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Unimicron Technology Corp patents


      
Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors



Unimicron Technology Corp.

Embedded chip package structure

Search recent Press Releases: Unimicron Technology Corp-related press releases
Count Application # Date Unimicron Technology Corp patents (updated weekly) - BOOKMARK this page
12014023949008/28/14 new patent  Packaging substrate and fabrication method thereof
22014020199207/24/14Circuit board structure having embedded electronic element and fabrication method thereof
32014018291207/03/14Packaging substrate
42014011071304/24/14Electronic device and method of fabricating the same
52014011071304/24/14Electronic device and method of fabricating the same
62014009079404/03/14Method of fabricating packaging substrate
72014009079404/03/14Method of fabricating packaging substrate
82014008446303/27/14Method of fabricating semiconductor package structure
92014008446303/27/14Method of fabricating semiconductor package structure
102014007649203/20/14Fabrication method of packaging substrate having embedded capacitors
112014007649203/20/14Fabrication method of packaging substrate having embedded capacitors
122014003513802/06/14Package structure having embedded semiconductor component and fabrication method thereof
132014002792501/30/14Through-holed interposer, packaging substrate, and methods of fabricating the same
142013033592812/19/13Carrier and method for fabricating coreless packaging substrate
152013031291111/28/13Wet-etching equipment and its supplying device
162013030981711/21/13Method of fabricating package structure
172013025862310/03/13Package structure having embedded electronic element and fabrication method thereof
182013024908309/26/13Packaging substrate
192013025238009/26/13Method for fabricating packaging structure having embedded semiconductor element
202013023094709/05/13Fabrication method of package structure having embedded semiconductor component
212013017568707/11/13Package stack device and fabrication method thereof
222013017568707/11/13Package stack device and fabrication method thereof
232013014704106/13/13Stack package structure and fabrication method thereof
242013014704106/13/13Stack package structure and fabrication method thereof
252013011868005/16/13Method for fabricating a packaging substrate
262013011868005/16/13Method for fabricating a packaging substrate
272013010521305/02/13Packaging substrate having embedded through-via interposer and method of fabricating the same
282013010594305/02/13Packaging substrate having embedded capacitors and fabrication method thereof
292013008350304/04/13Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
302013006210003/14/13Circuit board structure
312013004042702/14/13Fabrication method of packaging substrate having through-holed interposer embedded therein
322013003239002/07/13Packaging substrate having embedded interposer and fabrication method thereof
332013000870501/10/13Coreless package substrate and fabrication method thereof
342013000870601/10/13Coreless packaging substrate and method of fabricating the same
352013000929301/10/13Packaging substrate and method of fabricating the same
362013000930601/10/13Packaging substrate and fabrication method thereof
372012031437712/13/12Packaging structure embedded with electronic elements and method of fabricating the same
382012030201211/29/12Method for fabricating packaging substrate with embedded semiconductor component
392012027393011/01/12Semiconductor package structure and method of fabricating the same
402012027394111/01/12Package structure having embedded electronic component and fabrication method thereof
412012025577110/11/12Packaging substrate and method of fabricating the same
422012022876409/13/12Package structure, fabricating method thereof, and package-on-package device thereby
432012021762708/30/12Package structure and method of fabricating the same
442012019378908/02/12Package stack device and fabrication method thereof
452012016895907/05/12Package substrate having a through hole and method of fabricating the same
462012016485406/28/12Packaging substrate and method of fabricating the same
472012014620906/14/12Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
482012012060905/17/12Package structure having a semiconductor component embedded therein and method of fabricating the same
492012010459805/03/12Package structure having embedded semiconductor component and fabrication method thereof
502012009742904/26/12Package substrate and fabrication method thereof
512012009743004/26/12Packaging substrate and method of fabricating the same
