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S o i tec Silicon On Insulator Technologies
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S o i tec Silicon On Insulator Technologies patents

Recent patent applications related to S o i tec Silicon On Insulator Technologies. S o i tec Silicon On Insulator Technologies is listed as an Agent/Assignee. Note: S o i tec Silicon On Insulator Technologies may have other listings under different names/spellings. We're not affiliated with S o i tec Silicon On Insulator Technologies, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | S o i tec Silicon On Insulator Technologies-related inventors




Date S o i tec Silicon On Insulator Technologies patents (updated weekly) - BOOKMARK this page
04/18/13Three dimensional structures having improved alignments between layers of microcomponents
02/14/13Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods
02/14/13Methods of forming bonded semiconductor structures in 3d integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods
02/14/13Three dimensionally integrated semiconductor systems including photoactive devices and semiconductor-on-insulator substrates, and methods of forming such three dimensionally integrated semiconductor systems
01/24/13Bonding surfaces for direct bonding of semiconductor structures
10/04/12Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
10/04/12Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods
10/04/12Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
08/23/12Iii-v semiconductor structures with diminished pit defects and methods for forming the same
08/09/12Metallic carrier for layer transfer and methods for forming the same
07/26/12Precise oxide dissolution
06/28/12Strain relaxation using metal materials and related structures
06/21/12Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
04/19/12Etching composition, in particular for silicon materials, characterizing defects on surfaces of such materials and process of treating such surfaces with the etching compostion
04/05/12Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods
04/05/12Systems and methods for forming semiconductor materials by atomic layer deposition
03/29/12Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride
02/02/12Fabricating a multilayer structure with circuit layer transfer
01/19/12Fabrication of substrates with a useful layer of monocrystalline semiconductor material
12/15/11Systems and methods for a gas treatment of a number of substrates
12/01/11Relaxation and transfer of strained material layers
12/01/11Adaptation of the lattice parameter of a layer of strained material
11/24/11Iii-v semiconductor structures and methods for forming the same
11/24/11Method of fabricating a back-illuminated image sensor
11/24/11Methods of forming semiconductor structures comprising direct bonding of substrates
11/17/11Method of producing a layer of cavities
11/17/11Three dimensional structures having improved alignments between layers of microcomponents
11/03/11Method for manufacturing components
09/29/11Test method on the support substrate of a substrate of the "semiconductor on insulator" type
09/29/11Treatment for bonding interface stabilization
09/29/11Method of fabricating a release substrate
09/29/11Optoelectronic substrate and methods of making same
09/22/11Process for fabricating a multilayer structure with post-grinding trimming
09/08/11Electronic devices with improved ohmic contact
09/08/11Forming structures that include a relaxed or pseudo-relaxed layer on a substrate
09/01/11Uv absorption based monitor and control of chloride gas stream
08/11/11Method to fabricate and treat a structure of semiconductor-on-insulator type, enabling displacement of dislocations, and corresponding structure
08/11/11Method of producing a silicon-on-sapphire type heterostructure
07/28/11Methods for relaxation and transfer of strained layers and structures fabricated thereby
07/28/11Patterned thin soi
07/28/11Process for manufacturing a structure comprising a germanium layer on a substrate
06/30/11Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters
05/19/11Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods
05/19/11Mixed trimming method
05/05/11Method of forming a composite laser substrate
04/28/11Progressive trimming method
03/31/11Process for bonding and transferring a layer
03/03/11Methods for fabricating compound material wafers
02/24/11Initiating molecular bonding
02/03/11Methods for improving the quality of group iii-nitride materials and structures produced by the methods
01/20/11Methods and structures for bonding elements
12/23/10Process for manufacturing a composite substrate
12/16/10Process for transferring a layer of strained semiconductor material
10/14/10Electronic device with controlled electrical field
09/30/10Semiconductor structure having a protective layer
08/26/10Transfer of high temperature wafers
08/19/10Method for making a substrate of the semiconductor on insulator type with an integrated ground plane
08/12/10Method for reclaiming a surface of a substrate
08/05/10Precise oxide dissolution
07/29/10Method of fabricating a composite structure with a stable bonding layer of oxide
07/29/10Device for polishing the edge of a semiconductor substrate
07/15/10Method of fabricating epitaxially grown layers on a composite structure
07/01/10Method for fabricating a semiconductor substrate and semiconductor substrate
06/17/10Composite substrate and fabricating the same
04/29/10Defectivity of post thin layer separation by modification of its separation annealing
Patent Packs
04/08/10Relaxation of a strained material layer with application of a stiffener
02/25/10Methods of forming a layer of material on a substrate and structures formed therefrom
02/18/10(110) oriented silicon substrate and a bonded pair of substrates comprising said (110) oriented silicon substrate
01/21/10Transfer method with a treatment of a surface to be bonded
01/14/10Multilayer structure and fabrication thereof
12/31/09Method of fabricating an epitaxially grown layer
12/24/09Method of forming a device wafer with recyclable support
12/03/09Equipment for bonding by molecular adhesion
11/26/09Methods for making substrates and substrates formed therefrom
10/22/09Process for bonding by molecular adhesion
10/22/09Relaxation of a strained layer using a molten layer
09/17/09Method of fabricating an epitaxially grown layer
08/20/09Temperature-controlled purge gate valve for chemical vapor deposition chamber
07/30/09Methods for fabricating compound material wafers
07/26/12Epitaxial methods for reducing surface dislocation density in semiconductor materials
Patent Packs
11/04/10Method for transferring a layer from a donor substrate onto a handle substrate
07/29/10Epitaxial methods and structures for forming semiconductor materials
07/22/10Method for recycling a substrate, laminated water fabricating method and suitable recycled donor substrate
06/10/10Improved process for preparing cleaned surfaces of strained silicon
05/27/10Strain engineered composite semiconductor substrates and methods of forming same
05/06/10Methods of forming layers of semiconductor material having reduced lattice strain, semiconductor structures, devices and engineered substrates including same
01/14/10Strained layers within semiconductor buffer structures
08/13/09Optoelectronic substrate and methods of making same







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