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Senju Metal Industry Co Ltd patents


Recent patent applications related to Senju Metal Industry Co Ltd. Senju Metal Industry Co Ltd is listed as an Agent/Assignee. Note: Senju Metal Industry Co Ltd may have other listings under different names/spellings. We're not affiliated with Senju Metal Industry Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Senju Metal Industry Co Ltd-related inventors


Fluid discharge device, fluid discharge method, and fluid application device

A defect may occur in which as the amount of fluid discharged by a fluid discharge device decreases, a mask is not filled with the fluid even when the fluid is discharged. In order to fill a workpiece with the fluid, it is necessary to replace air in the workpiece... Senju Metal Industry Co Ltd

Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint

Provided herein is a solder material that includes a spherical core that provides space between a joint object and another object to be joined to the joint object and a solder coated layer that has a melting point at which a core layer of the core is not melted. The... Senju Metal Industry Co Ltd

Lead-free solder alloy

Provided is a lead-free solder alloy that has excellent tensile strength and ductility, does not deform after heat cycles, and does not crack. The In and Bi content are optimized and the Sb and Ni content are adjusted. As a result, this solder alloy has an alloy composition including, by... Senju Metal Industry Co Ltd

Lead-free solder ball

A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble... Senju Metal Industry Co Ltd

Flux for rapid heating method and solder paste for rapid heating method

The invention has an object to provide a flux for rapid heating method used in the rapid heating method such as a laser reflow, the flux being able to suppress any scattering of the solder alloy, and a solder paste for the rapid heating method. The flux contains rosin, a... Senju Metal Industry Co Ltd

Solder alloy for plating and electronic component

The disclosed solder alloy is useful for plating and for use with electronic components, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass % inclusive and the remainder including Sn, and is... Senju Metal Industry Co Ltd

Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet

Provided is a solder transfer sheet which is capable of increasing the amount of solder to be transferred without the occurrence of bridging. A solder transfer sheet 1A includes a base material 5, an adhesive layer 4 formed on the surface of the base material 5, a solder powder-containing adhesive... Senju Metal Industry Co Ltd

Resin composition and flux

A resin composition having an adhesive property in a high temperature range that is estimated during soldering, and flux using this resin composition, a flux residue of which is washable. The resin composition contains a hydroxyl carboxylic acid having two or more carboxyl groups and a hydroxyl group in its... Senju Metal Industry Co Ltd

Solder material, solder paste, solder preform, solder joint and managing the solder material

Provided is a solder material having oxidation resistance at the time of melting solder or after melting it, as well as managing a thickness of oxide film at a fixed value or less before melting the solder. A Cu core ball 1A is provided with a Cu ball 2A for... Senju Metal Industry Co Ltd

Solder paste and solder joint

Provided is a flux for a solder paste that can prevent peeling from electrode, which is seen in a component, a thickness of which is reduced, such a semiconductor package like BGA. Rosin, a glycol-ether-based solvent, an organic acid, a thixotropic agent, a halogen compound, and an imidazole compound are... Senju Metal Industry Co Ltd

Soldering device

Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device... Senju Metal Industry Co Ltd

Vacuum-processing device and control method therefor, and vacuum soldering device and control method therefor

The invention enables quick evacuation of a chamber to a specified target degree of vacuum while increasing selectivity of evacuation conditions. A vacuum-processing device contains a chamber 40 that enables a workpiece to be soldered in a vacuum environment, an operating part 20 that sets a condition for evacuating the... Senju Metal Industry Co Ltd

Cu column, cu core column, solder joint, and through-silicon via

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to... Senju Metal Industry Co Ltd

Lead-free solder alloy for terminal preliminary plating, and electronic component

Provided is a lead-free solder alloy for terminal preliminary plating, by which the separation property when pulling up the terminals from molten solder is improved. The lead-free solder alloy for terminal preliminary plating contains 4 mass % or more and 6 mass % or less of Cu, 0.1 mass %... Senju Metal Industry Co Ltd

