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Samsung Electro mechanics Co Ltd
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Samsung Electro mechanics Co Ltd patents


Recent patent applications related to Samsung Electro mechanics Co Ltd. Samsung Electro mechanics Co Ltd is listed as an Agent/Assignee. Note: Samsung Electro mechanics Co Ltd may have other listings under different names/spellings. We're not affiliated with Samsung Electro mechanics Co Ltd, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Samsung Electro mechanics Co Ltd-related inventors




Date Samsung Electro mechanics Co Ltd patents (updated weekly) - BOOKMARK this page
08/25/16 new patent  Resin composition and printed circuit board comprising the same
08/25/16 new patent  Actuator and camera module including the same
08/25/16 new patent  Camera module
08/25/16 new patent  Chip electronic component and manufacturing method thereof
08/25/16 new patent  Power amplifier and method
08/25/16 new patent  Optical image stabilizer and camera module including the same
08/25/16 new patent  Circuit board and manufacturing method thereof
08/25/16 new patent  Circuit board and manufacturing method thereof
08/25/16 new patent  Circuit board and assembly thereof
08/18/16Printed circuit board and manufacturing method thereof
08/18/16Resin composition for printed circuit board, insulating film, and printed circuit board using the same
08/18/16Apparatus and driving gyro sensor
08/18/16Coil electronic component and manufacturing method thereof
08/18/16Multilayer ceramic electronic component and board having the same
08/18/16Multilayer ceramic electronic component and board having the same
08/18/16Multilayer ceramic electronic component
08/18/16In-mold antenna, controlling antenna characteristics and manufacturing in-mold antenna
08/18/16Input driver for power amplifier and transmitter
08/18/16Printed circuit board having metal bumps
08/11/16Angular velocity sensor
08/11/16Multilayer ceramic component
08/11/16Multilayer ceramic electronic component and manufacturing the same
08/11/16Electronic device including multiband antenna using persistent conductive border
08/11/16Multiband antenna having external conductor and electronic device including the same
08/11/16Near field communications antenna and terminal including the same
08/11/16Printed circuit board and manufacturing method thereof
08/11/16Portable terminal
08/11/16Printed circuit board, semiconductor package and manufacturing the same
08/11/16Electronic component and board having the same
08/04/16Dielectric composition and multilayer ceramic capacitor containing the same
08/04/16Lens module
08/04/16Actuator and camera module
08/04/16Power inductor
08/04/16Power inductor
08/04/16Coil component
08/04/16Electronic component, and manufacturing thereof
08/04/16Method of manufacturing multilayer ceramic electronic component
08/04/16Printed circuit board, semiconductor package and manufacturing the same
08/04/16Wireless power transmitter and wireless power receiver
08/04/16Optical image stabilizer and camera module including the same
08/04/16Optical image stabilizer and camera module including the same
08/04/16Optical image stabilizer and camera module including the same
08/04/16Optical image stabilizer for a camera module and calibrating gain thereof
07/28/16Mems sensor
07/28/16Magnetic composition and inductor including the same
07/28/16Electronic component
07/28/16Coil component and manufacturing the same
07/28/16Electronic component and manufacturing method thereof
07/28/16Electronic component
07/28/16Coil component
07/28/16Inductor and manufacturing the same
07/28/16Wire-wound inductor and manufacturing the same
07/28/16Electronic component
07/28/16Power inductor and manufacturing the same
07/28/16Dielectric ceramic composition, dielectric material, and multilayer ceramic capacitor containing the same
07/28/16Electronic component and board having the same
07/28/16Multilayer ceramic component and board having the same
07/28/16Multi-layer ceramic capacitor assembly
07/28/16Tantalum capacitor
07/28/16Common mode filter and manufacturing the same
07/28/16Radiator frame having antenna pattern embedded therein, electronic device including radiator frame, and manufacturing radiator frame
07/28/16Camera module
07/28/16Embedded board and manufacturing the same
07/28/16Electronic component embedded printed circuit board and manufacturing the same
07/28/16Printed circuit board and manufacturing the same
07/28/16Printed circuit board with embedded electronic component and manufacturing method thereof
07/28/16Electronic component embedded printed circuit board and manufacturing the same
07/28/16Surface mounted electronic component
07/21/16Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board
07/21/16Complex sensor and manufacturing the same
07/21/16Subminiature optical system and portable device including the same
07/21/16Electronic component
