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Shinko Electric Industries Co Ltd patents


Recent patent applications related to Shinko Electric Industries Co Ltd. Shinko Electric Industries Co Ltd is listed as an Agent/Assignee. Note: Shinko Electric Industries Co Ltd may have other listings under different names/spellings. We're not affiliated with Shinko Electric Industries Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Shinko Electric Industries Co Ltd-related inventors


 new patent  Lead frame and electronic component device

A lead frame includes a terminal portion. The terminal portion includes: a columnar electrode; a first metal plating layer formed on an upper surface of the electrode; and a second metal plating layer formed on a lower surface of the electrode. The terminal portion includes a plurality of terminal portions.... Shinko Electric Industries Co Ltd

Wiring substrate and electronic component device

A wiring substrate includes a first insulation layer having a component mounting area and a mark formation area, an electrode pad arranged in the component mounting area and having an upper surface exposed from the first insulation layer and a side surface and a lower surface embedded in the first... Shinko Electric Industries Co Ltd

Electrostatic chuck and substrate fixing device

An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and a metal material. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and... Shinko Electric Industries Co Ltd

Electrostatic chuck and substrate fixing device

An electrostatic chuck includes a heating part, a substrate on the heating part, a temperature sensor, and an embedment part. The substrate includes a first surface onto which an object is to be attracted and held, a second surface opposite from the first surface and contacting the heating part, and... Shinko Electric Industries Co Ltd

Interconnection substrate and semiconductor package

An interconnection substrate includes a first insulating layer, and an interconnection structure formed on the first insulating layer, wherein the interconnection structure includes an interconnection pattern having a first metal layer, a second metal layer formed on the first metal layer, and a third metal layer formed on the second... Shinko Electric Industries Co Ltd

Electronic component-embedded substrate and electronic component device

An electronic component-embedded substrate includes a core substrate, a cavity penetrating the core substrate, a wiring layer formed on one surface of the core substrate, a support pattern extending over the cavity and configured to divide the cavity into a plurality of component embedding areas, an insulation wall portion arranged... Shinko Electric Industries Co Ltd

Carrier base material-added wiring substrate

A carrier base material-added wiring substrate includes a wiring substrate and a carrier base material. The wiring substrate includes an insulation layer, a wiring layer arranged on a lower surface of the insulation layer, and a solder resist layer that covers the lower surface of the insulation layer and includes... Shinko Electric Industries Co Ltd

Lead frame and electronic component device

A lead frame includes: a resin portion including an upper surface and a lower surface opposite to the upper surface; and a first terminal formed to penetrate the resin portion. The first terminal includes: a first upper terminal portion disposed to protrude from the upper surface; a first lower terminal... Shinko Electric Industries Co Ltd

Peeling apparatus and peeling method

A peeling apparatus 1 includes a first peeling die and a second peeling die respectively including a pair of cutting blades 251 that peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire material 2 to cut the insulating film, and... Shinko Electric Industries Co Ltd

Loop heat pipe

A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body... Shinko Electric Industries Co Ltd

Lead frame and electronic component device

An electronic component device, includes: a lead frame including a terminal portion, the terminal portion including a columnar electrode and a metal plating layer, wherein the metal plating layer is formed on a lower surface of the electrode and a portion of a side surface of the electrode; an electronic... Shinko Electric Industries Co Ltd

Wiring substrate and semiconductor device

A wiring substrate includes a first wiring structure and a second wiring structure having a higher wiring density. The second wiring structure includes a wiring layer formed on a first insulation layer of the first wiring structure. The wiring layer includes a first wiring pattern, the upper surface of which... Shinko Electric Industries Co Ltd

Substrate holding apparatus

A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and... Shinko Electric Industries Co Ltd

Wiring board

A wiring board includes an insulating layer including a first insulating film provided with a first surface and a second surface that is opposite to the first surface, and composed of only resin, and a second insulating film provided with a first surface and a second surface that is opposite... Shinko Electric Industries Co Ltd

Substrate fixing device

A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a... Shinko Electric Industries Co Ltd

Electronic component-embedded board and electronic component device

An electronic component-embedded board includes: a core substrate; a cavity which penetrates the core substrate; a wiring layer formed on one face of the core substrate; a component mounting pattern formed of the same material as the wiring layer and laid across the cavity to partition the cavity into through... Shinko Electric Industries Co Ltd

