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Shin etsu Handotai Co Ltd
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Shin etsu Handotai Co Ltd patents

Recent patent applications related to Shin etsu Handotai Co Ltd. Shin etsu Handotai Co Ltd is listed as an Agent/Assignee. Note: Shin etsu Handotai Co Ltd may have other listings under different names/spellings. We're not affiliated with Shin etsu Handotai Co Ltd, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Shin etsu Handotai Co Ltd-related inventors




Date Shin etsu Handotai Co Ltd patents (updated weekly) - BOOKMARK this page
04/27/17 new patent  Method for manufacturing semiconductor substrate, manufacturing semiconductor device, semiconductor substrate, and semiconductor device
03/16/17Fixed-abrasive-grain wire, wire saw, and slicing workpiece
03/09/17Manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing method
03/09/17Workpiece holding apparatus
02/16/17Method for growing a silicon single crystal
02/16/17Method for evaluating soi substrate
02/09/17Method for heat treatment of silicon single crystal wafer
02/09/17Method for evaluating warpage of wafer and sorting wafer
02/09/17Method for manufacturing a bonded soi wafer
02/02/17Semiconductor substrate and semiconductor device
02/02/17Method for producing semiconductor epitaxial wafer and semiconductor epitaxial wafer
02/02/17Method for manufacturing a bonded soi wafer and bonded soi wafer
01/19/17Method for slicing workpiece and processing liquid
01/05/17Method for heat treatment of silicon single crystal wafer
12/22/16Method for manufacturing bonded soi wafer
12/15/16Method of manufacturing epitaxial wafer and silicon-based substrate for epitaxial growth
12/15/16Method for manufacturing bonded wafer
12/15/16Method for evaluating semiconductor substrate
12/01/16Semiconductor substrate for flash lamp anneal, anneal substrate, semiconductor device, and manufacturing semiconductor device
11/17/16Workpiece processing apparatus and workpiece processing method
11/17/16Apparatus for producing silicon single crystal
11/17/16Semiconductor-wafer cleaning tank and manufacturing bonded wafer
11/10/16Method for recovering and purifying argon gas from silicon single crystal manufacturing apparatus and recovering and purifying argon gas
10/20/16Method for slicing workpiece and workpiece holder
10/13/16Chamfering manufacturing notchless wafer
10/13/16Method for evaluating concentration of defect in silicon single crystal substrate
10/06/16Method for manufacturing single crystal
09/22/16Wafer drying drying a wafer
09/01/16Method for slicing workpiece
08/18/16Method for manufacturing silicon single crystal
08/11/16Heat treatment method
07/28/16Apparatus for dressing urethane foam pad for use in polishing
07/28/16Method for producing mirror-polished wafer
07/14/16Method for manufacturing bonded wafer
07/07/16Method for evaluating polishing pad and polishing wafer
07/07/16Silicon single crystal pulling apparatus
07/07/16Method of producing bonded wafer
07/07/16Method for manufacturing bonded wafer
06/23/16Method for slicing ingot and wire saw
05/12/16Silicon wafer heat treatment method
05/05/16Silicon-based substrate, semiconductor device, and manufacturing semiconductor device
05/05/16Silicon epitaxial wafer and producing silicon epitaxial wafer
04/28/16Single-crystal manufacturing apparatus and manufacturing single crystal
04/28/16Method of producing bonded wafer
04/28/16Semiconductor device
04/21/16Semiconductor substrate, semiconductor device and manufacturing the semiconductor device
04/14/16Method of producing polishing head and polishing apparatus
03/17/16Method for evaluating a semiconductor wafer
03/10/16Ultrasonic cleaning cleaning
03/10/16Method of producing silicon single crystal
02/25/16Semiconductor light emitting device and producing the same
01/14/16Template assembly and producing template assembly
01/07/16Method for measuring recombination lifetime of silicon substrate
12/31/15Method of producing carrier for use in double-side polishing apparatus and double-side polishing wafers
12/17/15Method of producing silicon carbide and silicon carbide
12/10/15Method of producing silicon single crystal ingot
11/26/15Method for manufacturing soi wafer and soi wafer
11/19/15Method of resuming operation of wire saw
11/12/15Carrier for use in double-side polishing apparatus and double-side polishing wafer
