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Winbond Electronics Corp
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Winbond Electronics Corp patents


Recent patent applications related to Winbond Electronics Corp. Winbond Electronics Corp is listed as an Agent/Assignee. Note: Winbond Electronics Corp may have other listings under different names/spellings. We're not affiliated with Winbond Electronics Corp, we're just tracking patents.

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Securely binding between memory chip and host

A memory system includes an interface, a non-volatile memory and a controller. The interface is configured to communicate over an unsecured communication link with an external host. The non-volatile memory is pre-programmed with a device identifier and a corresponding initialization key that are additionally stored in a database that resides... Winbond Electronics Corp

Anti-rollback version upgrade in secured memory chip

A secured storage system includes a non-volatile memory and a controller. The non-volatile memory is configured to store a first data item and a respective first version identifier assigned to the first data item. The controller is configured to receive a second data item accompanied by a second version identifier... Winbond Electronics Corp

Method and serial data output in memory device

A memory device includes a memory array storing data, a sense amplifier configured to read a plurality of data bits from the memory array and output a sense data signal including the data bits read from the memory array, a data multiplexer configured to receive the sense data signal and... Winbond Electronics Corp

Memory controller for performing write transaction

A memory device includes a memory array including a plurality of memory cells that store data, a sense circuit coupled to the memory array for reading data stored in the memory array, a data register for storing data to be written into the memory array, a data processor, and a... Winbond Electronics Corp

Data management in multiply-writeable flash memories

According to the present disclosure is provided a device and method for mapping management in a flash memory based on partitioning the memory to a main address space and a substitute space, each partition comprising locations in the memory that are denoted by at least three statues according to which... Winbond Electronics Corp

Apparatus and read time control in ecc-enabled flash memory

In a flash semiconductor memory, sense and contiguous ECC coding operations are carried out over a range of VCC values without wasted time by allocating a predetermined number of clocks to the combined operations rather than to the individual operations and operating at higher frequency for high VCC values, and... Winbond Electronics Corp

Protection from side-channel attacks by varying clock delays

A system, comprising a logic circuit and delay circuitry, is described. The logic circuit is configured to perform a plurality of instances of a particular computation that is based on a plurality of inputs. The delay circuitry is configured to vary a power-consumption profile of the logic circuit over the... Winbond Electronics Corp

Level faults interception in integrated circuits

There is provided a computerized mechanism for vulnerability evaluation in a layout having circuitry units as interceptors, comprising receiving a layout with interceptors incorporated therein at prearranged positions, virtually inducing faults in the layout by modeling a physical phenomenon that affects timings in the layout, detecting timing violations in the... Winbond Electronics Corp

 new patent  Sensor array, manufacturing method thereof, and sensing method

A sensor array includes a circuit board, a plurality of first sensing units, and at least one second sensing unit. The circuit board has an upper surface and a lower surface that are opposite to each other. The first sensing units are located on the upper surface of the circuit... Winbond Electronics Corp

 new patent  Memory device and manufacturing method thereof

The invention provides a memory device. The memory device includes a substrate, a plurality of first wires, a plurality of etch-stop layers, a dielectric layer, and a plurality of vias. The substrate has a plurality of first regions and a plurality of second regions arranged in a staggered manner along... Winbond Electronics Corp

Semiconductor memory device and continuous reading the same

A semiconductor memory device is provided. The semiconductor memory device includes a memory cell array, a page-reading portion which selects a page of the memory cell array, reads data of the selected page, and transmits the read data to a data-holding portion, and a control portion which controls continuous reading... Winbond Electronics Corp

Semiconductor memory device, flash memory and continuous reading method thereof

A semiconductor memory device, a flash memory and a continuous reading method thereof are provided for achieving a continuous reading of pages in high speed. A flash memory 100 of the invention includes a memory cell array 110; a page reading element, which selects a page of the memory cell... Winbond Electronics Corp

Resistive random access memory, manufacturing method thereof, and operation thereof

