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Unimicron Technology Corp
Unimicron Technology Corporation
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Unimicron Technology Corp patents


      
Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors


Method of fabricating packaging substrate having a through-holed interposer

Unimicron Technology

Method of fabricating packaging substrate having a through-holed interposer

Method of fabricating a through-holed interposer

Unimicron Technology

Method of fabricating a through-holed interposer

Search recent Press Releases: Unimicron Technology Corp-related press releases
Count Application # Date Unimicron Technology Corp patents (updated weekly) - BOOKMARK this page
12015018769207/02/15 new patent  Packaging substrate having a through-holed interposer
22015017947506/25/15Method of fabricating packaging substrate having a through-holed interposer
32015017947606/25/15Method of fabricating a through-holed interposer
42015013552705/21/15Method of fabricating packaging substrate having embedded through-via interposer
52015012928505/14/15Packaging substrate having embedded through-via interposer
62015006803303/12/15Method of fabricating packaging substrate
72014026316809/18/14Method for manufacturing package substrate
82014026433509/18/14Package substrate and testing the same
92014023949008/28/14Packaging substrate and fabrication method thereof
102014020199207/24/14Circuit board structure having embedded electronic element and fabrication method thereof
112014018291207/03/14Packaging substrate
122014011071304/24/14Electronic device and fabricating the same
132014009079404/03/14Method of fabricating packaging substrate
142014008446303/27/14Method of fabricating semiconductor package structure
152014007649203/20/14Fabrication packaging substrate having embedded capacitors
162014003513802/06/14Package structure having embedded semiconductor component and fabrication method thereof
172014002792501/30/14Through-holed interposer, packaging substrate, and methods of fabricating the same
182013033592812/19/13Carrier and fabricating coreless packaging substrate
192013031291111/28/13Wet-etching equipment and its supplying device
202013030981711/21/13Method of fabricating package structure
212013025862310/03/13Package structure having embedded electronic element and fabrication method thereof
222013024908309/26/13Packaging substrate
232013025238009/26/13Method for fabricating packaging structure having embedded semiconductor element
242013023094709/05/13Fabrication package structure having embedded semiconductor component
252013017568707/11/13Package stack device and fabrication method thereof
262013014704106/13/13Stack package structure and fabrication method thereof
272013011868005/16/13Method for fabricating a packaging substrate
282013010521305/02/13Packaging substrate having embedded through-via interposer and fabricating the same
292013010594305/02/13Packaging substrate having embedded capacitors and fabrication method thereof
302013008350304/04/13Packaging substrate having a holder, fabricating the packaging substrate, package structure having a holder, and fabricating the package structure
312013006210003/14/13Circuit board structure
322013004042702/14/13Fabrication packaging substrate having through-holed interposer embedded therein
332013003239002/07/13Packaging substrate having embedded interposer and fabrication method thereof
342013000870501/10/13Coreless package substrate and fabrication method thereof
352013000870601/10/13Coreless packaging substrate and fabricating the same
362013000929301/10/13Packaging substrate and fabricating the same
372013000930601/10/13Packaging substrate and fabrication method thereof
382012031437712/13/12Packaging structure embedded with electronic elements and fabricating the same
392012030201211/29/12Method for fabricating packaging substrate with embedded semiconductor component
402012027393011/01/12Semiconductor package structure and fabricating the same
412012027394111/01/12Package structure having embedded electronic component and fabrication method thereof
422012025577110/11/12Packaging substrate and fabricating the same
432012022876409/13/12Package structure, fabricating method thereof, and package-on-package device thereby
442012021762708/30/12Package structure and fabricating the same
452012019378908/02/12Package stack device and fabrication method thereof
462012016895907/05/12Package substrate having a through hole and fabricating the same
472012016485406/28/12Packaging substrate and fabricating the same
482012014620906/14/12Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
492012012060905/17/12Package structure having a semiconductor component embedded therein and fabricating the same
