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Semtech Corporation patents


Recent patent applications related to Semtech Corporation. Semtech Corporation is listed as an Agent/Assignee. Note: Semtech Corporation may have other listings under different names/spellings. We're not affiliated with Semtech Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Semtech Corporation-related inventors


 new patent  Single-shot encapsulation

A semiconductor device includes a semiconductor wafer. A plurality of pillar bumps is formed over the semiconductor wafer. A solder is deposited over the pillar bumps. The semiconductor wafer is singulated into a plurality of semiconductor die after forming the pillar bumps while the semiconductor wafer is on a carrier.... Semtech Corporation

Method and system of timing and localizing a radio signal

Method of timing, in a receiver, a radio signal generated in and transmitted from a transmitter, the radio signal comprising a series of frequency chirps, the system including: receiving the radio signal from the transmitter; synthesizing projection vectors comprising a series of frequency chirps that are a complex-conjugate image of... Semtech Corporation

Low parasitic surface mount circuit over wirebond ic

A semiconductor device has an interposer and a surface mount technology (SMT) component disposed on the interposer. The interposer is disposed on an active surface of a semiconductor die. The semiconductor die is disposed on a substrate. A first wire bond connection is formed between the interposer and semiconductor die.... Semtech Corporation

Low complexity, low power and long range radio receiver

A radio receiver for processing digital chirp spread-spectrum modulated signals that comprise a plurality of frequency chirps that are cyclically time-shifted replicas of a base chirp profile, said time-shifts being an encoded representation of a transmitted message. Includes a soft demapping unit that is adapted for working on fully populated... Semtech Corporation

Wireless communication system with macro diversity

A wireless communication system, comprising one or several nodes (A) equipped by a wireless radio interface that is adapted for transmitting digital messages modulated in the form of a series of frequency chirps, for example, LoRa-modulated radio signals. The message is received simultaneously by several base stations (C, D, E),... Semtech Corporation

Communication device and method in the cellular band

A wireless communication method in a network comprising a plurality of nodes including ranging masters, broadcasting a chirp-modulated ranging requests, and ranging slaves slave, replying with thereto with chirp-modulated ranging responses, whereby mobile nodes can locate themselves passively by listening to the request/reply exchanges, based on the respective time differences... Semtech Corporation

Ranging and positioning system

A ranging and positioning system comprising transmitters and receiver nodes communicating together by chirp-modulated radio signals, that have a ranging mode in which ranging exchange of signals takes place between a master device and a slave device that leads to the evaluation of the range between them. The slave is... Semtech Corporation

Semiconductor device and forming insulating layers around semiconductor die

A semiconductor device has a semiconductor wafer including a plurality of semiconductor die and a plurality of contact pads formed over a first surface of the semiconductor wafer. A trench is formed partially through the first surface of the semiconductor wafer. An insulating material is disposed over the first surface... Semtech Corporation

Semiconductor device and stacking semiconductor die for system-level esd protection

A semiconductor device has a first semiconductor die including a first protection circuit. A second semiconductor die including a second protection circuit is disposed over the first semiconductor die. A portion of the first semiconductor die and second semiconductor die is removed to reduce die thickness. An interconnect structure is... Semtech Corporation

Semiconductor device on leadframe with integrated passive component

A semiconductor device includes a substrate and a first conductive layer formed over a first surface of the substrate. The first conductive layer is patterned into a first portion of a first passive circuit element. The first conductive layer is patterned to include a first coiled portion. A second conductive... Semtech Corporation

Method and device for capacitive near-field communication in mobile devices

A mobile device includes a conductive element and a ground node. The conductive element is configured to be detected by a proximity sensor. A switch is coupled between the conductive element and ground node. The conductive element is coupled to the ground node by closing the switch. A first memory... Semtech Corporation

System and robust and accurate rssi based location estimation

The present invention proposed a weighted Centroid Localisation (WCL) algorithm, which does the location estimation based only on the known positions of the gateways and the measurements of the Received Signal Strength Indication (RSSI) at the gateways. The algorithm computes the weight of the gateway based on their rank when... Semtech Corporation

System and robust and efficient tdoa based location estimation in the presence of various multipath delay

A system comprising at least a mobile device (110) and a plurality of gateways (120a-120g) whose positions are known, wherein the gateways (120a-120g) are operatively arranged to determine for each gateway a time differences of arrival (TDOA) of a signal originated by the mobile device (110). A solver unit (160)... Semtech Corporation

Method and device for improved accuracy of proximity and touch detection in mobile devices

A mobile device has a proximity sensor. A compensation value of the proximity sensor is determined. The compensation value is compared to a reference compensation value to determine validity of the compensation value. A capacitance of the proximity sensor is measured. A value of the capacitance of the proximity sensor... Semtech Corporation

Semiconductor device and forming inverted pyramid cavity semiconductor package

A semiconductor device has a first substrate. A conductive layer is formed over the first substrate. A first cavity is formed through the first substrate and extending to the conductive layer. A first semiconductor die including a plurality of first interconnect structures is disposed in the first cavity. A second... Semtech Corporation

Semiconductor device and forming dcalga package using semiconductor die with micro pillars

A semiconductor device has a first semiconductor die disposed over a substrate. A plurality of composite interconnect structures are formed over the semiconductor die. The composite interconnect structures have a non-fusible conductive pillar and a fusible layer formed over the non-fusible conductive pillar. The fusible layer is reflowed to connect... Semtech Corporation

Fibre stub device and method using butt coupling for receptacled photonic devices

A novel, hybrid optical fibre stub device comprises a first ferrule transparent to UV light and a second ferrule including a conventional material. An optical fibre is disposed through the first ferrule and second ferrule. The input and output faces of the optical fibre are prepared suitable for optical coupling.... Semtech Corporation

Semiconductor device and forming inverted pyramid cavity semiconductor package

A semiconductor device has a first substrate. A conductive layer is formed over the first substrate. A first cavity is formed through the first substrate and extending to the conductive layer. A first semiconductor die including a plurality of first interconnect structures is disposed in the first cavity. A second... Semtech Corporation

Semiconductor device and encapsulating semiconductor die

A semiconductor device has a semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die. An insulating layer is formed over an active surface of the semiconductor die. A trench is formed in a non-active area of the semiconductor wafer between the semiconductor die. The trench extends partially through... Semtech Corporation

Semiconductor device and forming small z semiconductor package

A semiconductor device has a plurality of first semiconductor die. A plurality of first bumps is formed over the first semiconductor die. A first protection layer is formed over the first bumps. A portion of the first semiconductor die is removed in a backgrinding operation. A backside protection layer is... Semtech Corporation








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