Optical semiconductor device

An optical semiconductor device includes a base, a wiring substrate, and a sub-mount. The base includes a bottom wall, a side wall projecting from a peripheral edge of the bottom wall, and a flange extending outward from an upper end of the side wall. The wiring substrate includes a distal... Shinko Electric Industries Co Ltd

Electronic device

An electronic device includes: a casing; a through hole which penetrates a bottom plate of the casing; a pin inserted into the through hole; a battery mounted on the pin inside the casing, wherein the battery includes a first lead terminal connected to an upper face of the battery, and... Shinko Electric Industries Co Ltd

Wiring substrate and semiconductor package

A wiring substrate includes an insulating layer and a wiring layer buried in the insulating layer at a first surface of the insulating layer. The wiring layer includes a first portion and a second portion. The first portion is narrower and thinner than the second portion. The first portion includes... Shinko Electric Industries Co Ltd

Wiring board

A wiring board includes an electronic component; an insulating layer containing the electronic component therein, and including a via hole that is open at one surface of the insulating layer to expose an electrode of the electronic component; a first wiring layer embedded in the insulating layer, one surface of... Shinko Electric Industries Co Ltd

Wiring substrate and semiconductor device

A wiring component electrically connects a first semiconductor element, including first and second electrode terminals, and a second semiconductor element, including third and fourth electrode terminals. The wiring component includes first and second connection terminals respectively connected to the first and third electrode terminals. A third connection terminal is connected... Shinko Electric Industries Co Ltd

Electrostatic chuck

An electrostatic chuck includes a dielectric layer and a conductive layer located inside the dielectric layer. The dielectric layer includes an upper surface and a plurality of protrusions protruding from the upper surface. Each of the protrusions includes a top portion that serves as an attraction surface on which a... Shinko Electric Industries Co Ltd

Electronic component built-in substrate and electronic component device

A substrate includes a core substrate; a cavity formed on an upper surface side of the core substrate; a bottom plate of the cavity formed integrally with the core substrate; a through-hole formed in the bottom plate, a component mounting portion formed at a portion of the bottom plate, an... Shinko Electric Industries Co Ltd

Wafer holding apparatus and baseplate structure

A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a... Shinko Electric Industries Co Ltd

Wiring substrate and semiconductor device

A wiring substrate includes a first wiring layer, an insulative resin first insulation layer covering the first wiring layer, and a second wiring layer located on an upper surface of the first insulation layer. A via wiring layer, which extends through the first insulation layer to connect the first and... Shinko Electric Industries Co Ltd

Wiring substrate and semiconductor device

A wiring substrate includes a first insulating layer including a first through-hole formed through the first insulating layer in a thickness direction, a wiring layer formed on a lower surface of the first insulating layer, and a via wiring filled in the first through-hole and connected to the wiring layer,... Shinko Electric Industries Co Ltd

Circuit board

A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and... Shinko Electric Industries Co Ltd

Zinc ferrite film and manufacturing zinc ferrite film

A method for manufacturing a zinc ferrite film includes forming a zinc ferrite film on a base material by having a reaction liquid, which contains metal ions including only bivalent iron ions and bivalent zinc ions, contact an oxidation liquid, which contains an oxidant that oxidizes the metal ions, in... Shinko Electric Industries Co Ltd

Electronic part embedded substrate and producing an electronic part embedded substrate

An electronic part embedded substrate is disclosed. The electronic part embedded substrate includes a first substrate, a second substrate, an electronic part, an electrically connecting member, and a sealing member. A method of producing an electronic part embedded substrate is also disclosed. The method includes mounting an electronic part onto... Shinko Electric Industries Co Ltd

Sintered body and electrostatic chuck

A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body... Shinko Electric Industries Co Ltd

Optical sensor

An optical sensor includes a flexible substrate, a light emitting element, and a light receiving element. The light emitting element and the light receiving element are mounted on element mounting portions and connected to element connection portions by wires. The optical sensor also includes through wirings extending through the substrate.... Shinko Electric Industries Co Ltd

Wiring substrate

A wiring substrate includes an insulating layer including a projection and a wiring layer on the projection. The wiring layer includes a first metal layer on an end face of the projection and a second metal layer on the first metal layer. The width of the end face of the... Shinko Electric Industries Co Ltd

Wiring board and semiconductor device

A wiring board includes a first insulating layer made of a single layer of non-photosensitive resin including a reinforcing member, a center position of the reinforcing member being positioned on a side toward a first surface with respect to a center of the first insulating layer in a thickness direction;... Shinko Electric Industries Co Ltd

