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Unimicron Technology Corp patents


      
Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors




Count Application # Date Unimicron Technology Corp patents (updated weekly) - BOOKMARK this page
12015018769207/02/15 Packaging substrate having a through-holed interposer
22015017947506/25/15 Method of fabricating packaging substrate having a through-holed interposer
32015017947606/25/15 Method of fabricating a through-holed interposer
42015013552705/21/15 Method of fabricating packaging substrate having embedded through-via interposer
52015012928505/14/15 Packaging substrate having embedded through-via interposer
62015006803303/12/15 Method of fabricating packaging substrate
72014026316809/18/14 Method for manufacturing package substrate
82014026433509/18/14 Package substrate and testing the same
92014023949008/28/14 Packaging substrate and fabrication method thereof
102014020199207/24/14 Circuit board structure having embedded electronic element and fabrication method thereof
112014018291207/03/14 Packaging substrate
122014011071304/24/14 Electronic device and fabricating the same
132014009079404/03/14 Method of fabricating packaging substrate
142014008446303/27/14 Method of fabricating semiconductor package structure
152014007649203/20/14 Fabrication packaging substrate having embedded capacitors
162014003513802/06/14 Package structure having embedded semiconductor component and fabrication method thereof
172014002792501/30/14 Through-holed interposer, packaging substrate, and methods of fabricating the same
182013033592812/19/13 Carrier and fabricating coreless packaging substrate
192013031291111/28/13 Wet-etching equipment and its supplying device
202013030981711/21/13 Method of fabricating package structure
212013025862310/03/13 Package structure having embedded electronic element and fabrication method thereof
222013024908309/26/13 Packaging substrate
232013025238009/26/13 Method for fabricating packaging structure having embedded semiconductor element
242013023094709/05/13 Fabrication package structure having embedded semiconductor component
252013017568707/11/13 Package stack device and fabrication method thereof
262013014704106/13/13 Stack package structure and fabrication method thereof
272013011868005/16/13 Method for fabricating a packaging substrate
282013010521305/02/13 Packaging substrate having embedded through-via interposer and fabricating the same
292013010594305/02/13 Packaging substrate having embedded capacitors and fabrication method thereof
302013008350304/04/13 Packaging substrate having a holder, fabricating the packaging substrate, package structure having a holder, and fabricating the package structure
312013006210003/14/13 Circuit board structure
322013004042702/14/13 Fabrication packaging substrate having through-holed interposer embedded therein
332013003239002/07/13 Packaging substrate having embedded interposer and fabrication method thereof
342013000870501/10/13 Coreless package substrate and fabrication method thereof
352013000870601/10/13 Coreless packaging substrate and fabricating the same
362013000929301/10/13 Packaging substrate and fabricating the same
372013000930601/10/13 Packaging substrate and fabrication method thereof
382012031437712/13/12 Packaging structure embedded with electronic elements and fabricating the same
392012030201211/29/12 Method for fabricating packaging substrate with embedded semiconductor component
402012027393011/01/12 Semiconductor package structure and fabricating the same
412012027394111/01/12 Package structure having embedded electronic component and fabrication method thereof
422012025577110/11/12 Packaging substrate and fabricating the same
432012022876409/13/12 Package structure, fabricating method thereof, and package-on-package device thereby
442012021762708/30/12 Package structure and fabricating the same
452012019378908/02/12 Package stack device and fabrication method thereof
462012016895907/05/12 Package substrate having a through hole and fabricating the same
472012016485406/28/12 Packaging substrate and fabricating the same
482012014620906/14/12 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
492012012060905/17/12 Package structure having a semiconductor component embedded therein and fabricating the same
502012010459805/03/12 Package structure having embedded semiconductor component and fabrication method thereof
512012009742904/26/12 Package substrate and fabrication method thereof
522012009743004/26/12 Packaging substrate and fabricating the same
532012004936303/01/12 Package structure
542012004936603/01/12 Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
552012003740402/16/12 Packaging substrate having a passive element embedded therein and fabricating the same
562012003741102/16/12 Packaging substrate having embedded passive component and fabrication method thereof
572012003228202/09/12 Microelectromechanical system (mems) carrier and fabricating the same
582012001296201/19/12 Electronic device and fabricating the same
592012001300201/19/12 Package structure
602011009785004/28/11 Method of fabricating a packaging structure
612011009785104/28/11 Method of fabricating a package structure