A resistive random access memory (RRAM) including a first electrode, a second electrode, and a charge trapping layer is provided. The second electrode is located on the first electrode. The charge trapping layer is located between the first electrode and the second electrode. The charge trapping includes a first region... Winbond Electronics Corp

Semiconductor device and security system

A semiconductor device is provided. The semiconductor device includes a unique-information generation portion, a detection portion, a memory portion, and a readout portion. The unique-information generation portion operates in a plurality of operation environments to generate unique information. The unique information includes stable information and unstable information. The stable information... Winbond Electronics Corp

Non-volatile semiconductor memory device

A flash memory includes a memory array including a memory mat MAT-0, MAT-1; a page buffer 170-0, holding data read from the memory mat MAT-0; a page buffer 170-1, holding data read from the memory mat MAT-1; an ECC circuit 140, performing data error checking and correction; an output buffer... Winbond Electronics Corp

Fatigue detection apparatus and fatigue detection method

A fatigue detection apparatus is provided. The fatigue detection apparatus includes a first detector, a second detector and a processor. The first detector is configured to obtain a first physiological signal and the second detector is configured to obtain a second physiological signal. The processor is coupled to the first... Winbond Electronics Corp

Method and pulse signal analyzing

A method and an apparatus for pulse signal analyzing are provided. The method includes: receiving a pulse signal; decomposing the pulse signal into a plurality of characteristics signal; generating a spectrum for each of the plurality of characteristics signal by using a spectrum projection; obtaining a plurality of quantized data... Winbond Electronics Corp

Semiconductor memory device

A semiconductor memory device which is capable of high-speed operation in synchronization with external control signals is provided. The semiconductor memory device has a data input portion, a memory array, a data output portion, and a control portion. The data input portion receives command and address input data in response... Winbond Electronics Corp

Semiconductor memory device and reading method thereof

The invention provides a semiconductor memory device and a reading method thereof, which are capable of suppressing a peak current when pre-charging a bit line are provided. The reading method of a flash memory of the present invention includes steps of: pre-charging a selected bit line; and reading a voltage... Winbond Electronics Corp

Memory storage apparatus and operating method thereof

A memory storage apparatus having a plurality of operating modes is provided. The memory storage apparatus includes a memory control circuit and a memory cell array circuit. The memory control circuit controls the memory storage apparatus to operate in one of the operating modes. The memory control circuit controls the... Winbond Electronics Corp

Semiconductor memory device

A semiconductor memory device improving a high-temperature data retention is provided. Here, a flash memory includes an erasing element erasing a selected storage cell in a storage cell array. The erasing element further includes an applying element, a verifying element, and a decision element. The applying element applies a monitoring... Winbond Electronics Corp

Method for fabricating memory device

A method for fabricating a memory device is provided. In the method, a first gate dielectric layer is formed on a substrate in a first region. A second gate dielectric layer is formed on the substrate in a second region and a third region. A first conductive layer is formed... Winbond Electronics Corp

Nand flash memory and reading method thereof

An NAND flash memory and a reading method thereof capable of high-speed reading of SFDP data are provided. The flash memory includes a memory cell array, a page buffer/reading circuit 170 and a controller 150. The page buffer/reading circuit 170 includes a first latch circuit L1 and a second latch... Winbond Electronics Corp

Memory device and manufacturing the same

Provided is a memory device including a substrate and a gate structure. The gate structure is located on the substrate. The gate structure includes a stack gate and a selection gate aside the stack structure. A topmost surface of the selection gate is lower than a topmost surface of the... Winbond Electronics Corp

Package substrate and manufacturing method thereof and package

A package substrate including a carrier, a first patterned conductive layer, a second patterned conductive layer and a 3D-printing conductive wire is provided. The carrier has a first surface, a second surface and a third surface. The first surface is opposite to the second surface, and the third surface is... Winbond Electronics Corp

Non-volatile semiconductor memory device

A non-volatile semiconductor memory device includes a memory array 20, including a plurality of memory elements; a selection part, selecting the memory elements of the memory array based on address data; a mode selection part 30, selecting any one of a RAM mode and a flash mode, where the RAM... Winbond Electronics Corp

