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Unimicron Technology Corp
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Unimicron Technology Corp patents


      
Recent patent applications related to Unimicron Technology Corp. Unimicron Technology Corp is listed as an Agent/Assignee. Note: Unimicron Technology Corp may have other listings under different names/spellings. We're not affiliated with Unimicron Technology Corp, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Unimicron Technology Corp-related inventors




Date Unimicron Technology Corp patents (updated weekly) - BOOKMARK this page
07/02/15Packaging substrate having a through-holed interposer
06/25/15Method of fabricating packaging substrate having a through-holed interposer
06/25/15Method of fabricating a through-holed interposer
05/21/15Method of fabricating packaging substrate having embedded through-via interposer
05/14/15Packaging substrate having embedded through-via interposer
03/12/15Method of fabricating packaging substrate
09/18/14Method for manufacturing package substrate
09/18/14Package substrate and testing the same
08/28/14Packaging substrate and fabrication method thereof
07/24/14Circuit board structure having embedded electronic element and fabrication method thereof
07/03/14Packaging substrate
04/24/14Electronic device and fabricating the same
04/03/14Method of fabricating packaging substrate
03/27/14Method of fabricating semiconductor package structure
03/20/14Fabrication packaging substrate having embedded capacitors
02/06/14Package structure having embedded semiconductor component and fabrication method thereof
01/30/14Through-holed interposer, packaging substrate, and methods of fabricating the same
12/19/13Carrier and fabricating coreless packaging substrate
11/28/13Wet-etching equipment and its supplying device
11/21/13Method of fabricating package structure
10/03/13Package structure having embedded electronic element and fabrication method thereof
09/26/13Packaging substrate
09/26/13Method for fabricating packaging structure having embedded semiconductor element
09/05/13Fabrication package structure having embedded semiconductor component
07/11/13Package stack device and fabrication method thereof
06/13/13Stack package structure and fabrication method thereof
05/16/13Method for fabricating a packaging substrate
05/02/13Packaging substrate having embedded through-via interposer and fabricating the same
05/02/13Packaging substrate having embedded capacitors and fabrication method thereof
04/04/13Packaging substrate having a holder, fabricating the packaging substrate, package structure having a holder, and fabricating the package structure
03/14/13Circuit board structure
02/14/13Fabrication packaging substrate having through-holed interposer embedded therein
02/07/13Packaging substrate having embedded interposer and fabrication method thereof
01/10/13Coreless package substrate and fabrication method thereof
01/10/13Coreless packaging substrate and fabricating the same
01/10/13Packaging substrate and fabricating the same
01/10/13Packaging substrate and fabrication method thereof
12/13/12Packaging structure embedded with electronic elements and fabricating the same
11/29/12Method for fabricating packaging substrate with embedded semiconductor component
11/01/12Semiconductor package structure and fabricating the same
11/01/12Package structure having embedded electronic component and fabrication method thereof
10/11/12Packaging substrate and fabricating the same
09/13/12Package structure, fabricating method thereof, and package-on-package device thereby
08/30/12Package structure and fabricating the same
08/02/12Package stack device and fabrication method thereof
07/05/12Package substrate having a through hole and fabricating the same
06/28/12Packaging substrate and fabricating the same
06/14/12Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
05/17/12Package structure having a semiconductor component embedded therein and fabricating the same
05/03/12Package structure having embedded semiconductor component and fabrication method thereof
04/26/12Package substrate and fabrication method thereof
04/26/12Packaging substrate and fabricating the same
03/01/12Package structure
03/01/12Package structure having through-silicon-via (tsv) chip embedded therein and fabrication method thereof
02/16/12Packaging substrate having a passive element embedded therein and fabricating the same
