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Tsmc Solid State Lighting Ltd patents

Recent patent applications related to Tsmc Solid State Lighting Ltd. Tsmc Solid State Lighting Ltd is listed as an Agent/Assignee. Note: Tsmc Solid State Lighting Ltd may have other listings under different names/spellings. We're not affiliated with Tsmc Solid State Lighting Ltd, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "T" | Tsmc Solid State Lighting Ltd-related inventors




Date Tsmc Solid State Lighting Ltd patents (updated weekly) - BOOKMARK this page
08/27/15Light-emitting devices with through-substrate via connections
07/09/15Method and structure for led with nano-patterned substrate
07/02/15Light-emitting devices on textured substrates
06/18/15Pre-cutting a back side of a silicon substrate for growing better iii-v group compound layer on a front side of the substrate
06/11/15Doubled substrate multi-junction light emitting diode array structure
06/11/15Light emitting diode with micro-structure lens
05/28/15Novel semiconductor package with through silicon vias
05/21/15Led device with improved thermal performance
05/07/15Thermal protection structure for multi-junction led module
05/07/15Lighting apparatus having improved light output uniformity and thermal dissipation
04/30/15Batwing led with remote phosphor configuration
04/23/15Method to remove sapphire substrate
04/02/15Dicing-free led fabrication
03/26/15Vertical led chip package on tsv carrier
03/26/15Light emitting diode and fabrication thereof
03/26/15Light-emitting diode lamp and making
03/19/15Led module and bonding thereof
02/26/15Light-emitting diode with current-spreading region
02/26/15Light color and intensity adjustable led
02/26/15Photonic devices with embedded hole injection layer to improve efficiency and droop rate
09/18/14Method and fabricating phosphor-coated led dies
09/11/14Shadow mask assembly
08/21/14Structure and led with phosphor coating
07/31/14Multi-vertical led packaging structure
07/03/14Color temperature adjustment for led lamps using switches
06/12/14Cost-effective led lighting instrument with good light output uniformity
06/05/14Method and fabricating phosphor-coated led dies
06/05/14Micro-structure phosphor coating
04/24/14Led module and bonding thereof
04/17/14Method and packaging phosphor-coated leds
04/03/14Led emitter with improved white color appearance
04/03/14Light emitting diode optical emitter with transparent electrical connectors
03/27/14Wafer level photonic device die structure and making the same
03/20/14Iii-v group compound devices with improved efficiency and droop rate
03/20/14Photonic devices with embedded hole injection layer to improve efficiency and droop rate
03/20/14Pre-cutting a back side of a silicon substrate for growing better iii-v group compound layer on a front side of the substrate
03/20/14High voltage led with improved heat dissipation and light extraction
03/06/14Single phosphor layer photonic device for generating white light or color lights
03/06/14Method and accurate die-to-wafer bonding
02/27/14Method and fabricating phosphor-coated led dies
02/27/14Omnidirectional reflector
02/27/14Light color and intensity adjustable led
01/23/14Forming light-emitting diodes using seed particles
10/03/13Optimizing light extraction efficiency for an led wafer
09/19/13Changing led light output distribution through coating configuration
09/19/13Growing an improved p-gan layer of an led through pressure ramping
08/29/13Led with embedded doped current blocking layer
08/22/13Method of growing a high quality iii-v compound layer on a silicon substrate
08/22/13Led packaging structure having improved thermal dissipation and mechanical strength
07/25/13Led thermal protection structures
06/20/13Led lighting apparatus with flexible light modules
06/20/13Light-emitting diode (led) package systems
05/30/13Cost-effective led lighting instrument with good light output uniformity
02/21/13Light-emitting devices with textured active layer
11/29/12Method of separating light-emitting diode from a growth substrate
11/15/12Methods of fabricating light emitting diode packages
11/15/12Light emitting diode light bar module with electrical connectors formed by injection molding
09/13/12Light emitting diode emitter substrate with highly reflective metal bonding
09/06/12Led flip-chip package structure with dummy bumps







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Tsmc Solid State Lighting Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Tsmc Solid State Lighting Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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