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Siltronic Ag
Siltronic Ag_20100121
Siltronic Ag_20100128

Siltronic Ag patents

Recent patent applications related to Siltronic Ag. Siltronic Ag is listed as an Agent/Assignee. Note: Siltronic Ag may have other listings under different names/spellings. We're not affiliated with Siltronic Ag, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Siltronic Ag-related inventors

Epitaxially coated semiconductor wafer, and producing an epitaxially coated semiconductor wafer

Epitaxial wafers with a high concentration of BMD nuclei or developed BMDs just below a denuded zone, and having low surface roughness, are produced by forming an oxynitride layer on a purposefully oxidized epitaxial layer by a short RTA treatment in a nitriding atmosphere, removing the oxynitride layer, and then... Siltronic Ag

Semiconductor wafer comprising a monocrystalline group-iiia nitride layer

Problems associated with the mismatch between a silicon substrate and a group-IIIA nitride layer are addressed by employing a silicon substrate processed to have a surface comprising closely spaced tips extending from the surface, depositing a group-IIIB silicide layer on the tips, then depositing a group-IIIB nitride layer, and then... Siltronic Ag

Method for depositing a layer on a semiconductor wafer by vapor deposition in a process chamber

A method for depositing a layer on a semiconductor wafer by vapor deposition in a process chamber, involves removing native oxide from a surface of the wafer; and then depositing an epitaxial layer with a thickness of at least 40 μm on the surface of the wafer by introducing a... Siltronic Ag

Susceptor for holding a semiconductor wafer having an orientation notch, a depositing a layer on a semiconductor wafer, and semiconductor wafer

A semiconductor wafer processing susceptor for holding a wafer having an orientation notch during deposition of a layer on the wafer, having a placement surface for supporting the semiconductor wafer in the rear edge region of the wafer, the placement surface having a stepped outer delimitation, and an indentation of... Siltronic Ag

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Siltronic Ag in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Siltronic Ag with additional patents listed. Browse our Agent directory for other possible listings. Page by