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Rohinni Llc patents

Recent patent applications related to Rohinni Llc. Rohinni Llc is listed as an Agent/Assignee. Note: Rohinni Llc may have other listings under different names/spellings. We're not affiliated with Rohinni Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "R" | Rohinni Llc-related inventors

Semiconductor device on string circuit and making the same

An elongated light circuit includes an elongated circuit trace and a plurality of micro-sized, unpackaged LEDs disposed sequentially on the circuit trace. A height of the LEDs ranges from about 12.5 microns to about 200 microns. The elongated circuit trace and the LEDs are coated with a protective coating.... Rohinni Llc

Method and light diffusion

A display apparatus includes a substrate and a plurality of LEDs. Each LED is attached to the substrate via conductive pads on a side of the LED. A diffuser having light diffusing characteristics is aligned with the plurality LEDs against a surface of the substrate. The diffuser is aligned so... Rohinni Llc

Method for applying phosphor to light emitting diodes and apparatus thereof

A method of applying phosphor to an unpackaged Light-Emitting Diode (LED) die includes transferring the unpackaged LED die directly to a product substrate; disposing a coverlay on the product substrate to create a cavity around the unpackaged LED die; and applying phosphor to substantially fill the cavity around the unpackaged... Rohinni Llc

Method and transfer of semiconductor devices

A system to transfer an unpackaged die directly from a die holding substrate to a transfer location on a secondary substrate. The system includes a die separation device disposed adjacent to the die holding substrate to initiate separation of the unpackaged die from the die holding substrate. An energy source... Rohinni Llc

Semiconductor device on glass substrate and making the same

A lighting component including a plurality of die transferred to the glass substrate. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer... Rohinni Llc

Manufacture of circuit assembly with unpackaged semiconductor devices

An apparatus includes a carrier-to-circuit transfer mechanism that is configured to obtain one or more unpackaged semiconductor devices on a carrier substratum and directly transfer the one or more unpackaged semiconductor devices from the carrier substratum to a circuit assembly. The apparatus further includes an in-situ packager that is configured... Rohinni Llc

Apparatus and direct transfer of semiconductor devices

An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. The apparatus includes a first frame to hold the first substrate, and a second frame to hold the second... Rohinni Llc

Apparatus and direct transfer of semiconductor devices via stacking

An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape.... Rohinni Llc

Electrophotographic deposition of unpackaged semiconductor device

A method of depositing an unpackaged semiconductor die (“die”) onto a substrate. The method includes writing a latent image on a photosensitive drum. The latent image represents an outline for the die to be placed onto the substrate. The photosensitive drum is configured to have an electro-static charge and the... Rohinni Llc

Substrate with array of leds for backlighting a display device

An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of... Rohinni Llc

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Rohinni Llc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Rohinni Llc with additional patents listed. Browse our Agent directory for other possible listings. Page by