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Stmicroelectronics Pte Ltd patents

Recent patent applications related to Stmicroelectronics Pte Ltd. Stmicroelectronics Pte Ltd is listed as an Agent/Assignee. Note: Stmicroelectronics Pte Ltd may have other listings under different names/spellings. We're not affiliated with Stmicroelectronics Pte Ltd, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Stmicroelectronics Pte Ltd-related inventors

Date Stmicroelectronics Pte Ltd patents (updated weekly) - BOOKMARK this page
04/20/17 new patent  Overmold proximity sensor and associated methods
02/23/17Proximity sensor and manufacturing method therefor
02/23/17Molded range and proximity sensor with optical resin lens
02/23/17Semiconductor die attachment with embedded stud bumps in attachment material
02/09/17Semiconductor device, semiconductor package, and manufacturing semiconductor device
12/22/16Electronic device with redistribution layer and stiffeners and related methods
12/22/16Image sensor device with an electromagnetic compatibility shield (emc) and associated methods
10/06/16Electronic device with dummy ic die and related methods
10/06/16Semiconductor packages with pillar and bump structures
09/29/16Proximity and ranging sensor
07/07/16Integrated circuit (ic) package with thick die pad, and associated methods
07/07/16Image sensor device with sensing surface cavity and related methods
06/30/16Cored solder wire with rosin flux and thermoset material
06/30/16Molded proximity sensor
06/30/16Flexible smart glove
06/30/16Method of making an electronic device including two-step encapsulation and related devices
06/30/16Semiconductor device, semiconductor package, and manufacturing semiconductor device
06/30/16Chip scale package camera module with glass interposer and making the same
06/30/16Wafer level packaging for proximity sensor
06/23/16Image sensing device with cap and related methods
06/16/16Integrated circuit device with shaped leads and forming the device
06/16/16Integrated circuit (ic) package with a solder receiving area and associated methods
05/12/16Image sensor device with different width cell layers and related methods
04/28/16Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
04/21/16Durable miniature gas composition detector having fast response time
04/14/16Gas sensor device with frame passageways and related methods
04/14/16Electronic device with redistribution layer and stiffeners and related methods
04/14/16Patterned lead frame
04/14/16Method for making an optical proximity sensor
04/14/16Image sensor device with flexible interconnect layer and related methods
04/14/16Image sensing device with interconnect layer gap and related methods
04/14/16Optical semiconductor device including blackened tarnishable bond wires and related methods
04/07/16Wafer level packaging, optical detection sensor and forming same
03/31/16Method for making semiconductor devices including reactant treatment of residual surface portion
02/18/16Compact microelectronic integrated gas sensor
02/11/16Integrated multi-sensor module
02/04/16System-in-packages and methods for forming same
01/21/16Integrated smo gas sensor module
01/07/16Selective component bonding technique
11/19/15Electronic device including components in component receiving cavity and related methods
10/22/15Integrated circuit package and forming the same
09/10/15Flexible electrochemical micro-sensor
08/27/15High throughput programming a phase change non-volatile memory device
08/20/15Electronic device with heat dissipater
08/20/15Low profile camera module with image compensation
07/30/15Method of making a suspended membrane device
07/30/15Error correction in memory devices by multiple readings with different references
07/09/15Method for making semiconductor devices including reactant treatment of residual surface portion
05/28/15Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device
05/21/15Method of processing a semiconductor wafer such as to make prototypes and related apparatus
05/21/15Optical sensor package
05/21/15Liquid crystal cell connection to lens mount of camera module
05/21/15Camera module
04/16/15Optical assembly including electrically conductive coupling member and related methods
03/26/15No-lead semiconductor package and manufacturing the same
03/12/15Through via package
03/05/15Optoelectronics assembly and making optoelectronics assembly
02/05/15Electronic modules and methods of making electronic modules
01/29/15Image sensor device with infrared filter adhesively secured to image sensor integrated circuit and related methods
01/01/15Infrared camera sensor
01/01/15Absolute temperature disposable glucose strip
01/01/15Combo bio and temperature disposable sensor on flexible foil
01/01/15Optical package with recess in transparent cover
10/02/14Integrated multi-sensor module
10/02/14Methods and devices for packaging integrated circuits
Patent Packs
