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Semiconductor Components Industries Llc patents


Recent patent applications related to Semiconductor Components Industries Llc. Semiconductor Components Industries Llc is listed as an Agent/Assignee. Note: Semiconductor Components Industries Llc may have other listings under different names/spellings. We're not affiliated with Semiconductor Components Industries Llc, we're just tracking patents.

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 new patent  Semiconductor devices and methods of making the same

In one embodiment, methods for making semiconductor devices are disclosed.... Semiconductor Components Industries Llc

 new patent  Semiconductor packages and related methods

Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the leadframe, and encapsulating at least a portion of the semiconductor die or the electronic component using a mold compound leaving two or more leads of the leadframe exposed. The... Semiconductor Components Industries Llc

 new patent  High-electron-mobility transistor (hemt) semiconductor devices with reduced dynamic resistance

High-electron-mobility transistor (HEMT) devices are described in this patent application. In some implementations, the HEMT devices can include a back barrier hole injection structure. In some implementations, the HEMT devices include a conductive striped portion electrically coupled to a drain contact.... Semiconductor Components Industries Llc

 new patent  Monolithic series switching semiconductor device having low-resistance substrate contact structure and method

A semiconductor device structure includes a region of semiconductor material with a first major surface and an opposing second major surface. A contact structure is disposed in a first portion of the region of semiconductor material and includes a tub structure extending from adjacent a first portion of the first... Semiconductor Components Industries Llc

 new patent  Power supply controller and related methods

A power supply controller having a shortened reset time due to a small hiccup voltage includes an electrical circuit providing a repeated voltage hiccup of a supply voltage of the controller of a switched-mode power supply (SMPS) when the controller enters a latched state. A plurality of comparators each have... Semiconductor Components Industries Llc

 new patent  Active output driver supply compensation for noise reduction

An electronic system, in some embodiments, comprises: a power source; a load coupled to the power source; an analog-to-digital converter, coupled to the power source and the load, that samples a fluctuating voltage supplied by the power source and generates a digital representation of said fluctuating voltage; control logic, coupled... Semiconductor Components Industries Llc

Cascode semiconductor package and related methods

A semiconductor package includes an electrically conductive base (base) having a source connector. A drain connector and a gate connector are electrically coupled with the base. A depletion mode gallium nitride field-effect transistor (GaN FET) and an enhancement mode laterally diffused metal-oxide-semiconductor field-effect transistor (LDMOS FET) are also coupled with... Semiconductor Components Industries Llc

Methods and an image sensor with a multi-branch transistor

Various embodiments of the present technology may comprise a method and device for a multi-branch transistor for use in an image sensor. The device may comprise an active region, wherein the active region comprises three doped regions. At least two of the three doped region may be floating diffusion active... Semiconductor Components Industries Llc

Hybrid control technique for power converters

A power conversion circuit includes a high-side MOSFET and a low-side MOSFET. A conduction terminal of the high-side MOSFET is coupled to a conduction terminal of the low-side MOSFET at a half-bridge (HB) circuit node. The high-side MOSFET is switched off. Voltage potential transitions of the HB circuit node are... Semiconductor Components Industries Llc

Substrate structures and methods of manufacture

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first... Semiconductor Components Industries Llc

Methods and determining a relative state of charge of a battery

Various embodiments of the present technology may comprise methods and apparatus for determining a relative state of charge of battery. According to various embodiments, the methods and apparatus may operate to establish continuity between the RSOC values that are computed before and after a change in the charge mode of... Semiconductor Components Industries Llc

Adaptive feedback control voltage regulators

A voltage regulator includes a first feedback circuit, a second feedback circuit, and a feedback signal adaptive circuit. The first voltage feedback circuit includes an amplifier that is configured to generate a compensation signal according to a feedback signal from an output of the voltage regulator and a reference voltage,... Semiconductor Components Industries Llc

Three-phase brushless motor state identification

A method for determining the state of a brushless motor having first, second and third phases, in some embodiments, comprises: decoupling said motor from a power source; determining whether said motor is rotating or non-rotating; if the motor is rotating, determining a first phase voltage state relative to a common... Semiconductor Components Industries Llc

Control circuit and method therefor

In one embodiment, a control circuit may be configured to form a switching signal to switch a power transistor at a frequency to regulate an output voltage of the power supply to a target value wherein the control circuit is configured to operate in a normal operating mode and a... Semiconductor Components Industries Llc

