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Sumco Techxiv Corporation
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Sumco Techxiv Corporation patents

Recent patent applications related to Sumco Techxiv Corporation. Sumco Techxiv Corporation is listed as an Agent/Assignee. Note: Sumco Techxiv Corporation may have other listings under different names/spellings. We're not affiliated with Sumco Techxiv Corporation, we're just tracking patents.

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Date Sumco Techxiv Corporation patents (updated weekly) - BOOKMARK this page
02/02/17Manufacturing silicon monocrystal
07/07/16Method and device for polishing semiconductor wafer
06/23/16Scattering plate, grinding wheel, and grinding device
04/14/16Method for producing single crystal, and producing silicon wafer
12/31/15Manufacturing epitaxial silicon wafer, and epitaxial silicon wafer
06/11/15Semiconductor wafer manufacturing method
04/23/15Silicon single crystal pulling apparatus and manufacturing silicon single crystal
10/02/14Method for slicing semiconductor single crystal ingot
02/06/14Method for manufacturing single crystal
01/23/14Process for production of silicon single crystal, and highly doped n-type semiconductor substrate
12/06/12Etching method and etching apparatus of semiconductor wafer
01/19/12Method of manufacturing epitaxial silicon wafer and apparatus therefor
06/16/11Method for manufacturing semiconductor wafer
06/09/11Silicon single crystal pull-up apparatus
05/26/11Silicon single crystal pull-up apparatus
01/27/11Silicon single crystal pulling apparatus and manufacturing silicon single crystal
11/25/10Producing method and apparatus of silicon single crystal, and silicon single crystal ingot
11/11/10Semiconductor wafer manufacturing method
10/28/10Film formation reactive producing film-formed substrate
08/26/10Method of manufacturing monocrystal, flow straightening cylinder, and monocrystal pulling-up device
08/26/10Semiconductor single crystal production apparatus
08/19/10Clamp
07/15/10Manufacturing silicon single crystal
06/17/10Dopant implanting method and doping apparatus
06/10/10Method and manufacturing epitaxial silicon wafer
06/10/10Double-side grinding wafer and double-side grinding method
06/03/10Process for production of silicon single crystal, and silicon single crystal substrate
05/13/10Silicon crystalline material and manufacturing the same
05/06/10Susceptor device, manufacturing apparatus of epitaxial wafer, and manufacturing epitaxial wafer
04/29/10Polishing pad seasoning method, seasoning plate, and semiconductor polishing device
04/22/10Control controlled object in time variant system with dead time, such as single crystal production device by czochralski method
04/15/10Method of cleaning semiconductor wafer and semiconductor wafer
03/11/10Semiconductor wafer inspection method
03/04/10Method for manufacturing single crystal
01/14/10Method for heat-treating silicon wafer
12/17/09Semiconductor wafer
12/17/09Method for manufacturing a semiconductor wafer
12/03/09Single crystal manufacturing apparatus and method
12/03/09Wafer conveyance method and wafer conveyance device
12/03/09Semiconductor wafer
12/03/09Slurry supplying apparatus and polishing semiconductor wafer utilizing same
11/19/09Etching method and etching apparatus of semiconductor wafer
11/05/09Semiconductor wafer processing method and apparatus
10/29/09Device and manufacturing a semiconductor wafer
09/17/09Single crystal silicon pulling apparatus, preventing contamination of silicon melt, and device for preventing contamination of silicon melt
08/06/09Methods for evaluating and manufacturing semiconductor wafer
07/09/09Method and measuring spectroscopic absorbance
06/11/09Method of injecting dopant gas
02/26/09Method of recycling abrasive slurry
01/14/10Method for heat-treating silicon wafer







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