Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Shindengen Electric Manufacturing Co Ltd patents


Recent patent applications related to Shindengen Electric Manufacturing Co Ltd. Shindengen Electric Manufacturing Co Ltd is listed as an Agent/Assignee. Note: Shindengen Electric Manufacturing Co Ltd may have other listings under different names/spellings. We're not affiliated with Shindengen Electric Manufacturing Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Shindengen Electric Manufacturing Co Ltd-related inventors


 new patent  Semiconductor device and manufacturing method thereof

A semiconductor device of the present invention includes: a plurality of wiring boards disposed separately from one another; a plurality of semiconductor elements disposed on first main surfaces of the wiring boards and electrically connected to the wiring boards; a plurality of terminals electrically connected to the wiring boards; a... Shindengen Electric Manufacturing Co Ltd

Power module

When a short-circuit failure has occurred in a power semiconductor device provided in a power module, a radical and rapid temperature increase is prevented by instantly interrupting a short-circuit current. A power module 10 has a package 10a. Provided in the package 10a are: a MOSFET 21 serving as the... Shindengen Electric Manufacturing Co Ltd

Method for manufacturing silicon carbide semiconductor device, manufacturing semiconductor base, silicon carbide semiconductor device, and device for manufacturing silicon carbide semiconductor device

A method for manufacturing a silicon carbide semiconductor device comprises: a step for forming a front-surface electrode (30) on a front surface side of a silicon carbide wafer (10); a step for thinning the silicon carbide wafer (10) by reducing a thickness of the silicon carbide wafer (10) from a... Shindengen Electric Manufacturing Co Ltd

Placement base for semiconductor device and vehicle equipment

A placement base (100) of a semiconductor device (90) comprises a body (10) on which the semiconductor device (90) is disposed, and a fixing unit (40) for fixing the semiconductor device (90) to the body (10). The body (10) has a supporting unit (12) and a bottom surface (11) placed... Shindengen Electric Manufacturing Co Ltd

Mounting structure for mounting shunt resistor and manufacturing mounting structure for mounting shunt resistor

A mounting structure includes a PCB on which first and second conductive patterns are formed, and a shunt resistor mounted on one surface of a substrate via a conductive bonding material. Each of the first and second conductive patterns includes: a first/second lead-out portion and a first/second pull-out portion which... Shindengen Electric Manufacturing Co Ltd

Placement base for semiconductor device and vehicle equipment

A placement base (100) of a semiconductor device (90) comprises a body (10), to which a radiation agent (80) having viscosity is applied and on which a semiconductor device (90) is disposed, and a protrusion (20), which is placed in an outer periphery of the body (10) and on which... Shindengen Electric Manufacturing Co Ltd

Power converter and semiconductor device

A power converter includes a semiconductor element disposed on a substrate, a thermistor element for detecting the temperature of the substrate, the thermistor element being disposed on the substrate, a current detection resistor having one end connected to a ground side node and another end that is grounded, a first... Shindengen Electric Manufacturing Co Ltd

Battery charging device and controlling battery charging device

A battery charging device includes a conversion part that converts an alternating current output from an alternating-current generator into a direct current by a switching element and supplies the direct current to a battery; a number-of-revolutions acquisition part that acquires a number of revolutions of the alternating-current generator based on... Shindengen Electric Manufacturing Co Ltd

Method of manufacturing semiconductor device and resist glass

In a method of manufacturing a semiconductor device having an oxide film removing step where an oxide film formed on a surface of a semiconductor substrate is partially removed, the oxide film removing step includes: a first step where a resist glass layer is selectively formed on an upper surface... Shindengen Electric Manufacturing Co Ltd

Heat dissipating structure

A heat sink according to one embodiment of the present invention includes: a base portion having a first surface and a second surface which oppose each other; at least one heat dissipating fin extending vertically from the first surface, each of the at least one heat dissipating fin having an... Shindengen Electric Manufacturing Co Ltd

Heat dissipating structure

The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat... Shindengen Electric Manufacturing Co Ltd

Semiconductor device

A Schottky barrier diode (semiconductor device) includes at least: a semiconductor substrate of an N type (first conductivity type); a semiconductor portion (first portion) of a P type (second conductivity type) opposite to the N type, the semiconductor portion being formed on a part of a one main surface side... Shindengen Electric Manufacturing Co Ltd

