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Triquint Semiconductor Inc patents


Recent patent applications related to Triquint Semiconductor Inc. Triquint Semiconductor Inc is listed as an Agent/Assignee. Note: Triquint Semiconductor Inc may have other listings under different names/spellings. We're not affiliated with Triquint Semiconductor Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "T" | Triquint Semiconductor Inc-related inventors


Surface acoustic wave device having a piezoelectric layer on a quartz substrate and methods of manufacturing thereof

Embodiments of a surface acoustic wave (saw) device and methods of fabrication thereof are disclosed. In some embodiments, a saw device includes a quartz carrier substrate, a piezoelectric layer on a surface of the quartz carrier substrate, and at least one interdigitated transducer on a surface of the piezoelectric layer opposite the quartz carrier substrate, wherein a thickness of the piezoelectric layer is less than twice a transducer electrode period of the at least one interdigitated transducer. ... Triquint Semiconductor Inc

Guided surface acoustic wave device providing spurious mode rejection

Embodiments of a surface acoustic wave (saw) device having a guided saw structure that provides spurious mode suppression and methods of fabrication thereof are disclosed. In some embodiments, a saw device includes a non-semiconductor support substrate, a piezoelectric layer on a surface of the non-semiconductor support substrate, and at least one interdigitated transducer on a surface of the piezoelectric layer opposite the non-semiconductor support substrate. ... Triquint Semiconductor Inc

Systems and methods for cancellation of leakage into a rx port of a duplexer or multiplexer

Systems and methods relating to improving transmit (tx) port to receive (rx) port isolation of a duplexer or multiplexer are disclosed. In some embodiments, a system includes a duplexer or multiplexer having a transmit port, a receive port, and an antenna port. ... Triquint Semiconductor Inc

Hollow-cavity flip-chip package with reinforced interconnects and process for making the same

The present disclosure relates to a flip-chip package with a hollow-cavity and reinforced interconnects, and a process for making the same. The disclosed flip-chip package includes a substrate, a reinforcement layer over an upper surface of the substrate, a flip-chip die attached to the upper surface of the substrate by interconnects through the reinforcement layer, an air cavity formed between the substrate and the flip-chip die, and a protective layer encapsulating the flip-chip die and defining a perimeter of the air cavity. ... Triquint Semiconductor Inc

Air gap in baw top metal stack for reduced resistive and acoustic loss

Embodiments of a bulk acoustic wave (baw) device including a high conductivity electrode are disclosed. In some embodiments, a baw device includes a piezoelectric layer, a first electrode on a first surface of the piezoelectric layer, and a second electrode on a second surface of the piezoelectric layer opposite the first electrode. ... Triquint Semiconductor Inc

Monolithic wideband trifilar transformer

Transformers that provide impedance transformations within integrated circuits (ics) are disclosed. Embodiments of the transformers may include a plurality of conductors connected in series within one another wherein the conductors are arranged to form transmission lines. ... Triquint Semiconductor Inc








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