622011005732303/10/11 Packaging structure having embedded semiconductor element and fabricating the same
632011005331803/03/11 Fabrication package structure
642011004212802/24/11 Coreless packaging substrate and fabricating the same
652011003160602/10/11 Packaging substrate having embedded semiconductor chip
662010031996612/23/10 Packaging substrate and fabrication method thereof
672010031403712/16/10 Method for fabricating packaging substrate
682010018700307/29/10 Circuit board structure and fabrication method thereof
692010010834505/06/10 Lid for micro-electro-mechanical device and fabricating the same
702010005214803/04/10 Package structure and package substrate
712010005392003/04/10 Packaging substrate with embedded semiconductor component and fabricating the same
722010003282702/11/10 Package structure
732010000633101/14/10 Printed circuit board with embedded semiconductor component and fabricating the same
742010000633101/14/10 Printed circuit board with embedded semiconductor component and fabricating the same
752016013348305/12/16 Manufacturing interposed substrate
762016011130104/21/16 Coreless packaging substrate and fabricating the same
772016011311404/21/16 Carrier substrate
782016011312504/21/16 Rigid flex board module and the manufacturing method thereof
792016009713004/07/16 Preparation conductive sponge having effect of shielding electromagnetic wave
802016009351403/31/16 Manufacturing process for substrate structure having component-disposing area
812016008682203/24/16 Packaging substrate having a holder, fabricating the packaging substrate, package structure having a holder, and fabricating the package structure
822016007350503/10/16 Manufacturing multilayer flexible circuit structure
832016005077102/18/16 Manufacturing circuit structure embedded with heat-dissipation block
842016002594401/28/16 Optical-electro circuit board, optical component and manufacturing method thereof
852016001254801/14/16 Automated accounting system and method thereof
862016000437301/07/16 Method for providing auxiliary information and touch control display apparatus using the same
872016000747201/07/16 Method of fabricating an electrical device package structure
882016000748301/07/16 Fabrication packaging substrate having embedded passive component
892015036219812/17/15 Dehumidification apparatus and dehumidification method
902015036267412/17/15 Opto-electronic circuit board and assembling the same
912015036608112/17/15 Manufacturing circuit structure embedded with electronic device
922015035485212/10/15 Air conditioning apparatus
932015030516110/22/15 Embedded component structure and process thereof
942015028769110/08/15 Method of fabricating package structure
952015028937410/08/15 Connector
962015028937710/08/15 Manufacturing connector
972015026680609/24/15 Manufacturing diamine monomer with side chain
982015014628505/28/15 Reflective structure for optical touch sensing
992015012169305/07/15 Manufacturing multi-layer circuit board
1002015012169405/07/15 Manufacturing multi-layer circuit board
1012015012562505/07/15 Manufacturing multi-layer circuit board
1022015009731804/09/15 Manufacturing interposed substrate
1032015005346202/26/15 Wiring board structure
1042015005346302/26/15 Rigid flex board module and the manufacturing method thereof
1052015005479002/26/15 Optical touch sensing structure
1062014033225211/13/14 Carrier substrate and manufacturing method thereof
1072014033225311/13/14 Carrier substrate and manufacturing method thereof
1082014033570611/13/14 Electrical connector
1092014027544009/18/14 Diamine monomer having side chain, polyimide compound having side chain and manufacturing method thereof
1102014027544109/18/14 Polyimide compound having side chain and manufacturing method thereof
1112014027547009/18/14 Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof
1122014023946308/28/14 Embedded chip package structure
1132014022527208/14/14 Embedded electronic device package structure
1142014018291307/03/14 Packaging substrate and fabricating the same
1152014017479106/26/14 Circuit board and manufacturing method thereof
1162014017480406/26/14 Electrical device package structure and fabricating the same
1172014015109906/05/14 Wiring board and laser drilling method thereof
1182014015110706/05/14 Touch member and manufacturing the same
1192014015446306/05/14 Substrate structure and manufacturing method thereof
1202014013813005/22/14 Substrate structure having component-disposing area and manufacturing process thereof
1212014013814205/22/14 Interposed substrate and manufacturing method thereof
1222014011968805/01/14 Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
1232014010277204/17/14 Packaging carrier and manufacturing method thereof and chip package structure
1242014009943204/10/14 Fabrication flexible circuit board
1252014006957403/13/14 Manufacturing circuit board
1262014005340002/27/14 Method for fabricating package substrate
1272014004191902/13/14 Circuit structure and manufacturing method thereof
1282014003352602/06/14 Fabricating embedded package structure
1292014003436102/06/14 Circuit board
1302013032756412/12/13 Circuit board and manufacturing method thereof
1312013031301111/28/13 Interposed substrate and manufacturing method thereof
