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Unimicron Technology Corp patents


Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors


Manufacturing method of circuit board and structure thereof

A manufacturing method of a circuit board including the following steps is provided. A first patterned circuit layer is formed on a surface of a circuit substrate, and the first patterned circuit layer exposes a portion of the surface of the circuit substrate. ... Unimicron Technology Corp

Circuit board structure and manufacturing method thereof

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface opposite to each other, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive via connecting the first and the second patterned circuit layers. ... Unimicron Technology Corp

Method for manufacturing circuit redistribution structure

A method for manufacturing a circuit redistribution structure includes the following steps. A first dielectric is formed on a carrier. ... Unimicron Technology Corp

Circuit board and method for manufacturing the same

A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. ... Unimicron Technology Corp

Manufacturing method of interconnection structure

An interconnection structure and a manufacturing method thereof are provided. The method includes the following steps. ... Unimicron Technology Corp

Circuit board and method for manufacturing the same

A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. ... Unimicron Technology Corp

Circuit board structure

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. ... Unimicron Technology Corp

Manufacturing method of circuit substrate and mask structure and manufacturing method thereof

A manufacturing method of a circuit substrate is provided. A substrate is provided. ... Unimicron Technology Corp

Circuit board and manufacturing method thereof

A circuit board including a substrate, a patterned circuit layer and a photo-imaginable dielectric layer is provided. The substrate has a first surface and a second surface opposite to each other. ... Unimicron Technology Corp

Manufacturing method of circuit board structure

Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (e-chuck). ... Unimicron Technology Corp

Circuit board element

A circuit board element includes a glass substrate, a first dielectric layer, and a first patterned metal layer. The glass substrate has an edge. ... Unimicron Technology Corp

Package carrier and manufacturing method of package carrier

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. ... Unimicron Technology Corp

Manufacturing method of a circuit board having a glass film

Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (e-chuck). ... Unimicron Technology Corp

Circuit redistribution structure unit and method for manufacturing circuit redistribution structure

A method for manufacturing a circuit redistribution structure includes the following steps. A first dielectric is formed on a carrier. ... Unimicron Technology Corp

12/28/17 / #20170374748

Package structure and manufacturing method thereof

A package structure includes a metal layer, a composite layer of a non-conductor inorganic material and an organic material, a sealant, a chip, a circuit layer structure, and an insulating protective layer. The composite layer of the non-conductor inorganic material and the organic material is disposed on the metal layer. ... Unimicron Technology Corp

09/21/17 / #20170273191

Manufacturing method of circuit board and stamp

A manufacturing method of a circuit board and a stamp are provided. The method includes the following steps. ... Unimicron Technology Corp

09/21/17 / #20170273190

Manufacturing method of circuit board and stamp

A manufacturing method of a circuit board and a stamp are provided. The method includes: forming a circuit pattern and a dielectric layer on a dielectric substrate; forming a conductive via in the dielectric layer; forming a thermal-sensitive adhesive layer on the dielectric layer; forming a photoresist material layer on the thermal-sensitive adhesive layer; imprinting the photoresist material layer using a stamp, wherein a first conductive layer is disposed on the surface of the pressing side of the stamp, a second conductive layer is disposed on the surface of the other portions; applying a current to the stamp; removing the stamp and the photoresist material layer and the thermal-sensitive adhesive layer below the pressing side to form a patterned photoresist layer and thermal-sensitive adhesive layer; forming a patterned metal layer on the region exposed by the patterned photoresist layer; removing the patterned photoresist layer and thermal-sensitive adhesive layer.. ... Unimicron Technology Corp

09/21/17 / #20170273189

Manufacturing method of circuit board and piezochromic stamp

A manufacturing method of a circuit board and a piezochromic stamp are provided. A circuit pattern is formed on a dielectric substrate. ... Unimicron Technology Corp

