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Unimicron Technology Corp
Unimicron Technology Corporation
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Unimicron Technology Corporation_20100114

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Unimicron Technology Corp patents


      
Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors


Packaging substrate having embedded through-via interposer

Unimicron Technology

Packaging substrate having embedded through-via interposer

Reflective structure for optical touch sensing

Unimicron Technology Corp.

Reflective structure for optical touch sensing

Manufacturing  multi-layer circuit board

Unimicron Technology Corp.

Manufacturing multi-layer circuit board

Search recent Press Releases: Unimicron Technology Corp-related press releases
Count Application # Date Unimicron Technology Corp patents (updated weekly) - BOOKMARK this page
12015013552705/21/15Method of fabricating packaging substrate having embedded through-via interposer
22015012928505/14/15Packaging substrate having embedded through-via interposer
32015006803303/12/15Method of fabricating packaging substrate
42014026316809/18/14Method for manufacturing package substrate
52014026433509/18/14Package substrate and testing the same
62014023949008/28/14Packaging substrate and fabrication method thereof
72014020199207/24/14Circuit board structure having embedded electronic element and fabrication method thereof
82014018291207/03/14Packaging substrate
92014011071304/24/14Electronic device and fabricating the same
102014009079404/03/14Method of fabricating packaging substrate
112014008446303/27/14Method of fabricating semiconductor package structure
122014007649203/20/14Fabrication packaging substrate having embedded capacitors
132014003513802/06/14Package structure having embedded semiconductor component and fabrication method thereof
142014002792501/30/14Through-holed interposer, packaging substrate, and methods of fabricating the same
152013033592812/19/13Carrier and fabricating coreless packaging substrate
162013031291111/28/13Wet-etching equipment and its supplying device
172013030981711/21/13Method of fabricating package structure
182013025862310/03/13Package structure having embedded electronic element and fabrication method thereof
192013024908309/26/13Packaging substrate
202013025238009/26/13Method for fabricating packaging structure having embedded semiconductor element
212013023094709/05/13Fabrication package structure having embedded semiconductor component
222013017568707/11/13Package stack device and fabrication method thereof
232013014704106/13/13Stack package structure and fabrication method thereof
242013011868005/16/13Method for fabricating a packaging substrate
252013010521305/02/13Packaging substrate having embedded through-via interposer and fabricating the same
262013010594305/02/13Packaging substrate having embedded capacitors and fabrication method thereof
272013008350304/04/13Packaging substrate having a holder, fabricating the packaging substrate, package structure having a holder, and fabricating the package structure
282013006210003/14/13Circuit board structure
292013004042702/14/13Fabrication packaging substrate having through-holed interposer embedded therein
302013003239002/07/13Packaging substrate having embedded interposer and fabrication method thereof
312013000870501/10/13Coreless package substrate and fabrication method thereof
322013000870601/10/13Coreless packaging substrate and fabricating the same
332013000929301/10/13Packaging substrate and fabricating the same
342013000930601/10/13Packaging substrate and fabrication method thereof
352012031437712/13/12Packaging structure embedded with electronic elements and fabricating the same
362012030201211/29/12Method for fabricating packaging substrate with embedded semiconductor component
372012027393011/01/12Semiconductor package structure and fabricating the same
382012027394111/01/12Package structure having embedded electronic component and fabrication method thereof
392012025577110/11/12Packaging substrate and fabricating the same
402012022876409/13/12Package structure, fabricating method thereof, and package-on-package device thereby
412012021762708/30/12Package structure and fabricating the same
422012019378908/02/12Package stack device and fabrication method thereof
432012016895907/05/12Package substrate having a through hole and fabricating the same
442012016485406/28/12Packaging substrate and fabricating the same
452012014620906/14/12Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
462012012060905/17/12Package structure having a semiconductor component embedded therein and fabricating the same
