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Tokyo Seimitsu Co Ltd
Tokyo Seimitsu Co Ltd_20100114

Tokyo Seimitsu Co Ltd patents

Recent patent applications related to Tokyo Seimitsu Co Ltd. Tokyo Seimitsu Co Ltd is listed as an Agent/Assignee. Note: Tokyo Seimitsu Co Ltd may have other listings under different names/spellings. We're not affiliated with Tokyo Seimitsu Co Ltd, we're just tracking patents.

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Provided is a prober capable of maintaining parallelism between a probe card and a wafer as well as performing wafer-level inspection with high accuracy. A test head is held by a test head holding part, and the test head and a probe card are sucked and fixed to a pogo... Tokyo Seimitsu Co Ltd

Wafer inspection method

A wafer inspection method whereby inspection accuracy and operation efficiency is improved. A method for performing electrical inspection by bringing, at one time, a plurality of probes into contact with a plurality of pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection... Tokyo Seimitsu Co Ltd

Laser dicing device

A height position of a surface of a wafer can be detected accurately and stably without being affected by variation in a thin film formed on the surface of the wafer. An AF (autofocus) device irradiates the surface of the wafer W with an AF laser beam, detects reflection light... Tokyo Seimitsu Co Ltd

Three-dimensional coordinate measurement apparatus

There is provided a three-dimensional coordinate measurement apparatus capable of reducing shaking of a Y carriage and improving measurement accuracy. A groove is formed along a Y-axis direction in a right side part of a surface plate made of stone, and a Y guide is formed between the groove and... Tokyo Seimitsu Co Ltd

Shape measuring apparatus

In a shape measuring apparatus for measuring the roughness and/or contour of a surface of a workpiece by sliding a sensing pin on a tip end side of an arm on the workpiece, the arm is provided with an engagement mechanism that makes a sensing pin side of the arm... Tokyo Seimitsu Co Ltd

Positioning and fixing device

Provided is a prober capable of suppressing the increase in installation area and the increase in device cost, and also improving the throughput, while maintaining the accuracy of the moving position of an alignment device shared by each of measuring units. The prober includes: a plurality of measuring units, each... Tokyo Seimitsu Co Ltd

Semiconductor wafer inspection apparatus and semiconductor wafer inspection method

The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is... Tokyo Seimitsu Co Ltd

Bidirectional displacement detector

A bidirectional displacement detector according to the present invention includes: a displacement detector which includes a first detection element and a second detection element; a base at which the first detection element is provided; an arm which is coupled to the base so as to be rotatable around an arm... Tokyo Seimitsu Co Ltd

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Tokyo Seimitsu Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Tokyo Seimitsu Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by