Solder material, solder joint, and manufacturing the solder material

Provided is a solder material which enables a growth of an oxide film to be inhibited. A solder ball which is a solder material is composed of a solder layer and a covering layer covering the solder layer. The solder layer is spherical and is composed of a metal material... Senju Metal Industry Co Ltd

Cu ball, cu core ball, solder joint, solder paste, and solder foam

Provided are a Cu ball, a Cu core ball, a solder joint, solder paste and foamed solder, which are superior in the impact resistance to dropping and can inhibit any occurrence of poor joints a junction defect. An electronic component 60 is constructed by joining a solder bump 30 of... Senju Metal Industry Co Ltd

Cu core ball, solder paste and solder joint

A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than... Senju Metal Industry Co Ltd

Solder alloy, solder ball, chip solder, solder paste and solder joint

A solder alloy that contains 0.005 mass % or more and 0.1 mass % or less of Mn, 0.001 mass % or more and 0.1 mass % or less of Ge, and a balance of Sn. A plurality of Ge oxides is distributed on an outermost surface side of an... Senju Metal Industry Co Ltd

Flux and solder paste

Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a... Senju Metal Industry Co Ltd

Flux and solder paste

Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a... Senju Metal Industry Co Ltd

Method for producing metal ball, joining material, and metal ball

Produced is a metal ball which suppresses an emitted α dose. Contained are the steps of melting a pure metal by heating the pure metal at a temperature which is higher than a boiling point of an impurity to be removed, higher than a melting point of the pure metal,... Senju Metal Industry Co Ltd

Flux-coated ball and manufacturing the same

Provided herein is a flux-coated ball having a ball-like joining material and a flux layer that covers a surface of the joining material. The flux layer is formed from high volatile flux solvent including ethyl acetate, acetone or methyl ethyl ketone. Thickness of the flux layer ranges from 2.5 μm... Senju Metal Industry Co Ltd

Solder paste

A method of printing solder paste on a substrate through minute apertures in a mask member, in which the solder paste is supplied to the apertures of the mask member under less than atmospheric pressure and has a viscosity so that the solder paste is filled in the apertures under... Senju Metal Industry Co Ltd

Solder alloy

A solder alloy has an alloy composition consisting of, in mass %: Bi: 0.1 to 0.8%; Ag: 0 to 0.3%; Cu: 0 to 0.7%; P: 0.001 to 0.1%, with the balance being Sn. A total amount of Ag and Bi is from 0.3 to 0.8% in the alloy composition.... Senju Metal Industry Co Ltd

Flux and solder paste

Using flux to suppress increase in the viscosity of solder paste during its storage and also to improve the fusibility of a solder alloy. The flux, which contains an activator and a solvent, forms solder paste by being mixed with a granular solder alloy. The flux contains a monoalkyl propylene... Senju Metal Industry Co Ltd

Flux

A method of preventing variation of the viscosity of a solder paste, and flux for producing solder paste, viscosity of which is prevented from varying. In the flux, which is suitable to be mixed with solder powder to produce the solder paste, an amount of methacrylate polymer which reduces a... Senju Metal Industry Co Ltd

Ni ball, ni core ball, solder joint, solder paste, and solder foam

Provided are a Ni ball, a Ni core ball, a solder joint, solder paste and foamed solder which are superior in the impact resistance to dropping and can inhibit any occurrence of a poor joints. An electronic component 60 is constructed by joining a solder bump 30 of a semiconductor... Senju Metal Industry Co Ltd

Jet nozzle and jet soldering apparatus

Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the... Senju Metal Industry Co Ltd

Solder alloy for led, and led module

Provided is a solder alloy having a composition suitable for soldering a module obtained by joining an aluminum substrate to a component wherein a main body, in which the area of an electrode on a side surface is not more than 30% of the total area of the side surface,... Senju Metal Industry Co Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Senju Metal Industry Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Senju Metal Industry Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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