472012010459805/03/12Package structure having embedded semiconductor component and fabrication method thereof
482012009742904/26/12Package substrate and fabrication method thereof
492012009743004/26/12Packaging substrate and fabricating the same
502012004936303/01/12Package structure
512012004936603/01/12Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
522012003740402/16/12Packaging substrate having a passive element embedded therein and fabricating the same
532012003741102/16/12Packaging substrate having embedded passive component and fabrication method thereof
542012003228202/09/12Microelectromechanical system (mems) carrier and fabricating the same
552012001296201/19/12Electronic device and fabricating the same
562012001300201/19/12Package structure
572011009785004/28/11Method of fabricating a packaging structure
582011009785104/28/11Method of fabricating a package structure
592011005732303/10/11Packaging structure having embedded semiconductor element and fabricating the same
602011005331803/03/11Fabrication package structure
612011004212802/24/11Coreless packaging substrate and fabricating the same
622011003160602/10/11Packaging substrate having embedded semiconductor chip
632010031996612/23/10Packaging substrate and fabrication method thereof
642010031403712/16/10Method for fabricating packaging substrate
652010018700307/29/10Circuit board structure and fabrication method thereof
662010010834505/06/10Lid for micro-electro-mechanical device and fabricating the same
672010005214803/04/10Package structure and package substrate
682010005392003/04/10Packaging substrate with embedded semiconductor component and fabricating the same
692010003282702/11/10Package structure
702010000633101/14/10Printed circuit board with embedded semiconductor component and fabricating the same
712010000633101/14/10Printed circuit board with embedded semiconductor component and fabricating the same
722015014628505/28/15 new patent  Reflective structure for optical touch sensing
732015012169305/07/15Manufacturing multi-layer circuit board
742015012169405/07/15Manufacturing multi-layer circuit board
752015012562505/07/15Manufacturing multi-layer circuit board
762015009731804/09/15Manufacturing interposed substrate
772015005346202/26/15Wiring board structure
782015005346302/26/15Rigid flex board module and the manufacturing method thereof
792015005479002/26/15Optical touch sensing structure
802014033225211/13/14Carrier substrate and manufacturing method thereof
812014033225311/13/14Carrier substrate and manufacturing method thereof
822014033570611/13/14Electrical connector
832014027544009/18/14Diamine monomer having side chain, polyimide compound having side chain and manufacturing method thereof
842014027544109/18/14Polyimide compound having side chain and manufacturing method thereof
852014027547009/18/14Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof
862014023946308/28/14Embedded chip package structure
872014022527208/14/14Embedded electronic device package structure
882014018291307/03/14Packaging substrate and fabricating the same
892014017479106/26/14Circuit board and manufacturing method thereof
902014017480406/26/14Electrical device package structure and fabricating the same
912014015109906/05/14Wiring board and laser drilling method thereof
922014015110706/05/14Touch member and manufacturing the same
932014015446306/05/14Substrate structure and manufacturing method thereof
942014013813005/22/14Substrate structure having component-disposing area and manufacturing process thereof
952014013814205/22/14Interposed substrate and manufacturing method thereof
962014011968805/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
972014010277204/17/14Packaging carrier and manufacturing method thereof and chip package structure
982014009943204/10/14Fabrication flexible circuit board
992014006957403/13/14Manufacturing circuit board
1002014005340002/27/14Method for fabricating package substrate
1012014004191902/13/14Circuit structure and manufacturing method thereof
1022014003352602/06/14Fabricating embedded package structure
1032014003436102/06/14Circuit board
1042013032756412/12/13Circuit board and manufacturing method thereof
1052013031301111/28/13Interposed substrate and manufacturing method thereof
1062013021287708/22/13Manufacturing circuit board
1072013020646708/15/13Circuit board
1082013018380007/18/13Circuit board structure and fabrication thereof
1092013010520205/02/13Circuit board structure
1102013004007102/14/13Circuit board and fabrication method thereof
1112013001157601/10/13Display device and light sensing system
1122012031877012/20/12Manufacturing circuit board
1132012031258812/13/12Circuit board
1142012029208911/22/12Circuit board structure with capacitors embedded therein and fabricating the same
