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Tessera Research Llc patents

Recent patent applications related to Tessera Research Llc. Tessera Research Llc is listed as an Agent/Assignee. Note: Tessera Research Llc may have other listings under different names/spellings. We're not affiliated with Tessera Research Llc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "T" | Tessera Research Llc-related inventors




Date Tessera Research Llc patents (updated weekly) - BOOKMARK this page
03/21/13High io substrates and interposers without vias
12/13/12Semiconductor chip package assembly and making same
11/15/12Semiconductor chip package assembly and making same
11/01/12Three-dimensional system-in-a-package
10/25/12Interposer having molded low cte dielectric
10/25/12Multi-chip module with stacked face-down connected dies
10/25/12Vias in porous substrates
10/25/12Reinforced fan-out wafer-level package
08/09/12Bsi image sensor package with variable light transmission for even reception of different wavelengths
07/19/12High density three-dimensional integrated capacitors
06/21/12Dual wafer spin coating
06/21/12Void-free wafer bonding using channels
06/21/12Simultaneous wafer bonding and interconnect joining
06/21/12Enhanced stacked microelectronic assemblies with central contacts
06/14/12Interconnect structure
06/14/12High density three-dimensional integrated capacitors
06/14/12Pin attachment
06/14/12Compliant interconnects in wafers
06/07/12Stacked microelectronic assemby with tsvs formed in stages and carrier above chip
06/07/12Stacked microelectronic assembly having interposer connecting active chips
06/07/12Stacked microelectronic assembly with tsvs formed in stages with plural active chips
05/24/12Enhanced stacked microelectronic assemblies with central contacts and vias connected to the central contacts
05/17/12Conductive pads defined by embedded traces
05/03/12No flow underfill
04/19/12Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
03/22/12Tsop with impedance control
03/22/12Multi-function and shielded 3d interconnects
03/22/12Staged via formation from both sides of chip
03/22/12Impedance controlled packages with metal sheet or 2-layer rdl
03/22/12Chip assembly having via interconnects joined by plating
03/22/12Stacked chip assembly having vertical vias
03/22/12Stacked multi-die packages with impedance control
03/22/12Metal can impedance control structure
02/02/12Microelectronic packages with nanoparticle joining
01/26/12Microelectronic elements with rear contacts connected with via first or via middle structures
01/26/12Microelectronic elements having metallic pads overlying vias
01/26/12Methods of forming semiconductor elements using micro-abrasive particle stream
01/26/12Non-lithographic formation of three-dimensional conductive elements
01/26/12Active chip on carrier or laminated chip having microelectronic element embedded therein
01/26/12Microelectronic elements with post-assembly planarization
01/19/12Stackable molded microelectronic packages
01/19/12Stackable molded microelectronic packages with area array unit connectors
01/12/12Microelectronic packages with dual or multiple-etched flip-chip connectors
11/24/11Microelectronic assembly with joined bond elements having lowered inductance
06/23/11Microelectronic assembly with bond elements having lowered inductance
06/23/11Microelectronic assembly with joined bond elements having lowered inductance
05/05/11Microelectronic assembly with impedance controlled wirebond and conductive reference element
04/28/11Microelectronic assembly with impedance controlled wirebond and conductive reference element
12/16/10Curable resins and articles made therefrom
09/16/10Microelectronic assembly with impedance controlled wirebond and conductive reference element
09/16/10Microelectronic assembly with impedance controlled wirebond and reference wirebond
12/24/09Wafer level edge stacking







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Tessera Research Llc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Tessera Research Llc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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