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Stmicroelectronics Pte Ltd patents

Recent patent applications related to Stmicroelectronics Pte Ltd. Stmicroelectronics Pte Ltd is listed as an Agent/Assignee. Note: Stmicroelectronics Pte Ltd may have other listings under different names/spellings. We're not affiliated with Stmicroelectronics Pte Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Stmicroelectronics Pte Ltd-related inventors

Semiconductor packages having an electric device with a recess

Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhesive material,... Stmicroelectronics Pte Ltd

Integrated smo gas sensor module

Miniature resistive gas detectors incorporate thin films that can selectively identify specific gases when heated to certain characteristic temperatures. A solid state gas sensor module is disclosed that includes a gas sensor, a heater, and a temperature sensor, stacked over an insulating recess. The insulating recess is partially filled with... Stmicroelectronics Pte Ltd

Miniature gas analyzer

A miniature gas analyzer capable of detecting VOC gases in ambient air as well as sensing relative humidity and ambient temperature can be used to monitor indoor air quality. The VOC gas sensor is thermally controlled and can be tuned to detect a certain gas by programming an adjacent heater.... Stmicroelectronics Pte Ltd

Integrated air quality sensor

A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air... Stmicroelectronics Pte Ltd

Optical sensor package including a cavity formed in an image sensor die

One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to optical sensor that includes a substrate, an image sensor die and a light-emitting device. A first surface of the image sensor die is coupled to the substrate,... Stmicroelectronics Pte Ltd

Wafer level proximity sensor

Wafer level proximity sensors are formed by processing a silicon substrate wafer and a silicon cap wafer separately, bonding the cap wafer to the substrate wafer, forming an interconnect structure of through-silicon vias within the substrate, and singulating the bonded wafers to yield individually packaged sensors. The wafer level proximity... Stmicroelectronics Pte Ltd

Image sensing device with cap and related methods

An image sensing device includes an interconnect layer and a number of grid array contacts arranged on a bottom side of the interconnect layer. An image sensor integrated circuit (IC) is carried by the interconnect layer and has an image sensing surface. A number of electrical connections are coupled between... Stmicroelectronics Pte Ltd

Integrated circuit (ic) package with a grounded electrically conductive shield layer and associated methods

An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding wire is within the encapsulated body and has a proximal end coupled to the substrate and a distal end exposed on an... Stmicroelectronics Pte Ltd

Integrated multi-sensor module

A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific... Stmicroelectronics Pte Ltd

Method for making an integrated circuit (ic) package with an electrically conductive shield layer

A method for making at least one integrated circuit (IC) package includes positioning an electrically conductive shield layer adjacent an interior of a mold, and coupling the mold onto a substrate carrying at least one IC thereon. A molding material is supplied into the interior of the mold to form... Stmicroelectronics Pte Ltd

Semiconductor packages and methods for forming same

One or more embodiments are directed to a semiconductor package that includes an integrated heatsink and methods of forming same. In one embodiment, the semiconductor package includes a semiconductor die coupled to a first surface of a die pad. A heatsink is coupled to a second surface of the die... Stmicroelectronics Pte Ltd

Vacuum integrated electronic device and manufacturing process thereof

A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to... Stmicroelectronics Pte Ltd

Proximity sensor, electronic manufacturing proximity sensor

The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the... Stmicroelectronics Pte Ltd

Proximity sensor, electronic manufacturing proximity sensor

The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting... Stmicroelectronics Pte Ltd

Overmold proximity sensor and associated methods

An electronic device includes a substrate, an optical sensor coupled to the substrate, and an optical emitter coupled to the substrate. A lens is aligned with the optical emitter and includes an upper surface and an encapsulation bleed stop groove around the upper surface. An encapsulation material is coupled to... Stmicroelectronics Pte Ltd

Proximity sensor and manufacturing method therefor

A proximity sensor is provided according to the embodiments of the present disclosure, comprising: a sensor chip; a light-emitting device; a substrate, the sensor chip and the light-emitting device being located on the substrate; a transparent molding material covering a light-emitting surface of the light-emitting device; and a non-transparent molding... Stmicroelectronics Pte Ltd

Molded range and proximity sensor with optical resin lens

A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip... Stmicroelectronics Pte Ltd

Semiconductor die attachment with embedded stud bumps in attachment material

The embodiments of the present disclosure relate to a semiconductor device and a manufacturing method therefor. The semiconductor device comprises: a die attachment pad; a stud bump located on the die attachment pad and in direct contact with the die attachment pad; a first die located on the stud bump... Stmicroelectronics Pte Ltd

Semiconductor device, semiconductor package, and manufacturing semiconductor device

Embodiments of the present disclosure provide a semiconductor device, a semiconductor package, and a method for manufacturing a semiconductor device. The semiconductor device comprises: a semiconductor die; an electrical isolation layer formed on a surface of the semiconductor die; a substrate; and a non-conductive adhesive layer disposed between the electrical... Stmicroelectronics Pte Ltd

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Stmicroelectronics Pte Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Stmicroelectronics Pte Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by