Memory apparatus and operating method thereof

A memory apparatus including a memory cell array, a register unit and a command generator is provided. The memory cell array includes a plurality of memory cells. The register unit is configured to record a plurality of user-defined information. The command generator receives a user-defined command and operates at least... Winbond Electronics Corp

Package and packaging process of a semiconductor device

A packaging process of a semiconductor device includes following steps. A patterned conductive layer and a solder resist layer that covers the patterned conductive layer are formed through 3D-printing over a carrier having a cavity. The patterned conductive layer and the solder resist layer extend to the outside of the... Winbond Electronics Corp

Gas sensor

A gas sensor including a first sensing component, a second sensing component and a voltage enhancement circuit is provided. The first sensing component is coupled between a first voltage and a first node, where an impedance value of the first sensing component is proportional to a gas concentration. The second... Winbond Electronics Corp

Semiconductor device, manufacturing the same and generation unique information

A semiconductor device with improved generation function of unique information is provided. The semiconductor device includes an integrated circuit designed or fabricated based on a general design condition or manufacturing condition, an input/output circuit, and a unique-information generation circuit to generate unique information of the semiconductor device. The unique-information generation... Winbond Electronics Corp

Non-volatile semiconductor memory device and driving word line thereof

A non-volatile semiconductor memory device and a driving method for word lines thereof are provided. A flash memory of the invention includes a memory cell array including blocks and a block selection element selecting the block of the memory cell array based on row address information and including a block... Winbond Electronics Corp

Data sensing apparatus

A data sensing apparatus adapted for sensing read-out data of a memory apparatus includes a sensing reference voltage generator, a sensing reference current generator, and a sense amplifier. The sensing reference voltage generator receives a reference voltage, generates a reference current according to the reference voltage and a control signal,... Winbond Electronics Corp

Semiconductor device

A voltage generating circuit 100 of the present invention includes a control logic 110, a voltage generating element 120 and a connecting element 130. The voltage generating element 120 includes a plurality of registers A-1, B-1, C-1, D-1, voltage generating blocks A-2, B-2, C-2 and a voltage switch 32. The... Winbond Electronics Corp

Equipment protection system and protection device thereof

A protection device is provided, including a first fixed member, a second fixed member, a supporting member, a roller, an awning, an electromagnetic device, and a power supply unit. The supporting member connects to the first and second fixed members. The roller is movably disposed on the supporting member. The... Winbond Electronics Corp

Printed flexible ph sensors and methods for fabricating the same

A printed flexible PH sensor is provided. The printed flexible PH sensor includes a flexible substrate. A working electrode is disposed on the flexible substrate, and the working electrode includes a first silver layer formed on the flexible substrate by an ink-jet printing process, a second silver layer formed on... Winbond Electronics Corp

12/14/17 / #20170358589

Manufacturing semiconductor memory device

A manufacturing method of a semiconductor memory device is provided. The semiconductor memory device can suppress current leakage generated during a programming action so that the programming action can be executed with high reliability. A flash memory of this invention has a memory array in which NAND type strings are... Winbond Electronics Corp

12/07/17 / #20170352432

E-fuse device and array thereof

An e-fuse device includes a transferring circuit, a detecting-and-outputting circuit, and a fusing circuit. The transferring circuit transfers an input signal to a data node. The detecting-and-outputting circuit generates an output signal according to the logic level of the data node. The fusing circuit includes an e-fuse cell, a first... Winbond Electronics Corp

12/07/17 / #20170353295

Cracking devices and methods thereof

A cracking method for cracking a secret key of an encrypting device includes: building up a leakage model for the encrypting device; performing a mathematical calculation on the leakage model, according to a plurality of sets of input data, to generate a mathematical model; generating a plurality of sets of... Winbond Electronics Corp

11/16/17 / #20170329670

Semiconductor storage device and memory system having the same

A semiconductor storage device and a memory system having the same. The semiconductor storage device includes a memory array, an error checking/correction (ECC) element, and a setting element. The ECC element stores generated error correction codes to a storage area. The setting element can set the storage area from the... Winbond Electronics Corp

