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Unimicron Technology Corporation
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Unimicron Technology Corp patents


      
Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors



Unimicron Technology

Packaging substrate

Unimicron Technology Corp.

Packaging substrate and method of fabricating the same

Search recent Press Releases: Unimicron Technology Corp-related press releases
Count Application # Date Unimicron Technology Corp patents (updated weekly) - BOOKMARK this page
12014020199207/24/14Circuit board structure having embedded electronic element and fabrication method thereof
22014018291207/03/14Packaging substrate
32014011071304/24/14Electronic device and method of fabricating the same
42014011071304/24/14Electronic device and method of fabricating the same
52014009079404/03/14Method of fabricating packaging substrate
62014009079404/03/14Method of fabricating packaging substrate
72014008446303/27/14Method of fabricating semiconductor package structure
82014008446303/27/14Method of fabricating semiconductor package structure
92014007649203/20/14Fabrication method of packaging substrate having embedded capacitors
102014007649203/20/14Fabrication method of packaging substrate having embedded capacitors
112014003513802/06/14Package structure having embedded semiconductor component and fabrication method thereof
122014002792501/30/14Through-holed interposer, packaging substrate, and methods of fabricating the same
132013033592812/19/13Carrier and method for fabricating coreless packaging substrate
142013031291111/28/13Wet-etching equipment and its supplying device
152013030981711/21/13Method of fabricating package structure
162013025862310/03/13Package structure having embedded electronic element and fabrication method thereof
172013024908309/26/13Packaging substrate
182013025238009/26/13Method for fabricating packaging structure having embedded semiconductor element
192013023094709/05/13Fabrication method of package structure having embedded semiconductor component
202013017568707/11/13Package stack device and fabrication method thereof
212013017568707/11/13Package stack device and fabrication method thereof
222013014704106/13/13Stack package structure and fabrication method thereof
232013014704106/13/13Stack package structure and fabrication method thereof
242013011868005/16/13Method for fabricating a packaging substrate
252013011868005/16/13Method for fabricating a packaging substrate
262013010521305/02/13Packaging substrate having embedded through-via interposer and method of fabricating the same
272013010594305/02/13Packaging substrate having embedded capacitors and fabrication method thereof
282013008350304/04/13Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
292013006210003/14/13Circuit board structure
302013004042702/14/13Fabrication method of packaging substrate having through-holed interposer embedded therein
312013003239002/07/13Packaging substrate having embedded interposer and fabrication method thereof
322013000870501/10/13Coreless package substrate and fabrication method thereof
332013000870601/10/13Coreless packaging substrate and method of fabricating the same
342013000929301/10/13Packaging substrate and method of fabricating the same
352013000930601/10/13Packaging substrate and fabrication method thereof
362012031437712/13/12Packaging structure embedded with electronic elements and method of fabricating the same
372012030201211/29/12Method for fabricating packaging substrate with embedded semiconductor component
382012027393011/01/12Semiconductor package structure and method of fabricating the same
392012027394111/01/12Package structure having embedded electronic component and fabrication method thereof
402012025577110/11/12Packaging substrate and method of fabricating the same
412012022876409/13/12Package structure, fabricating method thereof, and package-on-package device thereby
422012021762708/30/12Package structure and method of fabricating the same
432012019378908/02/12Package stack device and fabrication method thereof
442012016895907/05/12Package substrate having a through hole and method of fabricating the same
452012016485406/28/12Packaging substrate and method of fabricating the same
462012014620906/14/12Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
472012012060905/17/12Package structure having a semiconductor component embedded therein and method of fabricating the same
482012010459805/03/12Package structure having embedded semiconductor component and fabrication method thereof
492012009742904/26/12Package substrate and fabrication method thereof
