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Suss Microtec Lithography Gmbh patents

Recent patent applications related to Suss Microtec Lithography Gmbh. Suss Microtec Lithography Gmbh is listed as an Agent/Assignee. Note: Suss Microtec Lithography Gmbh may have other listings under different names/spellings. We're not affiliated with Suss Microtec Lithography Gmbh, we're just tracking patents.

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Date Suss Microtec Lithography Gmbh patents (updated weekly) - BOOKMARK this page
01/19/17Spacer displacement device for a wafer illumination unit and wafer illumination unit
12/22/16Device for treating a disc-shaped substrate and support adapter
11/17/16Apparatus, system, and handling aligned wafer pairs
11/17/16Apparatus, system, and handling aligned wafer pairs
10/20/16Method and device for curing at least in part a photoresist applied to a substrate
10/13/16Method and device for applying a coating to a substrate
10/13/16Debonding temporarily bonded semiconductor wafers
10/13/16Wafer treating device and sealing ring for a wafer treating device
10/13/16Method for coating a substrate
10/06/16Method for regulating a light source of a photolithography exposure system and exposure assembly for a photolithography device
08/18/16Chuck for suction and holding a wafer
05/26/16Baking device for a wafer coated with a coating containing a solvent
03/31/16Method for coating a substrate and coating device
03/31/16Method for coating a substrate with a lacquer and device for planarising a lacquer layer
10/15/15Bottle supply system and bottle cap adapter
09/10/15Method and temporary bonding of ultra thin wafers
07/23/15System amd substrate holding
04/16/15Debonding temporarily bonded semiconductor wafers
03/26/15Method for thermal-slide debonding of temporary bonded semiconductor wafers
10/30/14Apparatus and aligning and centering wafers
09/19/13Method and temporary bonding of ultra thin wafers
04/05/12Apparatus for high throughput wafer bonding
12/01/11Apparatus and detaping an adhesive layer from the surface of ultra thin wafers
10/20/11Debonding equipment and methods for debonding temporary bonded wafers
10/20/11Debonding equipment and methods for debonding temporary bonded wafers
08/05/10Device for coating a substrate







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