11/16/17 / #20170330915

Resistive random access memory

A resistive random access memory includes a memory cell disposed at an intersection point between a first conductive line and a second conductive line. The memory cell includes a selector structure, a first current limiter structure and a resistor structure. The first current limiter structure is disposed between the selector... Winbond Electronics Corp

10/26/17 / #20170311452

Stamp for printed circuit process and fabricating the same and printed circuit process

A stamp that is configured to be employed in a printed circuit process, a method of fabricating the stamp, and a printed circuit process are provided, and the stamp includes a main structure, a micro-protrusion structure, and a plurality of nano-conical structures. The micro-protrusion structure is located on the main... Winbond Electronics Corp

10/19/17 / #20170299489

Particle sensing device and electronic apparatus having the same

A particle sensing device, including a substrate and at least one particle sensing element, is provided. The substrate has a groove, and a through hole is disposed at a bottom of the groove. The through hole penetrates a bottom of the substrate. The particle sensing element is disposed in the... Winbond Electronics Corp

10/19/17 / #20170302435

Encryption/decryption apparatus and power analysis protecting method thereof

An encryption/decryption apparatus and a power analysis protecting method thereof are provided. The encryption/decryption apparatus adapted to perform encryption/decryption operation on digital data includes a data encryption/decryption unit, a random number generator, and a power analysis protecting circuit. The data encryption/decryption unit receives the digital data and performs an encryption/decryption... Winbond Electronics Corp

10/12/17 / #20170292912

Particle sensing device and electronic apparatus having the same

A particle sensing device, which senses a particulate matter by using a light beam from a light source, is provided. The particle sensing device includes a columnar array and a light-sensing element. The columnar array is disposed at a downstream side of a traveling path of the light beam. The... Winbond Electronics Corp

10/12/17 / #20170293226

Exposure method, exposure equipment and 3-d structure

An exposure method is provided. The exposure method includes coating a photo-curable material on a substrate, and exposing a portion of the photo-curable material by providing a first light source through an optical fiber to form a first photo-cured material. The optical fiber includes a light output end and a... Winbond Electronics Corp

10/12/17 / #20170294579

Resistive random access memory device and fabricating the same

A resistive random access memory device and a method for fabricating the same are presented. The resistive random access memory device includes a first electrode having a first dopant within. A second electrode is disposed on the first electrode. A resistive switching layer is disposed between the first electrode and... Winbond Electronics Corp

10/12/17 / #20170295639

Printed circuit, thin film transistor and manufacturing method thereof

A printed circuit, a thin film transistor and manufacturing methods thereof are provided. The printed circuit includes a plurality of metal nanostructures and a metal oxide layer. The metal oxide layer is disposed on a surface of the metal nanostructures and fills a space at an intersection of the metal... Winbond Electronics Corp

10/05/17 / #20170286063

Non-modular multiplier, non-modular multiplication and computational device

A non-modular multiplier, a method for non-modular multiplication and a computational device are provided. The non-modular multiplier includes an interface and circuitry. The interface is configured to receive n-bit integers A and B. The circuitry is configured to calculate a non-modular product (A*B) by performing a sequence of computations, and... Winbond Electronics Corp

09/28/17 / #20170277465

Option code providing circuit and providing method thereof

An option code providing circuit includes a plurality of resistive random access memory cells and a controller. The controller determines whether to provide a control signal to operate a heavy forming operation on the resistive random access memory cells or not. Wherein, the controller performs a read operation on the... Winbond Electronics Corp

09/28/17 / #20170278553

Semiconductor device and output circuit thereof

A semiconductor device and an output circuit thereof for accelerating rising of a pull-up transistor are provided. The output circuit of the invention includes an external terminal (130), an output buffer (110) and a pre-buffer circuit (120). The external terminal (130) can output output data to an external part. The... Winbond Electronics Corp

