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Siliconware Precision Industries Co Ltd
Siliconware Precision Industries Co Ltd_20131212
  

Siliconware Precision Industries Co Ltd patents

Recent patent applications related to Siliconware Precision Industries Co Ltd. Siliconware Precision Industries Co Ltd is listed as an Agent/Assignee. Note: Siliconware Precision Industries Co Ltd may have other listings under different names/spellings. We're not affiliated with Siliconware Precision Industries Co Ltd, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Siliconware Precision Industries Co Ltd-related inventors




Date Siliconware Precision Industries Co Ltd patents (updated weekly) - BOOKMARK this page
06/22/17 new patent  Electronic package
06/15/17Method of fabricating substrate structure
06/08/17Method for fabricating package structure
05/25/17Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereof
05/25/17Electronic package and fabricating the same
05/25/17Method of fabricating semiconductor package
05/11/17Fabrication packaging substrate
04/13/17Method for fabricating package structure
03/23/17Package structure, chip structure and fabrication method thereof
03/16/17Electronic package and fabrication method thereof
02/23/17Electronic package and fabrication method thereof
02/16/17Fabrication packaging substrate
02/16/17Fabrication coreless packaging substrate
02/16/17Electronic package and fabrication method thereof
02/16/17Electronic module
02/09/17Electronic package and fabricating the same
02/09/17Semiconductor device having conductive vias
02/09/17Electronic package and fabrication method thereof
02/02/17Carrier structure, packaging substrate, electronic package and fabrication method thereof
02/02/17Packaging substrate
01/05/17Electronic package and fabrication method thereof
12/08/16Substrate structure, fabrication method thereof and conductive structure
11/10/16Electronic device and fabrication method thereof
11/10/16Electronic package and fabrication method thereof
11/03/16Substrate structure with first and second conductive bumps having different widths
10/20/16Electronic packaging structure and fabricating electronic package
10/13/16Electronic device
09/22/16Electronic package and fabrication method thereof and substrate structure
09/08/16Electronic package and fabrication method thereof
08/25/16Method for fabricating package structure
08/18/16Substrate structure
08/18/16Electronic package and fabrication method thereof
08/11/16Package structure and fabrication method thereof
08/11/16Method for fabricating semiconductor package
08/04/16Electronic package structure and fabrication method thereof
08/04/16Method of manufacturing semiconductor package
07/14/16Fabrication semiconductor package
07/07/16Method of fabricating semiconductor package
06/30/16Substrate structure
06/30/16Semiconductor structure and fabricating the same
06/30/16Package structure and fabrication method thereof
06/23/16Method for manufacturing multi-chip package
06/16/16Package structure and fabrication method thereof
06/16/16Electronic module
06/09/16Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and fabricating the same
06/09/16Packaging structure and fabricating the same
06/02/16Electronic package
06/02/16Package substrate, semiconductor package and manufacturing the same
05/26/16Electronic package and fabrication method thereof
05/19/16Electronic package and fabrication method thereof
05/19/16Package structure and fabrication method thereof
05/19/16Semiconductor package and fabrication method thereof
05/19/16Fabrication semiconductor package having embedded semiconductor elements
05/12/16Package structure and fabrication method thereof
05/12/16Semiconductor package and fabrication method thereof
05/12/16Electronic package and fabrication method thereof
05/05/16Package structure and fabrication method thereof
05/05/16Package substrate, package structure and fabrication method thereof
05/05/16Substrate structure and fabrication method thereof
04/28/16Method of fabricating semiconductor package having an interposer structure
04/28/16Package structure and fabrication method thereof
04/21/16Electronic package and fabrication method thereof
04/07/16Package substrate, package structure, and methods of fabricating the same
03/31/16Package stucture and fabricating the same
03/31/16Semiconductor package and related method
Patent Packs
03/24/16Package substrate and fabricating the same
03/24/16Semiconductor structure and fabricating the same
03/17/16Semiconductor package, carrier structure and fabrication method thereof
03/17/16Package structure and fabrication method thereof
03/17/16Substrate structure and manufacturing the same
03/17/16Package structure with an embedded electronic component and fabricating the package structure
03/17/16Semiconductor package structure and fabricating the same
03/17/16Wire bonding device and eliminating defective bonding wire
03/17/16Substrate structure and fabricating the same
03/17/16Package structure
03/10/16Semiconductor package and fabricating the same
03/10/16Semiconductor package and fabricating the same
03/03/16Electronic module and fabrication method thereof
03/03/16Package structure and fabrication method thereof
02/18/16Interposer with conductive post and fabrication method thereof