1322013021287708/22/13 Manufacturing circuit board
1332013020646708/15/13 Circuit board
1342013018380007/18/13 Circuit board structure and fabrication thereof
1352013010520205/02/13 Circuit board structure
1362013004007102/14/13 Circuit board and fabrication method thereof
1372013001157601/10/13 Display device and light sensing system
1382012031877012/20/12 Manufacturing circuit board
1392012031258812/13/12 Circuit board
1402012029208911/22/12 Circuit board structure with capacitors embedded therein and fabricating the same
1412012023117909/13/12 Embedded wiring board and a manufacturing method thereof
1422012017439107/12/12 Process for fabricating wiring board
1432012017526507/12/12 Circuit board surface structure and fabrication method thereof
1442012016831607/05/12 Fabricating process of embedded circuit structure
1452012012483005/24/12 Process for fabricating circuit board
1462012007386703/29/12 Circuit structure
1472012006763003/22/12 Circuit structure of circuit board
1482012003165102/09/12 Circuit board
1492012003165202/09/12 Circuit board and manufacturing method thereof
1502012002458402/02/12 Connector and manufacturing method thereof
1512012000647801/12/12 Fabricating circuit board
1522011030344212/15/11 Substrate strip with wiring and manufacturing the same
1532011028426711/24/11 Circuit board and manufacturing method thereof
1542011025343510/20/11 Multilayer three-dimensional circuit structure
1552011015466406/30/11 Structure of circuit board and fabricating the same
1562011015542706/30/11 Circuit substrate and manufacturing method thereof
1572011015542806/30/11 Circuit board and manufacturing method thereof
1582011015544006/30/11 Circuit board and process for manufacturing the same
1592011015544106/30/11 Circuit board and process for fabricating the same
1602011014705606/23/11 Circuit board and process for fabricating the same
1612011014733906/23/11 Method for manufacturing wiring structure of wiring board
1622011014734206/23/11 Method for fabricating wiring structure of wiring board
1632011013949406/16/11 Embedded wiring board and manufacturing the same
1642011011437305/19/11 Circuit board and manufacturing method thereof
1652011010054305/05/11 Manufacturing circuit structure
1662011009477904/28/11 Circuit structure
1672011007680203/31/11 Embedded chip package process
1682010031997012/23/10 Package substrate having embedded capacitor
1692010031997312/23/10 Package substrate having embedded capacitor
1702010031435212/16/10 Fabricating embedded package structure
1712010029455311/25/10 Package substrate having embedded capacitor
1722010028854911/18/10 Coreless packaging substrate and manufacturing the same
1732010027945211/04/10 Image sensor chip package method
1742010026453410/21/10 Chip package structure and manufacturing method thereof
1752010025230310/07/10 Circuit board and manufacturing method thereof
1762010021592708/26/10 Composite circuit substrate structure
1772010020015408/12/10 Fabricating process of circuit board with embedded passive component
1782010019346608/05/10 Method of manufacturing circuit board
1792010016409207/01/10 Semiconductor process, and silicon substrate and chip package structure applying the same
1802010010108304/29/10 Method for fabricating circuit board structure with concave conductive cylinders
1812010008962704/15/10 Multilayer three-dimensional circuit structure and manufacturing method thereof
1822010007761004/01/10 Method for manufacturing three-dimensional circuit
1832010006531903/18/10 Wiring board and process for fabricating the same
1842010005925603/11/10 Circuit structure of circuit board and process for manufacturing the same
1852010004396202/25/10 Fabrication rigid-flex circuit board
1862010004408202/25/10 Wiring board
1872010003150202/11/10 Method for fabricating blind via structure of substrate
1882010002579402/04/10 Image sensor chip package structure and method thereof
1892010001306801/21/10 Chip package carrier and fabrication method thereof
1902009031409512/24/09 Pressure sensing device package and manufacturing method thereof
1912009030199712/10/09 Fabricating process of structure with embedded circuit
1922009028885811/26/09 Circuit structure and manufacturing method thereof
1932009028267411/19/09 Electrical interconnect structure and process thereof and circuit board structure
1942009028493511/19/09 Structure and manufacturing process for circuit board
1952009027390711/05/09 Circuit board and process thereof
1962009025024710/08/09 Circuit board and manufacturing method thereof
1972009020585208/20/09 Circuit board and manufacturing method thereof
1982009019736408/06/09 Method of fabricating substrate
1992009016605907/02/09 Circuit board and process thereof
2002009014497206/11/09 Circuit board and process for fabricating the same
2012009011726205/07/09 Method of fabricating circuit board
2022009010477204/23/09 Process of fabricating circuit structure
2032013032756412/12/13 Circuit board and manufacturing method thereof
2042010001306801/21/10 Chip package carrier and fabrication method thereof



ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Unimicron Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Unimicron Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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