522012004936303/01/12Package structure
532012004936603/01/12Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
542012003740402/16/12Packaging substrate having a passive element embedded therein and method of fabricating the same
552012003741102/16/12Packaging substrate having embedded passive component and fabrication method thereof
562012003228202/09/12Microelectromechanical system (mems) carrier and method of fabricating the same
572012001296201/19/12Electronic device and method of fabricating the same
582012001300201/19/12Package structure
592011009785004/28/11Method of fabricating a packaging structure
602011009785104/28/11Method of fabricating a package structure
612011005732303/10/11Packaging structure having embedded semiconductor element and method for fabricating the same
622011005331803/03/11Fabrication method of package structure
632011004212802/24/11Coreless packaging substrate and method for fabricating the same
642011003160602/10/11Packaging substrate having embedded semiconductor chip
652010031996612/23/10Packaging substrate and fabrication method thereof
662010031403712/16/10Method for fabricating packaging substrate
672010018700307/29/10Circuit board structure and fabrication method thereof
682010010834505/06/10Lid for micro-electro-mechanical device and method for fabricating the same
692010005214803/04/10Package structure and package substrate
702010005392003/04/10Packaging substrate with embedded semiconductor component and method for fabricating the same
712010003282702/11/10Package structure
722010000633101/14/10Printed circuit board with embedded semiconductor component and method for fabricating the same
732010000633101/14/10Printed circuit board with embedded semiconductor component and method for fabricating the same
742014023946308/28/14 new patent  Embedded chip package structure
752014022527208/14/14Embedded electronic device package structure
762014018291307/03/14Packaging substrate and method of fabricating the same
772014017479106/26/14Circuit board and manufacturing method thereof
782014017480406/26/14Electrical device package structure and method of fabricating the same
792014015109906/05/14Wiring board and laser drilling method thereof
802014015110706/05/14Touch member and method of manufacturing the same
812014015446306/05/14Substrate structure and manufacturing method thereof
822014013813005/22/14Substrate structure having component-disposing area and manufacturing process thereof
832014013814205/22/14Interposed substrate and manufacturing method thereof
842014013813005/22/14Substrate structure having component-disposing area and manufacturing process thereof
852014013814205/22/14Interposed substrate and manufacturing method thereof
862014011968805/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
872014011968805/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
882014010277204/17/14Packaging carrier and manufacturing method thereof and chip package structure
892014010277204/17/14Packaging carrier and manufacturing method thereof and chip package structure
902014009943204/10/14Fabrication method for flexible circuit board
912014009943204/10/14Fabrication method for flexible circuit board
922014009943204/10/14Fabrication method for flexible circuit board
932014006957403/13/14Manufacturing method of circuit board
942014006957403/13/14Manufacturing method of circuit board
952014005340002/27/14Method for fabricating package substrate
962014004191902/13/14Circuit structure and manufacturing method thereof
972014003352602/06/14Fabricating method of embedded package structure
982014003436102/06/14Circuit board
992013032756412/12/13Circuit board and manufacturing method thereof
1002013032756412/12/13Circuit board and manufacturing method thereof
1012013031301111/28/13Interposed substrate and manufacturing method thereof
1022013021287708/22/13Manufacturing method of circuit board
1032013021287708/22/13Manufacturing method of circuit board
1042013020646708/15/13Circuit board
1052013020646708/15/13Circuit board
1062013018380007/18/13Circuit board structure and fabrication thereof
1072013018380007/18/13Circuit board structure and fabrication thereof
1082013010520205/02/13Circuit board structure
1092013004007102/14/13Circuit board and fabrication method thereof
1102013001157601/10/13Display device and light sensing system
1112012031877012/20/12Manufacturing method of circuit board
1122012031258812/13/12Circuit board
1132012029208911/22/12Circuit board structure with capacitors embedded therein and method for fabricating the same
1142012023117909/13/12Embedded wiring board and a manufacturing method thereof
1152012017439107/12/12Process for fabricating wiring board