High reliability housing for a semiconductor package

Implementations of semiconductor packages may include: a substrate including a first side and a second side and an image signal processor (ISP) including a first side and a second side where first side of the ISP is coupled to the first side of the substrate. A first mold compound may... Semiconductor Components Industries Llc

Image sensor pixels with overflow capabilities

An image sensor pixel may include multiple split photodiodes that are covered by a single microlens. The image sensor may include a charge overflow capacitor coupled to a pixel charge storage within the image sensor via a gain control transistor. The image sensor pixel may have phase detection capabilities in... Semiconductor Components Industries Llc

Average current and frequency control

Apparatuses, systems and methods for regulating the output currents of a power supply at a target output current include a buck converter module operably connected to a power source and a load. A first switch couples the power source to the buck converter module during a first period of a... Semiconductor Components Industries Llc

Absolute and differential pressure sensors and related methods

Implementations of absolute pressure sensor devices may include a microelectromechanical system (MEMS) absolute pressure sensor coupled over a controller die. The MEMS absolute pressure sensor may be mechanically coupled to the controller die and may also be configured to electrically couple with the controller die. A perimeter of the controller... Semiconductor Components Industries Llc

Resonance-coupled signaling between ic modules

Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a transmitter in a first module, the transmitter providing a modulated carrier signal; a receiver in a second module demodulating the modulated carrier signal; and a galvanically isolated signaling path that includes: a first... Semiconductor Components Industries Llc

Current sense element for current regulated circuit and the like and method therefor

In one form, a circuit having a current sense element includes a current sense element, a target signal generator, and an error signal generator. The current sense element has first and second terminals and is adapted to be coupled in a current path whose current is to be sensed. The... Semiconductor Components Industries Llc

Receiver for resonance-coupled signaling

An illustrative integrated circuit configured for galvanically isolated signaling includes a receiver having: a detector module coupled to receive a differential signal from terminals of a transformer secondary, the detector module responsively presenting an impedance that varies based on a magnitude of the differential signal; a biasing module that converts... Semiconductor Components Industries Llc

Galvanically-isolated signaling between modules with step-up transformer

An illustrative embodiment of an integrated circuit configured for galvanically isolated signaling includes a transfer conductor carrying a modulated carrier signal. A floating transfer loop is electromagnetically coupled to the transfer conductor to receive the modulated carrier signal. The floating transfer loop includes a primary of a step-up transformer. A... Semiconductor Components Industries Llc

Method for forming ohmic contacts

Implementations of an ohmic contact for a gallium nitride (GaN) device may include: a first layer including aluminum coupled directly with the GaN device; the GaN having a heterostructure with an undoped GaN channel and a semi-insulating aluminum gallium nitride (AlGaN) barrier, all the foregoing operatively coupled with a substrate;... Semiconductor Components Industries Llc

Switched mode power supply with dynamic frequency foldback

In one form, a switched mode power supply controller with frequency foldback includes a pulse width modulator responsive to a clock signal to generate a drive signal having a pulse width that varies in response to a feedback signal, and a variable frequency oscillator having a first input for receiving... Semiconductor Components Industries Llc

Image pixels with in-column comparators

Image sensors may include imaging pixels that have comparators to read out image pixel signals. An imaging pixel may include a photodiode, a floating diffusion region, and a transfer transistor that transfers charge from the photodiode to the floating diffusion region. The floating diffusion region may be coupled to a... Semiconductor Components Industries Llc

Imaging systems with fluidic color filter elements

Imaging systems may include fluidic color filter elements to increase the flexibility of the system. An imaging system may include a number of fluid reservoirs with different color filter element fluids. The imaging sensor may include a number of separated color filter chambers. Fluids from the fluid reservoirs may be... Semiconductor Components Industries Llc

Process of forming an electronic device including exposing a substrate to an oxidizing ambient

A process of forming electronic device can include providing a substrate having a first portion and a second portion; introducing a nitrogen-containing species into the second portion of the substrate; and exposing the substrate to an oxidizing ambient, wherein a thicker oxide is grown from the first portion as compared... Semiconductor Components Industries Llc

Single or multi chip module package and related methods

Implementations of a semiconductor device package may include: a plurality of electrical contacts on a first face of a die, at least one clip electrically and mechanically coupled with at least one electrical contact on a second face of the die where the second face of the die is on... Semiconductor Components Industries Llc

