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Win Semiconductors Corp patents

Date	Win Semiconductors Corp patents (updated weekly) - BOOKMARK this page
09/21/17	Protective cover for an acoustic wave device and fabrication method thereof
08/03/17	Gate metal structure for compound semiconductor devices
07/20/17	Protection structure for semiconductor device package
07/06/17	Schottky barrier semiconductor device having a nanoscale film interface
06/15/17	Integrated structures of acoustic wave device and varactor, and acoustic wave device, varactor and power amplifier, and fabrication methods thereof
06/08/17	Protection structure for semiconductor device package
05/11/17	Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device
04/20/17	Layout compound semiconductor integrated circuits
03/23/17	Method for fabricating a semiconductor integrated chip
03/16/17	Protective cover for an acoustic wave device and fabrication method thereof
03/09/17	Heterojunction bipolar transistor
02/16/17	High-frequency package
02/16/17	High-frequency package
12/22/16	Biasing circuitry
11/24/16	Package structure and three dimensional package structure
11/24/16	Low noise amplifier with noise and linearity improvement
11/24/16	Power amplifier
08/25/16	Layout structure of heterojunction bipolar transistors
06/30/16	Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereof
02/04/16	Stacked structure of semiconductor chips having via holes and metal bumps
01/21/16	Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
01/21/16	Heterojunction bipolar transistor
11/05/15	High breakdown voltage metal-insulator-metal capacitor
10/01/15	Compound semiconductor integrated circuit with three-dimensionally formed components
07/23/15	Semiconductor integrated circuit
04/09/15	Wafer holding structure
04/09/15	Method for forming through wafer vias in semiconductor devices
09/25/14	Wafer edge protector
09/18/14	Probe card, probe structure and manufacturing the same
09/11/14	Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof
08/21/14	Integrated circuits with esd protection devices
08/21/14	Phemt and hbt integrated epitaxial structure
07/31/14	Semiconductor integrated circuit
07/03/14	Compound semiconductor esd protection devices
07/03/14	Compound semiconductor esd protection devices
05/01/14	Fabrication dicing of semiconductor wafers using laser cutting techniques
04/17/14	Structure and air cavity packaging
04/10/14	Compound semiconductor integrated circuit with three-dimensionally formed components
04/10/14	High-voltage integrated metal capacitor and fabrication method
02/27/14	Compound semiconductor integrated circuit
12/19/13	Monolithic compound semiconductor structure
12/19/13	Integrated structure of compound semiconductor devices
12/19/13	Fabrication producing semiconductor chips with enhanced die strength
12/05/13	Phemt hbt integrated epitaxial structure and a fabrication method thereof
10/24/13	Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
10/03/13	Group iii nitride-based high electron mobility transistor
06/06/13	Compound semiconductor integrated circuit with three-dimensionally formed components
04/25/13	Structure of semiconductor chips with enhanced die strength and a fabrication method thereof
03/10/11	Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film
07/08/10	Full periphery multi-gate transistor with ohmic strip
02/11/10	Method for mounting a thinned semiconductor wafer on a carrier substrate
11/12/09	High linearity doped-channel fet