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Win Semiconductors Corp patents

Recent patent applications related to Win Semiconductors Corp. Win Semiconductors Corp is listed as an Agent/Assignee. Note: Win Semiconductors Corp may have other listings under different names/spellings. We're not affiliated with Win Semiconductors Corp, we're just tracking patents.

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Date Win Semiconductors Corp patents (updated weekly) - BOOKMARK this page
03/23/17 new patent  Method for fabricating a semiconductor integrated chip
03/16/17Protective cover for an acoustic wave device and fabrication method thereof
03/09/17Heterojunction bipolar transistor
02/16/17High-frequency package
02/16/17High-frequency package
12/22/16Biasing circuitry
11/24/16Package structure and three dimensional package structure
11/24/16Low noise amplifier with noise and linearity improvement
11/24/16Power amplifier
08/25/16Layout structure of heterojunction bipolar transistors
06/30/16Acoustic wave device structure, integrated structure of power amplifier and acoustic wave device, and fabrication methods thereof
02/04/16Stacked structure of semiconductor chips having via holes and metal bumps
01/21/16Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
01/21/16Heterojunction bipolar transistor
11/05/15High breakdown voltage metal-insulator-metal capacitor
10/01/15Compound semiconductor integrated circuit with three-dimensionally formed components
07/23/15Semiconductor integrated circuit
04/09/15Wafer holding structure
04/09/15Method for forming through wafer vias in semiconductor devices
09/25/14Wafer edge protector
09/18/14Probe card, probe structure and manufacturing the same
09/11/14Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof
08/21/14Integrated circuits with esd protection devices
08/21/14Phemt and hbt integrated epitaxial structure
07/31/14Semiconductor integrated circuit
07/03/14Compound semiconductor esd protection devices
07/03/14Compound semiconductor esd protection devices
05/01/14Fabrication dicing of semiconductor wafers using laser cutting techniques
04/17/14Structure and air cavity packaging
04/10/14Compound semiconductor integrated circuit with three-dimensionally formed components
04/10/14High-voltage integrated metal capacitor and fabrication method
02/27/14Compound semiconductor integrated circuit
12/19/13Monolithic compound semiconductor structure
12/19/13Integrated structure of compound semiconductor devices
12/19/13Fabrication producing semiconductor chips with enhanced die strength
12/05/13Phemt hbt integrated epitaxial structure and a fabrication method thereof
10/24/13Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
10/03/13Group iii nitride-based high electron mobility transistor
06/06/13Compound semiconductor integrated circuit with three-dimensionally formed components
04/25/13Structure of semiconductor chips with enhanced die strength and a fabrication method thereof
03/10/11Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film
07/08/10Full periphery multi-gate transistor with ohmic strip
02/11/10Method for mounting a thinned semiconductor wafer on a carrier substrate
11/12/09High linearity doped-channel fet







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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Win Semiconductors Corp in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Win Semiconductors Corp with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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