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Semiconductor Components Industries Llc patents


Recent patent applications related to Semiconductor Components Industries Llc. Semiconductor Components Industries Llc is listed as an Agent/Assignee. Note: Semiconductor Components Industries Llc may have other listings under different names/spellings. We're not affiliated with Semiconductor Components Industries Llc, we're just tracking patents.

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Stacked-gate super-junction mosfet

A MOSFET having a stacked-gate super-junction design and novel termination structure. At least some illustrative embodiments of the device include a conductive (highly-doped with dopants of a first conductivity type) substrate with a lightly-doped epitaxial layer. The volume of the epitaxial layer is substantially filled with a charge compensation structure... Semiconductor Components Industries Llc

Semiconductor devices and making the same

In one embodiment, the semiconductor devices relate to using one or more super-junction trenches for termination.... Semiconductor Components Industries Llc

Fuse element programming circuit and method

In one embodiment, a programming circuit is configured to form a programming current for a silicide fuse element by using a non-silicide programming element.... Semiconductor Components Industries Llc

Semiconductor component and manufacture

A semiconductor component includes a support having a lead integrally formed thereto. An insulated metal substrate is mounted to a surface of the support and a semiconductor chip is mounted to the insulated metal substrate. A III-N based semiconductor chip is mounted to the insulated metal substrate, where the III-N... Semiconductor Components Industries Llc

Semiconductor package and related methods

Implementations of semiconductor packages may include: a prefabricated electrically conductive section; two or more metal oxide semiconductor field effect transistors (MOSFET) physically coupled together; and a back metal coupled to the two or more MOSFETs; wherein the electrically conductive section may be coupled to the back metal and may be... Semiconductor Components Industries Llc

Semiconductor backmetal (bm) and over pad metallization (opm) structures and related methods

A method of forming semiconductor devices includes providing a wafer having a first side and second side, electrically conductive pads at the second side, and an electrically insulative layer at the second side with openings to the pads. The first side of the wafer is background to a desired thickness... Semiconductor Components Industries Llc

Area-friendly providing duty cycle inverse to supply voltage

An illustrative converter embodiment employs an oscillator comprising a capacitor and a comparator. The capacitor is alternately coupled to a charging current source and a discharging current source, the charging current source operating to charge the capacitor at a first rate and the discharging source operating to discharge the capacitor... Semiconductor Components Industries Llc

Method of manufacturing a circuit device

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and... Semiconductor Components Industries Llc

Semiconductor die singulation methods

Methods of singulating semiconductor die. Specific implementations may include: providing a semiconductor wafer including a plurality of die located on a first side of the semiconductor wafer where the plurality of die include a desired thickness. The method may include etching a plurality of trenches into the semiconductor wafer from... Semiconductor Components Industries Llc

Power conversion circuit with indicator coupled to input terminal to signal condition of the controller

A power conversion circuit has a controller with an input terminal and a circuit configured to drive an electric current out of the input terminal in response to a condition of the controller. An indicator is coupled to the input terminal of the controller. The controller includes a clock signal... Semiconductor Components Industries Llc

Communication circuit for flyback power converter with synchronous rectifier

A method for communicating with a power converter comprises initiating a communication sequence by sensing a first distortion of a sensed waveform during a discharge period of a first power transfer cycle of the power converter. The sensed waveform is proportional to a secondary current of the power converter. At... Semiconductor Components Industries Llc

Power converter and control method therefor

A power converter and a control method therefor are provided. The power converter includes a transformer, synchronous rectifier and a control circuit. A primary side of the transformer receives an input voltage, and a secondary side of the transformer generates a sensing signal. The synchronous rectifier is coupled to the... Semiconductor Components Industries Llc

Distributed phase locked loop in hearing instruments

A system, in some embodiments, comprises: an antenna; a receiver, coupled to the antenna, to receive wireless signals from another electronic device; a signal processor (SP) coupled to the receiver; and a phase locked loop (PLL), distributed among the receiver and the SP, to synchronize the frequency of a data... Semiconductor Components Industries Llc

Methods and reducing spatial flicker artifacts

Various embodiments of the present technology may comprise a method and apparatus for reducing spatial flicker artifacts in high dynamic range images produced from multiple image captures with differing integration times. The method and apparatus may comprise, in the image captures, measuring pixel intensity selecting pixels with a predetermined intensity... Semiconductor Components Industries Llc

