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Wire Technology Co Ltd patents

Recent patent applications related to Wire Technology Co Ltd. Wire Technology Co Ltd is listed as an Agent/Assignee. Note: Wire Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Wire Technology Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "W" | Wire Technology Co Ltd-related inventors

 new patent  Metallic ribbon for power module packaging

A metallic ribbon for power module packaging is described. The metallic ribbon has a rectangular, oval or oblong cross section. The composition of the metallic ribbon is silver-palladium alloy containing 0.2 to 6 wt % Pd. The metallic ribbon has a thickness of 10 μm to 500 μm. The width... Wire Technology Co Ltd

Graphene coated silver alloy wire and methods for manufacturing the same

A graphene coated silver alloy wire is provided. The composite wire includes a core wire and one to three layers of graphene covering surfaces of the core wire. The core wire is made of a silver-based alloy including 2 to 6 weight percent of palladium. The core wire may be... Wire Technology Co Ltd

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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. is not affiliated or associated with Wire Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Wire Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by