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Tokyo Seimitsu Co Ltd
Tokyo Seimitsu Co Ltd_20100114
  

Tokyo Seimitsu Co Ltd patents

Recent patent applications related to Tokyo Seimitsu Co Ltd. Tokyo Seimitsu Co Ltd is listed as an Agent/Assignee. Note: Tokyo Seimitsu Co Ltd may have other listings under different names/spellings. We're not affiliated with Tokyo Seimitsu Co Ltd, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "T" | Tokyo Seimitsu Co Ltd-related inventors




Date Tokyo Seimitsu Co Ltd patents (updated weekly) - BOOKMARK this page
05/25/17Positioning and fixing device
01/12/17Semiconductor wafer inspection apparatus and semiconductor wafer inspection method
01/05/17Bidirectional displacement detector
12/22/16Laser dicing device and dicing method
12/08/16Three-dimensional coordinate measuring machine
09/29/16Three-dimensional coordinate measuring machine
09/15/16Angle measuring method and angle measuring system
08/18/16Rotation angle measurement device and rotation angle measurement method
06/09/16Roundness measuring apparatus
06/02/16Shape measuring device
01/07/16Three-dimensional coordinate measuring machine
12/17/15Probe device
12/17/15Alignment support device and alignment support probe device
10/15/15Angle measuring method and angle measuring system
05/21/15Prober
04/23/15Probing device for electronic device and probing method
04/23/15Dicing blade
04/09/15Dicing device and dicing method
02/05/15Rotation angle measurement device and rotation angle measurement method
10/09/14Angle measuring method and angle measuring system
07/19/12Circularity measuring apparatus and measurement value correcting circularity measuring method
02/03/11Tape adhering method and tape adhering device
05/13/10Polishing method and polishing apparatus
01/14/10Liquid discharge method and liquid discharger in temperature controlller
10/15/09Film thickness measuring apparatus and film thickness measuring method
10/08/09Displacement detector
10/01/09Blade breakage and abrasion detecting device
09/03/09Pad dresser, polishing device, and pad dressing method
03/05/09Method and device for forecasting/detecting polishing end point and for monitoring real-time film thickness
03/05/09Method and device for forecasting polishing end point
02/05/09Laser dicing device and laser dicing method
01/14/10Liquid discharge method and liquid discharger in temperature controlller







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Tokyo Seimitsu Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Tokyo Seimitsu Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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