Control device and program product

The control device includes a control signal supply unit, a frequency changing unit, and a storage unit. The control signal supply unit generates a control signal, and supplies the generated control signal to the switching element. The storage unit stores a frequency table defining a change value of a frequency... Shindengen Electric Manufacturing Co Ltd

Wide gap semiconductor device and manufacturing the same

A wide gap semiconductor device comprises a first conductive-type semiconductor layer (32); a second conductive-type region (41), (42) that is provided on the first conductive-type semiconductor layer (32); a first electrode (1), of which a part is disposed on the second conductive-type region (41), (42) and the other part is... Shindengen Electric Manufacturing Co Ltd

Silicon carbide semiconductor device and manufacturing the same

A silicon carbide semiconductor device includes: n type regions formed on a surface of the n− type epitaxial layer; p type body regions formed at positions deeper than the n type regions; p− type channel regions each reaching the p type body region; and n++ type source regions formed toward... Shindengen Electric Manufacturing Co Ltd

Semiconductor device

A semiconductor apparatus includes: a gate electrode in a trench and facing a p type base region with a gate insulating film interposed therebetween on a portion of a side wall; a shield electrode in the trench and between the gate electrode and a bottom of the trench; an electric... Shindengen Electric Manufacturing Co Ltd

Semiconductor device

Provided is a semiconductor apparatus includes: a gate electrode disposed inside a trench and opposedly facing a p type base region with a gate insulating film interposed therebetween on a portion of a side wall; a shield electrode disposed inside the trench and positioned between the gate electrode and a... Shindengen Electric Manufacturing Co Ltd

Power factor improving converter, and power supply device including power factor improving converter

Provided are a plurality of circuit blocks each including: a first series circuit including a first rectifying element and a first switching element which are connected in series; a second series circuit including a second rectifying element and a second switching element which are connected in series; and a capacitor,... Shindengen Electric Manufacturing Co Ltd

Semiconductor module and manufacturing semiconductor module

A semiconductor module (100) has a first insulating substrate (11); a first conductor layer (12) provided on a mounting surface of the first insulating substrate (11); a first electronic element (13) provided on the first conductor layer (12); a sealing resin (80), which covers an overall mounting region within the... Shindengen Electric Manufacturing Co Ltd

Power conversion device

Provided is a power conversion device that can suppress a surge to be generated when a load, such as a battery, is disconnected from an output of an AC generator. A rectifier circuit connected between an output portion of the AC generator and a first load rectifies the output of... Shindengen Electric Manufacturing Co Ltd

Method of manufacturing bonded body

Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the... Shindengen Electric Manufacturing Co Ltd

Semiconductor module

Semiconductor module has a first member, a second member, a conductor column extending in the vertical direction between the first member and the second member and a sealing resin covering a first conductor layer and a first power device of the first member, a second conductor layer and a second... Shindengen Electric Manufacturing Co Ltd

Bonding device, bonding method and pressure applying unit

Provided is a bonding device for bonding a substrate and an electronic part of an assembled body which is formed by mounting the electronic part on the substrate with a metal particle paste sandwiched therebetween. The bonding device is configured to bond the substrate and the electronic part to each... Shindengen Electric Manufacturing Co Ltd

Pressure applying unit

Provided is a pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating... Shindengen Electric Manufacturing Co Ltd

Transferring member and pressure applying unit

With such a configuration, it is possible to provide a transferring member for being used in a method of manufacturing a bonded body which can suppress the lowering of bonding property between a substrate and an electronic part and which can prevent the remarkable lowering of productivity of a bonded... Shindengen Electric Manufacturing Co Ltd

Semiconductor device and manufacturing semiconductor device

A semiconductor device includes an element portion and a gate pad portion on the same wide gap semiconductor substrate. The element portion includes a first trench structure having a plurality of first protective trenches and first buried layers formed deeper than gate trenches. The gate pad portion includes a second... Shindengen Electric Manufacturing Co Ltd

Lead frame, semiconductor device, manufacturing lead frame, and manufacturing semiconductor device

The solder thickness ensuring portion is thinner than a center region of the facing surface. A center region of the back surface is flat without a depression.... Shindengen Electric Manufacturing Co Ltd








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Shindengen Electric Manufacturing Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Shindengen Electric Manufacturing Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###