Real Time Touch



new TOP 200 Companies filing patents this week

new Companies with the Most Patent Filings (2010+)




Real Time Touch

Similar
Filing Names

Subtron Technology Co Ltd
Subtron Technology Co Ltd_20131212

Subtron Technology Co Ltd patents


Recent patent applications related to Subtron Technology Co Ltd. Subtron Technology Co Ltd is listed as an Agent/Assignee. Note: Subtron Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Subtron Technology Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Subtron Technology Co Ltd-related inventors


Manufacturing package carrier

A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner... Subtron Technology Co Ltd

Manufacturing circuit substrate

A manufacturing method of a circuit substrate includes the following steps. A core layer having a core dielectric layer, a first patterned circuit layer and a second patterned circuit layer is provided. An electroless plating nickel layer is formed on the first patterned circuit layer and the second patterned circuit... Subtron Technology Co Ltd

Substrate structure and manufacturing method thereof

A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region... Subtron Technology Co Ltd

Package substrate and manufacturing method thereof

A temporary package substrate includes a first copper layer, a second copper layer, a third copper layer, a first plating copper layer, a second plating copper layer, a third plating copper layer, a first dielectric layer, a second dielectric layer and two circuit structures. The second copper layer is located... Subtron Technology Co Ltd

Substrate structure

A substrate structure includes a dielectric layer, a metal foil, a patterned metal layer, a first patterned solder-resist layer, a release layer and a second patterned solder-resist layer. The dielectric layer includes a first surface having a plurality of recesses and a second surface. The metal foil is disposed on... Subtron Technology Co Ltd

Manufacturing circuit substrate

A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. Two insulating layers are formed on the two metal layers. Two including upper and bottom conductive layers are formed on the two insulating layers. Then, the... Subtron Technology Co Ltd

Package carrier and manufacturing method thereof

A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner... Subtron Technology Co Ltd

Package carrier and manufacturing method thereof

A package carrier includes a substrate, at least one heat conducting element, an insulating material, a first patterned circuit layer and a second patterned circuit layer. The substrate has an upper surface, a lower surface and a through hole. The heat conducting element is disposed inside the through hole and... Subtron Technology Co Ltd

Circuit board and manufacturing method thereof

A circuit board includes a substrate, a patterned copper layer, a phosphorous-containing electroless plating palladium layer, an electroless plating palladium layer and an immersion plating gold layer. The patterned copper layer is disposed on the substrate. The phosphorous-containing electroless plating palladium layer is disposed on the patterned copper layer, wherein... Subtron Technology Co Ltd

Package substrate and manufacturing method thereof

A method of manufacturing a package substrate is provided. A first copper layer and a first plating copper layer formed thereon, a first dielectric layer, a second copper layer and a second plating copper layer formed thereon, a second dielectric layer, a third copper layer and a third plating copper... Subtron Technology Co Ltd








ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009



###

This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Subtron Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Subtron Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

###