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Phoenix Pioneer Technology Co Ltd patents


Recent patent applications related to Phoenix Pioneer Technology Co Ltd. Phoenix Pioneer Technology Co Ltd is listed as an Agent/Assignee. Note: Phoenix Pioneer Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Phoenix Pioneer Technology Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "P" | Phoenix Pioneer Technology Co Ltd-related inventors


Interposer substrate and manufacturing the same

A method of manufacturing an interposer substrate, including providing a carrier having a first circuit layer formed thereon, forming a plurality of conductive pillars on the first circuit layer, forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer, forming, on... Phoenix Pioneer Technology Co Ltd

Packaging substrate and fabricating the same

A packaging substrate is provided, which includes: an insulating layer; a plurality of conductive bumps formed on the insulating layer, wherein each of the conductive bumps has a post body exposed from the insulating layer and a conductive pad embedded in the insulating layer, the post body being integrally formed... Phoenix Pioneer Technology Co Ltd

Fabrication a package substrate

This disclosure provides a package substrate and its fabrication method. The package substrate comprises: a first wiring layer including at least one first metal wire; a conductive connecting unit including a first connecting unit and a second connecting unit on the first wiring layer; a circuit chip having at least... Phoenix Pioneer Technology Co Ltd

Package apparatus

A package apparatus comprises a first wiring layer, a first dielectric material layer, a first conductive pillar layer, a first buffer layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to the first surface. The first dielectric... Phoenix Pioneer Technology Co Ltd

Package substrate

This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering... Phoenix Pioneer Technology Co Ltd

Method of fabricating package substrates

This disclosure provides a package substrate fabrication method including: forming a first conductive wire and a first connecting unit on a first carrier substrate; forming a first dielectric layer on the first carrier substrate while enabling an end face of the first connecting unit to be exposed; bonding a second... Phoenix Pioneer Technology Co Ltd

Package substrate, package structure including the same, and their fabrication methods

This disclosure provides a package substrate, a package structure including the same and their fabrication methods. The package substrate comprises: a first wiring layer having a first metal wire and a first dielectric material layer surrounding the first metal wire; a conductive pillar layer formed on the first wiring layer... Phoenix Pioneer Technology Co Ltd

Package substrate

This disclosure provides a package substrate which includes: a first conductive layer having a first conductive area and a second conductive area; a package unit layer disposed on the first conductive layer and including a first circuit device having a first terminal connected to the first conductive area and a... Phoenix Pioneer Technology Co Ltd

Substrate structure and manufacturing method thereof

A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a metal carrier, a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer and a conductive pillar layer. The first conductive wiring layer is disposed on a surface of the metal carrier.... Phoenix Pioneer Technology Co Ltd

Method of fabricating package substrates

This disclosure provides a package substrate fabrication method including: providing a carrier; forming a first dielectric layer on the carrier while enabling the first dielectric layer to be patterned including an opening; forming a first conducting unit on the carrier while enabling the first conducting unit to fill up the... Phoenix Pioneer Technology Co Ltd

Package substrate and its fabrication method

This disclosure provides a package substrate and its fabrication method. The package substrate comprises: a first wiring layer including at least one first metal wire; a conductive connecting unit including a first connecting unit and a second connecting unit on the first wiring layer; a circuit chip having at least... Phoenix Pioneer Technology Co Ltd

Ic carrier of semiconductor package and manufacturing method thereof

The present invention discloses an IC Carrier of a semiconductor package and its manufacturing method. The IC Carrier of the semiconductor package includes a dielectric layer and a patterned conductor layer. The dielectric layer has at least one opening groove. The patterned conductor layer is embedded in the dielectric layer,... Phoenix Pioneer Technology Co Ltd

Package substrate

This disclosure provides a package substrate which includes a rigid dielectric material layer, a first wiring layer having at least one first metal wire formed on the rigid dielectric material layer, and a first flexible dielectric material layer formed on the first wiring layer.... Phoenix Pioneer Technology Co Ltd

Package substrate and its fabrication method

This disclosure provides a package substrate and its fabrication method. The package substrate comprises: a first dielectric material layer have an opening; a first conductive unit including a first part in the opening of the first dielectric material layer and a second part on the first dielectric material layer; and... Phoenix Pioneer Technology Co Ltd

Packaging module and substrate structure thereof

A substrate structure is provided, including: a circuit board having a plurality of wiring layers; a first circuit layer; a plurality of conductive posts disposed on the first circuit layer; a first insulating layer encapsulating the circuit board, the first circuit layer and the conductive posts; and a second circuit... Phoenix Pioneer Technology Co Ltd

Substrate structure and manufacturing method thereof

A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a dielectric material layer, a first conductive wiring layer, a second conductive wiring layer, a first conductive pillar layer, and a second conductive pillar layer. The first conductive wiring layer is disposed inside the dielectric material... Phoenix Pioneer Technology Co Ltd

Substrate structure and manufacturing method thereof

A substrate structure and a manufacturing method thereof are provided. The substrate structure comprises a dielectric material layer, a conductive wiring layer, a metal core layer, and a conductive pillar layer. The conductive wiring layer is disposed on a surface of the dielectric material layer. The metal core layer having... Phoenix Pioneer Technology Co Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Phoenix Pioneer Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Phoenix Pioneer Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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