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Samsung Electro mechanics Co Ltd
Samsung Electro mechanics Co Ltd university Of Seoul Industry Cooperation Foundation
Samsung Electro mechanics Co Ltd Korea University Research x26 Business Foundation
Samsung Electro mechanics Co Ltd Korea Advanced Institute Of Science And Technology
Samsung Electro mechanics Co Ltd korea Advanced Institute Of Science And Technology
Samsung Electro mechanics Co Ltd Industry Foundation Of Chonnam National University
Samsung Electro mechanics Co Ltd Clemson University
Samsung Electro mechanics Co Ltd Ymt Co Ltd
Samsung Electro mechanics Co Ltd korea University Industrial x26 Academic
Samsung Electro mechanics Co Ltd Of Suwon Republic Of Korea
Samsung Electro mechanics Co Ltd sungkyunkwan University Foundation For Corporate Collaboration
Samsung Electro mechanics Co Ltd_20100128
Samsung Electro mechanics Co Ltd_20131212
Samsung Electro mechanics Co Ltd_20100121
Samsung Electro mechanics Co Ltd_20100114
Samsung Electro mechanics Co Ltd x26 Korea Advanced Institute Of Science And Technology
Samsung Electro mechanics Co Ltd_20100107
Samsung Electro mechanics Co Ltd s

Samsung Electro mechanics Co Ltd patents


Recent patent applications related to Samsung Electro mechanics Co Ltd. Samsung Electro mechanics Co Ltd is listed as an Agent/Assignee. Note: Samsung Electro mechanics Co Ltd may have other listings under different names/spellings. We're not affiliated with Samsung Electro mechanics Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Samsung Electro mechanics Co Ltd-related inventors


 new patent  Coil component and manufacturing the same

A coil component includes a substrate and a coil portion disposed on at least one surface thereof. The coil portion includes a first coil pattern disposed on one surface of the substrate, a first insulating layer covering the first coil pattern and having a first surface facing the substrate and... Samsung Electro mechanics Co Ltd

 new patent  Coil component and manufacturing same

A coil component includes an insulating layer having a coil shape, first and second coil conductor layers on opposing surfaces of the insulating layer, each having a coil shape corresponding to that of the insulating layer, and an encapsulant encapsulating the insulating layer and the first and second coil conductor... Samsung Electro mechanics Co Ltd

 new patent  Multilayer ceramic capacitor and board having the same

There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor includes: three external electrodes disposed to be spaced apart from one another on a mounting surface of a ceramic body; first internal electrodes each including first and second lead portions connected to the... Samsung Electro mechanics Co Ltd

 new patent  Film capacitor

A film capacitor includes a capacitor body including a dielectric film and first and second internal electrodes, and first and second external electrodes disposed on the capacitor body and connected to the first and second internal electrodes, respectively. The dielectric film includes a base film formed of an insulating inorganic... Samsung Electro mechanics Co Ltd

 new patent  Multilayer capacitor and board having the same

A multilayer capacitor includes a capacitor body including dielectric layers, first and second internal electrodes alternately disposed, with one of the dielectric layers interposed therebetween, and first and second groove parts formed in first and second surfaces of the capacitor body opposing each other to extend in a first direction... Samsung Electro mechanics Co Ltd

 new patent  Semiconductor package and manufacturing the same

A semiconductor package includes a substrate including at least one mounted electronic device; a sealer disposed to seal the electronic device; and a conductive blocking film disposed on a surface of the sealer and a side surface of the substrate, wherein the substrate includes a spacer formed along an outer... Samsung Electro mechanics Co Ltd

 new patent  Bulk acoustic wave filter device

A bulk acoustic wave filter device includes a resonating part, an electrode connecting part, a first layer, and a second layer. The resonating part is disposed on a substrate, and the electrode connecting part connects electrodes of the resonating part. The first layer is disposed on the substrate, and the... Samsung Electro mechanics Co Ltd

