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Utac Thai Limited patents

Recent patent applications related to Utac Thai Limited. Utac Thai Limited is listed as an Agent/Assignee. Note: Utac Thai Limited may have other listings under different names/spellings. We're not affiliated with Utac Thai Limited, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "U" | Utac Thai Limited-related inventors




Date Utac Thai Limited patents (updated weekly) - BOOKMARK this page
10/13/16Plated terminals with routing interconnections semiconductor device
10/13/16Plated terminals with routing interconnections semiconductor device
10/06/16Plated terminals with routing interconnections semiconductor device
08/18/16Singulation semiconductor package with plating on side of connectors
06/16/16Post-mold for semiconductor package having exposed traces
06/18/15Conductive shield for semiconductor package
01/16/14Very extremely thin semiconductor package
12/19/13Lead frame land grid array with routing connector trace under unit
11/14/13Plated terminals with routing interconnections semiconductor device
11/14/13Protruding terminals with internal routing interconnections semiconductor device
11/14/13Methods of manufacturing semiconductor devices including terminals with internal routing interconnections
09/19/13Molded leadframe substrate semiconductor package
09/12/13Lead frame land grid array
08/15/13Leadframe based multi terminal ic package
04/19/12Apparatus for and methods of attaching heat slugs to package tops
03/22/12Qfn process for strip test
03/01/12Singulation semiconductor package with plating on side of connectors
01/12/12Method of and system for cooling a singulation process
10/06/11Apparatus for and methods of attaching heat slugs to package tops
09/29/11Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
09/15/11Leadframe based multi terminal ic package
08/18/11Lead frame ball grid array with traces under die
06/23/11Lead frame land grid array with routing connector trace under unit
06/09/11Auxiliary leadframe member for stabilizing the bond wire process
03/31/11Molded leadframe substrate semiconductor package
02/17/11Flip chip cavity package
01/27/11Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow
12/30/10Package with heat transfer
12/09/10Method and no lead semiconductor package
09/16/10Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
09/16/10Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
06/10/10Method and plating a semiconductor package
05/27/10Very extremely thin semiconductor package
10/01/09Side rail remover







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Utac Thai Limited in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Utac Thai Limited with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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