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Shinko Electric Industries Co Ltd
Shinko Electric Industries Co Ltd_20100107
Shinko Electric Industries Co Ltd_20100128
  

Shinko Electric Industries Co Ltd patents

Recent patent applications related to Shinko Electric Industries Co Ltd. Shinko Electric Industries Co Ltd is listed as an Agent/Assignee. Note: Shinko Electric Industries Co Ltd may have other listings under different names/spellings. We're not affiliated with Shinko Electric Industries Co Ltd, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Shinko Electric Industries Co Ltd-related inventors




Date Shinko Electric Industries Co Ltd patents (updated weekly) - BOOKMARK this page
04/27/17 new patent  Leadframe
04/27/17 new patent  Inductor device and manufacturing the same
04/20/17Lead frame and semiconductor device
04/20/17Wiring substrate and manufacturing the same
04/13/17Wiring substrate and semiconductor device
04/06/17Wiring board
03/09/17Heat transfer device and making heat transfer device
03/09/17Electrostatic chuck device
03/02/17Electronic component device
02/09/17Lead frame and semiconductor device
02/09/17Wiring board and electronic component device
02/02/17Sensor
02/02/17Packaging structure
01/26/17Semiconductor device
01/26/17Packaging structure
01/19/17Electronic component device
01/19/17Electronic component device and manufacturing method thereof
12/29/16Wiring substrate and semiconductor device
12/22/16Electronic component device
12/15/16Patch-type module
12/15/16Wiring board and electronic component device
12/08/16Electronic part embedded substrate and producing an electronic part embedded substrate
12/01/16Semiconductor device
12/01/16Semiconductor device header and semiconductor device
12/01/16Wiring substrate and making wiring substrate
12/01/16Electronic component built-in substrate and electronic device
11/24/16Inductor and manufacturing same
11/24/16Inductor
11/24/16Wiring substrate, manufacturing wiring substrate and electronic component device
11/17/16Information collection circuit and information collection module
11/03/16Wiring substrate
11/03/16Wiring substrate
11/03/16Wiring substrate
10/27/16Optical waveguide device and manufacturing the same
10/27/16Optical module
10/27/16Wiring board
10/20/16Wiring board and semiconductor package
10/20/16Wiring substrate and manufacturing wiring substrate
10/20/16Inductor and coil substrate
10/06/16Optical device package and optical device apparatus
10/06/16Wiring substrate and semiconductor package
09/29/16Coil substrate, manufacturing coil substrate and inductor
09/22/16Wiring substrate and semiconductor device
09/22/16Wiring substrate and manufacturing the same
09/22/16Wiring substrate and electronic component device
09/15/16Semiconductor device
09/15/16Wiring substrate and manufacturing wiring substrate
09/08/16Wiring substrate and semiconductor package
08/18/16Wiring board and semiconductor package
08/11/16Circuit board and manufacturing circuit board
07/21/16Electronic component case and electronic component device
06/30/16Method of manufacturing optical waveguide device and laser processing apparatus
06/30/16Wiring substrate
06/23/16Semiconductor device and lead frame
06/23/16Semiconductor device and making the same
06/16/16Wiring board and semiconductor device
06/16/16Wiring board, electronic component device, and manufacturing those
06/02/16Wiring substrate, manufacturing the same and electronic component device
05/19/16Wiring board, electronic component device, manufacturing wiring board, and manufacturing electronic component device
05/19/16Electronic component device and manufacturing the same
05/12/16Semiconductor device
04/28/16Electrostatic chuck and base member for use in the same
04/14/16Power supply module, package for the power supply module, manufacturing the power supply module and wireless sensor module
04/07/16Fingerprint recognition semiconductor device and semiconductor device
03/31/16Semiconductor device and manufacturing the same
Patent Packs
03/31/16Semiconductor device and manufacturing the same
03/17/16Wiring substrate and semiconductor device
03/03/16Wiring substrate and manufacturing wiring substrate
03/03/16Support body, manufacturing support body, manufacturing wiring board, manufacturing electronic component, and wiring structure
02/25/16Electronic component device and manufacturing the same
02/11/16Wiring substrate and manufacturing the same
02/04/16Support member, wiring substrate, manufacturing wiring substrate, and manufacturing semiconductor package
02/04/16Method of manufacturing electronic device, and electronic component mounting device
02/04/16Method of manufacturing electronic device, and electronic component mounting device
01/21/16Wiring substrate and semiconductor device
01/14/16Lead frame and semiconductor device
01/07/16Wiring substrate
01/07/16Wiring substrate and semiconductor package
12/24/15Tray and wafer holding apparatus
12/17/15Wiring substrate and manufacturing the same
Patent Packs
12/10/15Optical waveguide device and manufacturing the same