 new patent  Bulk acoustic wave filter device and manufacturing the same

A bulk acoustic wave filter device and method thereof includes a first layer forming an air gap together with a substrate, a lower electrode disposed over the first layer, a piezoelectric layer disposed to cover a portion of the lower electrode, an upper electrode disposed over the piezoelectric layer, a... Samsung Electro mechanics Co Ltd

 new patent  Bulk acoustic wave resonator device

A bulk acoustic wave resonator device includes: a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed over a portion of the lower electrode; an upper electrode disposed on the piezoelectric layer; and a shape control layer covering an edge of a cavity disposed between the substrate... Samsung Electro mechanics Co Ltd

 new patent  Multilayer capacitor and board having the same

A multilayer capacitor and a board having the same includes external electrodes and internal electrodes. The external electrodes include connection portions formed on a mounting surface of a capacitor body and band portions formed on side surfaces of the capacitor body, and the internal electrodes include body portions overlapping each... Samsung Electro mechanics Co Ltd

Coil component and manufacturing the same

A coil component includes a body including a plurality of first and second coil patterns, which are alternately disposed, and insulating layers disposed therebetween. The first coil patterns may be connected to the second coil patterns adjacent to the first coil patterns by vias, a plurality of coils including at... Samsung Electro mechanics Co Ltd

Coil component

A coil component includes a body, a coil disposed inside of the body and forming one coil track when being viewed in a laminated direction, external electrodes disposed on an outer surface of the body. The coil track includes corner portions and linear portions connecting the respective corner portions to... Samsung Electro mechanics Co Ltd

Coil component

A coil component may include a body including a plurality of insulating layers having coil patterns disposed on the plurality of insulating layers. The coil pattern may include a coil portion, a leading portion disposed on one side of the insulating layer, and a connection portion connecting the coil portion... Samsung Electro mechanics Co Ltd

Bulk acoustic wave filter device and manufacturing the same

A bulk acoustic wave filter device includes a substrate, a lower electrode on the substrate, a piezoelectric layer covering at least a portion of the lower electrode, and an upper electrode covering at least a portion of the piezoelectric layer. The upper electrode has a density reduction layer disposed on... Samsung Electro mechanics Co Ltd

Acoustic resonator and method

An acoustic resonator including a substrate, an active vibration region including, sequentially stacked on the substrate, a lower electrode, a piezoelectric layer, and an upper electrode, and a horizontal resonance suppressing part formed from and disposed in the piezoelectric layer, the horizontal resonance suppressing part having piezoelectric physical properties that... Samsung Electro mechanics Co Ltd

Radio frequency switch circuit and apparatus having built-in coupler

A radio frequency switch circuit is described including a radio frequency switch and a coupler. The radio frequency switch includes a first band switch circuit connected between a first signal port and a common port, and configured to switch a first band signal. The coupler includes a first coupling wiring,... Samsung Electro mechanics Co Ltd

Multilayer ceramic capacitor and board having the same

A multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers; first and second internal electrodes disposed in the ceramic body, the first internal electrode having first and second lead portions exposed to a first surface of the ceramic body in a width direction, and the... Samsung Electro mechanics Co Ltd

Bulk acoustic wave filter

A bulk acoustic wave filter includes a substrate, a first electrode and a second electrode disposed on the substrate, a piezoelectric layer including a piezoelectric material, the piezoelectric layer disposed between the first and second electrodes, and a passive element disposed on one surface of a housing. The housing is... Samsung Electro mechanics Co Ltd

Thin film inductor and manufacturing method thereof

A thin film inductor includes a body including a coil part disposed therein, wherein the coil part includes a patterned insulating film disposed on a substrate and a coil pattern formed between the patterned insulating films, the coil pattern having a lower height than the insulating film, such that the... Samsung Electro mechanics Co Ltd