10/08/15Outer periphery polishing disc-shaped workpiece
10/08/15Method of manufacturing soi wafer
10/01/15Method of manufacturing silicon single crystal
09/03/15Method for manufacturing soi wafer
08/27/15Silicon single crystal growing growing silicon single crystal
08/27/15Method for growing silicon single crystal
Patent Packs
08/27/15Method for manufacturing soi wafer
08/27/15Method of measuring contamination amount of vapor phase growth apparatus, and manufacturing epitaxial wafer
08/20/15Method of charging raw material, manufacturing single crystals, and single-crystal manufacturing apparatus
08/06/15Double-side polishing method
07/30/15Double-side polishing method
07/30/15Semiconductor wafer evaluation method and semiconductor wafer manufacturing method
07/23/15Method for manufacturing soi wafer
05/28/15Semiconductor substrate evaluating method, semiconductor substrate for evaluation, and semiconductor device
05/28/15Method of double-side polishing wafer
05/28/15Double-disc grinding apparatus and workpiece double-disc grinding method
05/21/15Apparatus for manufacturing single crystal
05/07/15Method for manufacturing nitride semiconductor device
04/30/15Method for evaluating semiconductor wafer and evaluating semiconductor wafer
04/30/15Method for manufacturing bonded wafer
03/26/15Epitaxial substrate, semiconductor device, and manufacturing semiconductor device
Patent Packs
03/05/15Method for manufacturing soi wafer
02/26/15Method for cleaning semiconductor wafer
01/29/15Epitaxial substrate, semiconductor device, and manufacturing semiconductor device
01/29/15Double-side polishing apparatus
01/22/15Method for manufacturing silicon single crystal wafer
01/22/15C-v characteristic measurement measuring c-v characteristics
01/15/15Polishing head and polishing apparatus
01/08/15Method for manufacturing silicon epitaxial wafer
01/01/15Slurry and producing slurry
01/01/15Method for manufacturing silicon single crystal wafer and electronic device
12/25/14Method for calculating a height position of silicon melt surface, pulling silicon single crystal, and silicon single crystal pulling apparatus
12/25/14Epitaxial wafer and manufacturing method thereof
12/25/14Method for calculating nitrogen concentration in silicon single crystal and calculating resistivity shift amount
11/06/14Method for manufacturing soi wafer
10/30/14Method for processing wafer
10/30/14Method for manufacturing a bonded soi wafer
10/02/14Method for measuring film thickness distribution
09/18/14Reclaiming processing delaminated wafer
09/11/14Double-side polishing method
08/07/14Method for slicing workpiece and wire saw
07/03/14Method for calculating warpage of bonded soi wafer and manufacturing bonded soi wafer
06/26/14Method for manufacturing silicon single crystal
06/12/14Method for polishing silicon wafer and polishing agent
05/15/14Ozone gas generation processing apparatus, forming silicon oxide film, and evaluating silicon single crystal wafer
05/01/14Method for detecting crystal defects
05/01/14Method for manufacturing bonded substrate having an insulator layer in part of bonded substrate
04/24/14Polishing head and polishing apparatus
04/17/14Polishing head, polishing apparatus, and polishing workpiece
04/17/14Silicon wafer and producing the same
04/10/14Method for manufacturing bonded wafer and bonded soi wafer
Social Network Patent Pack
02/20/14Method for cleaning semiconductor wafer
01/30/14Method for measuring film thickness of soi layer of soi wafer
01/30/14Method for adjusting height position of polishing head and polishing workpiece
01/09/14Semiconductor wafer and manufacturing method thereof
01/02/14Method for resuming operation of wire saw and wire saw
12/26/13Silica glass crucible, manufacturing same, and manufacturing silicon single crystal
12/26/13Bonded substrate and manufacturing method thereof
12/05/13Susceptor and manufacturing epitaxial wafer using the same
12/05/13Silicon single crystal wafer
11/28/13Method for manufacturing silicon substrate and silicon substrate
Patent Packs
11/28/13Method for producing silicon wafer
11/28/13Method for manufacturing soi wafer
10/24/13Single crystal production apparatus and single crystal production method
10/17/13Light-emitting device
10/10/13Method for manufacturing silicon single crystal wafer and annealed wafer
09/26/13Single crystal production producing single crystal
