateral variation of... Osram Opto Semiconductors Gmbh

11/16/17 / #20170330981

Component and producing a component

A component with a semiconductor body, and first and second metal layer is disclosed. The first metal layer is arranged between the semiconductor body and the second metal layer, the semiconductor body has a first semiconductor layer on a side which is averted from the first metal layer, a second... Osram Opto Semiconductors Gmbh

11/16/17 / #20170330996

Semiconductor chip and producing a semiconductor chip

A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).... Osram Opto Semiconductors Gmbh

11/16/17 / #20170330997

Optoelectronic component and producing an optoelectronic component

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a layer structure having an active zone for producing electromagnetic radiation, wherein the active zone is arranged in a first plane, wherein a recess is introduced into the surface of... Osram Opto Semiconductors Gmbh

11/16/17 / #20170331015

Optoelectronic component and illumination device

An optoelectronic component includes an optoelectronic semiconductor chip and an optical element, wherein the optical element includes a prism structure configured to split light emitted by the semiconductor chip into two beams and deflect the beams in a first direction relative to one another, and the optical element includes a... Osram Opto Semiconductors Gmbh

11/16/17 / #20170331018

Optoelectronic component and the production thereof

An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein the optoelectronic semiconductor chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body... Osram Opto Semiconductors Gmbh

11/16/17 / #20170331019

Optoelectronic semiconductor component and producing an optoelectronic semiconductor component

An optoelectronic semiconductor component includes a carrier having a carrier top side and an opposing carrier underside, wherein the carrier top sides each have a larger area than the associated carrier undersides, the carrier parts fixedly connect to one another via at least one potting body and the potting body... Osram Opto Semiconductors Gmbh

11/16/17 / #20170331257

Light-emitting semiconductor chip and producing a semiconductor light-emitting chip

A light-emitting semiconductor chip (100) is provided, having a first semiconductor layer (1), which is at least part of an active layer provided for generating light and which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing... Osram Opto Semiconductors Gmbh

11/09/17 / #20170323872

Optoelectronic component and producing same

An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body, a top side... Osram Opto Semiconductors Gmbh

11/09/17 / #20170324000

Optoelectronic semiconductor chip and producing optoelectronic semiconductor chips

An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. The first semiconductor layer... Osram Opto Semiconductors Gmbh

11/09/17 / #20170324001

Light-emitting semiconductor chip

A semiconductor chip includes a semiconductor body with a semiconductor layer sequence. An active region intended for generating radiation is arranged between an n-conductive multilayer structure and a p-conductive semiconductor layer. A doping profile is formed in the n-conductive multilayer structure which includes at least one doping peak.... Osram Opto Semiconductors Gmbh

11/09/17 / #20170324005

Optoelectronic semiconductor chip

According to the present disclosure, optoelectronic semiconductor chip includes at least one n-doped semiconductor layer, at least one p-doped semiconductor layer and one active layer arranged between the at least one n-doped semiconductor layer and the at least one p-doped semiconductor layer. The p-doped semiconductor layer is electrically contacted by... Osram Opto Semiconductors Gmbh

11/09/17 / #20170324012

Optoelectronic component and producing an optoelectronic component

An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame... Osram Opto Semiconductors Gmbh

11/02/17 / #20170317067

Optoelectronic semiconductor device and apparatus with an optoelectronic semiconductor device

An optoelectronic semiconductor device and an apparatus with an optoelectronic semiconductor device are disclosed. In an embodiment the optoelectronic semiconductor component has an emission region including a semiconductor layer sequence having a first semiconductor layer, a second semiconductor layer, and an active region arranged between the first semiconductor layer and... Osram Opto Semiconductors Gmbh

11/02/17 / #20170317231

Method of detaching a substrate, device that carries out such a method and pumping device that pumps etching solution

A method of debonding a substrate from a layer sequence includes a) providing a composite including a wafer with the substrate, the layer sequence applied to a growth surface of the substrate, and a sacrificial layer arranged between the substrate and the layer sequence, a carrier on a cover surface... Osram Opto Semiconductors Gmbh

11/02/17 / #20170317233

Optoelectronic component and the production thereof

An optoelectronic component includes an optoelectronic semiconductor chip including first and second electrical contacts, a first leadframe section including a first chip contact pad and a first soldering contact pad situated opposite the first chip contact pad, and a second leadframe section including a second chip contact pad and a... Osram Opto Semiconductors Gmbh