Power inductor with a chip structure

An inductor includes first and second coil patterns disposed in a single chip, and at least one common lead terminal electrically connected to respective end portions of the first and second coil patterns. The first and second coil patterns operate independently of each other, such that a range of a... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes a semiconductor chip having an active surface, the active surface having a connection pad disposed thereon, and an inactive surface opposing the active surface; an encapsulant encapsulating at least a portion of the semiconductor chip; an insulating layer disposed on the active surface of the... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposite the active surface; an encapsulant encapsulating at least some portions of... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package module

A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member... Samsung Electro mechanics Co Ltd

Bulk acoustic wave resonator and filter including the same

A bulk acoustic wave resonator includes a substrate, a first electrode and a second electrode formed on the substrate, and a piezoelectric layer provided between the first electrode and the second electrode. Either one or both of the first electrode and the second electrode include a molybdenum-tungsten alloy having a... Samsung Electro mechanics Co Ltd

Complex electronic component and manufacturing the same

A complex electronic component includes: an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes: first and second discharging electrodes having a gap disposed therebetween; a blocking layer disposed between the first and second discharging electrodes; and a discharging layer... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; and a second... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes a first connection member having a through hole, a semiconductor chip in the through hole, having an active surface with a connection pad and an inactive surface on an opposing side. An encapsulant encapsulates at least a portion of the first connection member and the... Samsung Electro mechanics Co Ltd

Wireless communication antenna including magnetic body

A wireless communication antenna includes: a magnetic body including a plurality of bar-shaped unit ribbons arranged in columns, wherein the unit ribbons have shape anisotropy and a radiation direction on a side of the wireless communication antenna; and a solenoid coil including conductive patterns disposed around the magnetic body.... Samsung Electro mechanics Co Ltd

Common gate amplifier circuit and power amplifier using the same

A power amplifier includes a common source amplifier and a common gate amplifier circuit. The common source amplifier circuit has a terminal connected to a radio frequency (RF) input terminal and uses a source terminal commonly as an input terminal and an output terminal of the power amplifier. The common... Samsung Electro mechanics Co Ltd

Acoustic wave filter device

An acoustic wave filter device includes a lower electrode disposed between a substrate and a piezoelectric layer, an upper electrode disposed on the piezoelectric layer, and an insulating layer disposed on the upper electrode. The insulating layer exposes portions of the upper electrode.... Samsung Electro mechanics Co Ltd

12/21/17 / #20170367186

Multilayer capacitor and board having the same

A multilayer capacitor include dielectric layers stacked in a direction perpendicular to a mounting surface of a capacitor body, and internal electrodes and an equivalent series inductance (ESL) control pattern formed on upper and lower portions of the dielectric layers, respectively. The internal electrodes have an area larger than that... Samsung Electro mechanics Co Ltd

12/21/17 / #20170367187

Multilayer ceramic electronic component and board having the same

A multilayer ceramic electronic component includes: a ceramic body including: an active part with dielectric layers interposed with a plurality of first and second internal electrodes; an upper cover part above the active part; a lower cover part below the active part and having a thickness greater than that of... Samsung Electro mechanics Co Ltd

12/21/17 / #20170367188

Capacitor component

A capacitor component includes a body including a plurality of dielectric layers having a stacked structure and a plurality of first internal electrodes and a plurality of second internal electrodes alternately disposed with dielectric layers disposed therebetween. A first external electrode is on a first surface and a second surface... Samsung Electro mechanics Co Ltd

12/14/17 / #20170358396

Electronic component having multilayer structure and manufacturing the same

An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body.... Samsung Electro mechanics Co Ltd

12/14/17 / #20170358534

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip; a second interconnection member disposed on the first interconnection member and the semiconductor chip and including... Samsung Electro mechanics Co Ltd

12/14/17 / #20170358548

Electronic component package and electronic device including the same

An electronic component package includes an electronic component, a redistribution layer electrically connected to the electronic component and having terminal connection pads, a passivation layer disposed on one side of the redistribution layer and having openings exposing at least portions of the terminal connection pads, and connection terminals disposed in... Samsung Electro mechanics Co Ltd

