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Siliconware Precision Industries Co Ltd
Siliconware Precision Industries Co Ltd_20131212

Siliconware Precision Industries Co Ltd patents


Recent patent applications related to Siliconware Precision Industries Co Ltd. Siliconware Precision Industries Co Ltd is listed as an Agent/Assignee. Note: Siliconware Precision Industries Co Ltd may have other listings under different names/spellings. We're not affiliated with Siliconware Precision Industries Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Siliconware Precision Industries Co Ltd-related inventors


Fabrication electronic package

An electronic package is provided, including: a circuit structure having opposite first and second surfaces, wherein first and second circuit layers are formed on the first and second surfaces of the circuit structure, respectively, the first circuit layer having a minimum trace width less than that of the second circuit... Siliconware Precision Industries Co Ltd

Electronic stack structure having passive elements and fabricating the same

An electronic stack structure is provided, including a first substrate, a second substrate stacked on the first substrate through a plurality of passive elements, and an electronic element disposed on at least one of the first substrate and the second substrate. As such, the distance between the first substrate and... Siliconware Precision Industries Co Ltd

Method of fabricating electronic package

A method of fabricating an electronic package is provided, including: providing a carrier body having a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic... Siliconware Precision Industries Co Ltd

Electronic package and fabricating the same

An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a barrier frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the barrier frame with... Siliconware Precision Industries Co Ltd

Electronic device

An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals,... Siliconware Precision Industries Co Ltd

Method of fabricating package structure with an embedded electronic component

The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the... Siliconware Precision Industries Co Ltd

Electronic package and fabricating the same

An electronic package is provided, which includes: a circuit structure having opposite first and second surfaces; a metal layer formed on the first surface of the circuit structure; an electronic element disposed on the metal layer; an encapsulant encapsulating the electronic element; a plurality of conductive posts disposed on the... Siliconware Precision Industries Co Ltd

Semiconductor package and fabrication method thereof

A semiconductor package is provided, including: a substrate; a first semiconductor element disposed on the substrate and having a first conductive pad grounded to the substrate; a conductive layer formed on the first semiconductor element and electrically connected to the substrate; a second semiconductor element disposed on the first semiconductor... Siliconware Precision Industries Co Ltd

Method for fabricating electronic package

A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon... Siliconware Precision Industries Co Ltd

Substrate structure

Provided is a substrate structure, including: a substrate body having a conductive contact; an insulating layer formed on the substrate body with the conductive contact exposed therefrom; and an insulating protection layer formed on a portion of a surface of the insulating layer, and having a plurality of openings corresponding... Siliconware Precision Industries Co Ltd

Fabrication electronic module

An electronic module is provided, including an electronic element and a strengthening layer formed on a side surface of the electronic element but not formed on an active surface of the electronic element so as to strengthen the structure of the electronic module. Therefore, the electronic element is prevented from... Siliconware Precision Industries Co Ltd

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and fabricating the same

A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposing the first surface and being in contact with the carrier; forming on the carrier and on the... Siliconware Precision Industries Co Ltd

Electronic package and substrate structure

Provided is a substrate structure, including a substrate having at least one chamfer formed on a surface thereof, and a plurality of conductive bodies formed to the substrate. Therefore, a stress generated during the packaging process is alleviated through the chamfer, and the substrate structure is prevented from being cracked.... Siliconware Precision Industries Co Ltd

Fabrication semiconductor structure

The present invention provides a semiconductor structure and a method of fabricating the same. The method includes: providing a chip having conductive pads, forming a metal layer on the conductive pads, forming a passivation layer on a portion of the metal layer, and forming conductive pillars on the metal layer.... Siliconware Precision Industries Co Ltd

Electronic package and substrate structure thereof

A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiving space so... Siliconware Precision Industries Co Ltd

Fabrication package structure

A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a dielectric layer on the carrier; forming a plurality of conductive posts in the dielectric layer; and forming a cavity in the dielectric layer to expose... Siliconware Precision Industries Co Ltd

Semiconductor package and a substrate for packaging

A semiconductor package is provided, which includes: a substrate having a metal pattern layer; a semiconductor die formed on the substrate; and an underfill filled between the substrate and the semiconductor die. At least an opening is formed in the metal pattern layer to reduce the area of the metal... Siliconware Precision Industries Co Ltd

Fabrication semiconductor package

A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace layer formed on the dielectric layer; a semiconductor chip is mounted on and electrically connected to the conductive trace layer; and an encapsulant formed over the dielectric... Siliconware Precision Industries Co Ltd

Semiconductor package structure and fabricating the same

A semiconductor package structure and a method of fabricating the same are provided. The semiconductor package structure includes a package body having opposing first and second surfaces; a plurality of first conductive pads and a plurality of second conductive pads formed on the first surface of the package body; a... Siliconware Precision Industries Co Ltd

Electronic package with antenna structure

Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a... Siliconware Precision Industries Co Ltd

