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Triquint Semiconductor Inc patents

Recent patent applications related to Triquint Semiconductor Inc. Triquint Semiconductor Inc is listed as an Agent/Assignee. Note: Triquint Semiconductor Inc may have other listings under different names/spellings. We're not affiliated with Triquint Semiconductor Inc, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "T" | Triquint Semiconductor Inc-related inventors




Date Triquint Semiconductor Inc patents (updated weekly) - BOOKMARK this page
03/16/17Monolithic wideband trifilar transformer
03/16/17Air gap in baw top metal stack for reduced resistive and acoustic loss
11/10/16Single varactor stack with low second-harmonic generation
08/25/16Dual-series varactor epi
08/18/16Power package lid
06/02/16Package for high-power semiconductor devices
05/12/16Dual stack varactor
04/21/16Power limiter
03/17/16Compound varactor
02/18/16Emitter contact epitaxial structure and ohmic contact formation for heterojunction bipolar transistor
01/21/16Methods, systems, and apparatuses for temperature compensated surface acoustic wave device
11/19/15Varactor diode with heterostructure
11/19/15Enclosure for a multi-channel modulator driver
11/12/15Dual stack varactor
10/15/15Clock generation circuit with dual phase-locked loops
09/24/15Low noise amplifier drain switch circuit
09/10/15Bias circuit for a high power radio frequency switching device
08/06/15Electrostatic discharge protection device
08/06/15Field effect transistor switching circuit
07/16/15Emitter contact epitaxial structure and ohmic contact formation for heterojunction bipolar transistor
07/16/15Doped gallium nitride high-electron mobility transistor
07/16/15Passive feedback path for pre-distortion in power amplifiers
04/30/15Advanced grounding scheme
04/16/15Package for high-power semiconductor devices
04/02/15Temperature compensated bulk acoustic wave devices using over-moded acoustic reflector layers
03/26/15Electrostatic discharge (esd) circuitry
03/05/15Bias-boosting bias circuit for radio frequency power amplifier
02/05/15Split biased radio frequency power amplifier with enhanced linearity
12/25/14Transformer for monolithic microwave integrated circuits
09/18/14Border ring mode suppression in solidly-mounted bulk acoustic wave resonator
09/11/14Acoustic wave device
08/21/14Package for high-power semiconductor devices
08/14/14Body-biased switching device
07/24/14Preform including a groove extending to an edge of the preform
07/17/14Switching device with resistive divider
07/03/14Radio frequency switch circuit
05/29/14Group iii-nitride-based transistor with gate dielectric including a fluoride - or chloride- based compound
04/17/14Flip-chip packaging techniques and configurations
04/10/14Bulk acoustic wave resonator with means for suppression of pass-band ripple in bulk acoustic wave filters
02/20/14Switching device with non-negative biasing
01/02/14Group iii-nitride transistor using a regrown structure
01/02/14Body-contacted partially depleted silicon on insulator transistor
12/19/13Optimal acoustic impedance materials for polished substrate coating to suppress passband ripple in baw resonators and filters
12/05/13In-situ barrier oxidation techniques and configurations
11/28/13Group iii-nitride transistor with charge-inducing layer
11/21/13Thermal spreader having graduated thermal expansion parameters
10/31/13Power amplifier with fast loadline modulation
10/03/13Radio frequency power amplifier with low dynamic error vector magnitude
09/12/13Flip-chip packaging techniques and configurations
06/27/13Mixer with high second-order and third-order intercept point
06/06/13Enclosure for a multi-channel modulator driver
05/16/13Device structure including high-thermal-conductivity substrate
05/02/13High electron mobility transistor structure and method
05/02/13High coupling, low loss saw filter and associated method
05/02/13Temperature compensation of acoustic resonators in the electrical domain
04/25/13Group iii-nitride metal-insulator-semiconductor heterostructure field-effect transistors
04/11/13High reliability wafer level package and manufacturing method
11/29/12Regrown shottky structures for gan hemt devices
11/22/12Complementary metal-oxide semiconductor direct current to direct current converter
11/08/12Flip-chip power amplifier and impedance matching network
09/27/12Quadrature lattice matching network
09/20/12Electrostatic discharge protection circuit for compound semiconductor devices and circuits
08/09/12Ladder quadrature hybrid
07/26/12Linear voltage-controlled current source
06/28/12Acoustic wave guide device and minimizing trimming effects and piston mode instabilities
Patent Packs
06/28/12Logic circuit without enhancement mode transistors
06/21/12High electron mobility transistor with indium gallium nitride layer
04/19/12Wafer level package and manufacturing method using photodefinable polymer for enclosing acoustic devices
04/05/12Sheet-molded chip-scale package
01/12/12Balanced switch
12/01/11Overdrive protection circuit
12/01/11Protection circuit for radio frequency power amplifier
10/13/11Voltage regulator with control loop for avoiding hard saturation
10/06/11High electron mobility transistor with recessed barrier layer
08/25/11Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor
08/04/11Automatic calibration circuit
06/30/11Input-power overload-protection circuit
03/24/11Piston mode acoustic wave device and method providing a high coupling factor
10/28/10Voltage regulator circuit
10/14/10Field effect transistor having a plurality of field plates
Patent Packs
10/14/10Field-plated transistor including feedback resistor
08/05/10Power amplifier with reconfigurable direct current coupling
05/20/10Package including proximately-positioned lead frame
05/13/10Radio frequency amplification circuit utilizing variable voltage generator
03/25/10Heteroepitaxial gallium nitride-based device formed on an off-cut substrate
11/19/09Heterojunction bipolar transistor device with electrostatic discharge ruggedness







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