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Shinkawa Ltd patents


Recent patent applications related to Shinkawa Ltd. Shinkawa Ltd is listed as an Agent/Assignee. Note: Shinkawa Ltd may have other listings under different names/spellings. We're not affiliated with Shinkawa Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Shinkawa Ltd-related inventors


Electronic-component mounting apparatus and electronic-component mounting method

Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage (45) divided into a heating section (452) and a non-heating section (456), the heating section being for heating a substrate (200) fixed to a front... Shinkawa Ltd

Mounting apparatus

The disclosure shows a mounting apparatus including a primary pedestal with a mounting stage installed thereon, a gantry frame supported on the primary pedestal, mounting heads supported on the gantry frame in a manner movable in the Y direction, a secondary pedestal arranged apart from the primary pedestal, and a... Shinkawa Ltd

Flux reservoir apparatus

A flux reservoir apparatus (100, 200) includes a stage (12) having a recessed portion (13) for reserving flux (51, 52, 53) therein and a flux pot (20) composed of an annular member having a through hole (30) through which the flux (51, 52, 53) flows, the flux pot arranged to... Shinkawa Ltd

Mounting apparatus

Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61... Shinkawa Ltd

Bonding apparatus and estimating position of landing point of bonding tool

A bonding apparatus 10 having a diagonal optical system 30, the bonding apparatus moves a capillary 24 down to a first heightwise position to calculate a position A11 of a tip end portion of the capillary 24 and a position A12 of a tip end portion of the capillary in... Shinkawa Ltd

Electronic component mounting apparatus

A mounting apparatus includes: a mounting tool; a supporting mechanism; a first pressurizing mechanism having a Z axis motor as a drive source for moving the mounting tool in the vertical direction together with the supporting mechanism so as to apply a first load to the electronic component; a second... Shinkawa Ltd

Mounting apparatus and measuring method

A mounting apparatus for mounting an electronic component onto a substrate includes: a mounting tool (14) configured to hold the electronic component by a holding surface (14a) as a tip end surface of the mounting tool; a movement mechanism configured to move the mounting tool (14) relatively with respect to... Shinkawa Ltd

Bonding apparatus and bonding method

A bonding apparatus 10 includes: a bonding head 18 configured to move a top camera 24 facing toward a bonding surface and a collet 22 disposed with an offset from the top camera 24, while integrally holding the top camera 24 and the collet 22; a bottom camera 28 facing... Shinkawa Ltd

Mounting apparatus

A mounting apparatus includes a Y-axis movable base 36 movable in a Y-axis direction, a Z-axis movable base 40 attached to the Y-axis movable base 36 and movable in a Z-axis direction, a mounting head 12 attached to the Z-axis movable base 40 and including a mounting tool 16 for... Shinkawa Ltd

Bonding device

Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction... Shinkawa Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Shinkawa Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Shinkawa Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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