1152012023117909/13/12Embedded wiring board and a manufacturing method thereof
1162012017439107/12/12Process for fabricating wiring board
1172012017526507/12/12Circuit board surface structure and fabrication method thereof
1182012016831607/05/12Fabricating process of embedded circuit structure
1192012012483005/24/12Process for fabricating circuit board
1202012007386703/29/12Circuit structure
1212012006763003/22/12Circuit structure of circuit board
1222012003165102/09/12Circuit board
1232012003165202/09/12Circuit board and manufacturing method thereof
1242012002458402/02/12Connector and manufacturing method thereof
1252012000647801/12/12Fabricating circuit board
1262011030344212/15/11Substrate strip with wiring and manufacturing the same
1272011028426711/24/11Circuit board and manufacturing method thereof
1282011025343510/20/11Multilayer three-dimensional circuit structure
1292011015466406/30/11Structure of circuit board and fabricating the same
1302011015542706/30/11Circuit substrate and manufacturing method thereof
1312011015542806/30/11Circuit board and manufacturing method thereof
1322011015544006/30/11Circuit board and process for manufacturing the same
1332011015544106/30/11Circuit board and process for fabricating the same
1342011014705606/23/11Circuit board and process for fabricating the same
1352011014733906/23/11Method for manufacturing wiring structure of wiring board
1362011014734206/23/11Method for fabricating wiring structure of wiring board
1372011013949406/16/11Embedded wiring board and manufacturing the same
1382011011437305/19/11Circuit board and manufacturing method thereof
1392011010054305/05/11Manufacturing circuit structure
1402011009477904/28/11Circuit structure
1412011007680203/31/11Embedded chip package process
1422010031997012/23/10Package substrate having embedded capacitor
1432010031997312/23/10Package substrate having embedded capacitor
1442010031435212/16/10Fabricating embedded package structure
1452010029455311/25/10Package substrate having embedded capacitor
1462010028854911/18/10Coreless packaging substrate and manufacturing the same
1472010027945211/04/10Image sensor chip package method
1482010026453410/21/10Chip package structure and manufacturing method thereof
1492010025230310/07/10Circuit board and manufacturing method thereof
1502010021592708/26/10Composite circuit substrate structure
1512010020015408/12/10Fabricating process of circuit board with embedded passive component
1522010019346608/05/10Method of manufacturing circuit board
1532010016409207/01/10Semiconductor process, and silicon substrate and chip package structure applying the same
1542010010108304/29/10Method for fabricating circuit board structure with concave conductive cylinders
1552010008962704/15/10Multilayer three-dimensional circuit structure and manufacturing method thereof
1562010007761004/01/10Method for manufacturing three-dimensional circuit
1572010006531903/18/10Wiring board and process for fabricating the same
1582010005925603/11/10Circuit structure of circuit board and process for manufacturing the same
1592010004396202/25/10Fabrication rigid-flex circuit board
1602010004408202/25/10Wiring board
1612010003150202/11/10Method for fabricating blind via structure of substrate
1622010002579402/04/10Image sensor chip package structure and method thereof
1632010001306801/21/10Chip package carrier and fabrication method thereof
1642009031409512/24/09Pressure sensing device package and manufacturing method thereof
1652009030199712/10/09Fabricating process of structure with embedded circuit
1662009028885811/26/09Circuit structure and manufacturing method thereof
1672009028267411/19/09Electrical interconnect structure and process thereof and circuit board structure
1682009028493511/19/09Structure and manufacturing process for circuit board
1692009027390711/05/09Circuit board and process thereof
1702009025024710/08/09Circuit board and manufacturing method thereof
1712009020585208/20/09Circuit board and manufacturing method thereof
1722009019736408/06/09Method of fabricating substrate
1732009016605907/02/09Circuit board and process thereof
1742009014497206/11/09Circuit board and process for fabricating the same
1752009011726205/07/09Method of fabricating circuit board
1762009010477204/23/09Process of fabricating circuit structure
1772013032756412/12/13Circuit board and manufacturing method thereof
1782010001306801/21/10Chip package carrier and fabrication method thereof



ARCHIVE: New 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Unimicron Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Unimicron Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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