Image sensor system with an automatic focus function

An imaging system may include at least two image sensors. Each image sensor may have a respective lens module that is configured to focus light on the image sensor. One of the image sensors may be a monochrome sensor, while another image sensor may be a color sensor. The monochrome... Semiconductor Components Industries Llc

Semiconductor packages with sub-terminals and related methods

A semiconductor device package includes a substrate having first and second opposing surfaces. A first surface of a die couples to the second surface of the substrate, and a first surface of an electrically conductive sub-terminal electrically couples with an electrical contact of the die and physically couples to the... Semiconductor Components Industries Llc

Method of forming a semiconductor device and structure therefor

An embodiment of a semiconductor device includes forming an active region that extends vertically into the semiconductor material in which the semiconductor device is formed. The active region may include a P-N junction or alternately a gate or a channel region of an MOS transistor.... Semiconductor Components Industries Llc

Controlling multiple facets of duty cycle response using a single motor integrated circuit pin

A system, in some embodiments, comprises: a motor; and control logic, coupled to the motor, to determine a duty keep status and a duty cycle threshold based on a received voltage, wherein the duty keep status indicates whether the system is to operate in a duty keep mode or a... Semiconductor Components Industries Llc

Controlling lead angle using a single motor integrated circuit pin

A system, in some embodiments, comprises: an analog-to-digital converter (ADC) configured to receive a discrete analog voltage and to generate a digital bit value representing said analog voltage; control logic, coupled to the ADC, configured to identify a target intercept and a target slope for a lead angle curve based... Semiconductor Components Industries Llc

Motor driving method

According to at least some embodiments, a method for driving a motor includes, upon a restart of the motor, determining whether the rotor is rotating based on a signal generated from outputs of at most one Hall sensor. The method further includes, if it is determined that the rotor is... Semiconductor Components Industries Llc

Identifying voltage divider defects to prevent motor integrated circuit damage

A motor control system, in some embodiments, comprises: a voltage divider circuit having an output node, a voltage on said output node representing a desired motor rotation direction; control logic configured to receive an indication of said voltage; and a motor controller coupled to the control logic, wherein, if said... Semiconductor Components Industries Llc

Image sensors having high dynamic range functionalities

An image sensor pixel may include a photodiode, a charge storage region, a floating diffusion node, and a capacitor. A first transistor may be coupled between the photodiode and the charge storage region. A second transistor may be coupled between the charge storage region and the capacitor. The photodiode may... Semiconductor Components Industries Llc

Image sensors having high dynamic range functionalities

The image sensor pixel may include a photodiode, a charge storage region, readout circuitry, and a transfer transistor that couples the photodiode to the charge storage region. The photodiode may generate first and second image signals during first and second exposure periods, respectively. The transfer transistor may transfer the first... Semiconductor Components Industries Llc

Imaging systems with high dynamic range and phase detection pixels

A pixel may include an inner sub-pixel group and an outer sub-pixel group. The inner sub-pixel group may have a smaller light collecting area than the outer sub-pixel group and therefore be less sensitive to light than the outer sub-pixel group. This may enable the pixel to be used to... Semiconductor Components Industries Llc

Methods and a multiple storage pixel imaging system

Various embodiments of the present technology may comprise a method and apparatus for a pixel array. Each pixel may include multiple storage regions capable of storing pixel signals during integration. The method and apparatus may utilize the floating diffusion region as a storage region during both an integration period and... Semiconductor Components Industries Llc

Auto addressing using functional connection

An apparatus for auto addressing includes a communication bus interface configured to receive an address assignment request to assign an address to the apparatus. A functional connection is configured to activate a device connected to the apparatus. A detector is configured to measure a characteristic of the device and to... Semiconductor Components Industries Llc

Apparatus and methods for buried channel transfer gate

An image sensor pixel may include a photodiode, a floating diffusion, and a transfer gate. A buried channel may be formed under the transfer gate. The buried channel may extend from the floating diffusion to overlap a portion of the transfer gate without extending completely beneath the transfer gate or... Semiconductor Components Industries Llc