09/21/17 / #20170273186

Manufacturing method of circuit board

A manufacturing method of a circuit board including the following steps is provided. A carrier substrate is provided. ... Unimicron Technology Corp

08/31/17 / #20170251551

Circuit structure

A circuit structure includes a patterned circuit layer, a patterned insulating layer and a support plate. The patterned insulating layer covers a portion of the patterned circuit layer, wherein an upper surface of the patterned circuit layer is aligned with a top surface of the patterned insulating layer. ... Unimicron Technology Corp

08/10/17 / #20170229248

Manufacturing method for capacitor

A manufacturing method for a capacitor is provided. The method includes the following steps. ... Unimicron Technology Corp

08/03/17 / #20170223841

Carrier substrate

A carrier substrate includes a circuit structure layer, a first solder resist layer, a second solder resist layer and conductive towers. The circuit structure layer includes a core structure layer, a first circuit layer and a second circuit layer. ... Unimicron Technology Corp

07/06/17 / #20170196095

Circuit board and manufacturing method thereof

A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. ... Unimicron Technology Corp

07/06/17 / #20170194249

Package substrate and method of fabricating the same

A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. ... Unimicron Technology Corp

06/15/17 / #20170171975

Circuit board structure

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. ... Unimicron Technology Corp

06/15/17 / #20170171973

Circuit board structure and manufacturing method thereof

A circuit board structure includes an inner circuit structure and a first build-up circuit structure. The inner circuit structure includes a core layer having an upper surface and a lower surface, a first patterned circuit layer disposed on the upper surface, a second patterned circuit layer disposed on the lower surface and a conductive through hole connecting the first and the second patterned circuit layers. ... Unimicron Technology Corp

06/08/17 / #20170164468

Circuit structure and manufacturing method thereof

A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. ... Unimicron Technology Corp

05/11/17 / #20170129454

Safety system and method for preventing living body from being locked in vehicle

A safety system for preventing a living body from being locked in a vehicle comprises a warning unit, a detection device and a limiting device. The detection device is disposed in a passenger's protection device which has to be used by a passenger when the vehicle is being driven. ... Unimicron Technology Corp

05/04/17 / #20170125337

Circuit structure and method for manufacturing the same

A method for manufacturing a circuit structure is described as follows. Two patterned circuit layers are formed on a core layer. ... Unimicron Technology Corp

04/20/17 / #20170110431

Pillar structure and manufacturing method thereof

A pillar structure is disposed on a substrate. The pillar structure includes a pad, a metal wire bump, a metal wire, and a metal plating layer. ... Unimicron Technology Corp

04/20/17 / #20170110393

Circuit board and manufacturing method thereof

A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. ... Unimicron Technology Corp

02/23/17 / #20170055349

Package structure and manufacturing method thereof

A package structure includes a circuit substrate, at least one electronic component, and a connecting slot. The circuit substrate includes at least one core layer, a build-up structure including at least three patterned circuit layers, at least two dielectric layers and conductive through holes, and circuit pads. ... Unimicron Technology Corp

02/16/17 / #20170048973

Circuit board structure and method for manufacturing the same

A method for manufacturing a circuit board structure is provided. First, a first circuit layer is formed on a carrier. ... Unimicron Technology Corp

02/09/17 / #20170042026

Circuit board and manufacturing method thereof

A circuit board including a substrate, a photo imageable dielectric layer and a plurality of conductive bumps is provided. The substrate has a first surface and a first circuit layer, wherein the first surface has a chip disposing area and an electrical connection area, and the first circuit layer is embedded in the first surface. ... Unimicron Technology Corp

02/02/17 / #20170034925

Circuit board and method for manufacturing the same

A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. ... Unimicron Technology Corp

01/26/17 / #20170025342

Chip package structure

A chip package structure including a molding compound, a carrier board, a chip, a plurality of conductive pillars and a circuit board is provided. The carrier board includes a substrate and a redistribution layer. ... Unimicron Technology Corp








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