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Samsung Electro mechanics Co Ltd
Samsung Electro mechanics Co Ltd university Of Seoul Industry Cooperation Foundation
Samsung Electro mechanics Co Ltd Korea University Research x26 Business Foundation
Samsung Electro mechanics Co Ltd Korea Advanced Institute Of Science And Technology
Samsung Electro mechanics Co Ltd korea Advanced Institute Of Science And Technology
Samsung Electro mechanics Co Ltd Industry Foundation Of Chonnam National University
Samsung Electro mechanics Co Ltd Clemson University
Samsung Electro mechanics Co Ltd Ymt Co Ltd
Samsung Electro mechanics Co Ltd korea University Industrial x26 Academic
Samsung Electro mechanics Co Ltd Of Suwon Republic Of Korea
Samsung Electro mechanics Co Ltd sungkyunkwan University Foundation For Corporate Collaboration
Samsung Electro mechanics Co Ltd_20100128
Samsung Electro mechanics Co Ltd_20131212
Samsung Electro mechanics Co Ltd_20100121
Samsung Electro mechanics Co Ltd_20100114
Samsung Electro mechanics Co Ltd x26 Korea Advanced Institute Of Science And Technology
Samsung Electro mechanics Co Ltd_20100107
Samsung Electro mechanics Co Ltd s

Samsung Electro mechanics Co Ltd patents


Recent patent applications related to Samsung Electro mechanics Co Ltd. Samsung Electro mechanics Co Ltd is listed as an Agent/Assignee. Note: Samsung Electro mechanics Co Ltd may have other listings under different names/spellings. We're not affiliated with Samsung Electro mechanics Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Samsung Electro mechanics Co Ltd-related inventors


Camera module

A camera module includes a housing; a first lens module and a second lens module accommodated in the housing; a printed circuit board attached to the housing; an actuator disposed between the first and second lens modules and the housing and configured to move the first and second lens modules... Samsung Electro mechanics Co Ltd

Optical imaging system

An optical imaging system includes lenses sequentially disposed from an object side toward an imaging plane. A third lens, a fourth lens, and a fifth lens of the lenses each have a negative refractive power. An F number of the optical imaging system is 1.7 or less.... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package and photosensitive resin composition

A fan-out semiconductor package includes: a semiconductor chip having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the semiconductor chip; and a first connection member disposed on the active surface of the semiconductor chip, wherein... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

The present disclosure relates to a semiconductor package, and more particularly, to a fan-out semiconductor package in which connection terminals may extend outwardly of a region in which a semiconductor chip is disposed. In the fan-out semiconductor package, a circuit density of a redistribution layer may be increased even in... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip,... Samsung Electro mechanics Co Ltd

Wireless power transmitter

A wireless power transmitter includes a converter comprising at least one switching element, and configured to generate boosted input power; a resonator and a controller. The resonator is configured to receive the boosted input power as an alternating current (AC) power, and transmit a ping signal in a detection mode... Samsung Electro mechanics Co Ltd

Wireless power transmitter

A wireless power transmitter includes a converter, a resonator, and a controller. The converter includes switching elements forming a bridge circuit, and is configured to output an alternating current (AC) voltage in response to control signals. The resonator includes a resonant capacitor and a resonant coil, and is configured to... Samsung Electro mechanics Co Ltd

Bulk-acoustic wave resonator and manufacturing the same

A bulk-acoustic wave resonator includes: a membrane layer disposed on a substrate and forming a cavity; a lower electrode disposed on the membrane layer; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer, and including a frame part disposed at an edge of... Samsung Electro mechanics Co Ltd

Information transmitter

An information transmitter includes a transmitting coil configured to receive a coil voltage to generate a magnetic field; and a signal generator configured to receive a direct current (DC) voltage and operating switches to apply the coil voltage to the transmitting coil, for a first time constant in a first... Samsung Electro mechanics Co Ltd

Inverter and wireless power transmitter using the same

An inverter includes a pulse generator configured to generate a reference pulse signal having a first frequency; and a gate signal generator configured to apply a pulse width modulation control having a variable duty rate, based on a second frequency, to the reference pulse signal to generate a gate signal.... Samsung Electro mechanics Co Ltd