09/28/17 / #20170279041

Resistive random access memory

A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a top electrode, a resistance changeable layer, an oxygen reservoir layer and a reactive oxygen barrier layer. The bottom electrode is disposed on a substrate. The top electrode is disposed above the bottom electrode.... Winbond Electronics Corp

09/21/17 / #20170271173

Method for forming metallization structure

A method for forming a metallization structure is provided, including forming a metallic powder layer on a substrate; performing a first laser sintering on a first portion of the metallic powder layer to form a metal layer; and in the presence of oxygen, performing a second laser sintering on a... Winbond Electronics Corp

09/21/17 / #20170271402

Three-dimensional resistive memory and forming the same

Provided is a three-dimensional resistive memory including a channel pillar, a first gate pillar, a first gate dielectric layer, first and second stacked structures, a variable resistance pillar and an electrode pillar. The channel pillar is on a substrate. The first gate pillar is on the substrate and at a... Winbond Electronics Corp

09/21/17 / #20170272036

Front-end amplifier circuits for biomedical electronics

A front-end amplifier circuit for receiving a biological signal includes a signal channel. The signal channel amplifies the biological signal to generate a detection current and includes a capacitive-coupled transconductance amplifier. The capacitive-coupled transconductance amplifier amplifies the biological signal with a transconductance gain to generate a first current.... Winbond Electronics Corp

09/14/17 / #20170261454

Mobile device having gas-sensing function

A mobile device having a gas-sensing function including a case body, a backlight module and a gas sensor is provided. The case body has at least one through hole. The backlight module is disposed in the case body. The gas sensor is disposed in the case body. The gas sensor... Winbond Electronics Corp

09/07/17 / #20170256322

Semiconductor memory device and verification input data

A semiconductor memory device and a verification method which can verify data taken inside external terminals are provided. The semiconductor memory device of the invention includes external input/output terminals for inputting or outputting data, a memory array 110 and a page buffer/sensing circuit 170. The page buffer/sensing circuit 170 holds... Winbond Electronics Corp

09/07/17 / #20170256711

Resistive random-access memory structure and fabricating the same

A resistive random-access memory structure and a method for fabricating a resistive random-access memory structure are described. A first dielectric layer is formed on a substrate. A plurality of bottom electrodes are independently embedded in the first dielectric layer. A transition metal oxide layer covers the plurality of bottom electrodes... Winbond Electronics Corp

09/07/17 / #20170256712

Method for manufacturing electrode and resistive random access memory

A method for manufacturing an electrode including the following steps is provided. A conductive layer is formed on a base material. A radio frequency physical vapor deposition (RF PVD) transition metal compound layer is formed on the conductive layer by using a RF PVD. A sacrificial layer is formed on... Winbond Electronics Corp

08/24/17 / #20170243656

Flash memory device and erase method thereof

Provided is a flash memory device capable of restricting power consumption in an erase operation. The invention includes a plurality of wells, a power supply device, and a coupling device. The power supply device applies erase voltages to the wells for performing an erase operation. The coupling device performs selective... Winbond Electronics Corp

08/17/17 / #20170236764

Electronic device package and manufacturing method thereof

An electronic device package and a manufacturing method thereof are provided. The electronic device package includes a flexible substrate, a first wiring structure, a first electronic device and a thermoplastic film having a second wiring structure. The first wiring structure is disposed on the flexible substrate. The first electronic device... Winbond Electronics Corp

08/10/17 / #20170228189

Semiconductor memory device and scrambling method thereof

A semiconductor memory device and a scrambling method thereof are provided, which are capable of realizing a balance between a data scrambling function and an accessible time. The semiconductor memory device of the invention includes a page buffer/sense circuit with the data scrambling function. During a programming operation, the page... Winbond Electronics Corp

08/10/17 / #20170229184

Semiconductor memory device, erasing method and programing method thereof

A semiconductor memory device, an erasing method and a programming method thereof which can improve yields and utilization efficiency of a memory array are provided. The semiconductor memory device includes a memory array, which includes a plurality of NAND strings; a page buffer/sensing circuit (170), which is connected to the... Winbond Electronics Corp