Bonded semiconductor package and related methods

Implementations of a semiconductor package may include: a first wafer having a first surface and a first set of blade interconnects, the first set of blade interconnects extending from the first surface. The package may include a second wafer having a first surface and a second set of blade interconnects,... Semiconductor Components Industries Llc

Electronic device including a cascode circuit having principal drive and bypass transistors

An electronic device can include a first transistor including a first gate electrode; and a second transistor including a second gate electrode. The first and second transistors can be electrically connected in a parallel arrangement, wherein the transistors have one or more different characteristics. For example, gate length, barrier layer... Semiconductor Components Industries Llc

Image sensor packages formed using temporary protection layers and related methods

An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an... Semiconductor Components Industries Llc

Imaging systems with data encryption and embedding capabalities

An imaging system may embed encrypted data into image data. The imaging system may generate image data in response to light received at a pixel array. The imaging system may include encryption circuitry that accesses an encryption key. The encryption circuitry may receive data related to the imaging system and/or... Semiconductor Components Industries Llc

Long-lasting wettable flanks

A method for plating package leads, in some embodiments, comprises: providing a package having a lead electrically coupled to a tie bar; singulating said lead; electroplating said singulated lead using the tie bar; and singulating said tie bar.... Semiconductor Components Industries Llc

Image sensors with infrared-blocking layers

An image sensor may include an infrared radiation-blocking layer. The infrared radiation-blocking layer may block infrared radiation from reflecting off of metal layers formed beneath pixel structures in the image sensor so that the reflected light does not reach the photodiodes. The infrared radiation-blocking layer may be formed between a... Semiconductor Components Industries Llc

Ripple reduction chopper amplifiers

An electrical circuit comprising a modulating chopper configured to receive a differential input signal at a first frequency and modulate the differential input signal to a second frequency to form a modulated differential signal, a null amplifier coupled to the modulating chopper and configured to amplify the modulated differential signal... Semiconductor Components Industries Llc

03/29/18 / #20180091748

Image sensors having dark pixels

An imaging sensor may include an array of imaging pixels and at least two rows of dark pixels. Each imaging pixel may include a photodiode that generates charge in response to incident light. Each dark pixel may include a photodiode that is shielded from incident light by shielding material. The... Semiconductor Components Industries Llc

03/22/18 / #20180082913

High reliability wafer level semiconductor packaging

Implementations of semiconductor packages may include: a semiconductor wafer, a glass lid fixedly coupled to a first side of the semiconductor die by an adhesive, a redistribution layer coupled to a second side of the semiconductor die, and a plurality of ball mounts coupled to the redistribution layer on a... Semiconductor Components Industries Llc

03/22/18 / #20180083058

Methods and a thermal equalizer in an image sensor

Various embodiments of the present technology may comprise a method and apparatus for an image sensor with a thermal equalizer for distributing heat. The method and apparatus may comprise a thermal equalizer disposed between a sensor die and a circuit die to prevent uneven heating of the pixels in the... Semiconductor Components Industries Llc

03/22/18 / #20180083336

Embedded directional couplers and related methods

A directional coupler includes an electrically conductive main line coupled at least partially in and/or on a dielectric layer and having input and output ports. An electrically conductive coupled line separated from the main line includes a coupled port and is at least partially formed in and/or on the dielectric... Semiconductor Components Industries Llc

03/22/18 / #20180083558

Rotor position sensing system for three phase motors and related methods

A system and method for sensing rotor position of a three-phase permanent magnet synchronous motor (PMSM) includes a controller coupled with the PMSM and causing a plurality of voltage pulses to be applied thereto. A timer and/or an analog-to-digital converter is coupled with the PMSM and measures a plurality of... Semiconductor Components Industries Llc

03/22/18 / #20180084054

Low power sensor communication using two or fewer wires

A sensor module, in some embodiments, comprises a sensor configured to capture data and a sensor interface coupled to the sensor and configured to process the data captured by the sensor to form processed data. The sensor module may also comprise a current consumption configuration component and a transistor coupled... Semiconductor Components Industries Llc

03/22/18 / #20180084164

Image sensors with stacked photodiodes

Electronic devices may include High Dynamic Range (HDR) complementary metal-oxide-semiconductor (CMOS) image sensor arrays that are illuminated from the back side of the substrate and operate in a rolling shutter (RS) scanning mode. An image sensor may include stacked chips to improve image sensor performance. For example, by stacking photodiodes... Semiconductor Components Industries Llc