Imaging lens unit

Disclosed herein is an imaging lens unit, including: a first lens having a positive (+) power; a second lens having a negative (−) power; a third lens selectively having one of a positive (+) and negative (−) power; a fourth lens having a negative (−) power; and a fifth lens... Samsung Electro mechanics Co Ltd

Camera module actuator

An actuator includes a magnet, a driving coil facing the magnet, a driver, and a position calculation processor. The driver is configured to move the magnet in at least one of an optical axis direction and a direction perpendicular to the optical axis by applying a driving signal to the... Samsung Electro mechanics Co Ltd

Iris scanning camera module and mobile device including the same

An iris scanning camera module includes a housing having an internal space, and a first lens module and a second lens module inside the internal space. The first lens module and the second lens module have optical axes parallel to each other. An image sensor is configured to convert light... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a first component disposed in the through-hole; a second component disposed in the through-hole and attached to the first component; an encapsulant filling at least portions of spaces between walls of the through-hole and side surfaces of the... Samsung Electro mechanics Co Ltd

Wireless power transmitter

A power transmitter includes: a first resonator configured to wirelessly supply power to a power receiver and having an impedance that changes in response to a foreign material being proximate to the power transmitter; a second resonator having an impedance that changes in response to the foreign material being proximate... Samsung Electro mechanics Co Ltd

Antenna switch circuit with improved harmonic suppression characteristic

An antenna switch circuit includes: a first switch circuit connected between a first signal port for signal transmission and reception and an antenna port, and operated by a first gate signal; and a second switch circuit connected between a second signal port for signal transmission and reception and the antenna... Samsung Electro mechanics Co Ltd

Inductor

An inductor includes a body having a coil, a magnetic material surrounding the coil, and a resin; and an external electrode disposed on at least a surface of the body. The body disposed in the inductor includes a particle which may soften an external impact acting on the inductor, in... Samsung Electro mechanics Co Ltd

Multilayer capacitor and manufacturing method thereof

A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers.... Samsung Electro mechanics Co Ltd

Multilayer capacitor and board having the same

A multilayer capacitor includes a body including dielectric layers, and first and second internal electrodes alternately disposed with respective dielectric layers interposed therebetween, first and second groove parts formed in external surfaces of the body in a first direction in which the dielectric layers are stacked, having at least one... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole, having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface, and having a protrusion bump disposed on the connection pad; an encapsulant encapsulating... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant filling at least portions of spaces between walls of the through-hole... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant filling at least portions of spaces between walls of the through-hole... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a... Samsung Electro mechanics Co Ltd

Fan-out sensor package and camera module including the same

A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of... Samsung Electro mechanics Co Ltd

Wireless power transmitter

A wireless power transmitter includes: a current adjuster configured to convert an input power into a transmission current, which is periodically varied according to a transmission frequency; and a power transmitter configured to receive the transmission current and wirelessly transmit power according to the transmission frequency.... Samsung Electro mechanics Co Ltd

Multilayer ceramic capacitor and board having the same

A multilayer ceramic capacitor includes a ceramic body including an active portion including dielectric layers and internal electrodes that are alternately stacked and a margin portion disposed on outer surfaces of the active portion; and external electrodes disposed on outer surfaces of the ceramic body. The margin portion includes an... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole, a first encapsulant encapsulating at least portions of the first connection member and the semiconductor chip, a second connection member disposed on the first connection member and the semiconductor chip. The... Samsung Electro mechanics Co Ltd

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; an encapsulant encapsulating at least portions of the first interconnection member and the inactive surface of the... Samsung Electro mechanics Co Ltd

Wireless communication antenna and mobile device including the same

A wireless communication antenna comprises a magnetic body and coil portions. The coil portions have a solenoid shape formed around the magnetic body defining a core. The coil portions are spaced apart from each other and connected to each other in series. Magnetic fields radiated by the coil portions overlap... Samsung Electro mechanics Co Ltd

Acoustic wave resonator and filter including the same

An acoustic wave resonator includes: a first piezoelectric portion of a piezoelectric layer, disposed on a cavity and having a first average thickness; and a second piezoelectric portion of the piezoelectric layer, disposed adjacent to an edge of the first piezoelectric portion and having a second average thickness that is... Samsung Electro mechanics Co Ltd