08/03/17 / #20170221567

Non-volatile semiconductor memory device

A non-volatile semiconductor memory device is provided. A determination circuit 200 used to determine the suspected qualification is connected with a plurality of page buffer/sensing circuits 170 via wirings PB_UP, PB_MG, PB_DIS. The page buffer/sensing circuit 170 includes a transistor Q2 in which a reference current Iref flows through a... Winbond Electronics Corp

07/27/17 / #20170214520

Method of protecting electronic circuit against eavesdropping by power analysis and electronic circuit using the same

An electronic circuit with protection against eavesdropping by power analysis is provided. The electronic circuit includes: a storage element for storing a set of bits; a logic unit for processing the stored set of bits and providing a next state set of bits after two or more cycles, wherein in... Winbond Electronics Corp

07/20/17 / #20170206973

Semiconductor memory device and operation method thereof

A NADN flash memory suppresses an influence caused by FG coupling and has high reliability. The flash memory of the invention includes: a memory array formed with a plurality of NAND strings; a row selection unit selecting rows of the memory array; and a bit line selection circuit (200) selecting... Winbond Electronics Corp

Patent Packs
06/29/17 / #20170186814

Memory devices

Memory devices are provided. The memory device includes a substrate. A dielectric layer is disposed on the substrate and a plurality of resistive memory cells is disposed on the dielectric layer. Each resistive memory cell includes a via disposed in a first opening of the dielectric layer. A conductive layer... Winbond Electronics Corp

06/29/17 / #20170187241

Wireless power transfer system supplying power required by adiabatic circuit

A wireless power transfer system includes a power supply side and a power reception side. The power supply side is configured to provide wireless power. The power reception side is electrically connected to the power supply side. The power reception side is configured to receive the wireless power and convert... Winbond Electronics Corp

06/15/17 / #20170170394

Resistive random access memory

A resistive random access memory is provided. The resistive random access memory includes a bottom electrode, a top electrode, a resistance-switching layer, an oxygen exchange layer, and a sidewall protective layer. The bottom electrode is disposed over a substrate. The top electrode is disposed over the bottom electrode. The resistance-switching... Winbond Electronics Corp

06/08/17 / #20170160145

Temperature detecting circuit

A temperature detecting circuit is provided. The temperature detecting circuit includes a band gap voltage generating circuit and an offset adjusting circuit. The band gap voltage generating circuit generates a reference voltage according to a bias voltage. The band gap voltage generating circuit has a voltage dividing circuit, and the... Winbond Electronics Corp

06/01/17 / #20170154674

Sense circuit for rram

A resistive random-access memory device includes a RRAM array including a plurality of RRAM cells coupled to a source line, a controller, a bit-line decoder, and a sense circuit. Each of the RRAM cells storing a logic state and is selected by the corresponding bit line and word line. The... Winbond Electronics Corp

06/01/17 / #20170155043

Resistive random access memory including layer for preventing hydrogen diffusion and fabricating the same

A resistive random access memory is provided. The resistive random access memory includes a first electrode, a second electrode, a resistance changeable oxide layer, a hard mask layer, and a hydrogen barrier layer. The first electrode is disposed on a substrate. The second electrode is disposed between the first electrode... Winbond Electronics Corp

05/18/17 / #20170140826

Nand flash memory and program method thereof

A NADN flash memory and a program method thereof suppressing an influence caused by FG coupling and having a high reliability are provided. The program method of the flash memory of the present invention includes a step of selecting pages of a memory array, a step of applying a programming... Winbond Electronics Corp

05/11/17 / #20170133094

Non-volatile semiconductor memory device and erasing method thereof

A non-volatile semiconductor memory device achieving low power consumption and erasing method thereof is provided. The flash memory of the present invention includes a memory array formed with NAND type strings. The memory array includes a plurality of global blocks, one global block includes a plurality of blocks, and one... Winbond Electronics Corp