502012009743004/26/12Packaging substrate and method of fabricating the same
512012004936303/01/12Package structure
522012004936603/01/12Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
532012003740402/16/12Packaging substrate having a passive element embedded therein and method of fabricating the same
542012003741102/16/12Packaging substrate having embedded passive component and fabrication method thereof
552012003228202/09/12Microelectromechanical system (mems) carrier and method of fabricating the same
562012001296201/19/12Electronic device and method of fabricating the same
572012001300201/19/12Package structure
582011009785004/28/11Method of fabricating a packaging structure
592011009785104/28/11Method of fabricating a package structure
602011005732303/10/11Packaging structure having embedded semiconductor element and method for fabricating the same
612011005331803/03/11Fabrication method of package structure
622011004212802/24/11Coreless packaging substrate and method for fabricating the same
632011003160602/10/11Packaging substrate having embedded semiconductor chip
642010031996612/23/10Packaging substrate and fabrication method thereof
652010031403712/16/10Method for fabricating packaging substrate
662010018700307/29/10Circuit board structure and fabrication method thereof
672010010834505/06/10Lid for micro-electro-mechanical device and method for fabricating the same
682010005214803/04/10Package structure and package substrate
692010005392003/04/10Packaging substrate with embedded semiconductor component and method for fabricating the same
702010003282702/11/10Package structure
712010000633101/14/10Printed circuit board with embedded semiconductor component and method for fabricating the same
722010000633101/14/10Printed circuit board with embedded semiconductor component and method for fabricating the same
732014018291307/03/14Packaging substrate and method of fabricating the same
742014017479106/26/14Circuit board and manufacturing method thereof
752014017480406/26/14Electrical device package structure and method of fabricating the same
762014015109906/05/14Wiring board and laser drilling method thereof
772014015110706/05/14Touch member and method of manufacturing the same
782014015446306/05/14Substrate structure and manufacturing method thereof
792014013813005/22/14Substrate structure having component-disposing area and manufacturing process thereof
802014013814205/22/14Interposed substrate and manufacturing method thereof
812014013813005/22/14Substrate structure having component-disposing area and manufacturing process thereof
822014013814205/22/14Interposed substrate and manufacturing method thereof
832014011968805/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
842014011968805/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
852014010277204/17/14Packaging carrier and manufacturing method thereof and chip package structure
862014010277204/17/14Packaging carrier and manufacturing method thereof and chip package structure
872014009943204/10/14Fabrication method for flexible circuit board
882014009943204/10/14Fabrication method for flexible circuit board
892014009943204/10/14Fabrication method for flexible circuit board
902014006957403/13/14Manufacturing method of circuit board
912014006957403/13/14Manufacturing method of circuit board
922014005340002/27/14Method for fabricating package substrate
932014004191902/13/14Circuit structure and manufacturing method thereof
942014003352602/06/14Fabricating method of embedded package structure
952014003436102/06/14Circuit board
962013032756412/12/13Circuit board and manufacturing method thereof
972013032756412/12/13Circuit board and manufacturing method thereof
982013031301111/28/13Interposed substrate and manufacturing method thereof
992013021287708/22/13Manufacturing method of circuit board
1002013021287708/22/13Manufacturing method of circuit board
1012013020646708/15/13Circuit board
1022013020646708/15/13Circuit board
1032013018380007/18/13Circuit board structure and fabrication thereof
1042013018380007/18/13Circuit board structure and fabrication thereof
1052013010520205/02/13Circuit board structure
1062013004007102/14/13Circuit board and fabrication method thereof
1072013001157601/10/13Display device and light sensing system
1082012031877012/20/12Manufacturing method of circuit board
1092012031258812/13/12Circuit board
1102012029208911/22/12Circuit board structure with capacitors embedded therein and method for fabricating the same
1112012023117909/13/12Embedded wiring board and a manufacturing method thereof
1122012017439107/12/12Process for fabricating wiring board