02/16/12Packaging substrate having embedded passive component and fabrication method thereof
02/09/12Microelectromechanical system (mems) carrier and fabricating the same
01/19/12Electronic device and fabricating the same
01/19/12Package structure
04/28/11Method of fabricating a packaging structure
04/28/11Method of fabricating a package structure
03/10/11Packaging structure having embedded semiconductor element and fabricating the same
03/03/11Fabrication package structure
02/24/11Coreless packaging substrate and fabricating the same
02/10/11Packaging substrate having embedded semiconductor chip
12/23/10Packaging substrate and fabrication method thereof
12/16/10Method for fabricating packaging substrate
07/29/10Circuit board structure and fabrication method thereof
05/06/10Lid for micro-electro-mechanical device and fabricating the same
03/04/10Package structure and package substrate
03/04/10Packaging substrate with embedded semiconductor component and fabricating the same
02/11/10Package structure
01/14/10Printed circuit board with embedded semiconductor component and fabricating the same
01/14/10Printed circuit board with embedded semiconductor component and fabricating the same
06/30/16Method for manufacturing an interposer, interposer and chip package structure
05/12/16Manufacturing interposed substrate
04/21/16Coreless packaging substrate and fabricating the same
04/21/16Carrier substrate
04/21/16Rigid flex board module and the manufacturing method thereof
04/07/16Preparation conductive sponge having effect of shielding electromagnetic wave
03/31/16Manufacturing process for substrate structure having component-disposing area
03/24/16Packaging substrate having a holder, fabricating the packaging substrate, package structure having a holder, and fabricating the package structure
03/10/16Manufacturing multilayer flexible circuit structure
02/18/16Manufacturing circuit structure embedded with heat-dissipation block
01/28/16Optical-electro circuit board, optical component and manufacturing method thereof
01/14/16Automated accounting system and method thereof
01/07/16Method for providing auxiliary information and touch control display apparatus using the same
01/07/16Method of fabricating an electrical device package structure
01/07/16Fabrication packaging substrate having embedded passive component
12/17/15Dehumidification apparatus and dehumidification method
12/17/15Opto-electronic circuit board and assembling the same
12/17/15Manufacturing circuit structure embedded with electronic device
12/10/15Air conditioning apparatus
10/22/15Embedded component structure and process thereof
10/08/15Method of fabricating package structure
10/08/15Connector
10/08/15Manufacturing connector
09/24/15Manufacturing diamine monomer with side chain
05/28/15Reflective structure for optical touch sensing
05/07/15Manufacturing multi-layer circuit board
05/07/15Manufacturing multi-layer circuit board
05/07/15Manufacturing multi-layer circuit board
04/09/15Manufacturing interposed substrate
02/26/15Wiring board structure
02/26/15Rigid flex board module and the manufacturing method thereof
02/26/15Optical touch sensing structure
11/13/14Carrier substrate and manufacturing method thereof
11/13/14Carrier substrate and manufacturing method thereof
11/13/14Electrical connector
09/18/14Diamine monomer having side chain, polyimide compound having side chain and manufacturing method thereof
09/18/14Polyimide compound having side chain and manufacturing method thereof
09/18/14Dianhydride monomer having side chain, polyimide compound having side chain and manufacturing method thereof
08/28/14Embedded chip package structure
08/14/14Embedded electronic device package structure
07/03/14Packaging substrate and fabricating the same
06/26/14Circuit board and manufacturing method thereof
06/26/14Electrical device package structure and fabricating the same
06/05/14Wiring board and laser drilling method thereof
06/05/14Touch member and manufacturing the same
06/05/14Substrate structure and manufacturing method thereof
05/22/14Substrate structure having component-disposing area and manufacturing process thereof
05/22/14Interposed substrate and manufacturing method thereof
05/01/14Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
04/17/14Packaging carrier and manufacturing method thereof and chip package structure
04/10/14Fabrication flexible circuit board
03/13/14Manufacturing circuit board
02/27/14Method for fabricating package substrate