Process of forming an electronic device including a multiple channel hemt

An electronic device can include a HEMT including at least two channel layers. In an embodiment, a lower semiconductor layer overlies a lower channel layer, wherein the lower semiconductor layer has an aluminum content that is at least 10% of a total metal content of the lower semiconductor layer. An... Semiconductor Components Industries Llc

Auto-tuning current limiter

A power conversion circuit is provided. A reference signal is integrated over a first timer period. A second signal is generated that is approximately proportional to an output current of the power conversion circuit. The second signal is integrated over a second time period. A first result of the integration... Semiconductor Components Industries Llc

Bi-directional feedback pin

A controller for a power conversion circuit has a first current-reading circuit coupled for receiving a first feedback signal at a first circuit node and generating an internal feedback signal at a second circuit node inversely proportional to the first feedback signal. A second current-reading circuit is coupled for receiving... Semiconductor Components Industries Llc

Low-power conversion between analog and digital signals using adjustable feedback filter

A system to convert between analog and digital signals, in some embodiments, comprises: a differentiator to produce a differentiated signal based on an input signal and a feedback signal; an integrator, coupled to the differentiator, to integrate the differentiated signal; a quantizer, coupled to the integrator, to quantize the integrated... Semiconductor Components Industries Llc

Image sensors with led flicker mitigaton global shutter pixles

An image sensor may include one or more pixels having a charge steering structure that may selectively route charge from a photodiode to increase the dynamic range of the pixel. The charge steering structure may be a coupled gate structure that routes overflow charge to a voltage supply and to... Semiconductor Components Industries Llc

Charge packet signal processing using pinned photodiode devices

An image sensor may include an array of image pixels coupled to analog-to-digital conversion circuitry formed from pinned photodiode charge transfer circuits. Majority charge carriers for the pinned photodiodes in the charge transfer circuits may be electrons for photodiode wells formed from n-type doped regions and may be holes for... Semiconductor Components Industries Llc

Process of forming an electronic device including a bond pad

A process of forming an electronic device including providing a substrate having a first surface and a second surface opposite the first surface; etching the substrate along the first surface to define a trench; forming a via within the trench; applying a tape including an adhesive to the first surface,... Semiconductor Components Industries Llc

Method of separating electronic devices having a back layer and apparatus

A method of singulating a wafer includes providing a wafer having a plurality of die formed as part of the wafer and separated from each other by spaces. The wafer has first and second opposing major surfaces and a layer of material disposed along the second major surface. The method... Semiconductor Components Industries Llc

12/07/17 / #20170352635

Bonding structure and method

A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.... Semiconductor Components Industries Llc

12/07/17 / #20170352694

Charge packet signal processing using pinned photodiode devices

An image sensor may include an array of image pixels coupled to analog-to-digital conversion circuitry formed from pinned photodiode charge transfer circuits. Majority charge carriers for the pinned photodiodes in the charge transfer circuits may be electrons for photodiode wells formed from n-type doped regions and may be holes for... Semiconductor Components Industries Llc

12/07/17 / #20170352696

Charge packet signal processing using pinned photodiode devices

An image sensor may include an array of image pixels coupled to analog-to-digital conversion circuitry formed from pinned photodiode charge transfer circuits. Majority charge carriers for the pinned photodiodes in the charge transfer circuits may be electrons for photodiode wells formed from n-type doped regions and may be holes for... Semiconductor Components Industries Llc

12/07/17 / #20170352698

Image sensor chip scale packages and related methods

Methods of forming an image sensor chip scale package. Implementations may include providing a semiconductor wafer having a pixel array, forming a first cavity through the wafer and/or one or more layers coupled over the wafer, filling the first cavity with a fill material, planarizing the fill material and/or the... Semiconductor Components Industries Llc

12/07/17 / #20170353108

Spread spectrum clock generator and method

In one form, a spread spectrum clock generator includes an oscillator and a digital modulator. The oscillator has a control input for setting an output frequency, and an output for providing a clock output signal. The digital modulator is responsive to the clock output signal to provide a control code... Semiconductor Components Industries Llc

12/07/17 / #20170353115

Protection circuit and flyback power converter

A protection circuit for a power converter is provided. The protection circuit includes a sensor circuit, a detection circuit and an initial protection circuit. The sensor circuit senses an output current of the power converter to generate a load signal. The detection circuit detects a voltage signal at a signal... Semiconductor Components Industries Llc