Patent Packs
02/18/16Method for fabricating package structure
02/18/16Interposer and fabrication method thereof
01/28/16Package structure and fabricating the same
01/21/16Method for fabricating an interposer
01/21/16Coreless packaging substrate and fabrication method thereof
01/14/16Fabrication packaging substrate
01/14/16Package structure and fabrication method thereof
01/14/16Package structure and fabrication method thereof
01/07/16Package structure and fabrication method thereof
12/17/15Circuit structure and fabrication method thereof
12/17/15Package structure and fabrication method thereof
12/03/15Fabrication wafer level package having a pressure sensor
12/03/15Package structure and fabrication method thereof
11/26/15Fabrication package having esd and emi preventing functions
11/19/15Packaging substrate and package structure
11/19/15Semiconductor package and manufacturing the same
11/19/15Package substrate and fabricating the same
11/12/15Semiconductor package and fabrication method thereof and carrier structure
11/12/15Coreless packaging substrate, pop structure, and methods for fabricating the same
11/12/15Package structure, chip structure and fabrication method thereof
11/12/15Package structure and fabricating the same
11/05/15Packaging substrate and semiconductor package having the same
10/22/15Method of fabricating a packaging substrate
10/22/15Semiconductor interposer and package structure having the same
10/22/15Substrate having electrical interconnection structures and fabrication method thereof
10/22/15Packaging substrate and fabrication method thereof
10/15/15Conductive via structure and fabrication method thereof
10/08/15Package structure and fabricating the same
09/17/15Electronic package and fabrication method thereof
09/10/15Method of fabricating semiconductor package
Social Network Patent Pack
09/10/15Package on package structure and fabrication method thereof
08/27/15Semiconductor package and fabrication method thereof
08/20/15Flip-chip packaging substrate, flip-chip package and fabrication methods thereof
08/20/15Package substrate and structure
07/30/15Substrate structure and fabrication method thereof
07/30/15Method of fabricating connection structure for a substrate
07/23/15Layer structure for mounting semiconductor device and fabrication method thereof
07/16/15Semiconductor package and fabrication method thereof
07/02/15Package on package structure and fabrication method thereof
07/02/15Circuit structure
Patent Packs
07/02/15Fabrication packaging substrate
07/02/15Semiconductor package and fabrication method thereof
06/25/15Semiconductor package and fabrication method thereof
06/25/15Flip-chip packaging structure
06/25/15Semiconductor substrate and fabrication method thereof
06/11/15Electronic component
06/11/15Package structure and fabrication method thereof
06/11/15Method for fabricating semiconductor package
06/04/15Semiconductor package and fabrication method thereof
06/04/15Method for fabricating emi shielding package structure
06/04/15Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers
05/28/15Packaging substrate and fabrication method thereof
05/28/15Electronic package and fabrication method thereof
05/21/15Semiconductor package and lead frame
05/14/15Fabrication semiconductor package
05/07/15Semiconductor package
05/07/15Semiconductor package and fabrication method thereof and substrate and packaging structure
04/16/15Package structure and fabrication method thereof
04/16/15Package structure having mems element
04/02/15Package on package structure and fabrication method thereof
03/12/15Semiconductor device and fabrication method thereof and semiconductor structure
03/12/15Semiconductor package and fabricating the same
03/12/15Fabrication semiconductor structure
03/05/15Method for fabricating semiconductor structure
02/26/15Semiconductor package and fabrication method thereof
02/19/15Fabrication packaging substrate
02/12/15Semiconductor package and fabrication method thereof
02/12/15Semiconductor package and fabrication method thereof
02/12/15Method for fabricating multi-chip stack structure
02/05/15Semiconductor package and fabricating the same
Patent Packs
02/05/15Semiconductor package and fabricating the same
01/29/15Method for fabricating wire bonding structure
01/29/15Substrate structure and semiconductor package having the same
01/29/15Testing apparatus and testing method
01/15/15Semiconductor device and fabrication method thereof
01/15/15Semiconductor package and fabricating the same
01/01/15Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereof
12/18/14Interposer and manufacturing the same
12/18/14Stacked package and fabricating the same
12/04/14Semiconductor package and fabrication method thereof
11/20/14Fabrication semiconductor package
11/20/14Method for fabricating semiconductor package
11/13/14Semiconductor package and fabrication method thereof
11/06/14Package structure and fabrication method thereof
10/30/14Multi bandwidth balun and circuit structure thereof
09/18/14Semiconductor package, fabrication method thereof and molding compound
09/11/14Semiconductor device having a conductive vias
08/21/14Multi-chip package and manufacturing the same
08/14/14Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function