1162012017526507/12/12Circuit board surface structure and fabrication method thereof
1172012016831607/05/12Fabricating process of embedded circuit structure
1182012012483005/24/12Process for fabricating circuit board
1192012007386703/29/12Circuit structure
1202012006763003/22/12Circuit structure of circuit board
1212012003165102/09/12Circuit board
1222012003165202/09/12Circuit board and manufacturing method thereof
1232012002458402/02/12Connector and manufacturing method thereof
1242012000647801/12/12Fabricating method of circuit board
1252011030344212/15/11Substrate strip with wiring and method of manufacturing the same
1262011028426711/24/11Circuit board and manufacturing method thereof
1272011025343510/20/11Multilayer three-dimensional circuit structure
1282011015466406/30/11Structure of circuit board and method for fabricating the same
1292011015542706/30/11Circuit substrate and manufacturing method thereof
1302011015542806/30/11Circuit board and manufacturing method thereof
1312011015544006/30/11Circuit board and process for manufacturing the same
1322011015544106/30/11Circuit board and process for fabricating the same
1332011014705606/23/11Circuit board and process for fabricating the same
1342011014733906/23/11Method for manufacturing wiring structure of wiring board
1352011014734206/23/11Method for fabricating wiring structure of wiring board
1362011013949406/16/11Embedded wiring board and method for manufacturing the same
1372011011437305/19/11Circuit board and manufacturing method thereof
1382011010054305/05/11Manufacturing method of circuit structure
1392011009477904/28/11Circuit structure
1402011007680203/31/11Embedded chip package process
1412010031997012/23/10Package substrate having embedded capacitor
1422010031997312/23/10Package substrate having embedded capacitor
1432010031435212/16/10Fabricating method of embedded package structure
1442010029455311/25/10Package substrate having embedded capacitor
1452010028854911/18/10Coreless packaging substrate and method for manufacturing the same
1462010027945211/04/10Image sensor chip package method
1472010026453410/21/10Chip package structure and manufacturing method thereof
1482010025230310/07/10Circuit board and manufacturing method thereof
1492010021592708/26/10Composite circuit substrate structure
1502010020015408/12/10Fabricating process of circuit board with embedded passive component
1512010019346608/05/10Method of manufacturing circuit board
1522010016409207/01/10Semiconductor process, and silicon substrate and chip package structure applying the same
1532010010108304/29/10Method for fabricating circuit board structure with concave conductive cylinders
1542010008962704/15/10Multilayer three-dimensional circuit structure and manufacturing method thereof
1552010007761004/01/10Method for manufacturing three-dimensional circuit
1562010006531903/18/10Wiring board and process for fabricating the same
1572010005925603/11/10Circuit structure of circuit board and process for manufacturing the same
1582010004396202/25/10Fabrication method of rigid-flex circuit board
1592010004408202/25/10Wiring board
1602010003150202/11/10Method for fabricating blind via structure of substrate
1612010002579402/04/10Image sensor chip package structure and method thereof
1622010001306801/21/10Chip package carrier and fabrication method thereof
1632009031409512/24/09Pressure sensing device package and manufacturing method thereof
1642009030199712/10/09Fabricating process of structure with embedded circuit
1652009028885811/26/09Circuit structure and manufacturing method thereof
1662009028267411/19/09Electrical interconnect structure and process thereof and circuit board structure
1672009028493511/19/09Structure and manufacturing process for circuit board
1682009027390711/05/09Circuit board and process thereof
1692009025024710/08/09Circuit board and manufacturing method thereof
1702009020585208/20/09Circuit board and manufacturing method thereof
1712009019736408/06/09Method of fabricating substrate
1722009016605907/02/09Circuit board and process thereof
1732009014497206/11/09Circuit board and process for fabricating the same
1742009011726205/07/09Method of fabricating circuit board
1752009010477204/23/09Process of fabricating circuit structure
1762013032756412/12/13Circuit board and manufacturing method thereof
1772010001306801/21/10Chip package carrier and fabrication method thereof


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Unimicron Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Unimicron Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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