05/11/17 / #20170133584

Conductive-bridging random access memory

A conductive-bridging random access memory is provided. The conductive-bridging random access memory includes a bottom electrode layer on a semiconductor substrate, an electrical resistance switching layer on the bottom electrode layer, a barrier layer on the electrical resistance switching layer, a top electrode layer on the barrier layer, and a... Winbond Electronics Corp

05/04/17 / #20170125098

Resistive memory apparatus and a writing method thereof

A resistive memory apparatus including a resistive memory cell array and a control unit is provided. The resistive memory cell array includes resistive memory cells. The control unit is configured to receive a logic data, determine a logic level of the logic data, and select one resistive memory cell from... Winbond Electronics Corp

05/04/17 / #20170125423

Dynamic random access memory

A dynamic random access memory (DRAM) includes a substrate, isolation structures, buried word lines, bit lines, and capacitors. The substrate includes active areas configured into strips and arranged as an array. The isolation structures are disposed in trenches of the substrate. Each isolation structure is disposed between two adjacent active... Winbond Electronics Corp

05/04/17 / #20170125673

Resistive memory and fabricating the same

Provided are a resistive memory and a method of fabricating the resistive memory. The resistive memory includes a first electrode, a second electrode, a variable resistance layer, an oxygen exchange layer, and a protection layer. The first electrode and the second electrode are arranged opposite to each other. The variable... Winbond Electronics Corp

05/04/17 / #20170127529

Method for manufacturing circuit board

A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended... Winbond Electronics Corp

04/27/17 / #20170117038

Resistfv memory and operating performing a forming operation thereof

An operating method for a resistive memory cell and a resistive memory are provided. The operating method for the resistive memory cell includes following steps. A forming operation for the resistive memory cell is performed. Whether the resistive memory cell is in a first state is determined, wherein the first... Winbond Electronics Corp

04/27/17 / #20170117046

Non-volatile semiconductor memory device

A non-volatile semiconductor memory device having an improved layout structure to achieve low power consumption, high speed and miniaturization is provided. A flash memory of the present invention includes a memory array formed with NAND type strings. The memory array includes a plurality of global blocks, one global block includes... Winbond Electronics Corp

Patent Packs
04/27/17 / #20170117463

Rram device and manufacturing the same

An RRAM device is provided, which includes a bottom electrode in an oxide layer, a plurality of dielectric protrusions on the oxide layer, wherein the bottom electrode is disposed between the two adjacent dielectric protrusions. A resistive switching layer is conformally disposed on the dielectric protrusions, the oxide layer, and... Winbond Electronics Corp

04/27/17 / #20170117464

Resistive random access memory device

A resistive random access memory device is provided, which includes a bottom electrode, a resistive switching layer disposed on the bottom electrode, an oxidizable layer disposed on the resistive switching layer, a first oxygen diffusion barrier layer disposed between the oxidizable layer and the resistive switching layer, and a second... Winbond Electronics Corp

04/20/17 / #20170110196

Nand flash memory

Serial NAND flash memory may be provided with the characteristics of continuous read of the memory across page boundaries and from logically contiguous memory locations without wait intervals, while also being clock-compatible with the high performance serial flash NOR (“HPSF-NOR”) memory read commands so that the serial NAND flash memory... Winbond Electronics Corp

04/13/17 / #20170102994

Methods and systems for nonvolatile memory data management

A system includes a first nonvolatile memory array, a second nonvolatile memory array, and a memory controller. The memory controller is configured to write an indicator bit to the second nonvolatile memory array, determine whether the indicator bit is valid in response to a power up of the system after... Winbond Electronics Corp

03/30/17 / #20170091519

Method for locating center of pupil and electronic apparatus

A method and an electronic apparatus for locating the center of a pupil are provided. The method includes: obtaining a glint-free image including a pupil; generating a gradient magnitude graph and a gradient orientation graph based on the glint-free image; sifting a plurality of first pixels from the gradient magnitude... Winbond Electronics Corp

03/30/17 / #20170092356

Devices and methods for selecting a forming voltage for a resistive random-access memory