Wireless power transmitter and controlling the same

A wireless power transmitter includes a switch circuit including switches connected to a transmission resonator; a current detector configured to detect a transient current induced in the transmission resonator; and a controller configured to control the switch circuit and adjust an output of the wireless power transmitter based on an... Samsung Electro mechanics Co Ltd

Camera module actuator

A camera module actuator includes, a magnet, a coil, a driver, and a position estimating processor. The coil is disposed to face the magnet. The driver is configured to move the magnet by applying a driving signal to the coil. The position estimating processor is configured to estimate a position... Samsung Electro mechanics Co Ltd

03/15/18 / #20180074296

Optical imaging system

An optical imaging system includes a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a negative refractive power, a fourth lens, a fifth lens, and a sixth lens having a positive refractive power and having a convex image-side shape,... Samsung Electro mechanics Co Ltd

03/15/18 / #20180074297

Optical imaging system

An optical imaging system includes lenses sequentially disposed from an object side toward an imaging plane. A stop is disposed between a third lens and a fourth lens. An object-side surface of the third lens may be concave, and a ratio TL/f of a distance TL from an object-side surface... Samsung Electro mechanics Co Ltd

03/15/18 / #20180074298

Optical imaging system

An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens having a negative refractive power, a fifth lens having a negative refractive power, a sixth lens, and a seventh lens having a positive refractive power. The first lens to seventh lens are sequentially... Samsung Electro mechanics Co Ltd

03/15/18 / #20180074534

Voltage dropping apparatus, voltage switching apparatus, and internal voltage supply apparatus using the same

A voltage dropping apparatus may include: a voltage dropping unit receiving an input voltage, outputting the input voltage in a first mode, and dropping a level of the input voltage in a second mode; a voltage output unit connected to the voltage dropping unit, receiving and outputting the input voltage... Samsung Electro mechanics Co Ltd

03/15/18 / #20180075971

Multilayer ceramic electronic component and manufacturing the same

A multilayer ceramic electronic component includes an inner layer part comprising dielectric layers and internal electrodes that are alternately disposed; and cover parts disposed on upper and lower surfaces of the inner layer part. The cover parts contain a nickel metal.... Samsung Electro mechanics Co Ltd

03/15/18 / #20180076147

Semiconductor package, manufacturing the same, and electronic device module

A semiconductor package includes a frame including a through-hole, an electronic component disposed in the through-hole, a redistribution portion disposed below the frame and the electronic component, a metal layer disposed on an inner surface of the frame, and a conductive layer disposed between the metal layer and the electronic... Samsung Electro mechanics Co Ltd

03/15/18 / #20180076156

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a processor chip disposed in the through-hole; a memory chip disposed in the through-hole and including a plurality of dies stacked on each other; an encapsulant encapsulating at least portions of the first interconnection member, the memory chip,... Samsung Electro mechanics Co Ltd

03/15/18 / #20180076178

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a first semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a first encapsulant encapsulating at least portions of the first interconnection member and the first semiconductor... Samsung Electro mechanics Co Ltd

03/08/18 / #20180067277

Camera module actuator

A camera module actuator is described including a magnet, a coil disposed to face the magnet, and a driver configured to apply a driving signal to the coil to move the magnet. The camera module actuator also includes a detector configured to detect a position of the magnet from a... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068775

Magnetic powder and inductor containing the same

A magnetic powder includes an insulating layer formed of a polymer material which is directly coated on a powder particle core having magnetic properties. An inductor containing the same is also provided. The magnetic powder does not include a separate inorganic insulating layer between the powder particle core and the... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068793

Capacitor component

A capacitor component includes a body, a plurality of internal electrodes disposed in the body, connection electrodes extended in a thickness direction of the body and electrically connected to the plurality of internal electrodes, upper electrodes disposed on an upper surface of the body and electrically connected to the connection... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068794

Capacitor component

A capacitor component includes a plurality of unit laminates, each comprising a body with a stacked structure including a plurality of internal electrodes and connection electrodes that extend in a stacking direction of the body and electrically connect to the plurality of internal electrodes, and pad portions between adjacent unit... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068795

Multilayer ceramic electronic component and manufacturing the same

A multilayer ceramic electronic component includes: a ceramic body including dielectric layers and internal electrodes, stacked to be alternately exposed to one end surface and the other end surface of the ceramic body, with each of the dielectric layers interposed therebetween; and external electrodes disposed on outer surfaces of the... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068796