03/15/18 / #20180074537

Regulation circuit associated with synchronous rectifier providing cable compensation for the power converter and method thereof

A regulation circuit of a power converter for cable compensation according to the present invention comprises a signal generator generating a compensation signal in accordance with a synchronous rectifying signal. An error amplifier has a reference signal for generating a feedback signal in accordance with an output voltage of the... Semiconductor Components Industries Llc

03/15/18 / #20180076120

Semiconductor device and aligning semiconductor wafers for bonding

A semiconductor device has a first semiconductor wafer. The first semiconductor wafer is singulated to provide a first wafer section including at least one first semiconductor die or a plurality of first semiconductor die. The first wafer section is a fractional portion of the first semiconductor wafer. An edge support... Semiconductor Components Industries Llc

03/15/18 / #20180076244

Embedded image sensor semiconductor packages and related methods

An embedded image sensor package including a transparent cover having a first side and an opposing second side. A first layer couples over the second side of the transparent cover and has an opening. An electrically conductive layer couples in or over the first layer and electrically couples with one... Semiconductor Components Industries Llc

03/15/18 / #20180076721

Quasi-resonant valley lockout without feedback reference

A method of controlling a power supply includes detecting a transition of the power supply to discontinuous conduction mode (DCM), and locking an operating point of the power supply after detecting the transition. The operating point can be unlocked when a timer expires or when a feedback voltage slope exceeds... Semiconductor Components Industries Llc

03/15/18 / #20180077368

Image sensors with power supply noise rejection capabilities

An image sensor may include an array of pixels having an active pixel. The active pixel may generate image signals in response to incident light. The image sensor may also include a power supply and booster circuitry. The power supply may provide a powers supply voltage signal, which has a... Semiconductor Components Industries Llc

03/08/18 / #20180068997

Cascode circuit and an electronic device including a transistor and a field electrode

In an aspect, a cascode circuit can include a high-side transistor and a low-side transistor. The source of the high-side transistor can be coupled to the drain of the low-side transistor; and the gate of the high-side transistor can be coupled to each of the source and the gate of... Semiconductor Components Industries Llc

03/08/18 / #20180069049

Semiconductor device and forming curved image sensor region robust against buckling

A semiconductor wafer has a plurality of non-rectangular semiconductor die with an image sensor region. The non-rectangular semiconductor die has a circular, elliptical, and shape with non-linear side edges form factor. The semiconductor wafer is singulated with plasma etching to separate the non-rectangular semiconductor die. A curved surface is formed... Semiconductor Components Industries Llc

03/08/18 / #20180069291

Radio frequency identification (rfid) tag device and related methods

Implementations of antennas may include a meandering T-matching structure, a first meandering feed line coupled to the meandering T-matching structure, and a first radiating part coupled to the first meandering feed line. Implementations may include a second meandering feed line coupled to the meandering T-matching structure, and a second radiating... Semiconductor Components Industries Llc

03/08/18 / #20180069495

Rotor position sensing system for three phase motors and related methods

A system and method for sensing rotor position of a three-phase permanent magnet synchronous motor (PMSM) includes a controller coupled with the PMSM and causing a plurality of voltage pulses to be applied thereto. A timer and/or an analog-to-digital converter is coupled with the PMSM and measures a plurality of... Semiconductor Components Industries Llc

03/08/18 / #20180070030

Global shutter imaging pixels

A global shutter imaging pixel may have a single source follower transistor. The source follower transistor may be coupled to a floating diffusion region and a charge storage region. In order to read out samples from the charge storage region without including a second source follower transistor in each pixel,... Semiconductor Components Industries Llc

03/08/18 / #20180070031

Imaging pixels with a fully depleted charge transfer path

An imaging pixel may have a fully depleted charge transfer path between a pinned photodiode and a floating diffusion region. A pinned transfer diode may be coupled between the pinned photodiode and the floating diffusion region. The imaging pixel may be formed in upper and lower substrates with an interconnect... Semiconductor Components Industries Llc

03/08/18 / #20180070038

Methods and a readout circuit

Methods and device for a readout circuit according to various aspects of the present invention may operate in conjunction with a storage device selectively coupled to an input signal having a voltage value within a first voltage range. A comparator may compare the voltage value of the input signal to... Semiconductor Components Industries Llc

