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Shibaura Mechatronics Corporation patents


Recent patent applications related to Shibaura Mechatronics Corporation. Shibaura Mechatronics Corporation is listed as an Agent/Assignee. Note: Shibaura Mechatronics Corporation may have other listings under different names/spellings. We're not affiliated with Shibaura Mechatronics Corporation, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Shibaura Mechatronics Corporation-related inventors


Electronic component, electronic component manufacturing apparatus, and electronic component manufacturing method

An electronic component, an electronic component manufacturing apparatus, and an electronic component manufacturing method are provided which enable an electromagnetic wave shielding film formed on a package to achieve an excellent shielding characteristic. An electronic component 10 includes an electromagnetic wave shielding film 13 formed on the top face of a package sealing elements. ... Shibaura Mechatronics Corporation

Tablet printing apparatus and tablet printing method

According to one embodiment, a tablet printing apparatus includes: a first conveyor conveying a tablet while holding a other surface of the tablet; a second conveyor conveying the tablet transferred from the first conveyor while holding a one surface of the tablet; a first print head performing printing on the one surface of the tablet; a second print head performing printing on the other surface of the tablet; a first detection mechanism detecting the one surface of the tablet; a second detection mechanism detecting the other surface of the tablet; and a controller sending a printing instruction to the first and the second print heads based on information related to the state of a split line included in detection information on the one surface of the tablet or detection information on the other surface of the tablet.. . ... Shibaura Mechatronics Corporation

Substrate processing apparatus

According to one embodiment, a substrate processing apparatus includes a processing chamber, a support part, a heater, and an optical member. In the processing chamber, air flows from the top to the bottom. ... Shibaura Mechatronics Corporation

Tablet printing apparatus and tablet printing method

To provide a tablet printing apparatus that can prevent drying of ink on the tip end of each nozzle of an inkjet printing mechanism, when a tablet does not arrive at a print position. A tablet printing apparatus includes: conveyor mechanism 17 that conveys sequentially fed tablets by moving a conveyor belt 171; an inkjet printing mechanism that performs printing on a tablet in a print position; a suction mechanism 174a that holds a tablet on the surface of the conveyor belt in a predetermined area including at least the print position by sucking in air; determination means (s15) that determines whether a tablet arrives at the print position; and head retreat means (32, s21) that retreats an inkjet head 31 such that a tip end part of each of the nozzles of the inkjet printing mechanism goes away from the surface of the conveyor belt, when it is determined that a tablet does not arrive at the print position.. ... Shibaura Mechatronics Corporation

Substrate treatment device and substrate treatment method

A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.. ... Shibaura Mechatronics Corporation

Shibaura Mechatronics Corporation

. . ... Shibaura Mechatronics Corporation

Tablet printing apparatus and tablet printing method

According to one embodiment, a tablet printing apparatus includes: a conveyor; an inkjet head configured to eject ink from a nozzle to a tablet conveyed by the conveyor to perform printing; an ink tank configured to contain the ink to be supplied to the inkjet head; a moving device configured to change the height of the ink tank; and a control unit configured to control the moving device. The control unit controls the moving device to change the height of the ink tank based on a use amount of the ink figured out in advance to maintain a head difference between the height of the liquid level of the ink in the ink tank and the height of a nozzle forming surface, where the nozzle is formed in the inkjet head, at a predetermined value.. ... Shibaura Mechatronics Corporation

Film forming apparatus, method for manufacturing film-formed product, and method for manufacturing electronic component

A film forming apparatus includes a chamber that is a container in which a sputter gas is introduced, a carrying unit provided inside the chamber, and circulating and carrying a work-piece on a trajectory of a circular circumference, and a film formation processing unit including a sputter source depositing, on the work-piece circulated and carried by the carrying unit, a film formation material by sputtering to form a film, and a dividing member dividing a film forming position where the film is formed on the work-piece by the sputter source. The dividing member is installed so as to divide the film forming position in a way that, in the trajectory of the circular circumference, a trajectory of passing through a region other than the film forming position performing the film formation is longer than a trajectory of passing through the film forming position performing the film formation.. ... Shibaura Mechatronics Corporation

Substrate transfer apparatus, substrate processing apparatus, and substrate processing method

According to one embodiment, a substrate transfer apparatus includes: a first gripping plate; a first claw that is supported by the first gripping plate, and has an abutment surface abutting on the outer peripheral surface of a substrate located above and below a surface of the first gripping plate; a second gripping plate arranged as overlapping with the first gripping plate; a second claw that is supported by the second gripping plate, and has an abutment surface abutting on the outer peripheral surface of the substrate located above and below the surface of the first gripping plate; and a gripping part configured to move the first gripping plate and the second gripping plate relative to each other such that the first claw and the second claw move close to and away from each other in a direction intersecting the outer peripheral surface of the substrate.. . ... Shibaura Mechatronics Corporation

Substrate processing apparatus and substrate processing method

According to one embodiment, a substrate processing apparatus includes a tank that stores a treatment liquid; a liquid level pipe connected to the tank such that the treatment liquid stored in the tank flows therein, and configured such that the liquid level of the treatment liquid therein moves according to increase and decrease of the treatment liquid in the tank; a liquid level sensor that detects the liquid level in the liquid level pipe; an air supply pipe for supplying a gas to a piping space above the liquid level in the liquid level pipe; and a controller that determines whether there is erroneous detection of the liquid level sensor based on a detection result obtained by the liquid level sensor in response to the movement of the liquid level in the liquid level pipe caused by supply of the gas to the piping space from the air supply pipe.. . ... Shibaura Mechatronics Corporation