07/21/16Multilayer ceramic electronic component, manufacturing the same, and circuit board having the same
07/21/16Multilayer ceramic component
07/21/16Multilayer ceramic electronic component
07/21/16Multilayer ceramic component and board having the same
07/21/16Method for manufacturing electronic component embedding substrate and electronic component embedding substrate
07/14/16Multilayer ceramic component and board having the same
07/14/16Wireless power transmitter
07/14/16Acoustic resonator and manufacturing the same
07/14/16Digital-to-analog converter, and motor driving control apparatus and method using the same
07/14/16Multilayer ceramic electronic component and board having the same
07/14/16Circuit board and manufacturing the same
07/14/16Printed circuit board, package and manufacturing the same
07/07/16Dielectric ceramic composition, dielectric material and multilayer ceramic capacitor including the same
07/07/16Coil-embedded substrate and manufacturing the same
07/07/16Coil component and manufacturing the same
07/07/16Multilayer ceramic electronic component
07/07/16Multilayer ceramic capacitor and board having the same
07/07/16Radio frequency switch
07/07/16Front end module
07/07/16Printed circuit board and electronic component module
07/07/16Substrate with electronic device embedded therein and manufacturing method thereof
06/30/16Illuminance sensor module
06/30/16Camera module
06/30/16Current generator and method
06/30/16Electronic component and manufacturing the same
06/30/16Coil structure and wireless power transmitter using the same
06/30/16Electronic component and manufacturing the same
06/30/16Multilayer electronic component and manufacturing the same
06/30/16Electronic component and board having the same
06/30/16Coil component and manufacturing the same
06/30/16Power transmitting coil structure and wireless power transmitting apparatus including the same
06/30/16Method of manufacturing electronic component
06/30/16Composite electronic component
06/30/16Electrode structure for capacitor, electrolytic capacitor, and manufacturing the same
06/30/16Antenna apparatus
06/30/16Antenna module
06/30/16Overheating control apparatus and driving system using the same
06/30/16Concurrent dual-band signal amplifier
06/30/16Front end circuit
06/30/16Circuit board and manufacturing method thereof
06/30/16Circuit board, multilayered substrate having the circuit board and manufacturing the circuit board
06/30/16Printed circuit board and manufacturing the same
06/30/16Printed circuit board and manufacturing the same
06/30/16Electronic component module and manufacturing method thereof
06/23/16Probe card
06/23/16Angular velocity sensor
06/23/16Lens assembly and camera module including the same
06/23/16Lens module
06/23/16Lens module
06/23/16Lens assembly and camera module including the same
06/23/16Camera module
06/23/16Electronic component and manufacturing the same
06/23/16Power inductor and maufacturing the same
06/23/16Composite electronic component
06/23/16Multilayer ceramic electronic component and manufacturing the same
06/23/16Solid electrolyte capacitor and manufacturing method thereof
06/23/16Tuning fork vibrator
06/23/16Hall sensor device and optical image stabilization device
06/23/16Flexible printed circuit board and manufacturing method thereof
06/23/16Printed circuit board and manufacturing the same
06/16/16Power amplifier
06/16/16Low-temperature sintering dielectric composition and multilayer ceramic capacitor formed thereof
06/16/16Rotation detection sensor
06/16/16Camera module
06/16/16Lens module
06/16/16Lens module
06/16/16Camera module
06/16/16Smart home control apparatus, smart home control method and smart home control system
06/16/16Resistor element and manufacturing the same
06/16/16Resistor element and manufacturing the same
06/16/16Electronic component and board having the same
06/16/16Electronic component and manufacturing the same
06/16/16Chip electronic component
06/16/16Electronic component and manufacturing the same
06/16/16Electronic component and manufacturing the same
06/16/16Dielectric ceramic composition, dielectric material and multilayer ceramic capacitor including the same
06/16/16Composite electronic component and manufacturing method thereof
06/16/16Conductive paste for internal electrode, piezoelectric element, and piezoelectric vibration module including the same
06/16/16Wireless charging control method, and wireless power transmission apparatus and wireless power receiving apparatus using the same
06/16/16Camera module
06/16/16Optical image stabilizer and decreasing power consumption
06/16/16Embedded device, and printed circuit board having the same
06/16/16Embedded printed circuit board and manufacturing the same
06/09/16Lens module
06/09/16Lens module
06/09/16Lens module
06/09/16Lens module
06/09/16Optical system
06/09/16Lens module
06/09/16Camera module
06/09/16Electronic component
06/09/16Electronic component
