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Rohm And Haas Electronic Materials Cmp Holdings Inc patents


Recent patent applications related to Rohm And Haas Electronic Materials Cmp Holdings Inc. Rohm And Haas Electronic Materials Cmp Holdings Inc is listed as an Agent/Assignee. Note: Rohm And Haas Electronic Materials Cmp Holdings Inc may have other listings under different names/spellings. We're not affiliated with Rohm And Haas Electronic Materials Cmp Holdings Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "R" | Rohm And Haas Electronic Materials Cmp Holdings Inc-related inventors


Cmp polishing composition comprising positive and negative silica particles

The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions comprising a positively charged silica particle composition with from 3 to 20 wt. % in total, based on the total silica particle solids in the CMP polishing composition, of one or more negatively charged silica particle compositions in which... Rohm And Haas Electronic Materials Cmp Holdings Inc

Chemical mechanical polishing pads having a consistent pad surface microtexture

The present invention provides pre-conditioned chemical mechanical (CMP) polishing pads comprising a polymer, preferably, a porous polymer having a pad surface microtexture effective for polishing having a series of visibly intersecting arcs on the polishing layer surface, the intersecting arcs having a radius of curvature equal to or greater than... Rohm And Haas Electronic Materials Cmp Holdings Inc

Apparatus for shaping the surface of chemical mechanical polishing pads

The present invention provides apparati for pre-conditioning polymeric, preferably, porous polymeric, chemical mechanical (CMP) polishing pads or layers and polishing a substrate that comprise a rotary grinder assembly having a rotor with a grinding surface of a porous abrasive material, a flat bed platen for holding the CMP polishing pad... Rohm And Haas Electronic Materials Cmp Holdings Inc

High planarization efficiency chemical mechanical polishing pads and methods of making

A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising a curative and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.3 to 9.8 wt. % and formed from a... Rohm And Haas Electronic Materials Cmp Holdings Inc

Auto catch apparatus and use in making chemical mechanical polishing pads

The present invention provides an apparatus for use in mixing and dispensing a curable fluid stream (stream) into an open mold to fill the mold to make polishing pads for chemical mechanical planarization of substrates. The apparatus comprises an actuator frame on which is mounted (i) a set of two... Rohm And Haas Electronic Materials Cmp Holdings Inc

Tapering poromeric polishing pad

The method forms a porous polyurethane polishing pad by coagulating thermoplastic polyurethane to create a porous matrix having large pores extending upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. Heating a press to temperature below or above the softening... Rohm And Haas Electronic Materials Cmp Holdings Inc

Tapered poromeric polishing pad

The porous polyurethane polishing pad includes a porous polyurethane matrix having large pores extending upward from a base surface and open to a polishing surface. A series of pillow structures is formed from the porous matrix that include the large pores and the small pores. The pillow structures have a... Rohm And Haas Electronic Materials Cmp Holdings Inc

Low-defect-porous polishing pad

The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates with a polishing fluid and relative motion between the polishing pad and the at least one of semiconductor, optical and magnetic substrates. The polishing layer has an open-cell polymeric matrix, a polishing... Rohm And Haas Electronic Materials Cmp Holdings Inc

Thermoplastic poromeric polishing pad

The porous polyurethane polishing pad includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores are interconnected with small pores. The porous matrix is a blend of two thermoplastic polymers. The first thermoplastic polyurethane has by molecular... Rohm And Haas Electronic Materials Cmp Holdings Inc

High removal rate chemical mechanical polishing pads and methods of making

A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising (i) one or more diisocyanate, polyisocyanate or polyisocyanate prepolymer, (ii) from 40 to 85 wt. % based on the total weight of (i)... Rohm And Haas Electronic Materials Cmp Holdings Inc

Debris-removal groove for cmp polishing pad

The invention provides a polishing pad suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polishing layer having a polymeric matrix, a thickness and a polishing track representing a working region of the polishing layer for polishing or planarizing. Radial... Rohm And Haas Electronic Materials Cmp Holdings Inc

Polishing layer analyzer and method

A polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.... Rohm And Haas Electronic Materials Cmp Holdings Inc

Chemical mechanical polishing pad, polishing layer analyzer and method

A chemical mechanical polishing pad, polishing layer analyzer is provided, wherein the analyzer is configured to detect macro inhomogeneities is polymeric sheets and to classify the polymeric sheets as either acceptable or suspect.... Rohm And Haas Electronic Materials Cmp Holdings Inc

Method of manufacturing chemical mechanical polishing pads

A method of manufacturing chemical mechanical polishing pads is provided, wherein an automated inspection system is configured to detect macro inhomogeneities is skived sheets and to classify the skived sheets as either acceptable or suspect; wherein the acceptable skived sheets are further processed to form polishing layers of chemical mechanical... Rohm And Haas Electronic Materials Cmp Holdings Inc

Polishing pad and producing same

The purpose of the present invention is to provide: a polishing pad having a high polishing rate and excellent planarizing properties; and a method for producing the polishing pad. A polishing pad which has a polishing layer comprising a polyurethane resin foam, said polishing pad being characterized in that a... Rohm And Haas Electronic Materials Cmp Holdings Inc








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