11/30/17 / #20170345745

High density semiconductor package and related methods

Implementations of semiconductor packages may include: a first semiconductor die having a plurality of balls coupled to a first side thereof, a second semiconductor die, a lead frame having a die attach area on a first side of the lead frame, the die attach area containing an opening therethrough and... Semiconductor Components Industries Llc

11/30/17 / #20170345779

Polymer resin and compression mold chip scale package

A method for fabricating a chip scale package, comprising: providing a wafer; applying a polymer resin on at least part of a first surface of the wafer and to one or more sides of the wafer; and applying a compression mold on at least part of a second surface of... Semiconductor Components Industries Llc

11/30/17 / #20170345833

Method of manufacturing and operating a non-volatile memory cell

A memory device includes a capacitor, a tunneling-enhanced device, and a transistor. In accordance with an embodiment, capacitor has first and second electrodes wherein the first electrode of the capacitor serves as a control gate of the memory device. The tunneling-enhanced device has a first electrode and a second electrode,... Semiconductor Components Industries Llc

11/30/17 / #20170345859

High reliability housing for a semiconductor package

Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate... Semiconductor Components Industries Llc

11/30/17 / #20170345862

Semiconductor package with interposer

Implementations of semiconductor packages may include: a first semiconductor die coupled to a first side of a substrate having one or more internal traces. One or more connectors coupled to the first semiconductor die and the first side of the substrate. A glass lid coupled to the first side of... Semiconductor Components Industries Llc

11/30/17 / #20170345864

Image sensor semiconductor packages and related methods

An image sensor semiconductor package (package) includes a printed circuit board (PCB) having a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die has a first surface with a photosensitive region and a second surface opposite the first surface of... Semiconductor Components Industries Llc

11/30/17 / #20170346513

Efficient closed loop tuning using signal strengh

A wireless communication system, in some embodiments, comprises: a receiver; one or more tunable elements, coupled to the receiver, to adjust an impedance of the system; and a processor, coupled to the one or more tunable elements, to tune said one or more tunable elements based on the strength of... Semiconductor Components Industries Llc

11/30/17 / #20170347042

Imaging systems with high dynamic range and phase detection pixels

An image sensor may have a pixel array, and the pixel array may include a plurality of image pixels that gather image data and a plurality of phase detection pixels that gather phase information. The phase detection pixels may be arranged in phase detection pixel blocks, and each phase detection... Semiconductor Components Industries Llc

11/30/17 / #20170347456

Single reflow power pin connections

A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the... Semiconductor Components Industries Llc

11/23/17 / #20170334625

Carrier tape with standoff units

A carrier tape system, in some embodiments, comprises: a tape; a series of index holes along a length of said tape; a series of pockets along said length; a first series of standoff units along said length; and a second series of standoff units along said length, wherein the series... Semiconductor Components Industries Llc

11/23/17 / #20170338304

Semiconductor device having self-isolating bulk substrate and method therefor

A semiconductor device comprises a bulk semiconductor substrate that includes a first conductivity type floating buried doped region bounded above by a second conductivity type doped region and bounded below by another second conductivity semiconductor region. Trench isolation regions extend through the second conductivity doped region and the first conductivity... Semiconductor Components Industries Llc

11/23/17 / #20170338749

Switching control circuit with signal process to accommodate the synchronous rectifier of power converters

A switching control circuit of a power converter according to the present invention comprises an input circuit and a clock generator. The input circuit is coupled to receive a feedback signal for generating a switching signal. The clock generator generates a clock signal to determine a switching frequency of the... Semiconductor Components Industries Llc

11/23/17 / #20170339353

Imaging systems with high dynamic range and phase detection pixels

An image sensor may include a pixel array with high dynamic range functionality and phase detection pixels. The phase detection pixels may be arranged in phase detection pixel groups. Each phase detection pixel group may include three adjacent pixels arranged consecutively in a line. A single microlens may cover all... Semiconductor Components Industries Llc

11/23/17 / #20170339355

Imaging systems with global shutter phase detection pixels

An image sensor may include a pixel array with global shutter phase detection pixels. The global shutter phase detection pixels may include global shutter charge storage regions. To prevent the global shutter charge storage regions from being exposed to incident light, a shielding layer may be provided. The shielding layer... Semiconductor Components Industries Llc