Multilayer capacitor and board having the same

A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately stacked with dielectric layers interposed therebetween. A first via electrode penetrates through the plurality of first internal electrodes and is exposed at the first surface of the capacitor body. A second via electrode... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068798

Thin film capacitor

A thin film capacitor includes a body having first and second electrode layers and first and second dielectric layers alternately stacked on a substrate. A thickness of the first dielectric layer is 1.2 to 3 times that of the second dielectric layer. Therefore, leakage current characteristics of the dielectric layers... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068911

Board for electronic component package, electronic component package, and manufacturing board for electronic component package

A board for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068915

Electronic element package and manufacturing the same

The present disclosure relates to an electronic element package and a method of manufacturing the same. The electronic element package includes a substrate, an element disposed on the substrate, and a cap enclosing the element. One of the substrate and the cap includes a groove, the other of the substrate... Samsung Electro mechanics Co Ltd

03/08/18 / #20180068952

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the... Samsung Electro mechanics Co Ltd

03/08/18 / #20180070458

Multi-layered substrate and manufacturing the same

A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting... Samsung Electro mechanics Co Ltd

03/01/18 / #20180059383

Imaging lens system

An imaging lens system includes a first lens having a positive refractive power, a second lens having a negative refractive power, a third lens having a positive refractive power, a fourth lens having a positive refractive power, a fifth lens having a negative refractive power, and a sixth lens having... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061533

Resistor element and resistor element assembly

A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061548

Composite ferrite sheet, manufacturing the same, and electronic device including the same

A composite ferrite sheet may include a ferrite sheet, and composite sheets attached to both surfaces of the ferrite sheet, respectively, and having insulating properties. The composite sheet may be formed of a resin containing metal powder particles. The composite ferrite sheet may be easily manufactured and have improved shielding... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061550

Magnetic composition and inductor including the same

A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 μm to 28 μm; the second magnetic metal particles have an average particle size of 1 μm to 4.5 μm; and the third magnetic metal particles include... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061552

Thin film type coil component

A thin film type coil component that includes a body having a coil embedded therein and including a composite of magnetic powder particles and a polymer, and external electrodes disposed on at least portions of external surfaces of the body. The body includes an upper body portion disposed on an... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061553

Chip electronic component including stress buffer layer

A chip electronic component includes a body including a coil portion disposed therein and a magnetic metallic powder, and a stress buffer layer disposed on a surface of the body. A Young's modulus of the stress buffer layer is less than that of the body.... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061555

Inductor and manufacturing the same

There are provided an inductor and a method of manufacturing the same. The inductor includes: a body including a plurality of coil layers and high-rigidity insulating layers disposed on and beneath the plurality of coil layers; and external electrodes disposed on external surfaces of the body and connected to the... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061561

Inductor array component and board for mounting the same

An inductor array component includes a body including a plurality of coil portions a coil included in the coil portions, external electrodes connected to both end portions of the coil and disposed on an outer surface of the body, a first blocking layer disposed between the coil portions, and a... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061571

Multilayer ceramic electronic component and manufacturing the same

There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061573

Thin-film capacitor

A thin-film capacitor includes a body in which a plurality of dielectric layers and first and second electrode layers are alternately stacked on a substrate, first and second electrode pads are on external surfaces of the body, and a plurality of vias are within the body. Among the plurality of... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061581

Thin film capacitor and manufacturing method thereof

A thin film capacitor includes a capacitor body formed by alternately stacking first and second electrode layers and a dielectric layer on a substrate, and having the second electrode layer disposed in an uppermost portion thereof, and a stress alleviation layer formed on the uppermost second electrode layer. The stress... Samsung Electro mechanics Co Ltd

Patent Packs
03/01/18 / #20180061729

Semiconductor package

A semiconductor package includes a first electronic component disposed on a first surface of a substrate, a first conductive member disposed on the first electronic component, and a sealing member configured to cover the first electronic component and forming a hole to expose the first conductive member to an exterior... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061794

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061795

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface; a second interconnection member disposed on the first interconnection member and the active surface of the semiconductor... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061801

Fan-out semiconductor package module

A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member... Samsung Electro mechanics Co Ltd

