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Toray Engineering Co Ltd patents

Recent patent applications related to Toray Engineering Co Ltd. Toray Engineering Co Ltd is listed as an Agent/Assignee. Note: Toray Engineering Co Ltd may have other listings under different names/spellings. We're not affiliated with Toray Engineering Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "T" | Toray Engineering Co Ltd-related inventors

 new patent  Led module and manufacturing led module

In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with... Toray Engineering Co Ltd

Method for manufacturing semiconductor device, semiconductor mounting device, and memory device manufactured by manufacturing semiconductor device

A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and... Toray Engineering Co Ltd

Process for producing resin-impregnated fiber bundle

A process for producing a resin-impregnated fiber bundle includes an unwinding step in which a resin-unimpregnated fiber bundle is unwound, a resin impregnation step in which the fiber bundle is passed through an impregnation bath filled with a resin, and an impregnation acceleration step in which after the resin impregnation... Toray Engineering Co Ltd

Film thickness measurement device and film thickness measurement method

A film thickness measurement device includes a light source, an imaging component, and a controller. The controller estimates unknown variables I1(j), I20(j), k(j), and t(i) based on the Formula (1), where i represents an observation point number of an interference image captured by the imaging component, j represents a number... Toray Engineering Co Ltd

Mounting device and mounting method

A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head... Toray Engineering Co Ltd

Resin flow analysis method and non-transitory computer-readable recording medium

A resin flow analysis method includes dividing a mold space model into small elements, acquiring a penetration coefficient, acquiring a flow conductance, and performing flow analysis of a resin in each of the small elements in the mold space model based on a first relational expression of the small elements... Toray Engineering Co Ltd

Method for detecting position of signal source in living body, and device for detecting position of signal source in living body

A method for detecting a position of a signal source in a living body includes: arranging three electrodes on a surface of the living body and alternately connecting a first external resistance and a second external resistance in parallel between the electrodes and a ground potential; measuring first voltages Vi... Toray Engineering Co Ltd

Method for forming sealing film, and sealing film

A method for forming a sealing film, in which a buffer layer and a barrier layer whose density is higher than that of the buffer layer are alternately formed on a substrate, includes forming a first buffer layer on a surface of the substrate, forming a first barrier layer on... Toray Engineering Co Ltd

Thin-film forming device

A thin-film forming device forms a thin film on a strip-shaped substrate by subjecting the strip-shaped substrate to a surface treatment while conveying the strip-shaped substrate in a state of being laid along an outer peripheral face of a main roll. The thin-film forming device comprises: a main roll chamber... Toray Engineering Co Ltd

Three-dimensional mounting method and three-dimensional mounting device

A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a... Toray Engineering Co Ltd

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009


This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Toray Engineering Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Toray Engineering Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by