12/07/17 / #20170349493

Insulator composition and manufacturing method using the same

An insulator composition includes Al2O3 having a particle size of 120 to 500 nm. The insulator composition has a strength of 400 to 740 MPa and a particle size of 1 μm or less.... Samsung Electro mechanics Co Ltd

12/07/17 / #20170352481

Capacitor component

A capacitor component includes a body including a plurality of dielectric layers having a layered structure, and first internal electrodes and second internal electrodes alternately disposed with respective dielectric layers of the plurality of dielectric layers interposed therebetween, a first external electrode formed on a first surface and a second... Samsung Electro mechanics Co Ltd

12/07/17 / #20170352482

Multilayer capacitor and board having the same

A multilayer capacitor includes a ceramic body including a plurality of dielectric layers stacked to be disposed perpendicularly to a mounting surface of the ceramic body, and first and second internal electrodes alternately disposed, with respective dielectric layers interposed therebetween, the first and second internal electrodes being exposed to the... Samsung Electro mechanics Co Ltd

12/07/17 / #20170353160

Multiphase power supply having single comparator

A multiphase power supply includes a multiphase converter including first and second converters having differing operating phases, each of the first and second converters configured to convert input power into driving power, and transmit the driving power to a power amplifier, a detector configured to detect a voltage based on... Samsung Electro mechanics Co Ltd

11/30/17 / #20170345549

Chip inductor and manufacturing the same

A chip inductor comprises a laminate including a plurality of sheets stacked therein; a coil disposed in the laminate and including an exposed portion, in which a portion of the coil is exposed outwardly of at least one surface of the laminate; and a non-magnetic insulating layer disposed on an... Samsung Electro mechanics Co Ltd

11/30/17 / #20170345556

Coil electronic component and manufacturing the same

A coil electronic component includes: a body including a substrate and coil parts disposed on first and second surfaces of the substrate; and external electrodes formed on outer surfaces of the body and connected to the coil parts. A metal layer is disposed within the substrate.... Samsung Electro mechanics Co Ltd

11/30/17 / #20170345574

Multilayered ceramic capacitor, mounting structure of circuit board having thereon multilayered ceramic capacitor, packing unit for multilayered ceramic capacitor

There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second... Samsung Electro mechanics Co Ltd

11/30/17 / #20170346279

Complex electronic component

A complex electronic component includes a body including a first external electrode and a second external electrode, disposed on an external surface thereof and a laminate; a plurality of first electrodes and a plurality of second electrodes, disposed in the laminate and electrically connected to the first external electrode and... Samsung Electro mechanics Co Ltd

11/30/17 / #20170346341

Resonance module and wireless power transmitter including the same

A wireless power transmitter includes: a switching unit configured to receive a direct current (DC) voltage and to perform switching to output a first alternating current (AC) voltage; a piezoelectric transformer configured to receive the first AC voltage through a first piezoelectric element, and to output a second AC voltage... Samsung Electro mechanics Co Ltd

11/23/17 / #20170338039

Thin film capacitor and manufacturing the same

A thin film capacitor includes: a body formed by alternately stacking first and second electrode layers, with dielectric layers therebetween on a substrate. A plurality of first vias are disposed in the body and electrically connected to the first electrode layers. A plurality of second vias are disposed in the... Samsung Electro mechanics Co Ltd

11/23/17 / #20170338042

Thin-film capacitor and manufacturing the same

A thin-film capacitor includes: a body in which a plurality of dielectric layers and first and second internal electrodes are alternately disposed on a substrate; and first and second external electrode disposed on an external surface of the body. A plurality of vias are disposed in the body, a first... Samsung Electro mechanics Co Ltd