A memory driving device and a method thereof applied for a RRAM array are provided. The memory driving device includes a voltage generator, a current detector, and a controller. The voltage generator generates a write voltage. An RRAM cell of the RRAM array is selected according to a selection signal... Winbond Electronics Corp

03/30/17 / #20170092368

Non-volatile semiconductor memory and erasing method thereof

An erasing method of a nonvolatile semiconductor memory device of the disclosure includes erasing data of a selected memory cell (step S100); immediately applying a programming voltage lower than a programming voltage in a programming time to all control gates of the selected memory cell after the erasing step, thereby... Winbond Electronics Corp

02/16/17 / #20170043159

Closed-loop stimulating apparatus and stimulating method thereof

Provided are a closed-loop stimulating apparatus and a stimulating method thereof, where the method includes: determining a physiological status variation of a user receiving a stimulating signal according to an electrocardiogram signal of the user, and generating the stimulating signal according to a variation of the electrocardiogram signal relative to... Winbond Electronics Corp

02/16/17 / #20170047123

Non-volatile semiconductor memory device and erase method thereof

Provided is an erase method for a non-volatile semiconductor memory device to compensate for the change in property of a memory cell, in proportion to the number of data rewrites to the memory cell. The erase method has an erase step to erase charges of a charge accumulation layer by... Winbond Electronics Corp

02/09/17 / #20170040532

Resistive random access memory

A resistive random access memory (RRAM) including a substrate, a conductive layer, a resistive switching layer, a copper-containing oxide layer, and an electron supply layer is provided. The conductive layer is disposed on the substrate. The resistive switching layer is disposed on the conductive layer. The copper-containing oxide layer is... Winbond Electronics Corp

02/09/17 / #20170040980

Power gating circuit and control power gating switch thereof

A power gating circuit and a control method for power gating switch thereof are provided. The power gating circuit includes a first switch, the power gating switch, a pre-charge circuit, and a control circuit. A first terminal and a second terminal of the first switch are coupled to a first... Winbond Electronics Corp

01/26/17 / #20170026178

Computational method, computational device andcomputer software product for montgomery domain

In Elliptic Curve Cryptography (ECC), one performs a great number of modular multiplications. These are usually done by Montgomery Multiplication algorithm, which needs the operands to be preprocessed (namely, converted to the Montgomery Domain), which is normally done by an equivalent of a long division. We provide a method to... Winbond Electronics Corp

01/19/17 / #20170018709

Memory device and manufacturing the same

The invention provides a memory device and a manufacturing method thereof. The memory device includes a substrate, a capacitor, a protection device, a first metal interconnect, and a second metal interconnect. The capacitor is located on the substrate of a first region. The protection device is located in the substrate... Winbond Electronics Corp

01/12/17 / #20170010866

Method, device and non-transitory computer-readable medium for cryptographic computation

A method, a device and a non-transitory computer-readable medium for cryptographic computation are provided. The method for computation includes: receiving, in a Montgomery multiplier circuit having a predefined block size, a pair of operands A and B and a modulus M for computation of a Montgomery product of A and... Winbond Electronics Corp

01/12/17 / #20170011798

Devices and methods for programming a resistive random-access memory

A memory-programming device includes a voltage generator, a resistive random-access memory, a current detector, and a controller. The voltage generator is configured to generate a program voltage. The resistive random-access memory receives the program voltage to generate a program current. The current detector detects the program current. The controller executes... Winbond Electronics Corp

01/12/17 / #20170011809

Semiconductor memory device, repairing bad column and setting setting redundant information thereof

A method for repairing of the invention includes steps as follows: storing redundant information including an address of the bad column, identification information for identifying a failure in which one of an even column or an odd column of the bad column and an address of a redundant column of... Winbond Electronics Corp

01/12/17 / #20170012643

Low density parity check decoding method performing on general graphic processing unit and decoding appratus

A low density parity check (LDPC) decoding method and a decoding apparatus are provided. The method includes following steps. Based on M edges of a Tanner graph related to a parity check matrix, each of the edges is associated with one of a plurality of threads, such that each of... Winbond Electronics Corp








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