03/01/18 / #20180058897

Capacitance liquid level sensor

In accordance with at least one embodiment, a method for detecting a liquid level includes providing a container (402) having a cavity, and disposing a sensor (102) in the cavity of the container (402), such that a ground pattern (310) on a first surface of the sensor (102) is positioned... Semiconductor Components Industries Llc

03/01/18 / #20180061791

Semiconductor copper metallization structure and related methods

Implementations of semiconductor packages may include: a silicon die including a pad, the pad including aluminum and copper; a passivation layer over at least a portion of the silicon die and a layer of one of a polyimide (PI) a polybenzoxazole (PBO), or a polymer resin coupled to the passivation... Semiconductor Components Industries Llc

03/01/18 / #20180061998

Bidirectional jfet and a process of forming the same

An electronic device comprising a bidirectional JFET can include a drain/source region; a lightly doped semiconductor layer overlying the drain/source region; a source/drain region overlying the lightly doped semiconductor layer; a trench extending through the source/drain region and into the lightly doped semiconductor layer; a gate electrode of the bidirectional... Semiconductor Components Industries Llc

03/01/18 / #20180063457

Analog-to-digital converter circuitry with offset distribution capabilities

Analog-to-digital converter (ADC) circuitry may receive multiple analog signals and output corresponding digital signals. During the conversion process, comparators may receive the analog signals and a ramp waveform and compare the two inputs to generate logic signals. The logic signals correspond to digital signals that are outputted by ADC circuitry.... Semiconductor Components Industries Llc

02/22/18 / #20180052046

Methods and a light sensor

Various embodiments of the present technology may comprise methods and apparatus for a light sensor with a precharge circuit, such as for charging an internal node of a sensor to a starting voltage equal to an ending voltage of a different sensor. The methods and apparatus may comprise sequentially reading... Semiconductor Components Industries Llc

02/22/18 / #20180053696

Damaging components with defective electrical couplings

A method, in some embodiments, comprises: providing a component having first and second electrical nodes; determining that the component lacks multiple, functional electrical couplings between said first and second nodes; damaging at least part of the component as a result of said determination; and determining, as a result of said... Semiconductor Components Industries Llc

02/22/18 / #20180053712

Holes and dimples to control solder flow

A system, in some embodiments, comprises: a first surface of a lead frame; a second surface of the lead frame, opposite the first surface, said second surface having been etched; and one or more holes passing through said lead frame and coincident with the first and second surfaces, wherein said... Semiconductor Components Industries Llc

02/22/18 / #20180053739

Semiconductor wafer and ball drop on thin wafer with edge support ring

A semiconductor wafer has an edge support ring around a perimeter of the semiconductor wafer and conductive layer formed over a surface of the semiconductor wafer within the edge support ring. A first stencil is disposed over the edge support ring with first openings aligned with the conductive layer. The... Semiconductor Components Industries Llc

02/22/18 / #20180054109

Control circuits and control methods for power converters

In a general aspect, a control circuit for a power converter can include an option selector circuit that is coupled with a detection pin. The option selector can, based on a voltage applied to the detection pin being greater than or less than a threshold voltage, respectively generate a first... Semiconductor Components Industries Llc

02/22/18 / #20180054131

Control circuit for power converter with isolated or non-isolated feedback

In one general aspect, a control circuit for a power converter can include a feedback terminal configured to be coupled to a non-isolated feedback of the power converter when a feedback of the power converter is the non-isolated feedback, or configured to be coupled to a ground when the feedback... Semiconductor Components Industries Llc

02/22/18 / #20180054132

Method and synchronous rectifier

A synchronous rectifier controller includes an exception timer, one or more blanking timers, and control logic. The control logic may detect a beginning of a conduction phase using a current sense signal. In response to detecting the beginning of the conduction phase, the control logic commences the exception timer, commences... Semiconductor Components Industries Llc

Patent Packs
02/22/18 / #20180054684

Active output driver supply compensation for noise reduction

An electronic system, in some embodiments, comprises: a power source; a load coupled to the power source; an analog-to-digital converter, coupled to the power source and the load, that samples a fluctuating voltage supplied by the power source and generates a digital representation of said fluctuating voltage; control logic, coupled... Semiconductor Components Industries Llc