11/23/17 / #20170338399

Acoustic resonator and manufacturing the same

An acoustic resonator includes: a substrate; a resonance part including a lower electrode, a piezoelectric layer, and an upper electrode sequentially stacked on the substrate, and a frame formed on the upper electrode along an edge of the upper electrode; and a trench part formed in at least one side... Samsung Electro mechanics Co Ltd

11/23/17 / #20170338792

Common mode filter and manufacturing the same

A common mode filter includes: a body disposed on a substrate, wherein the body includes: a coil part including one or more coils and a through-hole formed in a central portion thereof; and a core part including a magnetic powder, disposed on the coil part, and filling the through-hole. A... Samsung Electro mechanics Co Ltd

11/16/17 / #20170329105

Optical imaging system

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens. The first lens has positive refractive power and a convex image-side surface. The second lens has negative refractive power. The third lens has negative refractive power. The fourth lens... Samsung Electro mechanics Co Ltd

11/16/17 / #20170330674

Coil component and manufacturing the same

A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion... Samsung Electro mechanics Co Ltd

11/16/17 / #20170330675

Common mode filter

A common mode filter includes a lower cover layer including a first magnetic particle, a filter layer disposed on an upper surface of the lower cover layer, and including a coil portion including a plurality of coils and a coil peripheral portion including a second magnetic particle, and an upper... Samsung Electro mechanics Co Ltd

11/16/17 / #20170330688

Thin film capacitor and manufacturing method thereof

A thin film capacitor includes a body including a lower electrode formed on a substrate, a plurality of first electrode layers, and a plurality of second electrode layers stacked alternately with the plurality of first electrode layers, with one of the dielectric layers interposed therebetween. The lower electrode and the... Samsung Electro mechanics Co Ltd

11/16/17 / #20170330814

Electronic component package and manufacturing the same

An electronic component package includes a frame having a cavity, an electronic component disposed in the cavity of the frame, a first metal layer disposed on an inner wall of the cavity of the frame, an encapsulant encapsulating the electronic component, and a redistribution layer disposed below the frame and... Samsung Electro mechanics Co Ltd

11/02/17 / #20170316879

Composite electronic component, manufacturing the same, board for mounting thereof, and packaging unit thereof

A composite electronic component composed of a composite body including a capacitor and an electrostatic discharge (ESD) protection device coupled to each other. The capacitor includes a ceramic body in which a plurality of dielectric layers and internal electrodes are stacked with a respective dielectric layer therebetween. The ESD protection... Samsung Electro mechanics Co Ltd

11/02/17 / #20170316882

Capacitor component

A capacitor component includes a body including a plurality of dielectric layers having a layered structure and a first internal electrode and a second internal electrode alternately disposed with respective dielectric layers of the plurality of dielectric layers disposed therebetween. A first external electrode is disposed on a first surface... Samsung Electro mechanics Co Ltd

11/02/17 / #20170317505

Thin film coil and electronic device having the same

There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on... Samsung Electro mechanics Co Ltd

11/02/17 / #20170317506

Thin film coil and electronic device having the same

There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on... Samsung Electro mechanics Co Ltd

11/02/17 / #20170317660

Bulk acoustic wave resonator and manufacturing the same

A bulk acoustic wave resonator may include: an air cavity; an etching stop layer and an etching stop part, which define a lower boundary surface and a side boundary surface of the air cavity; and a resonating part formed on an approximately planar surface, which is formed by a upper... Samsung Electro mechanics Co Ltd

10/26/17 / #20170309388

Inductor and manufacturing method thereof

An inductor includes a support having first and second coils formed on first and second surfaces thereof, respectively; a body embedding the support therein so that end portions of the first and second coils are exposed through first and second surfaces of the body opposing each other, and including a... Samsung Electro mechanics Co Ltd

Patent Packs
10/26/17 / #20170309403

Multilayer capacitor and board having the same

A multilayer capacitor includes a body including a capacitor body formed by layering a plurality of dielectric layers and a plurality of first and second internal electrodes in a width direction, the first and second internal electrodes including body portions overlapping each other and lead portions exposed to a mounting... Samsung Electro mechanics Co Ltd