09/12/13Method for cleaning semiconductor wafer
07/18/13Susceptor and manufacturing epitaxial wafer
07/11/13Quartz glass crucible, producing the same, and producing silicon single crystal
07/11/13Thermal oxide film formation silicon single crystal wafer
05/23/13Apparatus and manufacturing semiconductor single crystal
04/25/13Method for heat-treating wafer, producing silicon wafer, silicon wafer, and heat treatment apparatus
04/25/13Method for manufacturing bonded wafer
04/18/13Method for producing silicon wafer and silicon wafer
03/14/13Method for evaluating thin-film-formed wafer
03/07/13Method for measuring and controlling distance between lower end surface of heat shielding member and surface of raw material melt and manufacturing silicon single crystal
02/14/13Silicon epitaxial wafer and manufacturing the same
02/07/13Single-crystal manufacturing manufacturing single crystal
01/24/13Method for checking ion implantation condition and manufacturing semiconductor wafer
12/27/12Silicon epitaxial wafer, manufacturing the same, bonded soi wafer and manufacturing the same
12/27/12Double-side polishing apparatus
12/06/12Vapor-phase growth semiconductor substrate support susceptor, epitaxial wafer manufacturing apparatus, and epitaxial wafer manufacturing method
11/29/12Wafer and epitaxial wafer, and manufacturing processes therefor
11/29/12Method for designing soi wafer and manufacturing soi wafer
11/22/12Method for designing soi wafer and manufacturing soi wafer
11/15/12Method for manufacturing bonded wafer
11/15/12Semiconductor substrate, electrode forming method, and solar cell fabricating method
11/15/12Polishing head and polishing apparatus
09/27/12Method for producing bonded wafer
09/13/12Method for manufacturing silicon epitaxial wafer
Patent Packs
08/16/12Single-crystal manufacturing apparatus
08/02/12Single-crystal manufacturing apparatus and single-crystal manufacturing method
05/31/12Method for manufacturing soi wafer
05/10/12Silicon oxide removal apparatus and facility for recycling inert gas for use in silicon single crystal manufacturing apparatus
04/26/12Manufacturing carrier for double-side polishing apparatus, carrier for double-side polishing apparatus, and double-side polishing wafer
02/09/12Inspection soi wafer
01/05/12Annealed wafer, producing annealed wafer and fabricating device
11/17/11Method for manufacturing soi wafer
11/10/11Single-crystal manufacturing method
11/03/11Semiconductor wafer having multilayer film, producing the same, and producing semiconductor device
10/20/11Method for polishing silicon wafer, producing silicon wafer, polishing disk-shaped workpiece, and silicon wafer
09/29/11Method for manufacturing bonded wafer
09/15/11Method for manufacturing soi wafer
09/08/11Upper heater for use in production of single crystal, single crystal production equipment, and producing single crystal
09/08/11Single-crystal manufacturing method and single-crystal manufacturing apparatus
09/01/11Method for manufacturing bonded wafer
07/21/11Ingot cutting apparatus and ingot cutting method
06/23/11Method for detecting diameter of single crystal, single-crystal manufacturing method by using the same and single-crystal manufacturing apparatus
06/23/11Method for manufacturing bonded wafer
06/16/11Vertical heat treatment apparatus and heat treatment method
Social Network Patent Pack
06/02/11Band saw cutting apparatus and ingot cutting method
06/02/11Wafer polishing method and double-side polishing apparatus
05/26/11Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
05/19/11Method for manufacturing soi wafer and soi wafer
05/05/11Method for manufacturing bonded wafer
05/05/11Carrier for a double-side polishing apparatus, double-side polishing apparatus using this carrier, and double-side polishing method
04/21/11Method for resuming operation of wire saw and wire saw
03/31/11Epitaxial growth susceptor
03/10/11Single-crystal manufacturing apparatus and single-crystal manufacturing method
03/10/11Method for slicing workpiece
03/03/11Vapor-phase growth apparatus and thin-film vapor-phase growth method
03/03/11Workpiece double-disc grinding apparatus and workpiece double-disc grinding method
02/24/11Silicon single crystal wafer and manufacturing silicon single crystal wafer, and evaluating silicon single crystal wafer
02/17/11Double-disc grinding producing wafer
02/10/11Single-crystal manufacturing apparatus