02/15/18 / #20180048835

Methods and a ccd image sensor

Various embodiments of the present technology may comprise methods and apparatus for a CCD image sensor. The image sensor may comprise a center channel disposed along a horizontal center line of the pixel array for collecting and transferring charge. The center channel is electrically coupled to a lateral overflow drain.... Semiconductor Components Industries Llc

02/15/18 / #20180048841

Global shutter image sensor pixels having improved shutter efficiency

An image sensor may be provided with an array of image sensor pixels formed on a substrate having front and back surfaces. Each pixel may have a photodiode that receives light through the back surface, a floating diffusion node, a charge transfer gate, and first and second reset transistor gates.... Semiconductor Components Industries Llc

02/15/18 / #20180048871

Methods and devices for increasing the spectral response of an image sensor

Various embodiments of the present technology may comprise methods and devices for improving the spectral response of an imaging device. The methods and devices may operate in conjunction with a pixel array and color filter array. The color filter array may comprise pattern of color filters arranged in groups. At... Semiconductor Components Industries Llc

02/08/18 / #20180040469

Semiconductor wafer and wafer thinning using grinding phase and separation phase

A semiconductor wafer has a base material. The semiconductor wafer may have an edge support ring. A grinding phase of a surface of the semiconductor wafer removes a portion of the base material. The grinder is removed from or lifted off the surface of the semiconductor wafer during a separation... Semiconductor Components Industries Llc

02/08/18 / #20180040522

Semiconductor wafer and backside probe testing through opening in film frame

A semiconductor test system has a film frame including a tape portion with one or more openings through the tape portion. The opening is disposed in a center region of the tape portion of the film frame. The film frame may have conductive traces formed on or through the tape... Semiconductor Components Industries Llc

02/08/18 / #20180040539

Quad flat no leads package

Implementations of semiconductor packages may include: a lead frame having at least one corner lead, the at least one corner lead positioned where two edges of the package meet, and the at least one lead having a half etch on a first portion of the lead and a half etch... Semiconductor Components Industries Llc

02/08/18 / #20180040593

Semiconductor device and integrating power module with interposer and opposing substrates

A semiconductor device has an interposer including a plurality of conductive vias formed through the interposer. A first semiconductor die is disposed over the interposer. A second semiconductor die is disposed over a first substrate. The first semiconductor die and second semiconductor die are power semiconductor devices. The interposer is... Semiconductor Components Industries Llc

02/01/18 / #20180031701

Obstacle monitoring using motion-compensated distance

An obstacle monitoring system includes a first transducer that obtains a first distance measurement to an obstacle using a first linear frequency modulated (“LFM”) chirp. The system further includes a second transducer, able to operate concurrently with the first transducer, that obtains a second distance measurement to the obstacle using... Semiconductor Components Industries Llc

02/01/18 / #20180033669

Electronic device and a process for forming the same

An electronic device can include a semiconductor material and a semiconductor layer overlying the semiconductor material, wherein the semiconductor layer has a greater bandgap energy as compared to the semiconductor material. The electronic device can include a component having a high electrical field region and a low electrical field region.... Semiconductor Components Industries Llc

02/01/18 / #20180033739

Semiconductor wafer and reducing wafer thickness with asymmetric edge support ring encompassing wafer scribe mark

A semiconductor wafer has a base material with a first thickness and first and second surfaces. A wafer scribe mark is disposed on the first surface of the base material. A portion of an interior region of the second surface of the base material is removed to a second thickness... Semiconductor Components Industries Llc

02/01/18 / #20180033777

Embedded stacked die packages and related methods

Forming a semiconductor package includes coupling electrically conductive elements with a substrate, coupling a first die with one or more of the electrically conductive elements, and at least partially encapsulating the first die and electrically conductive elements in a first mold layer. A first redistribution layer (RDL) is placed over... Semiconductor Components Industries Llc

02/01/18 / #20180033861

Electronic device including a dielectric layer having a non-uniform thickness

An electronic device can include a transistor having a drain region, a source region, a dielectric layer, and a gate electrode. The dielectric layer can have a first portion and a second portion, wherein the first portion is relatively thicker and closer to the drain region; the second portion is... Semiconductor Components Industries Llc

02/01/18 / #20180033877

Electronic device including a hemt

An electronic device can include a bidirectional HEMT. In an aspect, the electronic device can include a pair of switch gate and blocking gate electrodes, wherein the switch gate electrodes are not electrically connected to the blocking gate electrodes, and the first blocking, first switch, second blocking, and second switch... Semiconductor Components Industries Llc