Semiconductor device and semiconductor package

A semiconductor device includes: a semiconductor element; a heat radiator body having a housing recess wherein a bottom surface of the housing recess is thermally connected to the upper surface of the semiconductor element; a heat sink which is thermally connected to an upper surface of the heat radiator body... Shinko Electric Industries Co Ltd

Semiconductor device

A semiconductor device includes an electronic component and a wiring structural body located below the electronic component. The wiring structural body includes an insulation layer and a wiring layer that is connected to an electrode terminal of the electronic component. The semiconductor device also includes a wiring shield body arranged... Shinko Electric Industries Co Ltd

11/30/17 / #20170347455

Circuit board and electronic component device

A circuit board includes an insulating layer having a protrusion on a surface, and a connection pad formed on an upper surface of the protrusion. A peripheral portion of a lower surface of the connection pad is exposed from the protrusion.... Shinko Electric Industries Co Ltd

11/23/17 / #20170338398

Backing member

A backing member includes: a resin layer which contains a filler; and a plurality of leads each of which is embedded in the resin layer to penetrate through the resin layer from an upper surface of the resin layer to a lower surface of the resin layer. Each of the... Shinko Electric Industries Co Ltd

11/23/17 / #20170338628

Light-emitting device and package for light-emitting device

A light-emitting device includes a base body; light-emitting elements mounted on an upper surface of the base body; a frame body bonded to the upper surface of the base body, the frame body including inner lateral surfaces, outer lateral surfaces, and first through-holes that extend through the frame body in... Shinko Electric Industries Co Ltd

10/12/17 / #20170293096

Optical waveguide device

An optical waveguide device includes a wiring substrate, a first cladding layer formed on the wiring substrate, a base protective layer formed on the first cladding layer and formed into a certain pattern, a core layer formed on the first cladding layer and the base protective layer, a recess portion... Shinko Electric Industries Co Ltd

10/05/17 / #20170287805

Semiconductor device

A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a heat dissipation plate bonded to an upper surface of the semiconductor element with an adhesive, and an encapsulation resin that fills a gap between the heat dissipation plate and the wiring substrate. The heat... Shinko Electric Industries Co Ltd

09/21/17 / #20170271233

Semiconductor device

A semiconductor device includes an electronic component connected to a component pad of a wiring substrate, a connection member connected to a connection pad of the wiring substrate, and an encapsulation resin that encapsulates the electronic component and connection member. A wiring unit includes a first pad, embedded in the... Shinko Electric Industries Co Ltd

09/21/17 / #20170273175

Interconnection substrate and inspecting interconnection substrate

An interconnection substrate having a barcode includes a core layer, an interconnection layer over a first surface of the core layer, an insulating layer to cover the interconnection layer, and one or more additional interconnection layers over the insulating layer, wherein the barcode includes cells arranged at spaced intervals, and... Shinko Electric Industries Co Ltd

09/14/17 / #20170263545

Wiring board and semiconductor device

A wiring board includes: a first insulating layer; a first wiring layer formed on a lower surface of the first insulating layer; a first through hole which penetrates the first insulating layer; a first via wiring including: a filling portion formed to fill the first through hole; and a protruding... Shinko Electric Industries Co Ltd

09/07/17 / #20170256482

Wiring board, and semiconductor device

A wiring board includes: a first wiring structure including: a first insulating layer; a first wiring layer; and a via wiring; a protective insulating layer formed on the lower surface of the first insulating layer to cover a side surface of a lower portion of the first wiring layer; and... Shinko Electric Industries Co Ltd

08/24/17 / #20170242057

Probe guide, probe card, and probe guide manufacturing

A guide plate 20 is formed of a silicon plate 22 having guide holes 23 respectively adapted to support contact probes 13, the inner walls of the guide holes 23 include a guide film 25 formed on the inner wall surfaces of corresponding penetration-processed holes 24 of the silicon plate... Shinko Electric Industries Co Ltd

08/10/17 / #20170229388

Wiring substrate and semiconductor device

A wiring substrate includes a core substrate and a cavity extending through the core substrate. The cavity has a planar shape that is rectangular, and includes corners and sides connecting the corners in a plan view. The wiring substrate also includes first through holes that extend through the core substrate... Shinko Electric Industries Co Ltd

