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Qorvo Us Inc patents

Recent patent applications related to Qorvo Us Inc. Qorvo Us Inc is listed as an Agent/Assignee. Note: Qorvo Us Inc may have other listings under different names/spellings. We're not affiliated with Qorvo Us Inc, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "Q" | Qorvo Us Inc-related inventors




Date Qorvo Us Inc patents (updated weekly) - BOOKMARK this page
04/27/17 new patent  Acoustic resonator devices and methods providing patterned functionalization areas
04/27/17 new patent  Resonator structure with enhanced reflection of shear and longitudinal modes of acoustic vibrations
04/27/17 new patent  Radio frequency circuitry for carrier aggregation
04/20/17Deposition system for growth of inclined c-axis piezoelectric material structures
04/20/17Methods for fabricating acoustic structure with inclined c-axis piezoelectric bulk and crystalline seed layers
04/20/17Multi-stage deposition system for growth of inclined c-axis piezoelectric material structures
04/20/17Methods for producing piezoelectric bulk and crystalline seed layers of different c-axis orientation distributions
04/20/17Acoustic resonator structure with inclined c-axis piezoelectric bulk and crystalline seed layers
04/20/17Apparatus for a mulitple-input multiple-output (mimo) architecture
04/13/17Esd protection of capacitors using lateral surface schottky diodes
04/13/17Radio frequency front end circuitry for uplink carrier aggregation
04/06/17Active photonic device having a darlington configuration with feedback
04/06/17Methods of manufacturing a printed circuit module having a semiconductor device with a protective layer in place of a low-resistivity handle layer
04/06/17Active drain terminated distributed amplifier
03/30/17Compensation circuit for acoustic resonators
03/30/17Tunable compensation circuit for filter circuitry using acoustic resonators
03/23/17Substrates with integrated three dimensional solenoid inductors
03/23/17Substrates with integrated three dimensional inductors with via columns
03/23/17Tunable radio frequency filtering circuitry
03/16/17Backside semiconductor die trimming
03/16/17Linearization circuit for a multiple-stage rf power amplifier
03/02/17Stacked laminate inductors for high module volume utilization and performance-cost-size-processing-time tradeoff
03/02/17Radio frequency coupler circuitry
02/23/17Tunable transmit cancellation in acoustic receiver filters
02/16/17Low pressure encapsulant for size-reduced semiconductor package
02/16/17Radio frequency front end architecture with a switch topology for routing filter circuits while substantially reducing variations in the reactive loading at common ports
02/09/17Semiconductor package having a substrate structure with selective surface finishes
02/09/17Substrate structure with selective surface finishes for flip chip assembly
02/02/17Method of manufacture for a semiconductor device
02/02/17Reconfigurable rf filter
01/19/17Reconfigurable load modulation amplifier
01/19/17Reconfigurable load modulation amplifier
01/19/17Contact mems architecture for improved cycle count and hot-switching and esd
01/19/17Using an interconnect bump to traverse through a passivation layer of a semiconductor die
01/12/17Compensated programmable rf attenuator
01/12/17Antenna vswr rf duplexer
01/05/17Envelope tracking power converter circuitry
01/05/17Radio frequency filtering circuitry
12/15/16Compound varactor
12/08/16Rx shunt switching element-based rf front-end circuit
12/08/16Passive voltage-gain network
11/24/16Flip chip module with enhanced properties







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