03/01/18 / #20180061807

Semiconductor package and manufacturing the same

A semiconductor package includes a first substrate, a second substrate, a sealing member, a first conductive member, and a second conductive member. Electronic components are disposed on both surfaces of the first substrate. The second substrate is disposed on a surface of the first substrate. The sealing member is disposed... Samsung Electro mechanics Co Ltd

03/01/18 / #20180062443

Wireless power transmitter and wirelessly transmitting power

A wireless power transmitter includes: a converter including switching elements forming a bridge circuit, wherein the converter is configured to output an alternating current (AC) voltage including a frequency determined according to an operating frequency of at least one switching element among the switching elements; a resonator including an inductor... Samsung Electro mechanics Co Ltd

03/01/18 / #20180062606

Radio frequency transmitter having improved receive band rejection function

A radio frequency transmitter includes a transmit circuit configured to generate a transmit signal; a receive band rejection filter comprising a capacitor and an inductor resonating with each other to reject a receive frequency band from the transmit signal, wherein a ratio value of a capacitance value of the capacitor... Samsung Electro mechanics Co Ltd

03/01/18 / #20180062608

Bulk acoustic resonator and filter including the same

A bulk acoustic resonator includes: a substrate including an upper surface on which a substrate protection layer is disposed; and a membrane layer forming a cavity together with the substrate, wherein a thickness deviation of either one or both of the substrate protection layer and the membrane layer is 170... Samsung Electro mechanics Co Ltd

03/01/18 / #20180062619

Bulk acoustic filter device and manufacturing the same

A bulk acoustic filter device includes: a substrate including a through hole formed by a first recess and a second recess adjacent to the first recess; a membrane layer forming a cavity with the substrate; a filter including a lower electrode disposed on the membrane layer, a piezoelectric layer disposed... Samsung Electro mechanics Co Ltd

03/01/18 / #20180062620

Bulk-acoustic wave filter device

A bulk-acoustic wave filter device includes: a lower electrode layer disposed on the substrate; a bonding part disposed on the lower electrode layer, at an edge of the substrate; a ground part spaced apart from the bonding part; and a flow suppressing part disposed between the bonding part and the... Samsung Electro mechanics Co Ltd

03/01/18 / #20180062693

Unified communications apparatus

A communications apparatus includes: a communications IC including a first RF pin, a second RF pin, and a third RF pin; a first front-end module connected between the first RF pin and a first RF terminal to provide a first signal path for wireless Tx and Rx, a second signal... Samsung Electro mechanics Co Ltd

03/01/18 / #20180063961

Board having electronic element, manufacturing the same, and electronic element module including the same

A printed circuit board includes a board portion and an electronic element. The board portion includes a first substrate having an element accommodating portion and second substrates laminated on outer surfaces of the first substrate. The electronic element is disposed in the element accommodating part. The electronic element includes a... Samsung Electro mechanics Co Ltd

02/22/18 / #20180053036

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface with connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the... Samsung Electro mechanics Co Ltd

02/22/18 / #20180053719

Semiconductor package and electronic device module using the same

A semiconductor package includes a frame having a through hole, an electronic component disposed in the through hole, a metal layer disposed on either one or both of an inner surface of the frame and an upper surface of the electronic component, a redistribution portion disposed below the frame and... Samsung Electro mechanics Co Ltd

02/22/18 / #20180053732

Fan-out semiconductor package

A fan-out semiconductor package includes a semiconductor chip disposed in a through-hole of a first connection member having the through-hole and a second connection member disposed on an active surface of the semiconductor chip. A plurality of dummy vias surrounding the semiconductor chip are disposed in the first connection member.... Samsung Electro mechanics Co Ltd

Patent Packs
02/22/18 / #20180054182

Bulk acoustic wave resonator

A bulk acoustic wave resonator includes: a support part disposed on a substrate; a layer disposed on the support part, wherein an air cavity is formed between the support part, the substrate and the layer; and a frame extending along the layer, within the air cavity, and spaced apart from... Samsung Electro mechanics Co Ltd

02/15/18 / #20180045914

Optical imaging system

An optical imaging system includes a first lens having a positive refractive power, an image-side surface of the first lens being concave, a second lens, a third lens, an image-side surface of the third lens being concave, a fourth lens, a fifth lens, an image-side surface of the fifth lens... Samsung Electro mechanics Co Ltd