11/02/17 / #20170317240

Optoelectronic semiconductor chip

An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the... Osram Opto Semiconductors Gmbh

Patent Packs
11/02/17 / #20170317245

Method of applying a material to a surface

A method of applying a first material to a surface in a plurality of mutually separate coating regions includes: A) providing the surface containing the coating regions; B) producing a first masking layer on the surface by a photolithographic process, wherein the first masking layer includes a plurality of first... Osram Opto Semiconductors Gmbh

10/26/17 / #20170306224

Phosphor, producing a phosphor and use of a phosphor

A phosphor and a lighting device are disclosed. In an embodiment a lighting device includes a first phosphor disposed in a beam path of the primary radiation source, wherein the first phosphor has the formula Sr(SraM1−a)Si2Al2(N,X)6:D,A,B,E,G,L, wherein element M is selected from Ca, Ba, Mg or combinations thereof, wherein element... Osram Opto Semiconductors Gmbh

10/26/17 / #20170307177

Lighting assembly comprising a shutter that consists of a plurality of apertures

A light assembly includes a light source, and a micromechanical shutter arrangement having a two-dimensional arrangement of closable shutter openings, wherein at least one shutter opening has a rectangular shape with a length and a width, and the length is greater than the width. The light assembly may be configured... Osram Opto Semiconductors Gmbh

10/26/17 / #20170309481

Method for producing a plurality of semiconductor chips and semiconductor chip

A method for producing a plurality of semiconductor chips and a semiconductor chip are disclosed. The method includes applying a mask material on a growth surface of a growth substrate, wherein the growth surface includes sapphire, patterning the mask material into a multiply-connected mask layer by introducing openings into the... Osram Opto Semiconductors Gmbh

10/26/17 / #20170309777

Optoelectronic semiconductor chip comprising a multi-quantum well comprising at least one high barrier layer

An optoelectronic semiconductor chip including a multi-quantum well including at least one high barrier layer is disclosed. In an embodiment, the chip includes a p-type semiconductor region, an n-type semiconductor region and an active layer suitable for emission of radiation arranged between the p-type region and the n-type region, wherein... Osram Opto Semiconductors Gmbh

10/26/17 / #20170309794

Optoelectronic semiconductor chip and producing an optoelectronic semiconductor chip

In at least one embodiment, the optoelectronic semiconductor chip (100) comprises a semiconductor layer sequence (1) comprising a top side (2), a bottom side (3) diametrically opposite the top side (2), and an active layer (11) for generating electromagnetic radiation at a first wavelength (10), wherein the semiconductor chip (100)... Osram Opto Semiconductors Gmbh

10/26/17 / #20170310079

Laser component and producing same

A laser component has a housing, which includes a carrier having a cavity with a bottom surface and a sidewall, wherein the cavity widens starting from the bottom surface, the side wall is inclined relative to the bottom surface by an angle different from 45°, a laser chip, an emission... Osram Opto Semiconductors Gmbh

10/26/17 / #20170310081

Semiconductor laser diode

A semiconductor laser diode is provided. In an embodiment the semiconductor laser diode includes a semiconductor layer sequence having semiconductor layers disposed vertically one above the other. An active layer includes an active region having a width of greater than or equal to 30 μm emitting laser radiation during operation... Osram Opto Semiconductors Gmbh

10/19/17 / #20170301835

Method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device

A method for producing optoelectronic semiconductor devices and an optoelectronic semiconductor device are disclosed. In an embodiment, the method includes providing a plurality of semiconductor chips for producing electromagnetic radiation, arranging the plurality of semiconductor chips in a plane, forming a housing body composite, at least some regions of which... Osram Opto Semiconductors Gmbh

10/19/17 / #20170302058

Method for patterning a sequence of layers and semiconductor laser device

A method for patterning a sequence of layers and a semiconductor laser device are disclosed. In an embodiment the method creates at least one trench in the sequence of layers by two plasma etching methods. The semiconductor laser device comprises a sequence of layers including a semiconductor material and two... Osram Opto Semiconductors Gmbh

10/12/17 / #20170294428

Method of producing optoelectronic modules and an assembly having a module

A method produces a plurality of optoelectronic modules, and includes: A) providing a metallic carrier assembly with a plurality of carrier units; B) applying a logic chip, each having at least one integrated circuit, to the carrier units; C) applying emitter regions that generate radiation, which can be individually electrically... Osram Opto Semiconductors Gmbh

