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Set North America Llc patents


Recent patent applications related to Set North America Llc. Set North America Llc is listed as an Agent/Assignee. Note: Set North America Llc may have other listings under different names/spellings. We're not affiliated with Set North America Llc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Set North America Llc-related inventors


Thermocompression bonding with passivated nickel-based contacting metal

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc

Thermocompression bonding with passivated silver-based contacting metal

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc

Thermocompression bonding with passivated gold contacting metal

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc

Thermocompression bonding with passivated copper-based contacting metal

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc

Thermocompression bonding with passivated indium-based contacting metal

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc

Thermocompression bonding using metastable gas atoms

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc

System for low-force thermocompression bonding

Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. ... Set North America Llc








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Set North America Llc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Set North America Llc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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