10/26/17 / #20170309531

Electronic component package and manufacturing the same

An electronic component package includes a wiring part including an insulating layer, a conductive pattern formed on the insulating layer, and a conductive via connected to the conductive pattern through the insulating layer, an electronic component disposed on the wiring part, a frame disposed on the wiring part and having... Samsung Electro mechanics Co Ltd

10/26/17 / #20170309571

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the... Samsung Electro mechanics Co Ltd

10/26/17 / #20170310294

Common mode filter

A common mode filter includes a body portion including a plurality of external electrodes disposed externally on the body portion, a first filter portion disposed within the body portion and including a plurality of coil electrode layers, and a second filter portion disposed within the body portion and including a... Samsung Electro mechanics Co Ltd

10/19/17 / #20170301451

Coil electronic component and manufacturing method thereof

A coil electronic component includes a body and external terminals. The body includes a winding coil part and a pillar-shaped core part inserted inside of the winding coil part and formed of a magnetic metal. The external terminals are connected to the winding coil part and disposed on an external... Samsung Electro mechanics Co Ltd

10/19/17 / #20170301453

Coil electronic component

A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of... Samsung Electro mechanics Co Ltd

10/19/17 / #20170301468

Multilayer capacitor and manufacturing the same

A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part... Samsung Electro mechanics Co Ltd

10/19/17 / #20170301469

Method of manufacturing multilayer ceramic electronic component and multilayer ceramic electronic component

A method of manufacturing a multilayer ceramic electronic component includes forming external electrodes on end surfaces of a ceramic body, and more particularly, to forming external electrodes by attaching a sheet for forming an external electrode on a ceramic body. A multilayer ceramic electronic component thus formed has external electrodes... Samsung Electro mechanics Co Ltd

10/19/17 / #20170301632

Package and manufacturing the same

The method of manufacturing a package comprising: preparing a strip substrate having a plurality of separate package regions which are partitioned by a dicing region and via pads which are connected to one ends of plated tails which are divided to be disconnected in the dicing region; mounting at least... Samsung Electro mechanics Co Ltd

10/12/17 / #20170293104

Lens module

A lens module includes a first lens, a second lens, and a distance maintenance member disposed between the first lens and the second lens, the distance maintenance member having a hole for adjusting an amount of light. An inner circumferential surface of the hole includes a plurality of inclined surfaces... Samsung Electro mechanics Co Ltd

10/12/17 / #20170293110

Optical imaging system

An optical imaging system includes a first lens having refractive power; a second lens having refractive power; a third lens having refractive power and cemented to the second lens; a fourth lens having refractive power; a fifth lens having refractive power and cemented to the fourth lens; a sixth lens... Samsung Electro mechanics Co Ltd

10/12/17 / #20170294261

Common mode filter

A common mode filter includes a body portion including an external electrode disposed outwardly of the body portion, a plurality of coil electrode layers disposed within the body portion and electrically connected to the external electrode, and a shunt electrode layer disposed between portions of the plurality of coil electrode... Samsung Electro mechanics Co Ltd

10/12/17 / #20170294262

Method of manufacturing inductor and inductor

A method of manufacturing an inductor includes forming a step portion having a high-resolution pattern by using a photosensitive layer with photosensitive characteristics, and forming a low-resistance coil pattern by filling the step portion with a metal paste having a lower resistance than a photosensitive metal paste.... Samsung Electro mechanics Co Ltd

10/12/17 / #20170294469

Substrate for camera module and camera module having the same

A substrate for a camera module includes: a first substrate; an image sensor installed on the first substrate and a memory chip installed to be embedded in the first substrate. The first substrate includes a soft substrate portion disposed at a central portion of the first substrate, and a hard... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287619

