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Suss Microtec Lithography Gmbh patents


Recent patent applications related to Suss Microtec Lithography Gmbh. Suss Microtec Lithography Gmbh is listed as an Agent/Assignee. Note: Suss Microtec Lithography Gmbh may have other listings under different names/spellings. We're not affiliated with Suss Microtec Lithography Gmbh, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "S" | Suss Microtec Lithography Gmbh-related inventors


 new patent  Semiconductor bonding apparatus and related techniques

A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves.... Suss Microtec Lithography Gmbh

Apparatus and semiconductor wafer leveling, force balancing and contact sensing

A wafer bonder apparatus, includes a lower chuck, an upper chuck, a process chamber and three adjustment mechanisms. The three adjustment mechanisms are arranged around a top lid spaced apart from each other and are located outside of the process chamber. Each adjustment mechanism includes a component for sensing contact... Suss Microtec Lithography Gmbh

Light source arrangement for a photolithography exposure system and photolithography exposure system

A light source arrangement for a photolithography exposure system comprises at least three light sources with different wavelengths, and a beam splitting unit comprising at least three inputs, one output, and at least two reflecting faces. An input is assigned to each light source and each reflecting face. The reflecting... Suss Microtec Lithography Gmbh

Method for coating a substrate and also a coating system

Method for coating a substrate with a coating material is described, in particular with a coating or photoresist, wherein said substrate is provided in said method. Said coating material is applied to said upper side of said substrate. A gas flow is generated, said gas flow being directed from said... Suss Microtec Lithography Gmbh

System and related techniques for handling aligned substrate pairs

An industrial-scale system and method for handling precisely aligned and centered semiconductor substrate (e.g., wafer) pairs for substrate-to-substrate (e.g., wafer-to-wafer) aligning and bonding applications is provided. Some embodiments include an aligned substrate transport device having a frame member and a spacer assembly. The centered semiconductor substrate pairs may be positioned... Suss Microtec Lithography Gmbh

Semiconductor bonding apparatus and related techniques

A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves.... Suss Microtec Lithography Gmbh

Spacer displacement device for a wafer illumination unit and wafer illumination unit

A spacer displacement device for a wafer illumination unit comprises an actuator, a spacer which can be displaced between an active and an inactive position by the actuator, and a force transmission element which is coupled to the actuator. The force transmission element consists of wire.... Suss Microtec Lithography Gmbh








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