02/10/11Method for forming oxide film on silicon wafer
02/03/11Vertical boat for heat treatment and heat treatment of silicon wafer using the same
01/27/11Single crystal growth method and single crystal pulling apparatus
01/06/11Silicon single crystal wafer, producing silicon single crystal or producing silicon single crystal wafer, and semiconductor device
12/30/10Silicon epitaxial wafer and manufacturing method thereof
Social Network Patent Pack
12/23/10Single-crystal manufacturing manufacturing single crystal
12/23/10Method for manufacturing soi substrate
12/16/10Soi wafer, semiconductor device, and manufacturing soi wafer
11/25/10Ultrasonic cleaning apparatus and ultrasonic cleaning method
11/11/10Cylindrical grinding grinding
11/04/10Method for manufacturing compound semiconductor substrate, compound semiconductor substrate and light emitting device
10/28/10Light emitting device and fabricating the same
10/21/10Soi (silicon on insulator) structure semiconductor device and manufacturing the same
10/14/10Apparatus for producing single crystal
10/14/10Method for slicing workpiece by using wire saw and wire saw
10/07/10Epitaxial growth method
10/07/10Method for slicing workpiece by using wire saw and wire saw
09/16/10Apparatus and producing single crystal
08/26/10Semiconductor substrate and semiconductor device
07/22/10Method of improving nanotopography of surface of wafer and wire saw apparatus
07/08/10Thin film silicon wafer and manufacturing the same
07/01/10Slicing method and a wire saw apparatus
06/03/10Method for measuring rotation angle of bonded wafer
05/27/10Susceptor and manufacturing silicon epitaxial wafer
05/27/10Single crystal growth method and single crystal pulling apparatus
05/27/10Method of manufacturing single crystal
05/27/10Method for detecting the diameter of a single crystal and single crystal pulling apparatus
05/27/10Method for manufacturing soi wafer
05/13/10Method for growing silicon single crystal
05/13/10Method for manufacturing bonded wafer
05/06/10Method for manufacturing soi wafer
05/06/10Method for forming silicon oxide film of soi wafer
04/29/10Method for manufacturing silicon single crystal wafer
04/15/10Method for pulling silicon single crystal
04/15/10Slicing method and wire saw apparatus
Social Network Patent Pack
04/15/10Final polishing silicon single crystal wafer and silicon single crystal wafer
03/18/10Method for measuring distance between lower end surface of heat insulating member and surface of raw material melt and controlling thereof
02/25/10Method for producing soi substrate and soi substrate
02/25/10Vertical boat for heat treatment and heat treatment semiconductor wafer using thereof
02/18/10Slicing method
02/11/10System for manufacturing silicon single crystal and manufacturing silicon single crystal using this system
02/11/10Light-emitting device and fabricating the same
01/28/10Method for evaluating semiconductor wafer
01/28/10Method for evaluating silicon wafer
01/21/10Vertical heat treatment boat and heat treatment semiconductor wafer
01/07/10Method for manufacturing nitride semiconductor self-supporting substrate and nitride semiconductor self-supporting substrate
01/07/10Manufacturing strained si substrate
12/31/09Chamfering silicon wafer, producing silicon wafer, and etched silicon wafer
12/10/09Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
12/10/09Method of fabricating light emitting device and compound semiconductor wafer and light emitting device
12/10/09Method for producing semiconductor substrate
11/26/09Slicing method and manufacturing epitaxial wafer
11/12/09Method for producing soi wafer
11/05/09Method of fabricating light emitting device
10/15/09Method for producing sol substrate
10/08/09Method for evaluating soi wafer
10/08/09Apparatus and producing single crystals
10/08/09Method for manufacturing epitaxial wafer and epitaxial wafer
10/08/09Slicing method
10/01/09Method for manufacturing silicon wafer and silicon wafer manufactured by this method
09/17/09Method for determining distance between reference member and melt surface, controlling location of melt surface using the same, and producing silicon single crystal
08/13/09Surface grinding method and manufacturing semiconductor wafer
08/13/09Method for manufacturing bonded substrate
08/06/09Method for producing silicon wafer







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