10/05/17 / #20170288091

Method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component

The invention provides an optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component (10), comprising the following steps: •A) arranging at least one semiconductor chip (2) on a carrier (1), •B) applying an electrically insulating photoresist (3) to a top side (1a) of the carrier (1) and... Osram Opto Semiconductors Gmbh

10/05/17 / #20170288094

Optoelectronic semiconductor component

Disclosed is an optoelectronic semiconductor component (1) comprising a semiconductor member (2) that has a succession of semiconductor layers including an active region (20) for generating radiation, a first semiconductor layer (21), and a second semiconductor layer (22). The active region is located between the first semiconductor layer and the... Osram Opto Semiconductors Gmbh

10/05/17 / #20170288108

Light-emitting diode device

An optoelectronic device includes a printed circuit board, and a light source arranged on a surface of the printed circuit board, said light source comprising at least one luminous face formed by at least one light-emitting diode wherein the light-emitting diode is electrically connected to the printed circuit board, wherein... Osram Opto Semiconductors Gmbh

09/28/17 / #20170278829

Optoelectronic semiconductor component and flashlight

Optoelectronic semiconductor component includes at least four different light sources each including at least one optoelectronic semiconductor chip, which during operation emit radiation having mutually different colour loci in the CIE standard chromaticity diagram, wherein the semiconductor component is designed to emit white or coloured light having a variable correlated... Osram Opto Semiconductors Gmbh

Patent Packs
09/28/17 / #20170279011

Method for producing a conversion lamina and conversion lamina

A method for producing at least one conversion lamina for a radiation-emitting semiconductor component is specified. In an embodiment, the conversion lamina includes a base material and a conversion substance embedded in the base material, wherein the conversion lamina has a thickness between 60 μm inclusive and 170 μm inclusive.... Osram Opto Semiconductors Gmbh

09/21/17 / #20170271295

Electronic device and producing an electronic device

An electronic device and a method for producing an electronic device are disclosed. In an embodiment the electronic device includes a first component and a second component and a sinter layer connecting the first component to the second component, the sinter layer comprising a first metal, wherein at least one... Osram Opto Semiconductors Gmbh

09/21/17 / #20170271438

Method of producing semiconductor chips

A method of producing a plurality of semiconductor chips includes a) providing a carrier substrate having a first major face and a second major face opposite the first major face; b) forming a diode structure between the first major face and the second major face, the diode structure electrically insulating... Osram Opto Semiconductors Gmbh

09/21/17 / #20170271553

Light emitting diode chip having temperature compensation of the wavelength

An optoelectronic semiconductor chip is disclosed. In an embodiment the optoelectronic semiconductor chip includes a p-type semiconductor region, an n-type semiconductor region, and an active layer arranged between the p-type semiconductor region and the n-type semiconductor region. The active layer is designed as a multiple quantum well structure, wherein the... Osram Opto Semiconductors Gmbh

09/14/17 / #20170263825

Method for producing an optoelectronic component, and optoelectronic component

A method for producing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, the method includes arranging an optoelectronic semiconductor chip and a reflector on a top side of a carrier film, arranging a potting material in a region between the optoelectronic semiconductor chip and the reflector... Osram Opto Semiconductors Gmbh

09/14/17 / #20170263829

Optoelectronic component

An optoelectronic component includes a carrier, a light source formed on the carrier, the light source having at least one luminous face formed by one or more light emitting diodes, wherein an at least partly transparent lamina is arranged on the luminous face, the lamina having a surface facing the... Osram Opto Semiconductors Gmbh

09/14/17 / #20170263830

Optoelectronic component

An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous surface formed by at least one light-emitting diode, wherein a transparent converter-free spacer is arranged on the luminous surface such that a distance is formed... Osram Opto Semiconductors Gmbh

09/14/17 / #20170263836

Production of a device having a strip-type leadframe

A method of producing a device includes providing a strip-shaped leadframe, wherein the leadframe includes leadframe sections arranged in a row next to one another and connection structures connecting the leadframe sections, the connection structures each connecting two adjacent leadframe sections; forming molded bodies on the leadframe, the molded bodies... Osram Opto Semiconductors Gmbh