11/23/17 / #20170339358

Phase delay counting analog-to-digital converter circuitry

An analog-to-digital converter may include an integrator, a gated ring oscillator, a coarse counter, a phase state register, a counter register, and logic circuitry. The gated ring oscillator may output a phase state signal continuously to the phase state register. The phase state signal includes multiple phase nodes, each of... Semiconductor Components Industries Llc

11/16/17 / #20170330798

Process of forming an electronic device

A process of forming an electronic device includes providing a substrate having a major surface; etching a portion of a the substrate to define a trench extending from the major surface, wherein the portion of the trench has a first width, W1, along the major surface and a second width,... Semiconductor Components Industries Llc

11/16/17 / #20170330906

Image sensors with symmetrical imaging pixels

An image sensor may include a symmetrical imaging pixel with a floating diffusion region. The floating diffusion region may be formed in the center of the imaging pixel. A shallow p-well may be formed around the floating diffusion region. A transfer gate configured to transfer charge from a photodiode to... Semiconductor Components Industries Llc

11/16/17 / #20170332023

Image pixels having processed signal storage capabilities

An image sensor may include an array of image sensor pixels. Each image sensor pixel may have signal storage capabilities implemented through a write-back supply line and a control transistor for the supply line. Each image sensor pixel may output pixel values over column lines to switching circuitry. The switching... Semiconductor Components Industries Llc

11/09/17 / #20170323947

Schottky device and manufacture

A Schottky device includes a plurality of mesa structures where one or more of the mesa structures includes a doped region having a multi-concentration dopant profile. In accordance with an embodiment, the Schottky device is formed from a semiconductor material of a first conductivity type. Trenches having sidewalls and floors... Semiconductor Components Industries Llc

11/09/17 / #20170323958

Semiconductor device and manufacture

In one embodiment, an IGBT is formed to include a region of semiconductor material. Insulated gate structures are disposed in region of semiconductor material extending from a first major surface. An n-type field stop region extends from a second major surface into the region of semiconductor material. A p+ type... Semiconductor Components Industries Llc

11/09/17 / #20170324345

Hybrid control technique for power converters

A power conversion circuit includes a high-side MOSFET and a low-side MOSFET. A conduction terminal of the high-side MOSFET is coupled to a conduction terminal of the low-side MOSFET at a half-bridge (HB) circuit node. The high-side MOSFET is switched off. Voltage potential transitions of the HB circuit node are... Semiconductor Components Industries Llc

11/09/17 / #20170324915

Image sensor pixels having separated charge storage regions

An image sensor may include pixel having nested photosensitive regions. A pixel with nested photosensitive regions may include an inner photosensitive region that has a rectangular light collecting area. The inner photosensitive region may be formed in a substrate and may be surrounded by an outer photosensitive region. The pixel... Semiconductor Components Industries Llc

11/09/17 / #20170324917

Dual-photodiode image pixel

An image sensor may have an array of pixels that include nested sub-pixels that each have at least one respective photodiode. An inner sub-pixel of a pixel with nested sub-pixels may have a relatively lower effective light collecting area compared to an outer sub-pixel of the pixel within which the... Semiconductor Components Industries Llc

11/02/17 / #20170315147

Multi-axis accelerometer with reduced stress sensitivity

Implementations of an accelerometer component may include: a first Z proof mass rotatable about a first axis and coupled to an anchor, the first Z proof mass including a first plurality of electrodes. Implementations may include a second Z proof mass rotatable about the first axis and coupled to the... Semiconductor Components Industries Llc

Patent Packs
11/02/17 / #20170317021

Packaged semiconductor devices with multi-use input contacts and related methods

A semiconductor device includes a first contact receiving a first voltage, a second contact receiving a second voltage, one or more comparing elements comparing the first and second voltages, and one or more setting elements setting one or more parameters of the device in response to a comparison of the... Semiconductor Components Industries Llc

11/02/17 / #20170317072

Method of forming a heterojunction semiconductor device having integrated clamping device

A cascode switch structure includes a group III-V transistor structure having a first current carrying electrode, a second current carrying electrode and a first control electrode. A semiconductor MOSFET device includes a third current carrying electrode electrically connected to the second current carrying electrode, a fourth current carrying electrode electrically... Semiconductor Components Industries Llc