502012010459805/03/12Package structure having embedded semiconductor component and fabrication method thereof
512012009742904/26/12Package substrate and fabrication method thereof
522012009743004/26/12Packaging substrate and fabricating the same
532012004936303/01/12Package structure
542012004936603/01/12Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
552012003740402/16/12Packaging substrate having a passive element embedded therein and fabricating the same
562012003741102/16/12Packaging substrate having embedded passive component and fabrication method thereof
572012003228202/09/12Microelectromechanical system (mems) carrier and fabricating the same
582012001296201/19/12Electronic device and fabricating the same
592012001300201/19/12Package structure
602011009785004/28/11Method of fabricating a packaging structure
612011009785104/28/11Method of fabricating a package structure
622011005732303/10/11Packaging structure having embedded semiconductor element and fabricating the same
632011005331803/03/11Fabrication package structure
642011004212802/24/11Coreless packaging substrate and fabricating the same
652011003160602/10/11Packaging substrate having embedded semiconductor chip
662010031996612/23/10Packaging substrate and fabrication method thereof
672010031403712/16/10Method for fabricating packaging substrate
682010018700307/29/10Circuit board structure and fabrication method thereof
692010010834505/06/10Lid for micro-electro-mechanical device and fabricating the same
702010005214803/04/10Package structure and package substrate
712010005392003/04/10Packaging substrate with embedded semiconductor component and fabricating the same
722010003282702/11/10Package structure
732010000633101/14/10Printed circuit board with embedded semiconductor component and fabricating the same
742010000633101/14/10Printed circuit board with embedded semiconductor component and fabricating the same
752015014628505/28/15Reflective structure for optical touch sensing
762015012169305/07/15Manufacturing multi-layer circuit board
772015012169405/07/15Manufacturing multi-layer circuit board
782015012562505/07/15Manufacturing multi-layer circuit board
792015009731804/09/15Manufacturing interposed substrate
802015005346202/26/15Wiring board structure
812015005346302/26/15Rigid flex board module and the manufacturing method thereof
822015005479002/26/15Optical touch sensing structure
832014033225211/13/14Carrier substrate and manufacturing method thereof
842014033225311/13/14Carrier substrate and manufacturing method thereof
852014033570611/13/14Electrical connector
862014027544009/18/14Diamine monomer having side chain, polyimide compound having side chain and manufacturing method thereof
872014027544109/18/14Polyimide compound having side chain and manufacturing method thereof
882014027547009/18/14Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof
892014023946308/28/14Embedded chip package structure
902014022527208/14/14Embedded electronic device package structure
912014018291307/03/14Packaging substrate and fabricating the same
922014017479106/26/14Circuit board and manufacturing method thereof
932014017480406/26/14Electrical device package structure and fabricating the same
942014015109906/05/14Wiring board and laser drilling method thereof
952014015110706/05/14Touch member and manufacturing the same
962014015446306/05/14Substrate structure and manufacturing method thereof
972014013813005/22/14Substrate structure having component-disposing area and manufacturing process thereof
982014013814205/22/14Interposed substrate and manufacturing method thereof
992014011968805/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
1002014010277204/17/14Packaging carrier and manufacturing method thereof and chip package structure
1012014009943204/10/14Fabrication flexible circuit board
1022014006957403/13/14Manufacturing circuit board
1032014005340002/27/14Method for fabricating package substrate
1042014004191902/13/14Circuit structure and manufacturing method thereof
1052014003352602/06/14Fabricating embedded package structure
1062014003436102/06/14Circuit board
1072013032756412/12/13Circuit board and manufacturing method thereof
1082013031301111/28/13Interposed substrate and manufacturing method thereof
1092013021287708/22/13Manufacturing circuit board
1102013020646708/15/13Circuit board
1112013018380007/18/13Circuit board structure and fabrication thereof
1122013010520205/02/13Circuit board structure
1132013004007102/14/13Circuit board and fabrication method thereof
1142013001157601/10/13Display device and light sensing system
1152012031877012/20/12Manufacturing circuit board
1162012031258812/13/12Circuit board