08/10/17 / #20170231094

Wiring board with stacked embedded capacitors and making

A method of making a wiring board includes forming a first capacitor carrier layer with a first embedded chip capacitor, a first insulation layer disposed on an upper surface, a second insulation layer disposed on a lower surface, first upper and lower conductive vias in conductive contact with a first... Shinko Electric Industries Co Ltd

08/03/17 / #20170221829

Electronic component integrated substrate

An electronic component integrated substrate includes a first substrate including a first pad, a first solder resist layer provided with a first open portion that selectively exposes the first pad, and a connection pad formed on the first solder resist layer, and electrically connected to the first pad; a second... Shinko Electric Industries Co Ltd

08/03/17 / #20170221867

Semiconductor device

A semiconductor device includes a wiring substrate including an upper surface on which a component pad and a connection pad are formed, an electronic component connected to the component pad, a conductive connection member connected to the connection pad, an encapsulation resin that encapsulates the electronic component and the connection... Shinko Electric Industries Co Ltd

07/20/17 / #20170205444

Probe guide plate and probe device

A probe guide plate includes a first silicon substrate having first through-holes formed therein, an insulation layer formed on the first silicon substrate and having an opening on a region in which the first through-holes are arranged, a second silicon substrate arranged on the insulation layer and having second through-holes... Shinko Electric Industries Co Ltd

07/20/17 / #20170205445

Probe guide plate and probe device

A probe guide plate includes a first silicon substrate, a first recess portion formed in an upper surface of the first silicon substrate, first through-holes formed in the first silicon substrate at a bottom of the first recess portion, a second silicon substrate directly bonded on the first silicon substrate,... Shinko Electric Industries Co Ltd

07/20/17 / #20170207148

Lead frame and semiconductor device

A lead frame includes a first lead frame including a first lead; a second lead frame including a second lead, the second lead frame being stacked on the first lead frame so that a space is formed between the first lead frame and the second lead frame, and the second... Shinko Electric Industries Co Ltd

07/13/17 / #20170202081

Package for optical semiconductor device

A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater... Shinko Electric Industries Co Ltd

06/29/17 / #20170186677

Wiring substrate and semiconductor device

A wiring substrate includes a first wiring layer that is an uppermost wiring layer, a protective insulation layer that covers the first wiring layer, and a first through hole that extends through the protective insulation layer in a thickness-wise direction to partially expose an upper surface of the first wiring... Shinko Electric Industries Co Ltd

06/29/17 / #20170186684

Wiring substrate

A wiring substrate includes a first insulation layer, a wiring layer formed on an upper surface of the first insulation layer, a barrier film that covers the upper surface of the first insulation layer, an upper surface of the wiring layer, and side surfaces of the wiring layer, and a... Shinko Electric Industries Co Ltd

06/22/17 / #20170179012

Terminal structure and wiring substrate

A terminal structure of a wiring substrate includes a wiring layer, a protective insulation layer including an opening that partially exposes an upper surface of the wiring layer, and a connection terminal formed on the wiring layer. The connection terminal includes a base portion formed in the opening and a... Shinko Electric Industries Co Ltd

06/22/17 / #20170179013

Wiring board, and semiconductor device

A wiring board includes: a core substrate including: a metal plate having first through holes; a first insulating layer covering an upper surface and a lower surface of the metal plate and inner wall surfaces of the first through holes; through electrodes penetrating the first insulating layer in a thickness... Shinko Electric Industries Co Ltd

06/22/17 / #20170179022

Wiring board and semiconductor device

A wiring board includes a single-layer insulating layer, and a single-layer interconnect layer embedded in the insulating layer, wherein an entirety of a first surface of the interconnect layer is exposed in a recessed position relative to a first surface of the insulating layer, and a second surface of the... Shinko Electric Industries Co Ltd

06/15/17 / #20170170104

Wiring substrate and semiconductor device

A wiring substrate includes a wiring layer located on an insulation layer, and a protective insulation layer covering the wiring layer and the insulation layer. The protective insulation layer includes an opening that partially exposes the wiring layer. The wiring layer includes first and second metal layers. The first metal... Shinko Electric Industries Co Ltd

06/15/17 / #20170170130

Wiring board, semiconductor package, and semiconductor device

A wiring board includes: a first insulating layer which is made of an insulating resin containing a thermosetting resin as a main component; a recess portion formed in an upper surface of the first insulating a layer; a first wiring layer formed in the recess portion and comprising an upper... Shinko Electric Industries Co Ltd