02/15/18 / #20180047493

Coil component

A coil component includes a body including coil patterns and a plurality of trenches; and external electrodes electrically connected to the coil patterns. The plurality of trenches include a magnetic material, and at least one edge of a trench disposed outside of an outermost coil pattern among the coil patterns... Samsung Electro mechanics Co Ltd

02/15/18 / #20180047683

Fan-out semiconductor package

A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having connection pads disposed thereon and an inactive surface disposed to oppose the active surface; a dummy chip disposed in the through-hole and spaced apart from... Samsung Electro mechanics Co Ltd

02/15/18 / #20180048222

Voice coil motor actuator and method

An actuator driver for a voice coil motor (VCM) includes a digital converter configured to convert a VCM driving control code into a plurality of conversion codes including at least a first to nth conversion codes, during a predetermined period of time, a digital-to-analog converter configured to sequentially generate an... Samsung Electro mechanics Co Ltd

02/15/18 / #20180048281

Bulk acoustic filter device and manufacturing the same

A bulk acoustic filter device includes: a substrate; a cavity forming layer disposed on the substrate so as to form a cavity; a lower electrode disposed on the cavity; a piezoelectric layer disposed on the lower electrode; an upper electrode disposed on the piezoelectric layer; and a temperature compensation layer... Samsung Electro mechanics Co Ltd

02/15/18 / #20180048287

Bulk acoustic resonator

A bulk acoustic resonator may include a substrate; a resonating portion including a first electrode layer, a piezoelectric layer, and a second electrode layer which are sequentially stacked on the substrate, and partitioned into an active region and a non-active region; and a frame electrode layer including frame electrodes disposed... Samsung Electro mechanics Co Ltd

02/15/18 / #20180048291

Bulk-acoustic wave filter device

A bulk-acoustic wave filter device includes: a first substrate; a first filter disposed on the first substrate, within a cavity of the bulk-acoustic wave filter device; a second substrate coupled to the first substrate; a second filter disposed on the second substrate, within the cavity and facing the first filter;... Samsung Electro mechanics Co Ltd

02/15/18 / #20180047494

Coil component

A coil component includes: a body in which a support member is disposed; and first and second coil conductors formed on first and second surfaces of the support member, respectively, the second surface of the support member opposing the first surface thereof, and including first and second lead portions extended... Samsung Electro mechanics Co Ltd

02/08/18 / #20180040422

Thin-film ceramic capacitor

A thin-film ceramic capacitor includes a body in which dielectric layers and first and second electrode layers are alternately disposed on a substrate, and first and second electrode pads disposed on external surfaces of the body. A plurality of vias are disposed in the body. Each of a plurality of... Samsung Electro mechanics Co Ltd

02/08/18 / #20180041189

Bulk acoustic resonator and filter

A bulk acoustic resonator includes a substrate, a first electrode disposed above the substrate, a piezoelectric body disposed on the first electrode and including a plurality of piezoelectric layers each including aluminum nitride with a doping material, and a second electrode disposed on the piezoelectric body, where at least one... Samsung Electro mechanics Co Ltd

02/08/18 / #20180041191

Saw filter device and manufacturing the same

A surface acoustic wave (SAW) filter device includes: a first layer disposed on a substrate; an inter-digital transducer (IDT) electrode layer disposed on the first layer; a second layer covering the IDT electrode layer and the first layer; and an overlay layer covering the second layer, wherein the first layer... Samsung Electro mechanics Co Ltd

02/08/18 / #20180042113

Multilayer ceramic capacitor having three external electrodes and board having the same

A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from one another. When a length of the ceramic body is defined as L, and a width of an active region including a plurality of internal electrodes disposed... Samsung Electro mechanics Co Ltd

02/01/18 / #20180031798

Lens module and camera module including same

A lens module includes a lens and a lens barrel accommodating the lens. A distance between an internal surface of the lens barrel and an optical axis varies in a circumferential direction of the lens barrel.... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033533

Inductor

An inductor includes a body having a first magnetic portion above and below a coil, and a second magnetic portion above and below the first magnetic portion. The magnetic flux density of the magnetic substance in the first magnetic portion is higher than that of the magnetic substance in the... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033534

