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Senju Metal Industry Co Ltd patents

Recent patent applications related to Senju Metal Industry Co Ltd. Senju Metal Industry Co Ltd is listed as an Agent/Assignee. Note: Senju Metal Industry Co Ltd may have other listings under different names/spellings. We're not affiliated with Senju Metal Industry Co Ltd, we're just tracking patents.

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Date Senju Metal Industry Co Ltd patents (updated weekly) - BOOKMARK this page
05/25/17 new patent  Flux and solder paste
03/23/17Ni ball, ni core ball, solder joint, solder paste, and solder foam
03/16/17Jet nozzle and jet soldering apparatus
01/19/17Solder alloy for led, and led module
12/22/16Cu core ball, solder paste, formed solder, cu core column, and solder joint
12/01/16Liquid coating device
11/24/16Vacuum soldering apparatus and control method therefor
11/24/16Lead-free solder ball
10/20/16Ni ball, ni nuclear ball, solder joint, foam solder and solder paste
09/29/16Flux recovery device and soldering device
09/22/16Solder ball supplying method, solder ball supplying device, and solder bump forming method
09/08/16Soldering apparatus and vacuum-soldering method
09/01/16Flux recovery device and soldering device
09/01/16Solder transfer sheet
09/01/16Method of manufacturing an electrode for an energy storage device
08/18/16Sliding member
08/04/16Cleaning flux, cleaning solder paste, and solder joint
07/28/16Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint
07/28/16Sliding member and manufacturing sliding member
07/14/16Solder piece, chip solder and fabricating solder piece
07/07/16Electrically conductive adhesive agent, joined body, and joint
07/07/16Electrically conductive joining agent and solder joint
06/30/16Flux, solder paste and solder joint
06/30/16Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder
06/09/16Solder paste
06/09/16Solder paste
05/26/16Cu core ball
03/17/16Lead-free solder alloy
02/25/16Lead-free solder alloy and in-vehicle electronic circuit
01/14/16Electroconductive bonding material
12/31/15Gas-blowing-hole array structure and soldering apparatus
12/03/15Gas-intake-port array structure and soldering apparatus
11/26/15Cu ball
11/19/15Lead-free solder alloy
11/12/15Half bearing
11/05/15Layered solder material for bonding dissimilar electrodes, and bonding dissimilar electrodes to electronic components
10/29/15Cu ball
10/22/15Guide vane and jetting apparatus
10/01/15Sliding member and production same
10/01/15Soldering method using a low-temperature solder paste
09/17/15Electronic device including soldered surface-mount component
08/06/15High-temperature lead-free solder alloy
08/06/15Lead-free solder ball
06/25/15Device for coating thin molten solder film, thin solder film-covered component and manufacturing method therefor
06/11/15Flux composition, liquid flux, resin flux cored solder, and solder paste
05/07/15Solder piece, chip solder and fabricating solder piece
03/26/15Solder alloy
03/05/15Flux and solder paste
03/05/15Bump electrode, board which has bump electrodes, and manufacturing the board
02/05/15Lead-free solder alloy
02/05/15Lead-free solder alloy
01/29/15Solder paste
01/29/15Sn-cu-based lead-free solder alloy
01/08/15Solder bump forming method and apparatus
01/01/15Flux for flux-cored solder, and flux-cored solder
11/06/14Lead-free solder alloy, connecting member and a its manufacture, and electronic part
07/03/14Audio solder alloy
05/22/14Lead-free solder alloy
05/15/14Solder paste
04/24/14Solder alloy for power devices and solder joint having a high current density
04/10/14Sliding member and bearing
03/06/14Lead-free solder ball
03/06/14Sliding member
Patent Packs
12/26/13Solder alloy
05/30/13Electrode for energy storage device, manufacturing method thereof and connecting method thereof
05/23/13Oil supply device for conveyance device
04/04/13Solder piece, chip solder and fabricating solder piece
01/31/13Copper column and process for producing same
12/06/12Method for manufacturing solder column, manufacturing solder column, and solder column
11/22/12Method for soldering surface-mount component and surface-mount component
10/11/12Wave soldering tank
09/27/12Reflow furnace
09/06/12Solder bath and heating solder contained in the solder bath
07/12/12Nozzle for heating device, heating device, and nozzle for cooling device
01/12/12Localized jet soldering device and partial jet soldering method
12/08/11Solder bump formation on a circuit board using a transfer sheet
Patent Packs
11/24/11Point flow soldering apparatus
11/17/11Automatic soldering device and carrier device
10/13/11Soldering apparatus
10/13/11Soldering apparatus
04/21/11Power semiconductor device and manufacturing method therefor
03/24/11Solder preform and a process for its manufacture
11/25/10Lead-free solder alloy
07/01/10Solder bath and heating solder contained in the solder bath
07/01/10Apparatus and coating flux
09/24/09Method for increasing the effectiveness of a component of a material
06/11/09Alloy for a fusible plug and a fusible plug
05/28/09Reflow furnace

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Senju Metal Industry Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Senju Metal Industry Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by