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United Test And Assembly Center Ltd
United Test And Assembly Center Ltd_20100121
  

United Test And Assembly Center Ltd patents

Recent patent applications related to United Test And Assembly Center Ltd. United Test And Assembly Center Ltd is listed as an Agent/Assignee. Note: United Test And Assembly Center Ltd may have other listings under different names/spellings. We're not affiliated with United Test And Assembly Center Ltd, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | United Test And Assembly Center Ltd-related inventors




Date United Test And Assembly Center Ltd patents (updated weekly) - BOOKMARK this page
08/11/16Reliable interconnect
07/21/16Method of producing a semiconductor package
07/30/15Leadframe area array packaging technology
04/16/15Semiconductor packages and methods for forming semiconductor package
03/26/15Semiconductor packages and methods of packaging semiconductor devices
03/05/15Semiconductor packages and methods of packaging semiconductor devices
09/18/14Semiconductor packages and methods of packaging semiconductor devices
09/18/14Semiconductor packages and methods of packaging semiconductor devices
09/18/14Semiconductor packages and methods of packaging semiconductor devices
08/14/14Semiconductor packages and methods of packaging semiconductor devices
08/14/14Semiconductor packages and methods of packaging semiconductor devices
05/22/14Leadframe area array packaging technology
02/13/14Through silicon via dies and packages
05/16/13Packaging structural member
08/30/12Semiconductor packages and methods of packaging semiconductor devices
08/02/12Semiconductor packages and methods of packaging semiconductor devices
06/14/12Vented die and package
05/17/12Semiconductor packages and methods of packaging semiconductor devices
05/03/12Interposer for semiconductor package
02/09/12Semiconductor package and attaching semiconductor dies to substrates
01/26/12Mold design and semiconductor package
01/05/12Semiconductor packages and methods of packaging semiconductor devices
12/29/11Subscriber identity module (sim) card
10/14/10Semiconductor package and packaging semiconductor devices
05/06/10Semiconductor package and making the same
05/06/10Interposer for semiconductor package
04/29/10Shrink package on board
02/04/10Copper on organic solderability preservative (osp) interconnect and enhanced wire bonding process
01/21/10Packaging structural member
09/24/09Package-on-package semiconductor structure
08/13/09Semiconductor package and making the same
07/02/09Avoiding electrical shorts in packaging
06/11/09Flip-chip leadframe semiconductor package
01/21/10Packaging structural member







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with United Test And Assembly Center Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for United Test And Assembly Center Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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