10/02/14Semiconductor packages having an electric device with a recess
10/02/14Adhesive bonding technique for use with capacitive micro-sensors
10/02/14Apparatus and method to attach a wireless communication device into a semiconductor package
10/02/14Durable miniature gas composition detector having fast response time
10/02/14Accumulated power consumption sensor: application in smart batteries systems
10/02/14Contact having an angled portion
10/02/14Lens mount with conductive glue pocket for grounding to a circuit board
10/02/14Microelectronic environmental sensing module
09/11/14Self-sealing membrane for mems devices
07/10/14Method of fabricating land grid array semiconductor package
06/26/14Electronic device including electrically conductive vias having different cross-sectional areas and related methods
05/15/14Resistor thin film mtp memory
04/24/14Method for making paired lenses with an opaque barrier between, and product made
04/24/14System in package manufacturing method using wafer-to-wafer bonding
04/17/14Electronic device having a contact recess and related methods
Patent Packs
03/27/14Photoresist delivery system including control valve and associated methods
03/27/14Overmold with single attachment using optical film
03/20/14Wafer handling station including cassette members with lateral wafer confining brackets and associated methods
03/06/14Membrane structure for electrochemical sensor
02/27/14Method of selectively deglazing p205
01/09/14Methods for adjusting adhesion strength during sensor processing
01/02/14Fixing technology for component attach
12/05/13Wafer level optical sensor package and low profile camera module, and manufacture
12/05/13Cap for a microelectromechanical system device with electromagnetic shielding, and manufacture
11/28/13Resistor thin film mtp memory
07/04/13Circuit module with multiple submodules
07/04/13Methods and tmah etching
07/04/13Adapter for coupling a diffusion furnace system
07/04/13Temperature switch with resistive sensor
07/04/13Embedded wafer level ball grid array bar systems and methods
07/04/13Top gate mold with particle trap
07/04/13Adhesive dam
07/04/13Apparatus and placing solder balls
06/27/13Embedded wafer level optical package structure and manufacturing method
06/13/13Balanced leadframe package structure and manufacturing the same
06/13/13Offset of contact opening for copper pillars in flip chip packages
06/06/13Capacitance trimming with an integrated heater
05/23/13Ball grid array to pin grid array conversion
05/16/13Wafer level packaging, optical detection sensor and forming same
05/16/13Resistor thin film mtp memory
05/09/13Through via package
05/02/13Embedded wafer level package for 3d and package-on-package applications, and manufacture
05/02/13Land grid array semiconductor package and manufacture
05/02/13Embedded wafer level package for 3d and package-on-package applications, and manufacture
04/25/13Alcu hard mask process
Social Network Patent Pack
04/18/13Leadframe pad design with enhanced robustness to die crack failure
03/21/13Gettering dielectrically isolated devices
03/14/13Semiconductor package with improved pillar bump process and structure
01/10/13Microsensor with integrated temperature control
01/03/13Heat spreader for thermally enhanced flip-chip ball grid array package
11/08/12Method for producing a two-sided fan-out wafer level package with electrically conductive interconnects, and a corresponding semiconductor package
09/27/12Reducing warpage for fan-out wafer level packaging
07/05/12Thin film metal-dielectric-metal transistor
07/05/12Integrated chemical sensor
07/05/12Plasma treatment on semiconductor wafers
Patent Packs
07/05/12Through hole via filling using electroless plating
07/05/12Through hole via filling using electroless plating
07/05/12Thermo programmable resistor based rom
07/05/12Automatic shutter for adhesive dispenser
07/05/12Single chip having the chemical sensor and electronics on the same die
07/05/12Chemical sensor with replaceable sample collection chip
07/05/12Razor with chemical and biological sensor
07/05/12Image sensor circuit, system, and method
07/05/12Low cost thermally enhanced hybrid bga and manufacturing the same
07/05/12Plasma treatment on semiconductor wafers
07/05/12Reconstituted wafer warpage adjustment
06/28/12Lens alignment apparatus and method
06/28/12Ball grid array method and structure
06/28/12Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package
06/21/12Integrated heat pillar for hot region cooling in an integrated circuit
06/07/12Thermoelectric cooler system,
06/07/12Thermoelectric cooler system,
04/26/12Shielding techniques for an integrated circuit
02/23/12Susceptor support system
02/16/12Manufacturing fan-out wafer level packaging

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Stmicroelectronics Pte Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Stmicroelectronics Pte Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by