Fabrication semiconductor substrate

A semiconductor substrate is disclosed. The semiconductor substrate includes a substrate body having at least an opening formed on a surface thereof, wherein the surface of the substrate body and a wall of the opening are made of an insulating material; and a circuit layer formed on the surface of... Siliconware Precision Industries Co Ltd

Fabrication circuit structure

A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive... Siliconware Precision Industries Co Ltd

Electronic package and semiconductor substrate

A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having... Siliconware Precision Industries Co Ltd

Electronic package, semiconductor substrate of the electronic package, and manufacturing the electronic package

A semiconductor substrate is provided, including a substrate body, a plurality of conductive through holes penetrating the substrate body, and at least one pillar disposed in the substrate body with the at least one pillar being free from penetrating the substrate body. When the semiconductor substrate is heated, the at... Siliconware Precision Industries Co Ltd

Method of manufacturing package substrate and semiconductor package

A package substrate and a semiconductor package are provided. The package substrate includes an insulating layer having opposing first and second surfaces; a first wiring layer formed in the insulating layer, exposed from the first surface of the insulating layer, and having a plurality of first conductive pads; a second... Siliconware Precision Industries Co Ltd

Package structure

The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer,... Siliconware Precision Industries Co Ltd

Method of fabricating semiconductor package having metal layer

A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into... Siliconware Precision Industries Co Ltd

Fabrication package structure

A method for fabricating a package structure is provided, which includes the steps of: forming a first insulating layer on a carrier; forming a dielectric body on the first insulating layer, wherein the dielectric body has a first surface formed on the first insulating layer and a second surface opposite... Siliconware Precision Industries Co Ltd

Fabrication semiconductor package

A fabrication method of a semiconductor package includes the steps of: forming a release layer on a carrier having concave portions; disposing chips on the release layer in the concave portions of the carrier; forming an encapsulant on the chips and the release layer; forming a bonding layer on the... Siliconware Precision Industries Co Ltd

Substrate structure

A substrate structure is provided, including a substrate body having a conductive pad, an insulation layer formed on the substrate body and exposing the conductive pad, a conductive pillar disposed on the conductive pad, and a metal pad disposed on the insulation layer and electrically connected to the conductive pillar.... Siliconware Precision Industries Co Ltd

Semiconductor package and fabricating the same

A semiconductor package is provided, including a semiconductor substrate having a plurality of conductive vias, a buffer layer formed on the semiconductor substrate, a plurality of conductive pads formed on end surfaces of the conductive vias and covering the buffer layer. During a reflow process, the buffer layer greatly reduces... Siliconware Precision Industries Co Ltd

Electronic package

An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the... Siliconware Precision Industries Co Ltd

Fabrication semiconductor package

A semiconductor package is provided, which includes: a packaging substrate having opposite first and second surfaces and a plurality of first and second conductive pads formed on the first surface; a chip having opposite active and inactive surfaces and disposed on the first conductive pads via the active surface thereof;... Siliconware Precision Industries Co Ltd

Substrate structure and manufacturing the same

Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at least a concave portion filled... Siliconware Precision Industries Co Ltd

Carrier-free semiconductor package and fabrication method

A method for fabricating a carrier-free semiconductor package includes: half-etching a metal carrier to form a plurality of recess grooves and a plurality of metal studs each serving in position as a solder pad or a die pad; filing each of the recess grooves with a first encapsulant; forming on... Siliconware Precision Industries Co Ltd

07/13/17 / #20170201023

Electronic package

An electronic package includes a circuit structure having a first metal layer, a packaging layer formed on the circuit structure, and a second metal layer formed on the packaging layer and separated from the first metal layer at a distance. The first metal layer and the second metal layer constitute... Siliconware Precision Industries Co Ltd

07/06/17 / #20170194238

Substrate structure, electronic package and fabricating the electronic package

A substrate structure is provided, which includes: a substrate body having a first surface and a second surface opposite to the first surface; and a plurality of conductive posts disposed on the first surface of the substrate body and electrically connected to the substrate body. By replacing conventional through silicon... Siliconware Precision Industries Co Ltd

06/29/17 / #20170186702

Packaging substrate and electronic package having the same

A packaging substrate is provided, which includes: a substrate body having a first region with a plurality of conductive pads and a second region adjacent to the first region, and a material layer formed on the second region to prevent the substrate body from warping. An electronic package having the... Siliconware Precision Industries Co Ltd

06/29/17 / #20170186703

Fabrication semiconductor package

A semiconductor package is provided, including: an insulating base body having a first surface with an opening and a second surface opposite to the first surface; an insulating extending body extending outward from an edge of the first surface of the insulating base body, wherein the insulating extending body is... Siliconware Precision Industries Co Ltd

06/29/17 / #20170187117

Electronic component

An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the... Siliconware Precision Industries Co Ltd

06/22/17 / #20170181287

Electronic package

An electronic package is provided, which includes a substrate and an antenna board structure disposed on the substrate. The antenna board structure has a first portion, a second portion and a partition portion between the first portion and the second portion. As such, current can be split into two paths... Siliconware Precision Industries Co Ltd