06/09/16Multilayer seed pattern inductor, manufacturing method thereof, and board having the same
06/09/16Coil component
06/09/16Multilayer ceramic capacitor and board having the same mounted thereon
06/09/16Dielectric ceramic composition and multilayer ceramic capacitor including the same
06/09/16Ceramic dielectric composition and multilayer ceramic capacitor containing the same
06/09/16Multilayer ceramic capacitor and mounting board for multilayer ceramic capacitor
06/09/16Piezoelectric actuator driving circuit, driving signal generating circuit, and device and driving piezoelectric actuator using the same
06/09/16Acoustic resonator and manufacturing the same
06/09/16Crystal vibrator package
06/09/16Near-field antenna apparatus using eddy current and electronic device including the same
06/09/16Common mode filter
06/09/16Bulk acoustic wave filter
06/09/16Bulk acoustic wave resonator
06/09/16Bulk acoustic wave resonator and filter
06/09/16Signal transmitting-receiving apparatus
06/09/16Camera module
06/09/16Imaging apparatus and controlling the same
06/09/16Circuit board, package substrate and electronic device
06/09/16Printed circuit board with embedded electronic component and manufacturing the same
06/09/16Electronic device embedded substrate and manufacturing method thereof
06/02/16Camera module
06/02/16Camera module
06/02/16Lens module
06/02/16Lens module
06/02/16Optical system
06/02/16Optical system
06/02/16Coil component
06/02/16Ferrite and coil electronic component including the same
06/02/16Semiconductor package and manufacturing the same
06/02/16Wireless communications module
06/02/16Crystal oscillator package
06/02/16Common mode filter
06/02/16Printed circuit board and manufacturing the same
06/02/16Radio frequency switch circuit and control method thereof
06/02/16Multilayer ceramic substrate and manufacturing thereof
06/02/16Printed circuit board and manufacturing method thereof, and semiconductor package including the printed circuit board
05/26/16Lens module
05/26/16Filter preprocessing circuit, optical image stabilizer, and performing optical image stabilization
05/26/16Coil component
05/26/16Semiconductor package and manufacturing the same
05/26/16Piezoelectric actuator and lens module including the same
05/26/16Piezoelectric ceramic composition, piezoelectric element, and the same
05/26/16Antenna device and near field communication device including the same
05/26/16Printed circuit board with electronic component embedded therein and manufacturing the same
05/19/16Circuit board and manufacturing the same
05/19/16Microelectromechanical systems device
05/19/16Angular velocity sensor
05/19/16Method for measuring coefficient of thermal expansion and thermal mechanical analyzer
05/19/16Lens module
05/19/16Lens module
05/19/16Optical system
05/19/16Lens module
05/19/16Electronic component and manufacturing same
05/19/16Electronic component and board having the same
05/19/16Metal powder, electronic component and producing the same
05/19/16Piezoelectric actuator and capsule endoscope including the same
05/19/16Composite electronic component and board having the same
05/19/16Composite electronic component and board having the same
05/19/16Composite electronic component and board having the same
05/19/16Dual-band filter and operating method therof
05/19/16Camera module
05/19/16Circuit board
05/19/16Printed circuit board and manufacturing the same, and electronic component module
05/19/16Element embedded printed circuit board and manufacturing the same
05/19/16Electronic device module and manufacturing the same
05/12/16Isoflavone-based polymer, lens and camera module using the same
05/12/16Lens driving module
05/12/16Optical system
05/12/16Multilayer ceramic electronic component and board having the same
05/12/16Multilayer electronic component
05/12/16Composite electronic component and board having the same
05/12/16Tantalum capacitor and manufacturing the same
05/12/16Tantalum capacitor and manufacturing the same
05/12/16Tantalum capacitor and manufacturing the same
05/12/16Printed circuit board and manufacturing method thereof
05/12/16Antenna module and antenna assembly including the same
05/12/16Bias circuit and power amplifier having the same
05/12/16Surface acoustic wave device and apparatus including the same
05/12/16Communications device having multiple antennas, and operating communications device
05/12/16Wiring substrate
05/12/16Printed circuit board and manufacturing the same
05/12/16Detachable core substrate and manufacturing circuit board using the same
05/12/16Prepreg and manufacturing the same
05/05/16Sensor package and manufacturing method thereof
05/05/16Lens module



ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Samsung Electro mechanics Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Samsung Electro mechanics Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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