09/14/17 / #20170264073

Method of producing a laser chip

A method of producing a laser chip includes providing a semiconductor wafer; creating a plurality of depressions arranged one behind another along a breaking direction on a top side of the semiconductor wafer, wherein 1) each depression includes a front boundary face and a rear boundary face successively in the... Osram Opto Semiconductors Gmbh

09/07/17 / #20170256691

Optoelectronic component

An optoelectronic component includes a housing including a base section and a cover section that delimit an interior of the housing, wherein an optoelectronic semiconductor chip is arranged on the base section, the cover section is formed by an optical element, and a reflective element including openings is arranged between... Osram Opto Semiconductors Gmbh

08/31/17 / #20170250323

Method of producing an optoelectronic semiconductor component

A method of producing an optoelectronic semiconductor component includes providing a semiconductor body; applying a photoconductive layer on a radiation exit surface of the semiconductor body, wherein the semiconductor body emits electromagnetic radiation during operation; exposing at least one sub-region of the photoconductive layer with electromagnetic radiation generated by the... Osram Opto Semiconductors Gmbh

08/24/17 / #20170243850

Electronic arrangement

An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered... Osram Opto Semiconductors Gmbh

08/17/17 / #20170236980

Optoelectronic semiconductor chip and producing the same

An optoelectronic semiconductor chip and a method for producing the same are disclosed. In an embodiment an optoelectronic semiconductor chip includes a support substrate, a semiconductor layer sequence having a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and an active... Osram Opto Semiconductors Gmbh

08/03/17 / #20170219763

Optelectonic arrangement and lighting device

An optelectonic arrangement and a lighting device are disclosed. In an embodiment the arrangement includes a semiconductor chip for generating radiation and a radiation conversion element located downstream of the semiconductor chip with respect to a radiation direction, wherein the radiation conversion element includes a plurality of conversion bodies each... Osram Opto Semiconductors Gmbh

08/03/17 / #20170221869

Method of producing optoelectronic component with integrated protection diode

A method of producing an optoelectronic component includes providing an optoelectronic semiconductor chip having a first surface on which a first electrical contact and a second electrical contact are arranged; arranging a protection diode on the first contact and the second contact; galvanically growing a first pin on the first... Osram Opto Semiconductors Gmbh

08/03/17 / #20170222087

Optoelectronic component and the production thereof

An optoelectronic component and a method for the producing an optoelectronic component are disclosed. In an embodiment, the component comprises an active zone for generating electromagnetic radiation, wherein the active zone adjoins at least one layer arrangement of a semiconductor material, wherein the layer arrangement comprises at least two layers,... Osram Opto Semiconductors Gmbh

08/03/17 / #20170222088

Optoelectronic semiconductor chip and producing the same

An optoelectronic semiconductor chip includes a semiconductor layer sequence and a carrier substrate, wherein the semiconductor layer sequence includes a first semiconductor region of a first conductivity type, a second semiconductor region of a second conductivity type and an active layer arranged between the first semiconductor region and the second... Osram Opto Semiconductors Gmbh

08/03/17 / #20170222092

Housing for an optical component, assembly, producing a housing and producing an assembly

A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side,... Osram Opto Semiconductors Gmbh

08/03/17 / #20170222094

Electronic component, optoelectronic component, component arrangement, and producing an electronic component

An electronic component, an optoelectronic component, a component arrangement, and a method for producing an electronic component are disclosed. In an embodiment, the method includes forming a sacrificial structure on a top side of a carrier by a photolithographic process from a photoresist layer, arranging an electronic semiconductor chip on... Osram Opto Semiconductors Gmbh

08/03/17 / #20170222103

Optoelectronic component

An optoelectronic component includes a housing having a cavity in which an optoelectronic semiconductor chip having an emission face that emits light rays and a transparent potting material are arranged, wherein the cavity includes at least one side wall at least partly reflecting light rays incident on the side wall... Osram Opto Semiconductors Gmbh

08/03/17 / #20170222105

Semiconductor device, illuminating device, and producing a semiconductor device

A semiconductor device includes a semiconductor chip including an active region provided to generate radiation; a radiation exit face extending parallel to a main plane of extension of the active region; a molding molded in places onto the semiconductor chip and that, at least in places, forms at least one... Osram Opto Semiconductors Gmbh








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Osram Opto Semiconductors Gmbh in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Osram Opto Semiconductors Gmbh with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###