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Semtech Corporation patents


Recent patent applications related to Semtech Corporation. Semtech Corporation is listed as an Agent/Assignee. Note: Semtech Corporation may have other listings under different names/spellings. We're not affiliated with Semtech Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Semtech Corporation-related inventors


System and method to manage power for port controller based power supplies using a common power source

A system that delivers power between a common power source having a total deliverable system power and device loads. The system includes a power share interface that sums power consumed or requested by loads and determines availability of additional power. ... Semtech Corporation

Transient voltage suppression diodes with reduced harmonics, and methods of making and using

A semiconductor device includes a semiconductor die. A transient voltage suppression (tvs) structure is formed in the semiconductor die. ... Semtech Corporation

Method and device for reducing radio frequency interference of proximity and touch detection in mobile devices

A proximity sensor has a sensing node. A radio frequency signal is received at the sensing node. ... Semtech Corporation

Capacitive proximity sensor in a mobile device and method of limiting radiation absorption

A proximity sensor for detecting proximity of a body portion to a mobile device, comprising: a plurality of capacitive sensing electrodes for detecting said body portion, an electronic processing circuit arranged for measuring the capacities of said capacitive sensing electrodes and for generating a proximity signal based on the capacities so measured, wherein the capacitive sensing electrodes are connected together by one or more capacitive elements, and at least one capacitive sensing electrode is connectable to a radio circuit of said mobile device so as to constitute a radiofrequency antenna of said mobile device.. . ... Semtech Corporation

Semiconductor device and method of forming insulating layers around semiconductor die

A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. ... Semtech Corporation

Single-shot encapsulation

A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. ... Semtech Corporation

Method and system of timing and localizing a radio signal

Method of timing, in a receiver, a radio signal generated in and transmitted from a transmitter, the radio signal comprising a series of frequency chirps, the system including: receiving the radio signal from the transmitter; synthesizing projection vectors comprising a series of frequency chirps that are a complex-conjugate image of those comprised in the radio signal the projection vectors being time-shifted relative to one another by determined shift intervals of time; multiplying the received radio signal by the projection vectors and accumulating the results; interpolating the accumulating results to determine a peak time shift.. . ... Semtech Corporation

Low parasitic surface mount circuit over wirebond ic

A semiconductor device has an interposer and a surface mount technology (smt) component disposed on the interposer. The interposer is disposed on an active surface of a semiconductor die. ... Semtech Corporation

Low complexity, low power and long range radio receiver

A radio receiver for processing digital chirp spread-spectrum modulated signals that comprise a plurality of frequency chirps that are cyclically time-shifted replicas of a base chirp profile, said time-shifts being an encoded representation of a transmitted message. Includes a soft demapping unit that is adapted for working on fully populated as well as on partial modulation sets, and implements a timing error correction loop that acts back both in the time domain and in the frequency domain.. ... Semtech Corporation

Wireless communication system with macro diversity

A wireless communication system, comprising one or several nodes (a) equipped by a wireless radio interface that is adapted for transmitting digital messages modulated in the form of a series of frequency chirps, for example, lora-modulated radio signals. The message is received simultaneously by several base stations (c, d, e), and a server (s) is arranged for dividing the frames by the diverse stations and recombining a corrected frame for the intended recipient (b) based on error codes. ... Semtech Corporation

Communication device and method in the cellular band

A wireless communication method in a network comprising a plurality of nodes including ranging masters, broadcasting a chirp-modulated ranging requests, and ranging slaves slave, replying with thereto with chirp-modulated ranging responses, whereby mobile nodes can locate themselves passively by listening to the request/reply exchanges, based on the respective time differences of arrival.. . ... Semtech Corporation

Ranging and positioning system

A ranging and positioning system comprising transmitters and receiver nodes communicating together by chirp-modulated radio signals, that have a ranging mode in which ranging exchange of signals takes place between a master device and a slave device that leads to the evaluation of the range between them. The slave is arranged for recognizing a ranging request and transmit back a ranging response containing chirps that precisely aligned in time and frequency with the chirps in the ranging requests, whereupon the master can receive the ranging response, analyze the time and frequency the chirps contained therein with respect to his own time reference, and estimate a range to the slave.. ... Semtech Corporation

Semiconductor device and method of stacking semiconductor die for system-level esd protection

A semiconductor device has a first semiconductor die including a first protection circuit. A second semiconductor die including a second protection circuit is disposed over the first semiconductor die. ... Semtech Corporation

Semiconductor device and method of forming insulating layers around semiconductor die

A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. ... Semtech Corporation

08/17/17 / #20170236790

Semiconductor device on leadframe with integrated passive component

A semiconductor device includes a substrate and a first conductive layer formed over a first surface of the substrate. The first conductive layer is patterned into a first portion of a first passive circuit element. ... Semtech Corporation

06/29/17 / #20170187423

Method and device for capacitive near-field communication in mobile devices

A mobile device includes a conductive element and a ground node. The conductive element is configured to be detected by a proximity sensor. ... Semtech Corporation

06/01/17 / #20170156030

System and method for robust and efficient tdoa based location estimation in the presence of various multipath delay

A system comprising at least a mobile device (110) and a plurality of gateways (120a-120g) whose positions are known, wherein the gateways (120a-120g) are operatively arranged to determine for each gateway a time differences of arrival (tdoa) of a signal originated by the mobile device (110). A solver unit (160) computes the position of the mobile device (110), based on said time difference of arrival (tdoa). ... Semtech Corporation

06/01/17 / #20170156027

System and method for robust and accurate rssi based location estimation

The present invention proposed a weighted centroid localisation (wcl) algorithm, which does the location estimation based only on the known positions of the gateways and the measurements of the received signal strength indication (rssi) at the gateways. The algorithm computes the weight of the gateway based on their rank when the gateways are sorted by their relative rssi. ... Semtech Corporation

05/11/17 / #20170133323

Semiconductor device and method of forming inverted pyramid cavity semiconductor package

A semiconductor device has a first substrate. A conductive layer is formed over the first substrate. ... Semtech Corporation

05/04/17 / #20170125375

Semiconductor device and method of forming dcalga package using semiconductor die with micro pillars

A semiconductor device has a first semiconductor die disposed over a substrate. A plurality of composite interconnect structures are formed over the semiconductor die. ... Semtech Corporation

04/06/17 / #20170097481

Fibre stub device and method using butt coupling for receptacled photonic devices

A novel, hybrid optical fibre stub device comprises a first ferrule transparent to uv light and a second ferrule including a conventional material. An optical fibre is disposed through the first ferrule and second ferrule. ... Semtech Corporation

02/16/17 / #20170047308

Semiconductor device and method of forming inverted pyramid cavity semiconductor package

A semiconductor device has a first substrate. A conductive layer is formed over the first substrate. ... Semtech Corporation

02/02/17 / #20170033026

Semiconductor device and method of forming small z semiconductor package

A semiconductor device has a plurality of first semiconductor die. A plurality of first bumps is formed over the first semiconductor die. ... Semtech Corporation

02/02/17 / #20170032981

Semiconductor device and method of encapsulating semiconductor die

A semiconductor device has a semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die. ... Semtech Corporation








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