02/01/18 / #20180034389

Motor driver with multipurpose pin

In an embodiment, a motor driver comprises a multipurpose pin operable to couple the motor driver to a controller and judgment logic coupled to the multipurpose pin. The motor driver is operable to receive an input signal via the multipurpose pin and may be operable in a normal operation mode... Semiconductor Components Industries Llc

Patent Packs
02/01/18 / #20180034430

Programmable amplifier and operating the same

A programmable amplifier includes an amplifier, an input capacitor, a feedback circuit, and a high-pass filter circuit. The amplifier has an input coupled to the input capacitor for receiving an input signal. The feedback circuit includes multiple feedback capacitors of differing capacitance values that are each selectively coupled between the... Semiconductor Components Industries Llc

02/01/18 / #20180034447

Temperature compensated constant current system and method

A current reference circuit includes a voltage generating device, a resistor, one or more diodes, and a thermal bridge including one or more metal alloy contacts disposed on a substrate. The voltage generating device and the resistor have similar temperature coefficients. The diodes are thermally connected to the voltage generating... Semiconductor Components Industries Llc

01/25/18 / #20180021811

Method of forming a transducer controller and circuit therefor

In one embodiment, a transducer controller is configured to form a drive signal with a first frequency to drive a transducer. The drive signal has a period and a half-period and drives the transducer for a first portion of the half-period. The transducer controller is configured to, for a second... Semiconductor Components Industries Llc

01/25/18 / #20180025982

Semiconductor device and forming vertical one-time-programmable fuse

A vertical OTP fuse formed in a semiconductor device has a substrate and an insulating layer formed over the substrate with an opening through the insulating layer extending to the substrate. A conductive layer, such as silicide, is formed over a sidewall of the opening. A resistive material, such as... Semiconductor Components Industries Llc

01/25/18 / #20180026123

Bond-over-active circuity gallium nitride devices

Implementations of semiconductor devices may include: a first layer with a plurality of cells, each cell having a drain finger, a source finger and a gate ring; a second layer having a drain pad and a source pad, the drain pad having a width and a source pad having a... Semiconductor Components Industries Llc

01/25/18 / #20180026629

Output driver having pull-down capability

An output driver includes a switching device having a first node coupled to a gate of a power switch and pulling down a voltage level of the gate of the power switch to prevent a premature turn-on of the power switch. A pull-down circuit is coupled to the switching device... Semiconductor Components Industries Llc

01/25/18 / #20180026630

Circuit with transistors having coupled gates

A circuit can include a first transistor including a source and a gate; a second transistor including a drain and a gate, wherein the source of the first transistor is coupled to the drain of the second transistor; and a switchable element. In one embodiment, a first current-carrying terminal of... Semiconductor Components Industries Llc

01/18/18 / #20180019259

Semiconductor device and monolithically integrated power device and control logic

A monolithic semiconductor device has a substrate with a power region and control region. The substrate can be a silicon-on-insulator substrate. An opening is formed in the power region and extends partially through the substrate. A semiconductor material is formed within the opening. A power semiconductor device, such as a... Semiconductor Components Industries Llc

01/18/18 / #20180019275

Chip scale package and related methods

Implementations of semiconductor packages may include: a die coupled to a glass lid; one or more inner walls having a first material coupled to the die; an outer wall having a second material coupled to the die; and a glass lid coupled to the die at the one or more... Semiconductor Components Industries Llc

01/18/18 / #20180019332

Guard rings for cascode gallium nitride devices

Implementations of semiconductor devices may include: a plurality of drain fingers and a plurality of source fingers interdigitated with one another; at least one gate; and at gate bus formed to completely surround the plurality of drain fingers and the plurality of source fingers; wherein the gate bus is mechanically... Semiconductor Components Industries Llc

01/11/18 / #20180012994

Stacked-gate super-junction mosfet

A MOSFET having a stacked-gate super-junction design and novel termination structure. At least some illustrative embodiments of the device include a conductive (highly-doped with dopants of a first conductivity type) substrate with a lightly-doped epitaxial layer. The volume of the epitaxial layer is substantially filled with a charge compensation structure... Semiconductor Components Industries Llc

01/11/18 / #20180012995

Semiconductor devices and making the same

In one embodiment, the semiconductor devices relate to using one or more super-junction trenches for termination.... Semiconductor Components Industries Llc