08/07/14Interconnection structure for package and fabrication method thereof
Social Network Patent Pack
07/31/14Electronic package structure
07/24/14Semiconductor package and manufacturing the same
07/24/14Electronic package, fabrication method thereof and adhesive compound
07/24/14Duplexer, circuit structure thereof and rf transceiver apparatus comprising the duplexer
07/24/14Fabrication semiconductor package having electrical connecting structures
07/10/14Semiconductor package and fabrication method thereof
07/10/14Semiconductor package and fabrication method thereof
07/10/14Semiconductor package and fabrication method thereof
07/03/14Semiconductor package and fabrication method thereof
07/03/14Semiconductor package and fabrication method thereof
07/03/14Testing apparatus and testing method
06/26/14Fabrication semiconductor package
06/12/14Method for fabricating quad flat non-leaded semiconductor package
06/05/14Carrier, semiconductor package and fabrication method thereof
05/22/14Semiconductor package and fabrication method thereof
05/15/14Connection structure for a substrate and a fabricating the connection structure
05/15/14Method for fabricating semiconductor package
05/15/14Method of fabricating a semiconductor package
05/08/14Semiconductor substrate and fabrication method thereof
05/08/14Method of testing a semiconductor package
Social Network Patent Pack
05/08/14Method of fabricating a semiconductor package
05/01/14Semiconductor package and fabricating the same
05/01/14Package structure and fabrication method thereof
05/01/14Method of testing a semiconductor structure
04/10/14Fabrication stacked package structure
04/03/14Semiconductor package and fabrication method thereof
03/27/14Semiconductor package and fabrication method thereof
03/20/14Method for fabricating leadframe-based semiconductor package
03/20/14Fabrication carrier-free semiconductor package
03/20/14Semiconductor package and fabrication method thereof
03/20/14Method for manufacturing package structure with micro-electromechanical element
03/13/14Semiconductor package, fabricating the semiconductor package, and interposer structure of the semiconductor package
03/06/14Interconnection structure for semiconductor package
02/27/14Method of fabricating a packaging substrate
02/13/14Semiconductor package and fabricating the same
02/06/14Method of fabricating a semiconductor package
01/30/14Semiconductor package and fabricating the same
01/23/14Emi shielding semiconductor element and semiconductor stack structure
01/23/14Semiconductor substrate and fabricating the same
01/23/14Semiconductor package and fabricating the same
01/16/14Semiconductor package and fabricating the same
01/16/14Balanced-to-unbalanced converter
01/09/14Conductive bump structure and fabricating a semiconductor structure
01/09/14Substrate structure, semiconductor package and methods of fabricating the same
12/26/13Package structure having micro-electro-mechanical system element and fabrication the same
12/26/13Semiconductor package and fabricating the same
12/26/13Substrate structure and semiconductor package using the same
12/26/13Method of fabricating semiconductor package
12/19/13Substrate structure and package structure
12/19/13Packaging substrate, semiconductor package and fabrication method thereof
Social Network Patent Pack
12/12/13Method of fabricating multi-chip stack package structure having inner layer heat-dissipating board
12/12/13Testing apparatus and method
12/12/13Fabrication semiconductor package
12/05/13Package structure having mems element and fabrication method thereof
12/05/13Semiconductor package and fabrication method thereof
11/14/13Semiconductor package and fabrication method thereof
11/14/13Semiconductor package and a substrate for packaging
11/07/13Semiconductor package and fabrication method thereof
10/24/13Electrical interconnection structure and electrical interconnection method
10/03/13Semiconductor package, package structure and fabrication method thereof
10/03/13Packaging substrate, semiconductor package and fabrication method thereof
09/26/13Conductive bump structure on substrate and fabrication method thereof
09/26/13Interposer and electrical testing method thereof
09/26/13Fabrication wafer level semiconductor package and fabrication wafer level packaging substrate
09/12/13Semiconductor package and fabrication method thereof
09/05/13Semiconductor package and fabrication method thereof
09/05/13Substrate structure and fabrication method thereof
08/22/13Semiconductor package and fabrication method thereof
08/08/13Semiconductor package structure
08/08/13Fabrication package structure having mems element
07/25/13Carrier, semiconductor package and fabrication method thereof
07/11/13Led chip structure, packaging substrate, package structure and fabrication method thereof
06/27/13Semiconductor package having electrical connecting structures and fabrication method thereof
06/27/13Semiconductor package, packaging substrate and fabrication method thereof
06/20/13Cross-coupled bandpass filter
06/06/13Cross-coupled bandpass filter
05/09/13Packaging substrate and fabrication method thereof
05/09/13Packaging substrate and fabrication method thereof
04/18/13Semiconductor package and fabricating the same







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