12/10/15Wiring substrate, semiconductor device, and manufacturing wiring substrate
12/03/15Electrostatic chuck and semiconductor-liquid crystal manufacturing apparatus
11/26/15Electrostatic chuck and semiconductor-liquid crystal manufacturing apparatus
11/26/15Inductor and coil substrate
11/12/15Semiconductor device, heat conductor, and manufacturing semiconductor device
11/05/15Carbon nanotube sheet, electronic device, manufacturing carbon nanotube sheet, and manufacturing electronic device
11/05/15Wiring board, manufacturing wiring board, and electronic device
10/29/15Wiring substrate
10/29/15Method of manufacturing metal composite material, metal composite material, manufacturing heat dissipating component, and heat dissipating component
10/29/15Wiring substrate
10/29/15Photovoltaic cell mounting substrate and photovoltaic cell module
10/22/15Passive device substrate
10/22/15Battery built-in board and manufacturing the same
10/22/15Wiring substrate and manufacturing wiring substrate
10/08/15Optical waveguide device and manufacturing the same
10/08/15Wiring board and fabricating the same
10/01/15Wiring board
10/01/15Wiring board and manufacturing the same
10/01/15Semiconductor device, semiconductor manufacturing semiconductor device
09/24/15Inductor and coil substrate
09/24/15Temperature adjustment device
09/17/15Semiconductor package
09/17/15Cap, semiconductor device including the cap, and manufacturing method therefor
09/10/15Wiring substrate and semiconductor device
09/10/15Wiring substrate and making wiring substrate
09/10/15Wiring substrate and making wiring substrate
09/03/15Wiring substrate, manufacturing wiring substrate, and modifying surface of insulating layer
09/03/15Wiring substrate, manufacturing the same, and semiconductor device
08/27/15Wiring substrate, semiconductor device, and manufacturing wiring substrate
Social Network Patent Pack
08/27/15Wiring substrate and manufacturing wiring substrate
08/13/15Semiconductor device and manufacturing the same
08/13/15Wiring substrate, semiconductor package, and manufacturing semiconductor package
08/13/15Semiconductor device and manufacturing the same
08/13/15Wiring substrate and semiconductor package
08/06/15Semiconductor device
08/06/15Wiring substrate, semiconductor device, manufacturing wiring substrate, and manufacturing semiconductor device
07/30/15Heat sink and semiconductor device
07/23/15Carbon nanotube sheet, semiconductor device, manufacturing carbon nanotube sheet, and manufacturing semiconductor device
07/23/15Wiring substrate having columnar protruding part
Patent Packs
07/16/15Semiconductor device
07/16/15Wiring substrate and semiconductor package
07/16/15Wiring substrate
07/16/15Wiring substrate, manufacturing method therefor, and semiconductor package
07/09/15Method for manufacturing camera module
06/25/15Wiring substrate and semiconductor device
06/25/15Wiring substrate and semiconductor device
06/11/15Semiconductor package and manufacturing semiconductor package
06/11/15Wiring board
06/04/15Electronic device
05/28/15Optical waveguide device and manufacturing the same
05/21/15Probe card and manufacturing probe card
05/14/15Semiconductor device
04/16/15Light-emitting element mounting package, manufacturing the same, and light-emitting element package
04/16/15Wiring board, semiconductor device, and manufacturing wiring board
04/16/15Coil substrate, manufacturing coil substrate and inductor
04/02/15Semiconductor device
04/02/15Electronic component case and electronic component device
03/26/15Wiring board
03/19/15Wiring board and manufacturing wiring board
03/05/15Wiring substrate and light emitting device
03/05/15Wiring board, semiconductor device, and manufacturing wiring board
02/26/15Wiring board, semiconductor device, and manufacturing wiring board
02/19/15Wiring substrate, manufacturing the same, and semiconductor device
02/12/15Method of manufacturing wiring substrate
02/05/15Coil substrate, manufacturing coil substrate, and inductor
02/05/15Coil substrate, manufacturing the same, and inductor
01/29/15Light emitting device package and package for mounting light emitting device
01/29/15Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method
01/22/15Probe card and manufacturing the same
Patent Packs
01/22/15Probe card and manufacturing the same
01/15/15Wiring substrate and manufacturing the same
01/15/15Wiring board and manufacturing the same
01/08/15Wiring board and manufacturing wiring board
01/08/15Wiring substrate and semiconductor package
01/01/15Wiring board, semiconductor device, and manufacturing wiring board
12/25/14Pad structure and mounted structure
12/25/14Interposer, manufacturing interposer, and semiconductor device
12/18/14Photoelectric mixed substrate and optical module
12/18/14Battery and producing the same
12/11/14Wiring substrate and manufacturing wiring substrate
12/11/14Wiring substrate and manufacturing wiring substrate
12/11/14Interposer and semiconductor device including the same
12/04/14Sox gas sensor and measuring concentration of sox gas