Common mode filter

A multilayer common mode filter includes: a body including a coil part having a plurality of spiral coils, wherein the coil part has one lead portion connected to one of external electrodes disposed on the body and one or more dummy lead portions each connected to the other external electrodes,... Samsung Electro mechanics Co Ltd

Patent Packs
10/05/17 / #20170287639

Ceramic composition and multilayer capacitor having the same

A ceramic composition includes a ceramic powder and a phosphor (P). The phosphor (P) has a content of 1 to 2 wt %, based on a total weight of the ceramic powder not including the phosphor (P).... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287640

Multilayer ceramic electronic component and manufacturing the same

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the ceramic body, wherein the external electrodes include seed layers disposed on at least one surface of the ceramic body in a thickness direction, first electrode layers... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287796

Electronic component package

An electronic component package includes: a lower package, including a frame including a through-hole and a through-wiring, a first electronic component disposed in the through-hole of the frame, a redistribution layer disposed below the first electronic component and the frame and electrically connected to the first electronic component, and an... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287825

Fan-out semiconductor package and manufacturing same

A fan-out semiconductor package include a frame having a through hole; a semiconductor chip disposed in the through hole, and having an active surface, an inactive surface, and a side surface; an encapsulant disposed on one sides of the frame and the semiconductor chip, and in a space between the... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287839

Fan-out semiconductor package and manufacturing same

A fan-out semiconductor package includes a redistribution layer, the redistribution layer including a first insulating layer, a first wiring disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the first wiring, a line via passing through the second insulating layer continuously... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287852

Semiconductor package

A semiconductor package includes: a first substrate including a first ground conductor disposed on at least a second surface of a first surface and the second surface; a plurality of electronic elements mounted on the first surface and the second surface of the first substrate; a second substrate adhered to... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287853

Fan-out semiconductor package

The fan-out semiconductor package includes: a semiconductor chip having an active surface having a connection pad disposed thereon and an inactive surface disposed to oppose the active surface; a first capacitor disposed adjacently to the semiconductor chip; an encapsulant at least partially encapsulating the first connection member and the semiconductor... Samsung Electro mechanics Co Ltd

10/05/17 / #20170287856

Electronic component package

An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic... Samsung Electro mechanics Co Ltd

10/05/17 / #20170288458

Wireless power transmitter and controlling the same

A wireless power transmitter includes a resonator configured to transmit a detection signal; a period detector configured to detect a period of oscillation of an oscillation signal caused by remnants of the detection signal; and a controller configured to determine whether an external charging object is approaching in response to... Samsung Electro mechanics Co Ltd

10/05/17 / #20170288641

Baw filter and manufacturing the same

A bulk acoustic wave (BAW) filter includes: a substrate including a first mounting region and a second mounting region which are spaced apart from each other; a first fixing member disposed adjacent to the first mounting region; a second fixing member disposed adjacent to the second mounting region; a Tx... Samsung Electro mechanics Co Ltd

10/05/17 / #20170288645

Acoustic wave device and manufacturing the same

An acoustic wave device includes: a substrate; an acoustic wave generating part disposed on a surface of the substrate; a ground pad disposed on the surface of the substrate; a support part spaced apart from the acoustic wave generating part on the surface of the substrate; a shielding member disposed... Samsung Electro mechanics Co Ltd

09/28/17 / #20170278619

Coil device and apparatus including the same

A coil device includes a board, a first pattern formed on one surface of the board, and a second pattern formed on the other surface of the board. At least one pattern via electrically connects the first pattern and the second pattern to each other. A via region, corresponding to... Samsung Electro mechanics Co Ltd

09/28/17 / #20170278626

Composite electronic component

A composite electronic component includes a body having first and second external electrodes disposed on outer surfaces thereof and including a dielectric body; first and second electrodes disposed in the dielectric body and electrically connected to the first and second external electrodes, respectively; a third electrode disposed on the body... Samsung Electro mechanics Co Ltd