1172012029208911/22/12Circuit board structure with capacitors embedded therein and fabricating the same
1182012023117909/13/12Embedded wiring board and a manufacturing method thereof
1192012017439107/12/12Process for fabricating wiring board
1202012017526507/12/12Circuit board surface structure and fabrication method thereof
1212012016831607/05/12Fabricating process of embedded circuit structure
1222012012483005/24/12Process for fabricating circuit board
1232012007386703/29/12Circuit structure
1242012006763003/22/12Circuit structure of circuit board
1252012003165102/09/12Circuit board
1262012003165202/09/12Circuit board and manufacturing method thereof
1272012002458402/02/12Connector and manufacturing method thereof
1282012000647801/12/12Fabricating circuit board
1292011030344212/15/11Substrate strip with wiring and manufacturing the same
1302011028426711/24/11Circuit board and manufacturing method thereof
1312011025343510/20/11Multilayer three-dimensional circuit structure
1322011015466406/30/11Structure of circuit board and fabricating the same
1332011015542706/30/11Circuit substrate and manufacturing method thereof
1342011015542806/30/11Circuit board and manufacturing method thereof
1352011015544006/30/11Circuit board and process for manufacturing the same
1362011015544106/30/11Circuit board and process for fabricating the same
1372011014705606/23/11Circuit board and process for fabricating the same
1382011014733906/23/11Method for manufacturing wiring structure of wiring board
1392011014734206/23/11Method for fabricating wiring structure of wiring board
1402011013949406/16/11Embedded wiring board and manufacturing the same
1412011011437305/19/11Circuit board and manufacturing method thereof
1422011010054305/05/11Manufacturing circuit structure
1432011009477904/28/11Circuit structure
1442011007680203/31/11Embedded chip package process
1452010031997012/23/10Package substrate having embedded capacitor
1462010031997312/23/10Package substrate having embedded capacitor
1472010031435212/16/10Fabricating embedded package structure
1482010029455311/25/10Package substrate having embedded capacitor
1492010028854911/18/10Coreless packaging substrate and manufacturing the same
1502010027945211/04/10Image sensor chip package method
1512010026453410/21/10Chip package structure and manufacturing method thereof
1522010025230310/07/10Circuit board and manufacturing method thereof
1532010021592708/26/10Composite circuit substrate structure
1542010020015408/12/10Fabricating process of circuit board with embedded passive component
1552010019346608/05/10Method of manufacturing circuit board
1562010016409207/01/10Semiconductor process, and silicon substrate and chip package structure applying the same
1572010010108304/29/10Method for fabricating circuit board structure with concave conductive cylinders
1582010008962704/15/10Multilayer three-dimensional circuit structure and manufacturing method thereof
1592010007761004/01/10Method for manufacturing three-dimensional circuit
1602010006531903/18/10Wiring board and process for fabricating the same
1612010005925603/11/10Circuit structure of circuit board and process for manufacturing the same
1622010004396202/25/10Fabrication rigid-flex circuit board
1632010004408202/25/10Wiring board
1642010003150202/11/10Method for fabricating blind via structure of substrate
1652010002579402/04/10Image sensor chip package structure and method thereof
1662010001306801/21/10Chip package carrier and fabrication method thereof
1672009031409512/24/09Pressure sensing device package and manufacturing method thereof
1682009030199712/10/09Fabricating process of structure with embedded circuit
1692009028885811/26/09Circuit structure and manufacturing method thereof
1702009028267411/19/09Electrical interconnect structure and process thereof and circuit board structure
1712009028493511/19/09Structure and manufacturing process for circuit board
1722009027390711/05/09Circuit board and process thereof
1732009025024710/08/09Circuit board and manufacturing method thereof
1742009020585208/20/09Circuit board and manufacturing method thereof
1752009019736408/06/09Method of fabricating substrate
1762009016605907/02/09Circuit board and process thereof
1772009014497206/11/09Circuit board and process for fabricating the same
1782009011726205/07/09Method of fabricating circuit board
1792009010477204/23/09Process of fabricating circuit structure
1802013032756412/12/13Circuit board and manufacturing method thereof
1812010001306801/21/10Chip package carrier and fabrication method thereof



ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Unimicron Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Unimicron Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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