11/02/17 / #20170317598

Current sense detection for synchronous rectification

A power conversion circuit including an SR MOSFET is provided. A minimum off-time timer for the SR MOSFET is started. A voltage potential at a first terminal of the SR MOSFET is measured. The SR MOSFET is turned on after a rate of change over time of the voltage potential... Semiconductor Components Industries Llc

10/26/17 / #20170309617

Cascode semiconductor device structure and method therefor

In one embodiment, a cascode rectifier structure includes a group III-V semiconductor structure includes a heterostructure disposed on a semiconductor substrate. A first current carrying electrode and a second current carrying electrode are disposed adjacent a major surface of the heterostructure and a control electrode is disposed between the first... Semiconductor Components Industries Llc

10/19/17 / #20170299417

Level sensor and method

In accordance with an embodiment, a method for detecting a fluid level, includes providing a fluid container having a cavity and coupling a first sensor to the fluid container, the first sensor protected from a fluid in the cavity and positioned at a first vertical level of the fluid container.... Semiconductor Components Industries Llc

10/19/17 / #20170299879

Methods and a polarizing image sensor

Various embodiments of the present technology may comprise a method and apparatus for a polarizing filter. The polarizing filter may be formed such that the filter has varying polarization axes for blocking reflected light emitted from various directions. The method and apparatus may utilize metal wires or molecular chains to... Semiconductor Components Industries Llc

10/19/17 / #20170302853

Methods and optical image stabilization

Various embodiments of the present technology may comprise a method and apparatus for optical image stabilization. The apparatus may comprise a lens coupled to an actuator. The actuator may receive signals from an OIS circuit corresponding to a magnitude and direction, and the actuator may act on these signals by... Semiconductor Components Industries Llc

10/12/17 / #20170293811

Systems and methods for buffer-free lane detection

A method of performing lane detection without the use of a frame buffer may include capturing image frames with an image sensor in a vehicular imaging system. Feature extraction circuitry in the vehicular imaging system may analyze a frame to detect features corresponding to possible lane markers. The features may... Semiconductor Components Industries Llc

10/12/17 / #20170294362

Semiconductor package with elastic coupler and related methods

Implementations of semiconductor packages may include: a die coupled to a substrate; a housing coupled to the substrate and at least partially enclosing the die within a cavity of the housing, and; a pin fixedly coupled to the housing and electrically coupled with the die, wherein the pin includes a... Semiconductor Components Industries Llc

10/12/17 / #20170294530

Electronic device including a hemt with a segmented gate electrode and a process of forming the same

An electronic device can include a low-side HEMT including a segmented gate electrode; and a high-side HEMT coupled to the low-side HEMT, wherein the low-side and high voltage HEMTs are integrated within a same semiconductor die. In another aspect, an electronic device can include a source electrode; a low-side HEMT;... Semiconductor Components Industries Llc

10/12/17 / #20170295338

Backside illuminated global shutter pixel with active reset

An image sensor may include an array of pixels arranged in rows and columns. The array of pixels may operate in a global shutter mode. Each pixel in the array of pixels may have a floating diffusion node for storing charge and may include an active reset circuit that acts... Semiconductor Components Industries Llc

10/05/17 / #20170288027

Method of forming trench semiconductor device having multiple trench depths

A method of forming a semiconductor includes a providing a termination trench and an active trench within a semiconductor layer. The active trench is configured to be at a shallower depth than the termination trench to provide a trench depth difference. The selected trench depth difference in combination with one... Semiconductor Components Industries Llc

10/05/17 / #20170288528

Active clamp power converter and reducing shoot-through current during soft start

An ACF power converter uses a soft start operation to reduce overheating and stress on components. The power converter includes a first transistor and second transistor. A high side driver controls the first transistor, and low side driver controls the second transistor. A first operating potential is provided to the... Semiconductor Components Industries Llc

10/05/17 / #20170288550

Ultrasonic control a buck-boost power converter

A buck-boost power converter includes an inductor driver section, a pulse width modulated (PWM) section, and a switch control section. The inductor driver includes a first switch to selectively couple an input to a first node of an inductor, a second switch to selectively couple the first node of the... Semiconductor Components Industries Llc