Magnetic material and device for transmitting data using the same

A device for transmitting data includes a transmitting coil configured to receive and transmit the data signal and to generate a magnetic field, and a magnetic material provided on one surface of the transmitting coil. A ratio of a residual magnetic flux density and a saturation magnetic flux density of... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033535

Coil component and manufacturing the same

A method of manufacturing a coil component includes preparing a coil unit including a coil surrounded by an insulating film. The coil unit further has a through hole in a center thereof and has a first surface and a second surface opposing each other. A first magnetic sheet and a... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033538

Inductor

An inductor includes a body including a coil part therein. The coil part includes a support member and first and second coil patterns respectively formed on an upper surface and a lower surface of the support member, and 1.15≦b/a≦1.45, where a is a length from a central plane between the... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033539

Inductor having via connection layer

An inductor includes a body including a coil part therein. The coil part includes a first coil layer electrically connected to a first via; a second coil layer disposed below the first coil layer and electrically connected to a second via displaced laterally from that of the first via; and... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033540

Coil component and manufacturing the same

A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033541

Coil component and manufacturing the same

A coil component includes a coil part having a through hole in a center, including a coil covered by an insulating film, and having a first surface and a second surface opposing each other, a core disposed in the through hole and including a nonmagnetic layer, and cover portions disposed... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033542

Inductor and manufacturing method thereof

An inductor may include: a body, and a first and a second external electrode formed on end surfaces of the body. The body may include a coil support layer, a conductive coil formed on at least one surface of the coil support layer, a lamination part formed in a gap... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033546

Electronic component

An electronic component includes: a body containing a ceramic material; and an indication part formed on a surface of the body and including a base region and a marking region formed of a non-conductive paste on a portion of the base region.... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033550

Coil component and manufacturing same

A coil component includes an insulating layer and a coil pattern provided inside the insulating layer. A lower surface and a side surface of the coil pattern form an acute angle, in a longitudinal cross section of the coil pattern. In particular, a side surface of the coil pattern includes... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033552

Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein

There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033555

Dielectric ceramic composition, multilayer ceramic capacitor containing the same, and manufacturing multilayer ceramic capacitor

A dielectric ceramic composition contains: a barium titanate-based powder as a main ingredient; a first accessory ingredient containing Na; a second accessory ingredient containing Ba; and a third accessory ingredient containing Si. A content of the first accessory ingredient (based on moles of Na) is 0.3 to 4.0 moles per... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033559

Thin film capacitor

A thin film capacitor includes: a body in which first and second internal electrodes and dielectric layers are alternately stacked; and a plurality of first vias disposed in the body and electrically connected to the first internal electrodes and a plurality of second vias disposed in the body and electrically... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033560

Thin-film capacitor having asymmetric shaped vias

A thin-film capacitor includes a body in which a plurality of dielectric layers and first and second electrode layers are alternately disposed on a substrate and first and second electrode pads disposed on external surfaces of the body, wherein a plurality of vias are disposed within the body, and the... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033733

Fan-out semiconductor package

A fan-out semiconductor package includes a frame having a through hole, a semiconductor chip disposed in the through hole and including connection pads, an encapsulant encapsulating at least a portion of the frame and the semiconductor chip, and a redistribution layer disposed on the frame and the semiconductor chip and... Samsung Electro mechanics Co Ltd

02/01/18 / #20180033746

Electronic component package

An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the frame; a metal plate disposed on a first side of the electronic component and the frame; and a redistribution layer disposed on a second side of the electronic... Samsung Electro mechanics Co Ltd

Social Network Patent Pack
02/01/18 / #20180033751

Fan-out semiconductor package

A fan-out semiconductor package includes: a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole and having an active surface having a connection pad disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and... Samsung Electro mechanics Co Ltd

02/01/18 / #20180035031

Camera module and portable electronic device including the same

A camera module includes lenses, and reflecting parts disposed in front of the lenses and configured to reflect light incident thereto from different directions to the lenses. A reflecting part of the reflecting parts is rotatable, and a stopper configured to limit a rotation range of the reflecting part.... Samsung Electro mechanics Co Ltd

02/01/18 / #20180035545

Multilayer capacitor and board having the same

A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes alternately disposed with one of the dielectric layers interposed between each pair of adjacent first and second internal electrodes. First and second via electrodes penetrate through the plurality of second internal... Samsung Electro mechanics Co Ltd








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