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Shengyi Technology Co Ltd patents

Recent patent applications related to Shengyi Technology Co Ltd. Shengyi Technology Co Ltd is listed as an Agent/Assignee. Note: Shengyi Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Shengyi Technology Co Ltd, we're just tracking patents.

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Date Shengyi Technology Co Ltd patents (updated weekly) - BOOKMARK this page
01/12/17Halogen-free flame retardant type resin composition
01/05/17Epoxy resin composition, prepreg and laminate using same
09/22/16Halogen-free resin composition and uses thereof
09/15/16Thermosetting resin composition and uses thereof
08/25/16Thermosetting resin sandwich prepreg, preparation method thereof and copper clad laminate therefrom
08/25/16Phenoxycyclotriphosphazene active ester, halogen-free resin composition and uses thereof
08/25/16Halogen-free resin composition, and a prepreg and a laminate used for printed circuit using the same
08/25/16Resin composition and uses thereof in high frequency circuit boards
08/25/16Halogen-free resin composition and use thereof
08/18/16Halogen-free resin composition and uses thereof
08/11/16Thermosetting resin composition and uses thereof
06/30/16Halogen-free thermosetting resin composition, and prepreg and laminate for printed circuits using the same
06/30/16Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same
06/30/16Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same
04/28/16Cyanate resin composition and use thereof
04/21/16Cyanate resin composition and use thereof
01/28/16Halogen-free resin composition, and prepreg and laminate for printed circuits using the same
01/07/16Circuit substrate and process for preparing the same
12/10/15Halogen-free resin composition, and prepreg and laminate for printed circuits using same
10/29/15A halogen-free flame retardant resin composition and the use thereof
10/29/15Resin composition and its use
09/03/15Thermosetting resin composition and its usage
08/27/15Epoxy resin compound and prepreg and copper-clad laminate manufactured using the compound
07/02/15Thermosetting resin composition and usage thereof
07/02/15Thermosetting resin composition and usage thereof
07/02/15Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
07/02/15Thermosetting resin composition and use thereof
06/11/15Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom
12/25/14Circuit substrate and manufacturing method thereof
11/27/14Epoxy resin composition and high frequency circuit board manufactured by using the same
11/20/14Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same
07/24/14Benzoxazine intermediate and preparation method thereof







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Shengyi Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Shengyi Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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