06/08/17 / #20170160468

Light waveguide, manufacturing light waveguide, and light waveguide device

A light waveguide includes a first cladding layer, a groove formed in the first cladding layer, a core layer embedded in the groove, and a second cladding layer formed on the first cladding layer and the core layer. A width and thickness of one end of the core layer are... Shinko Electric Industries Co Ltd

06/08/17 / #20170162416

Electrostatic chuck and semiconductor manufacturing apparatus

An electrostatic chuck includes a mount base. The mount base includes a base body and an electrostatic electrode, which is located in the base body. The base body is formed from a ceramic that contains aluminum oxide, which serves as a main component, yttrium oxide, magnesium oxide, and calcium oxide.... Shinko Electric Industries Co Ltd

06/08/17 / #20170162520

Lead frame, electronic component device, and methods of manufacturing them

A lead frame includes a terminal part having a first side surface formed in a concave curve shape on a lower side from an upper end of the terminal part, and a second side surface formed in a concave curve shape on a lower side from a lower end of... Shinko Electric Industries Co Ltd

06/08/17 / #20170164473

Wiring substrate

A wiring substrate includes an insulating layer, a first wiring layer and a second wiring layer on opposite sides of the insulating layer, and a via piercing through the first wiring layer and the insulating layer to electrically connect to the second wiring layer. The via includes an end portion... Shinko Electric Industries Co Ltd

06/01/17 / #20170150927

Adhesive plaster module

An adhesive plaster module which has an adhesive layer for adhering to an object includes a substrate having the adhesive layer, a switch mounted on a same side of the substrate as the adhesive layer, a battery mounted on an opposite side of the substrate from the adhesive layer, and... Shinko Electric Industries Co Ltd

Patent Packs
05/25/17 / #20170146569

Probe guide plate and probe apparatus

A probe guide plate includes: a silicon substrate including one surface and the other surface opposite to the one surface; a through hole formed through the silicon substrate to extend from the one surface of the silicon substrate to the other surface of the silicon substrate; a silicon oxide layer... Shinko Electric Industries Co Ltd

05/25/17 / #20170150603

Wiring substrate

A wiring substrate includes a first insulation layer covering a first wiring layer, a wiring pattern formed on an upper surface of the first insulation layer, and a via formed in a via hole of the first insulation layer to electrically connect the wiring pattern and the first wiring layer.... Shinko Electric Industries Co Ltd

05/18/17 / #20170141023

Wiring substrate and semiconductor device

A wiring substrate including an insulation layer, a connection terminal projecting from an upper surface of the insulation layer, a protective insulation layer formed on the upper surface of the insulation layer covering a lower side surface of the connection terminal, and a cover layer covering an upper side surface... Shinko Electric Industries Co Ltd

05/18/17 / #20170141044

Wiring substrate and semiconductor device

A wiring substrate includes first through holes extending through an insulation layer, first via wirings formed in the first through holes, a conductive pattern connected to the first via wirings, recesses formed in the first via wirings, and a protective insulation layer covering the conductive pattern and the first via... Shinko Electric Industries Co Ltd

05/11/17 / #20170133300

Leadframe and semiconductor device

A semiconductor device includes a leadframe, a semiconductor chip, and an encapsulation resin encapsulating the leadframe and the semiconductor chip. The leadframe includes a first surface and a second surface facing away from the first surface. The semiconductor chip is mounted on the first surface of the leadframe. A part... Shinko Electric Industries Co Ltd

05/11/17 / #20170133821

Optical element package and optical element device

An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the... Shinko Electric Industries Co Ltd

05/04/17 / #20170125328

Semiconductor device and leadframe

A semiconductor device includes a leadframe, a semiconductor chip mounted on the leadframe, and an encapsulation resin covering the leadframe and the semiconductor chip. The leadframe includes a terminal having a pillar shape. The terminal includes a first end surface, a second end surface facing away from the first end... Shinko Electric Industries Co Ltd

05/04/17 / #20170125333

Wiring substrate and semiconductor device

A wiring substrate is provided with a wiring pattern including a pad and a circuit pattern. The pad is formed in a mounting region where an electronic component is mounted, and the circuit pattern extends in a planar direction from the pad. An insulation layer covers a lower surface of... Shinko Electric Industries Co Ltd

04/27/17 / #20170117210

Leadframe

A leadframe includes an individual region to become a semiconductor device, and an outer frame part supporting the individual region through its peripheral edge. The thickness of the outer frame part is greater than the thickness of the individual region.... Shinko Electric Industries Co Ltd