10/05/17 / #20170288552

Power converter and entering skip at a fixed output power in a light load condition independent of magnetizing inductance

A power converter has a power transistor and inductor coupled in a conduction path with the power transistor. A switching frequency of the power transistor is reduced during a light load condition. A pulse width of a drive signal to the power transistor is controlled to select a current through... Semiconductor Components Industries Llc

Patent Packs
10/05/17 / #20170290134

Discharge method and circuit for usb connector

This document discusses, among other things, a discharge circuit for a USB connector configured to discharge a voltage of a pin (e.g., a VBUS pin) of the USB connector. The discharge circuit can include a discharge load to discharge the voltage of the pin; a first control circuit to adjust... Semiconductor Components Industries Llc

09/28/17 / #20170277211

Signal receiving circuit and method, and signal detecting circuit

This document discusses, among other things, a signal receiving circuit, configured to receive an input voltage signal. The signal receiving circuit can comprise an input voltage regulating circuit and a comparing circuit. The input voltage regulating circuit can carry out a waveform pre-regulation for the input voltage signal to obtain... Semiconductor Components Industries Llc

09/28/17 / #20170277507

Systems and methods for audio playback

Implementations of a method of synchronizing audio playback may include, using a correction block and a second sample counter, comparing a number of playback samples in a slave channel stream with a number of master playback samples in a master channel stream received from a wireless telecommunication channel from a... Semiconductor Components Industries Llc

09/28/17 / #20170280074

High dynamic range and global shutter image sensor pixels having charge overflow signal detecting structures

An image sensor may include an array of image sensor pixels. Each pixel may have a photodiode, a charge storage region, and a charge overflow circuit. The charge storage region may be used to operate the image sensor array in global shutter mode. During high light level illumination, the charge... Semiconductor Components Industries Llc

09/21/17 / #20170271252

Stacked semiconductor device structure and method

A stacked semiconductor device structure includes a first semiconductor device having a first major surface and a second major surface opposite to the first major surface. The second major surface includes a recessed region bounded by sidewall portions, and the sidewall portions have outer surfaces defining peripheral edge segments of... Semiconductor Components Industries Llc

09/21/17 / #20170271489

Semiconductor device and manufacture

In one embodiment, an IGBT is formed to include a region of semiconductor material. Insulated gate structures are disposed in region of semiconductor material extending from a first major surface. An n-type field stop region extends from a second major surface into the region of semiconductor material. A p+ type... Semiconductor Components Industries Llc

09/21/17 / #20170271775

Direct transition from a waveguide to a buried chip

An assembly for confining electromagnetic radiation in a waveguide. The assembly comprises a waveguide, comprising walls surrounding a cavity and an aperture in the walls that opens to the cavity, and a substrate assembly disposed in the aperture. The substrate assembly comprises a substrate comprising an antenna, wherein the antenna... Semiconductor Components Industries Llc

09/21/17 / #20170271975

Temporary energy storage for voltage supply interruptions

In one form, a capacitor voltage limiter (240), comprises a supply node (244), a pass element (242) having a first current electrode coupled to the supply node (244), a control electrode, and a second current electrode. The second current electrode is adapted to be coupled to an external storage capacitor... Semiconductor Components Industries Llc

09/21/17 / #20170272667

Image sensors with a rolling shutter scanning mode and high dynamic range

Imaging pixels may be operated in a rolling shutter scanning mode. Charge signal that is generated on a first chip may be capacitively coupled to signal processing circuits on a second chip. A capacitor may be placed in the signal path that provides signal coupling between the chips and stores... Semiconductor Components Industries Llc

09/21/17 / #20170272740

Methods and error detection in an imaging system

Various embodiments of the present technology may comprise methods and apparatus for error detection in an imaging system. The method and apparatus may comprise pixels arranged in rows and columns and an error detection circuit receiving pixel data generated by the pixels. The error detection circuit may detect errors and... Semiconductor Components Industries Llc

09/14/17 / #20170261606

Circuit for acoustic distance time of flight compensation

In one form, an acoustic signal is generated for an acoustic transducer, where the acoustic transducer transmits the acoustic signal to determine a first position of an obstacle. In response to the acoustic signal encountering the obstacle within a predetermined distance, an echo, or pulse, is detected at the acoustic... Semiconductor Components Industries Llc