Substrate treating device and substrate treating method

According to the embodiment, a substrate treating device 1 that rotates and washes a substrate, the device includes a spinning holding mechanism for holding a substrate, a treatment liquid supply nozzle for supplying a treatment liquid to the substrate, a shielding plate that is arranged opposite to the substrate held by the spinning holding mechanism and that moves in a contact/separate direction with respect to the substrate, a shielding plate rotating mechanism for rotating the shielding plate, and a control device for controlling the shielding plate rotating mechanism to rotate the shielding plate without moving the shielding plate from a standby position when the treatment liquid is supplied from the treatment liquid supply nozzle. It is possible to prevent contamination of a substrate during the treatment process.. ... Shibaura Mechatronics Corporation

Substrate processing apparatus

According to one embodiment, a substrate processing apparatus includes: a removing part (d1) configured to remove liquid droplets present in a recess (30); a drain hole (30a) located at the bottom of the recess (30) of a nozzle head (32), and configured to discharge the liquid droplets as a target to be removed out of the recess (30); and a controller configured to control the discharge state of a gas discharge nozzle (33) such that there is a period in which a gas is discharged from the gas discharge nozzle (33) at a flow rate, at which the gas discharged does not reach a surface to be processed of s substrate w, in a period from the end of the rinsing process using a treatment liquid to the start of the drying process using the gas.. . ... Shibaura Mechatronics Corporation

Plasma processing apparatus

A plasma processing apparatus includes a cylindrical electrode which has a lower end provided with an opening, an upper end that is a closed end, in which a process gas is introduced, and which obtains a plasma process gas upon application of the voltage, and a chamber that is a vacuum container provided with an opening. The cylindrical electrode, which has the upper end attached to the opening of the chamber via an insulation material, is extended in the chamber. ... Shibaura Mechatronics Corporation

Film formation apparatus and film formation method

A film formation apparatus includes a chamber that is a sealed container in which a target formed of a film formation material is placed, and into which the workpiece is carried, a gas discharging unit discharging a gas in the sealed container for a predetermined time period after the workpiece is carried into the chamber to obtain a base pressure, and a sputter gas introducing unit introducing a sputter gas containing oxygen to the interior of the chamber having undergone the discharging and becoming the base pressure. The sputter gas introducing unit decreases an oxygen partial pressure in the sputter gas to be introduced in the chamber in accordance with an increase in the base pressure due to an increase of the film formation material sticking to the interior of the chamber.. ... Shibaura Mechatronics Corporation

09/14/17 / #20170259595

Tablet printing apparatus and tablet printing method

According to one embodiment, a tablet printing apparatus includes: a conveyer configured to convey a tablet along a line; an applicator head including a plurality of nozzles arranged in a direction crossing the conveyance direction of the tablet conveyed by the conveyer, configured to perform printing on the tablet by ejecting a liquid from the nozzles; and a controller configured to control the ejection of the liquid from the nozzles of the applicator head. The length of an array of the nozzles in a direction perpendicular to the conveyance direction is equal to or longer than the length of the tablet in the direction perpendicular to the conveyance direction. ... Shibaura Mechatronics Corporation

09/14/17 / #20170259308

Substrate processing device and substrate processing method

A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate w, the water removing unit 110 supplies a water removing agent to the surface of the substrate w to promote replacement of the cleaning water on the surface of the substrate w with the volatile solvent.. . ... Shibaura Mechatronics Corporation

09/07/17 / #20170256423

Substrate treating device and substrate treating method

According to the embodiment, a substrate treating device 10 for treating a semiconductor wafer w using an etchant l containing hydrofluoric acid and nitric acid includes a storage tank 210 that stores the etchant l; a concentration sensor 256 that measures a concentration of nitrous acid in the etchant l; an alcohol feeding line 280 that feeds ipa to the etchant l and maintains the concentration of nitrous acid to a predetermined value or more; and a substrate treating unit 100 that feeds the etchant l in the storage tank 210 to the semiconductor wafer w. The substrate treating device can improve the etching efficiency by efficiently generating nitrous acid, and thereby producing an etchant having a nitrous acid concentration suitable for etching.. ... Shibaura Mechatronics Corporation

08/31/17 / #20170250097

Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate

According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.. . ... Shibaura Mechatronics Corporation

06/29/17 / #20170183769

Film formation apparatus and film-formed workpiece manufacturing method

A film formation apparatus and a film-formed workpiece manufacturing method which are capable of forming a film with a uniform thickness on a workpiece like a three-dimensional object that includes a plurality of surfaces by a simple structure are provided. A film formation apparatus includes a target 21 that is a film formation material including a plane su3, a power supply unit 3 applying power to the target 21, a rotating unit 4 rotating a workpiece w that is a film formation object around a rotation axis ax1, and a revolving unit 5 revolving the rotating unit 4 around a revolution axis ax2 separate from the rotation axis ax1 to repeatedly make the workpiece w to come close to and move apart from the target 21.. ... Shibaura Mechatronics Corporation

02/23/17 / #20170053779

Substrate processing apparatus and substrate processing method

According to one embodiment, a substrate processing apparatus includes a processor, a transferring part, a load lock unit, and a transfer unit. The processor performs processing of a substrate in an atmosphere. ... Shibaura Mechatronics Corporation

01/19/17 / #a reflective mask cleaning apparatus according to an embodiment comprises a first supply section configured to supply a first solution containing at least one of an organic solvent and a surfactant to a ruthenium-containing capping layer provided in a reflective mask; and a second supply section configured to supply at least one of a reducing solution and an oxygen-free solution to the capping layer.

Shibaura Mechatronics Corporation

. . ... Shibaura Mechatronics Corporation








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