04/27/17 / #20170117219

Inductor device and manufacturing the same

An inductor device includes a first insulating layer having a first via hole, a first metal layer formed on an upper surface of the first insulating layer and having a droop portion at an upper end-side of the first via hole, a second metal layer formed on a lower surface... Shinko Electric Industries Co Ltd

04/20/17 / #20170110389

Lead frame and semiconductor device

A semiconductor device includes a lead frame; a semiconductor chip mounted on the lead frame; and an encapsulation resin, wherein a convexo-concave portion including a plurality of concave portions is provided at a covered portion of the lead frame that is covered by the encapsulation resin, wherein the planer shape... Shinko Electric Industries Co Ltd

04/20/17 / #20170110394

Wiring substrate and manufacturing the same

A wiring substrate includes an insulating layer, at least one via hole formed in the insulating layer, a first wiring layer formed on one surface of the insulating layer and having a droop portion at an end-side of the via hole, a second wiring layer formed on the other surface... Shinko Electric Industries Co Ltd

04/13/17 / #20170103942

Wiring substrate and semiconductor device

A wiring substrate includes a first connection terminal and a protective insulation layer. The first connection terminal is electrically connected to a wiring layer by a via wiring and projects upward from an upper surface of an insulation layer. The protective insulation layer is located on the upper surface of... Shinko Electric Industries Co Ltd

04/06/17 / #20170098600

Wiring board

A wiring board includes an insulating layer, a first wiring layer, and a second wiring layer. The first wiring layer is formed in a first surface of the insulating layer, and includes a pad on which a semiconductor chip is to be mounted and a wiring pattern. The second wiring... Shinko Electric Industries Co Ltd

03/09/17 / #20170067702

Heat transfer device and making heat transfer device

A heat transfer device includes a base material and a composite plating layer formed on the base material, wherein the composite plating layer includes metal and graphene particles dispersed in the metal.... Shinko Electric Industries Co Ltd

Patent Packs
03/09/17 / #20170069519

Electrostatic chuck device

An electrostatic chuck device includes a base plate, an electrostatic chuck plate coupled to an upper surface of the base plate and including a mount region on which an attraction subject is mounted, an electrostatic electrode embedded in the chuck plate, a focus ring that is located on the upper... Shinko Electric Industries Co Ltd

03/02/17 / #20170062370

Electronic component device

An electronic component device includes: a lower wiring substrate; an electronic component on the lower wiring substrate; an upper wiring substrate disposed above the lower wiring substrate and the electronic component; a bump conductor disposed between the lower wiring substrate and the upper wiring substrate to electrically connect the lower... Shinko Electric Industries Co Ltd

02/09/17 / #20170040183

Lead frame and semiconductor device

A lead frame includes a dam bar and leads connected by the dam bar. Each lead includes an inner lead, which is located at one side of the dam bar, and an outer lead, which is located at the other side of the dam bar and formed integrally with the... Shinko Electric Industries Co Ltd

02/09/17 / #20170040249

Wiring board and electronic component device

A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and... Shinko Electric Industries Co Ltd

02/02/17 / #20170027516

Sensor

A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive... Shinko Electric Industries Co Ltd

02/02/17 / #20170033071

Packaging structure

A packaging structure includes a first substrate including a first metal terminal and a first protruding resin portion formed at a first surface; a second substrate including a second metal terminal and a second protruding resin portion formed at a second surface, the second metal terminal being made of the... Shinko Electric Industries Co Ltd

01/26/17 / #20170025386

Semiconductor device

A semiconductor device includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip in a stacking direction. The first semiconductor chip includes a through electrode and a pad on an end face of the through electrode, facing toward the second semiconductor chip. The second... Shinko Electric Industries Co Ltd

01/26/17 / #20170025387

Packaging structure

A packaging structure includes a first substrate including a first metal terminal and a second metal terminal whose height is lower than the height of the first metal terminal; and a second substrate including a third metal terminal and a fourth metal terminal whose height is lower than the height... Shinko Electric Industries Co Ltd

01/19/17 / #20170018533

Electronic component device

An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic... Shinko Electric Industries Co Ltd

01/19/17 / #20170018534

Electronic component device and manufacturing method thereof

An electronic component device includes a first electronic component, a second electronic component disposed on and connected to the first electronic component, a first underfill resin filled between the first electronic component and the second electronic component, the first underfill resin having a base part arranged around the second electronic... Shinko Electric Industries Co Ltd








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