09/14/17 / #20170264201

Method and circuit for peak power in quasi-resonant converters

Implementations of the present disclosure involve a circuit and/or method for a control circuit of a switched-mode power supply that allows the power supply circuit to temporarily provide up to 2.0× the nominal maximum power rating of the circuit without the need for large storage devices within the power supply.... Semiconductor Components Industries Llc

09/14/17 / #20170264202

Method and circuit for peak power in quasi-resonant converters

Implementations of the present disclosure involve a circuit and/or method for a control circuit of a switched-mode power supply that allows the power supply circuit to temporarily provide up to 2.0× the nominal maximum power rating of the circuit without the need for large storage devices within the power supply.... Semiconductor Components Industries Llc

09/14/17 / #20170265025

Accommodating interference between wireless streaming and control protocols

Disclosed wireless systems, devices, and methods accommodate interference between different communication protocols. One illustrative wireless communications system embodiment includes: an accessory device and a media device. The accessory device supports a wireless streaming protocol and a wireless control protocol that interferes with the wireless streaming protocol. The media device intermittently... Semiconductor Components Industries Llc

09/07/17 / #20170256576

High reliability housing for a semiconductor package

Implementations of semiconductor packages may include: a substrate coupled to one or more die and to one or more connectors, a glass lid coupled over one or more die by an adhesive and a housing comprising one or more sides and a bottom opening and a top opening. The substrate... Semiconductor Components Industries Llc

09/07/17 / #20170257578

Imaging pixels with a fully depleted charge transfer path

An imaging pixel may have a fully depleted charge transfer path between a pinned photodiode and a floating diffusion region. A pinned transfer diode may be coupled between the pinned photodiode and the floating diffusion region. The imaging pixel may be formed in upper and lower substrates with an interconnect... Semiconductor Components Industries Llc

09/07/17 / #20170257580

Imaging systems with flicker mitigation and high dynamic range

An image pixel may include a shutter element that is operable in an open state during which a corresponding photodiode accumulates charge and a closed state during which charge is drained from the photodiode. During a first portion of an image frame, the image pixel may operate in a flicker... Semiconductor Components Industries Llc

09/07/17 / #20170257730

System and single radio multi-device communication

Aspects of the present disclosure involve a system and method for communicating with multiple devices using a single radio. In one embodiment, a wearable device is configured to use a single radio for near-field and far-field communications. In another embodiment, the wearable device is configured to include an adaptable radio... Semiconductor Components Industries Llc

08/31/17 / #20170250217

Method of forming a shallow pinned photodiode

An image sensor with a pinned photodiode includes a photodiode formed in a substrate by implanting dopants of a first type through one or more dielectric layers formed over the substrate. A pinning layer for the photodiode may be formed by implanting dopants of a second type through the same... Semiconductor Components Industries Llc

08/31/17 / #20170250218

Methods of forming imaging pixel microlenses

A method of forming a microlens may include using two layers of photoresist. The first photoresist layer may be patterned to form a first portion of a pixel microlens. A second photoresist layer may be patterned on top of the first portion of the pixel microlens. The second photoresist may... Semiconductor Components Industries Llc

08/24/17 / #20170243069

Methods and an imaging system

Various embodiments of the present technology may comprise a method and apparatus for an on-vehicle camera system capable of calibrating the camera's orientation (i.e. pitch, yaw, roll angles) in relation to the vehicle's coordinate system utilizing normally-encountered imagery. The method and apparatus may comprise utilizing an image processor to detect... Semiconductor Components Industries Llc

08/24/17 / #20170244917

Logarithmic pixels with correlated double sampling

An imaging pixel may be operated in either a linear mode or a logarithmic mode. In the logarithmic mode, the voltage at a floating diffusion region may be proportional to the logarithm of the intensity of incident light. In order to enable correlated double sampling (CDS) in the logarithmic mode,... Semiconductor Components Industries Llc

08/24/17 / #20170244921

Image sensors having high-efficiency charge storage capabilities

An image pixel may include a photodiode, storage node, floating diffusion, and capacitor. A first transistor may be coupled between the photodiode and the storage node. A second transistor may be coupled between the storage node and the floating diffusion. A third transistor may be coupled between the capacitor and... Semiconductor Components Industries Llc








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