12/04/14Probe guide plate and semiconductor inspection apparatus
11/27/14Electronic component device and manufacturing the same
11/13/14Electrostatic chuck and semiconductor manufacturing device
10/23/14Wiring board
10/09/14Wiring substrate and semiconductor device
10/02/14Lead frame and semiconductor device
Social Network Patent Pack
10/02/14Electronic component built-in substrate and manufacturing the same
10/02/14Electronic apparatus and fabrication the same
10/02/14Interposer and electronic component package
09/18/14Wiring substrate and manufacturing the same
09/18/14Wiring board and light emitting device
09/18/14Probe guide plate and manufacturing the same
08/28/14Semiconductor apparatus
08/28/14Semiconductor device and manufacturing semiconductor device
08/28/14Electronic device
08/28/14Substrate warp correcting device and substrate warp correcting method
08/14/14Wiring substrate and manufacturing the same
08/14/14Wiring board and light emitting device
07/31/14Wiring board and manufacturing wiring board
07/31/14Semiconductor device
07/31/14Built-in electronic component substrate and manufacturing the substrate
06/26/14Optical waveguide device
06/19/14Optical waveguide device and manufacturing the same
06/19/14Method of manufacturing semiconductor device
06/05/14Semiconductor package
05/29/14Electronic component device
Social Network Patent Pack
05/29/14Wiring substrate and semiconductor device
05/22/14Wiring substrate
05/08/14Radiation member
05/08/14Probe card and manufacturing the same
05/01/14Wiring substrate, manufacturing wiring substrate, and semiconductor package
05/01/14Optical waveguide and optical module
04/17/14Dielectric layer for electrostatic chuck and electrostatic chuck
04/10/14Wiring substrate and manufacturing wiring substrate
03/27/14Wiring substrate
03/27/14Method of manufacturing wiring substrate
03/20/14Wiring substrate
03/13/14Semiconductor package and manufacturing method
03/06/14Electronic component incorporated substrate
03/06/14Electronic component incorporated substrate and manufacturing electronic component incorporated substrate
02/27/14Probe card and manufacturing probe card
02/13/14Semiconductor device
02/06/14Heat radiation component and manufacturing heat radiation component
01/30/14Electroless plated film including phosphorus, boron and carbon nanotube
01/23/14Wiring substrate, manufacturing the wiring substrate, and semiconductor package
12/26/13Connection terminal structure, interposer, and socket
12/19/13Wiring board and manufacturing the same
12/05/13Electronic component built-in substrate and manufacturing the same
12/05/13Electrostatic chuck and manufacturing electrostatic chuck
11/28/13Electronic component enclosure and electronic apparatus
11/28/13Wiring substrate and manufacturing wiring substrate
11/28/13Wiring board and manufacturing the same
11/28/13Semiconductor package
11/28/13Wiring board and mounting structure
11/21/13Semiconductor device
11/21/13Semiconductor device and manufacturing the same
Social Network Patent Pack
11/21/13Electrostatic chuck and manufacturing the electrostatic chuck
11/07/13Method of manufacturing electronic device, and electronic component mounting device
10/31/13Wiring substrate and manufacturing the same
10/31/13Connection structure, wiring substrate unit, electronic circuit part unit, and electronic apparatus
10/31/13Wiring substrate and manufacturing wiring subtrate
10/31/13Electrostatic chuck
10/24/13Package and manufacturing package
10/24/13Lead frame, semiconductor package, and manufacturing the same
10/17/13Wiring substrate, manufacturing method thereof, and semiconductor package
10/17/13Wiring substrate and manufacturing the wiring substrate
10/10/13Wiring substrate and manufacturing wiring substrate
10/10/13Wiring substrate and manufacturing wiring substrate
10/10/13Stacked semiconductor device and manufacturing the same
10/03/13Lead frame, semiconductor device, and manufacturing lead frame
09/26/13Light-emitting element mounting package, manufacturing the same, and light-emitting element package
09/26/13Semiconductor package, semiconductor manufacturing semiconductor package
09/26/13Wiring substrate having columnar protruding part
09/12/13Wiring substrate and manufacturing wiring substrate
09/12/13Wiring board and semiconductor device
09/12/13Photoelectric composite substrate and manufacturing the same
08/01/13Printed wiring board and manufacturing printed wiring board
08/01/13Lead frame and manufacturing the same, and semiconductor device and manufacturing the same
07/25/13Wiring board and manufacturing the same
07/25/13Wiring substrate, light emitting device, and manufacturing wiring substrate
07/25/13Wiring substrate, light emitting device, and manufacturing wiring substrate
07/25/13Wiring substrate, light emitting device, and manufacturing wiring substrate
06/27/13Electronic device and manufacturing the same
06/27/13Semiconductor device, semiconductor package, and manufacturing semiconductor device
06/27/13Semiconductor device







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