09/28/17 / #20170278631

Capacitor and manufacturing same

A capacitor includes a body having a first surface, a second surface, and a third surface and a fourth surface connecting the first surface to the second surface, and including a first internal electrode and a second internal electrode respectively having a first lead portion and a second lead portion... Samsung Electro mechanics Co Ltd

09/28/17 / #20170278637

Multilayer ceramic capacitor and manufacturing the same

A multilayer ceramic capacitor (MLCC) includes: a ceramic body having a plurality of dielectric layers, first internal electrodes, and second internal electrodes; and a first external electrode and a second external electrode, disposed on an exterior of the ceramic body. A plurality of via electrodes are disposed in the ceramic... Samsung Electro mechanics Co Ltd

09/28/17 / #20170278766

Fan-out semiconductor package

A fan-out semiconductor package includes: a fan-out semiconductor package may include: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant... Samsung Electro mechanics Co Ltd

09/28/17 / #20170278812

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the semiconductor chip; a second interconnection... Samsung Electro mechanics Co Ltd

09/28/17 / #20170279307

Wireless power controller and wireless power transmitter using the same

A wireless power transmitter includes a wireless power controller configured to receive an alternating current (AC) voltage, to convert the AC voltage into a direct current (DC) voltage, and to generate an induced current from the DC voltage according to a switching control for a transformer; and a resonator configured... Samsung Electro mechanics Co Ltd

09/28/17 / #20170279470

High-frequency signal predistortion device and nonlinear distortion correcting device for power amplifier

A high-frequency signal predistortion device includes a high-frequency signal estimator, a predistortion estimator, and a predistorter. The high-frequency signal estimator is configured to determine non-linear distortion characteristics of high-frequency signals transmitted by antennas. The predistortion estimator is coupled to the high-frequency signal estimator. The predistortion estimator is configured to determine... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271071

Method of manufacturing coil device and coil device

Disclosed are a method of manufacturing a coil device and a coil device, which includes a base layer and a coil pattern formed on a surface of the base layer. In an aspect, the method of manufacturing a coil device includes forming a seed layer of a coil by bonding... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271072

Cover and electronic device including the same

A cover and an electronic device are described including the same. The cover includes a center area, a slit, and an inductance part. The center area is disposed on a plate of the cover. The slit is connected to the center area. The inductance part surrounds the center area defined... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271082

Dielectric composition and multilayer ceramic capacitor containing the same

A multilayer ceramic capacitor includes a ceramic body including dielectric layers and first and second internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and first and second external electrodes disposed on outer surfaces of the ceramic body, wherein the dielectric layer contains zirconium (Zr), a... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271222

Electronic element package and manufacturing the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271272

Fan-out semiconductor package and manufacturing same

The present disclosure relates to a fan-out semiconductor package including a frame having a through hole, a semiconductor chip disposed in the through hole, a first encapsulant disposed in a space between the frame and the semiconductor chip, a second encapsulant disposed on one sides of the frame and the... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271573

Electronic element package and manufacturing the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, a cap enclosing the element, a bonding portion bonding the substrate to the cap, and blocking portions disposed on both sides... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271779

Polarization twist reflector for multiband communications

A polarization twist reflector comprising a first groove group and a second groove group. The first groove group is configured to comprise first grooves disposed on a metal plate in a first direction and having a first depth. The second groove group is configured to comprise second grooves disposed on... Samsung Electro mechanics Co Ltd

09/21/17 / #20170271923

Wireless power transmitter and controlling the same

A wireless power transmitter includes a common bridge circuit configured to apply a first alternating current (AC) voltage to a terminal of each of a first resonator and a second resonator of the resonators, a first sub-bridge circuit configured to apply a second alternating current (AC) voltage to another terminal... Samsung Electro mechanics Co Ltd

09/21/17 / #20170273184

Composite electronic component and board having the same

A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that... Samsung Electro mechanics Co Ltd








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