02/13/14Circuit structure and manufacturing method thereof
02/06/14Fabricating embedded package structure
02/06/14Circuit board
12/12/13Circuit board and manufacturing method thereof
11/28/13Interposed substrate and manufacturing method thereof
08/22/13Manufacturing circuit board
08/15/13Circuit board
07/18/13Circuit board structure and fabrication thereof
05/02/13Circuit board structure
02/14/13Circuit board and fabrication method thereof
01/10/13Display device and light sensing system
12/20/12Manufacturing circuit board
12/13/12Circuit board
11/22/12Circuit board structure with capacitors embedded therein and fabricating the same
09/13/12Embedded wiring board and a manufacturing method thereof
07/12/12Process for fabricating wiring board
07/12/12Circuit board surface structure and fabrication method thereof
07/05/12Fabricating process of embedded circuit structure
05/24/12Process for fabricating circuit board
03/29/12Circuit structure
03/22/12Circuit structure of circuit board
02/09/12Circuit board
02/09/12Circuit board and manufacturing method thereof
02/02/12Connector and manufacturing method thereof
01/12/12Fabricating circuit board
12/15/11Substrate strip with wiring and manufacturing the same
11/24/11Circuit board and manufacturing method thereof
10/20/11Multilayer three-dimensional circuit structure
06/30/11Structure of circuit board and fabricating the same
06/30/11Circuit substrate and manufacturing method thereof
06/30/11Circuit board and manufacturing method thereof
06/30/11Circuit board and process for manufacturing the same
06/30/11Circuit board and process for fabricating the same
06/23/11Circuit board and process for fabricating the same
06/23/11Method for manufacturing wiring structure of wiring board
06/23/11Method for fabricating wiring structure of wiring board
06/16/11Embedded wiring board and manufacturing the same
05/19/11Circuit board and manufacturing method thereof
05/05/11Manufacturing circuit structure
04/28/11Circuit structure
03/31/11Embedded chip package process
12/23/10Package substrate having embedded capacitor
12/23/10Package substrate having embedded capacitor
12/16/10Fabricating embedded package structure
11/25/10Package substrate having embedded capacitor
11/18/10Coreless packaging substrate and manufacturing the same
11/04/10Image sensor chip package method
10/21/10Chip package structure and manufacturing method thereof
10/07/10Circuit board and manufacturing method thereof
08/26/10Composite circuit substrate structure
08/12/10Fabricating process of circuit board with embedded passive component
08/05/10Method of manufacturing circuit board
07/01/10Semiconductor process, and silicon substrate and chip package structure applying the same
04/29/10Method for fabricating circuit board structure with concave conductive cylinders
04/15/10Multilayer three-dimensional circuit structure and manufacturing method thereof
04/01/10Method for manufacturing three-dimensional circuit
03/18/10Wiring board and process for fabricating the same
03/11/10Circuit structure of circuit board and process for manufacturing the same
02/25/10Fabrication rigid-flex circuit board
02/25/10Wiring board
02/11/10Method for fabricating blind via structure of substrate
02/04/10Image sensor chip package structure and method thereof
01/21/10Chip package carrier and fabrication method thereof
12/24/09Pressure sensing device package and manufacturing method thereof
12/10/09Fabricating process of structure with embedded circuit
11/26/09Circuit structure and manufacturing method thereof
11/19/09Electrical interconnect structure and process thereof and circuit board structure
11/19/09Structure and manufacturing process for circuit board
11/05/09Circuit board and process thereof
10/08/09Circuit board and manufacturing method thereof
08/20/09Circuit board and manufacturing method thereof
08/06/09Method of fabricating substrate
07/02/09Circuit board and process thereof
06/11/09Circuit board and process for fabricating the same
05/07/09Method of fabricating circuit board
04/23/09Process of fabricating circuit structure
12/12/13Circuit board and manufacturing method thereof
01/21/10Chip package carrier and fabrication method thereof



ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Unimicron Technology Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Unimicron Technology Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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