01/04/18 / #20180005705

Fuse element programming circuit and method

In one embodiment, a programming circuit is configured to form a programming current for a silicide fuse element by using a non-silicide programming element.... Semiconductor Components Industries Llc

01/04/18 / #20180005927

Semiconductor component and manufacture

A semiconductor component includes a support having a lead integrally formed thereto. An insulated metal substrate is mounted to a surface of the support and a semiconductor chip is mounted to the insulated metal substrate. A III-N based semiconductor chip is mounted to the insulated metal substrate, where the III-N... Semiconductor Components Industries Llc

01/04/18 / #20180005936

Semiconductor package and related methods

Implementations of semiconductor packages may include: a prefabricated electrically conductive section; two or more metal oxide semiconductor field effect transistors (MOSFET) physically coupled together; and a back metal coupled to the two or more MOSFETs; wherein the electrically conductive section may be coupled to the back metal and may be... Semiconductor Components Industries Llc

01/04/18 / #20180005951

Semiconductor backmetal (bm) and over pad metallization (opm) structures and related methods

A method of forming semiconductor devices includes providing a wafer having a first side and second side, electrically conductive pads at the second side, and an electrically insulative layer at the second side with openings to the pads. The first side of the wafer is background to a desired thickness... Semiconductor Components Industries Llc

01/04/18 / #20180006565

Area-friendly providing duty cycle inverse to supply voltage

An illustrative converter embodiment employs an oscillator comprising a capacitor and a comparator. The capacitor is alternately coupled to a charging current source and a discharging current source, the charging current source operating to charge the capacitor at a first rate and the discharging source operating to discharge the capacitor... Semiconductor Components Industries Llc

01/04/18 / #20180006578

Method of manufacturing a circuit device

In one form, a method of manufacturing a circuit device comprises providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and... Semiconductor Components Industries Llc

12/28/17 / #20170372962

Semiconductor die singulation methods

Methods of singulating semiconductor die. Specific implementations may include: providing a semiconductor wafer including a plurality of die located on a first side of the semiconductor wafer where the plurality of die include a desired thickness. The method may include etching a plurality of trenches into the semiconductor wafer from... Semiconductor Components Industries Llc

12/28/17 / #20170373603

Power conversion circuit with indicator coupled to input terminal to signal condition of the controller

A power conversion circuit has a controller with an input terminal and a circuit configured to drive an electric current out of the input terminal in response to a condition of the controller. An indicator is coupled to the input terminal of the controller. The controller includes a clock signal... Semiconductor Components Industries Llc

12/28/17 / #20170373606

Communication circuit for flyback power converter with synchronous rectifier

A method for communicating with a power converter comprises initiating a communication sequence by sensing a first distortion of a sensed waveform during a discharge period of a first power transfer cycle of the power converter. The sensed waveform is proportional to a secondary current of the power converter. At... Semiconductor Components Industries Llc

12/28/17 / #20170373607

Power converter and control method therefor

A power converter and a control method therefor are provided. The power converter includes a transformer, synchronous rectifier and a control circuit. A primary side of the transformer receives an input voltage, and a secondary side of the transformer generates a sensing signal. The synchronous rectifier is coupled to the... Semiconductor Components Industries Llc

12/28/17 / #20170373824

Distributed phase locked loop in hearing instruments

A system, in some embodiments, comprises: an antenna; a receiver, coupled to the antenna, to receive wireless signals from another electronic device; a signal processor (SP) coupled to the receiver; and a phase locked loop (PLL), distributed among the receiver and the SP, to synchronize the frequency of a data... Semiconductor Components Industries Llc

12/28/17 / #20170374263

Methods and reducing spatial flicker artifacts

Various embodiments of the present technology may comprise a method and apparatus for reducing spatial flicker artifacts in high dynamic range images produced from multiple image captures with differing integration times. The method and apparatus may comprise, in the image captures, measuring pixel intensity selecting pixels with a predetermined intensity... Semiconductor Components Industries Llc

12/28/17 / #20170374306

Image sensor system with an automatic focus function

An imaging system may include at least two image sensors. Each image sensor may have a respective lens module that is configured to focus light on the image sensor. One of the image sensors may be a monochrome sensor, while another image sensor may be a color sensor. The monochrome... Semiconductor Components Industries Llc








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