1132012017526507/12/12Circuit board surface structure and fabrication method thereof
1142012016831607/05/12Fabricating process of embedded circuit structure
1152012012483005/24/12Process for fabricating circuit board
1162012007386703/29/12Circuit structure
1172012006763003/22/12Circuit structure of circuit board
1182012003165102/09/12Circuit board
1192012003165202/09/12Circuit board and manufacturing method thereof
1202012002458402/02/12Connector and manufacturing method thereof
1212012000647801/12/12Fabricating method of circuit board
1222011030344212/15/11Substrate strip with wiring and method of manufacturing the same
1232011028426711/24/11Circuit board and manufacturing method thereof
1242011025343510/20/11Multilayer three-dimensional circuit structure
1252011015466406/30/11Structure of circuit board and method for fabricating the same
1262011015542706/30/11Circuit substrate and manufacturing method thereof
1272011015542806/30/11Circuit board and manufacturing method thereof
1282011015544006/30/11Circuit board and process for manufacturing the same
1292011015544106/30/11Circuit board and process for fabricating the same
1302011014705606/23/11Circuit board and process for fabricating the same
1312011014733906/23/11Method for manufacturing wiring structure of wiring board
1322011014734206/23/11Method for fabricating wiring structure of wiring board
1332011013949406/16/11Embedded wiring board and method for manufacturing the same
1342011011437305/19/11Circuit board and manufacturing method thereof
1352011010054305/05/11Manufacturing method of circuit structure
1362011009477904/28/11Circuit structure
1372011007680203/31/11Embedded chip package process
1382010031997012/23/10Package substrate having embedded capacitor
1392010031997312/23/10Package substrate having embedded capacitor
1402010031435212/16/10Fabricating method of embedded package structure
1412010029455311/25/10Package substrate having embedded capacitor
1422010028854911/18/10Coreless packaging substrate and method for manufacturing the same
1432010027945211/04/10Image sensor chip package method
1442010026453410/21/10Chip package structure and manufacturing method thereof
1452010025230310/07/10Circuit board and manufacturing method thereof
1462010021592708/26/10Composite circuit substrate structure
1472010020015408/12/10Fabricating process of circuit board with embedded passive component
1482010019346608/05/10Method of manufacturing circuit board
1492010016409207/01/10Semiconductor process, and silicon substrate and chip package structure applying the same
1502010010108304/29/10Method for fabricating circuit board structure with concave conductive cylinders
1512010008962704/15/10Multilayer three-dimensional circuit structure and manufacturing method thereof
1522010007761004/01/10Method for manufacturing three-dimensional circuit
1532010006531903/18/10Wiring board and process for fabricating the same
1542010005925603/11/10Circuit structure of circuit board and process for manufacturing the same
1552010004396202/25/10Fabrication method of rigid-flex circuit board
1562010004408202/25/10Wiring board
1572010003150202/11/10Method for fabricating blind via structure of substrate
1582010002579402/04/10Image sensor chip package structure and method thereof
1592010001306801/21/10Chip package carrier and fabrication method thereof
1602009031409512/24/09Pressure sensing device package and manufacturing method thereof
1612009030199712/10/09Fabricating process of structure with embedded circuit
1622009028885811/26/09Circuit structure and manufacturing method thereof
1632009028267411/19/09Electrical interconnect structure and process thereof and circuit board structure
1642009028493511/19/09Structure and manufacturing process for circuit board
1652009027390711/05/09Circuit board and process thereof
1662009025024710/08/09Circuit board and manufacturing method thereof
1672009020585208/20/09Circuit board and manufacturing method thereof
1682009019736408/06/09Method of fabricating substrate
1692009016605907/02/09Circuit board and process thereof
1702009014497206/11/09Circuit board and process for fabricating the same
1712009011726205/07/09Method of fabricating circuit board
1722009010477204/23/09Process of fabricating circuit structure
1732013032756412/12/13Circuit board and manufacturing method thereof
1742010001306801/21/10Chip package carrier and fabrication method thereof


ARCHIVE: New 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Unimicron Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Unimicron Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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