06/15/17 / #20170171981

Method of fabricating substrate structure

The present invention provides a substrate structure and a method of fabricating the substrate structure. The method includes: forming a first wiring layer on a first carrier, forming a dielectric layer on the first wiring layer, forming a second wiring layer on the dielectric layer, forming an insulating protection layer... Siliconware Precision Industries Co Ltd

06/08/17 / #20170162494

Method for fabricating package structure

A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically... Siliconware Precision Industries Co Ltd

05/25/17 / #20170148679

Semiconductor package, semiconductor substrate, semiconductor structure and fabrication method thereof

A semiconductor package is disclosed, which includes: a packaging substrate; a semiconductor element disposed on the packaging substrate in a flip-chip manner; a stopping portion formed at edges of the semiconductor element; an insulating layer formed on an active surface of the semiconductor element and the stopping portion; and an... Siliconware Precision Industries Co Ltd

05/25/17 / #20170148716

Electronic package and fabricating the same

... Siliconware Precision Industries Co Ltd

05/25/17 / #20170148761

Method of fabricating semiconductor package

The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and... Siliconware Precision Industries Co Ltd

05/11/17 / #20170133337

Fabrication packaging substrate

A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery... Siliconware Precision Industries Co Ltd

04/13/17 / #20170103953

Method for fabricating package structure

A package structure includes a carrier, an electronic component disposed on the carrier, an encapsulant formed on the carrier for encapsulating the electronic component, a first shielding layer formed on the encapsulant, and a second shielding layer formed on the first shielding layer. The first and second shielding layers are... Siliconware Precision Industries Co Ltd

03/23/17 / #20170084562

Package structure, chip structure and fabrication method thereof

A chip structure is provided, which includes: a substrate having a plurality of conductive pads formed on a surface thereof; a first copper layer formed on each of the conductive pads; a nickel layer formed on the first copper layer; a second copper layer formed on the nickel layer; and... Siliconware Precision Industries Co Ltd

03/16/17 / #20170077047

Electronic package and fabrication method thereof

An electronic device package and manufacturing method are provided, including steps of: providing a carrier having at least an electronic element and at least a package block disposed thereon, wherein the package block has a plurality of conductive posts bonded to the carrier; forming an encapsulant on the carrier for... Siliconware Precision Industries Co Ltd

02/23/17 / #20170053859

Electronic package and fabrication method thereof

A method for fabricating an electronic package is provided, including the steps of: providing an interposer having a plurality of conductive vias and at least an opening formed at a periphery of the conductive vias; disposing at least an electronic element on the interposer; and bonding a cover plate to... Siliconware Precision Industries Co Ltd

02/16/17 / #20170047230

Fabrication packaging substrate

A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface... Siliconware Precision Industries Co Ltd

02/16/17 / #20170047240

Fabrication coreless packaging substrate

A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from the first surface of the dielectric layer, wherein the first circuit layer has a plurality of first conductive pads; a plurality... Siliconware Precision Industries Co Ltd

02/16/17 / #20170047262

Electronic package and fabrication method thereof

An electronic package is provided, which includes: a first circuit structure; at least first electronic element disposed on a surface of the first circuit structure; at least a first conductive element formed on the surface of the first circuit structure; a first encapsulant encapsulating the first electronic element and the... Siliconware Precision Industries Co Ltd

02/16/17 / #20170048981

Electronic module

An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the... Siliconware Precision Industries Co Ltd

02/09/17 / #20170040248

Electronic package and fabricating the same

A met of fabricating an electronic package is provided, g: providing a carrier body haying a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic... Siliconware Precision Industries Co Ltd

02/09/17 / #20170040277

Semiconductor device having conductive vias

A semiconductor device is provided, including: a substrate having opposing first and second surfaces and a plurality of conductive vias passing through the first and second surfaces; an insulating layer formed on the first surface of the substrate and exposing end portions of the conductive vias therefrom; and a buffer... Siliconware Precision Industries Co Ltd

02/09/17 / #20170040304

Electronic package and fabrication method thereof

An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface... Siliconware Precision Industries Co Ltd

02/02/17 / #20170033027

Carrier structure, packaging substrate, electronic package and fabrication method thereof

An electronic package is provided, including: a circuit structure having opposite first and second surfaces, wherein first and second circuit layers are formed on the first and second surfaces of the circuit structure, respectively, the first circuit layer having a minimum trace width less than that of the second circuit... Siliconware Precision Industries Co Ltd

02/02/17 / #20170033037

Packaging substrate

A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface... Siliconware Precision Industries Co Ltd

01/05/17 / #20170005023

Electronic package and fabrication method thereof

An electronic package is provided, which includes: a first circuit structure; a plurality of first electronic elements disposed on a surface of the first circuit structure; at least a first conductive element formed on the surface of the first circuit structure; and a first encapsulant formed on the surface of... Siliconware Precision Industries Co Ltd








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