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Xintec Inc patents


Recent patent applications related to Xintec Inc. Xintec Inc is listed as an Agent/Assignee. Note: Xintec Inc may have other listings under different names/spellings. We're not affiliated with Xintec Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "X" | Xintec Inc-related inventors


Chip package and manufacturing method thereof

A chip package includes a chip, an isolation layer on the bottom surface and the sidewall, a redistribution layer that is on the isolation layer and in electrical contact with a side surface of the conductive pad, and a passivation layer. The chip has a sensor, at least one conductive... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is... Xintec Inc

Chip package and forming the same

A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip,... Xintec Inc

Chip package and forming the same

A chip package including a substrate that has a first surface and a second surface opposite thereto is provided. The substrate includes a chip region and a scribe line region that extends along the edge of the chip region. The chip package further includes a dielectric layer disposed on the... Xintec Inc

Inductor structure and manufacturing method thereof

A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. A conductive layer is formed on the bond pads and the protection layer.... Xintec Inc

Chip package and forming the same

A chip package including a substrate is provided. A sensing region or device region of the substrate is electrically connected to a conducting pad. A first insulating layer is disposed on the substrate. A redistribution layer is disposed on the first insulating layer. A first portion and a second portion... Xintec Inc

Semiconductor structure and manufacturing method thereof

A manufacturing method of a semiconductor structure includes the following steps. A first isolation layer is formed on a first surface of a wafer substrate. A conductive pad is formed on the first isolation layer. A hollow region through the first surface and a second surface of the wafer substrate... Xintec Inc

Chip package and forming the same

A method for forming a chip package is provided. The method includes providing a first substrate and a second substrate. The first substrate is attached onto the second substrate by an adhesive layer. A first opening is formed to penetrate the first substrate and the adhesive layer and separate the... Xintec Inc

Chip scale sensing chip package

This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, comprising: a sensing device adjacent to the first top surface; and a plurality of conductive pads adjacent to first top surface and... Xintec Inc

Chip package and forming the same

A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing or device region which is adjacent to the first surface. A recess is in the substrate. The recess extends from the second surface towards the... Xintec Inc

Chip package and forming the same

A chip package is provided. The chip package includes a first chip including a carrier substrate and a device substrate thereon. A second chip is mounted on the device substrate. A portion of the device substrate extends outward from the edge of the second chip, so as to be exposed... Xintec Inc

Chip package and forming the same

A chip package including a substrate is provided. The substrate includes a front surface, a back surface, and a side surface. A redistribution layer is disposed on the back surface and is electrically connected to a sensing or device region in the substrate. A protection layer covers the redistribution layer... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, an insulating layer and a conductive layer. The chip includes a substrate, an epitaxy layer, a device region and a conductive pad. The epitaxy layer is disposed on the substrate, and the device region and the conductive pad are disposed on the epitaxy layer.... Xintec Inc

Semiconductor structure and manufacturing method thereof

A semiconductor structure includes a silicon substrate, a protection layer, an electrical pad, an isolation layer, a redistribution layer, a conductive layer, a passivation layer, and a conductive structure. The silicon substrate has a concave region, a step structure, a tooth structure, a first surface, and a second surface opposite... Xintec Inc

Chip package and forming the same

A method for forming a chip package is provided. The method includes providing a device substrate including a sensing device and conductive pads that are exposed from a surface of the device substrate. The method further includes forming a conductive structure correspondingly on each of the conductive pads, and then... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, a first adhesive layer, a second adhesive layer, and a protection cap. The chip has a sensing area, a first surface, a second surface that is opposite to the first surface, and a side surface adjacent to the first and second surfaces. The sensing... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a substrate, an isolation layer, a redistribution layer, a passivation layer, a first conductive layer, a second conductive layer, and a conductive structure. The isolation layer is located on the substrate. The redistribution layer is located on the isolation layer. The passivation layer is located on... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, an adhesive layer, and a dam element. The chip has a sensing area, a first surface, and a second surface that is opposite to the first surface. The sensing area is located on the first surface. The adhesive layer covers the first surface of... Xintec Inc

Sensing device and forming the same

A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. A sensing region is adjacent to the first surface. A temporary cover plate is provided on the second surface to cover the sensing region. The... Xintec Inc

Chip package and forming the same

A chip package is provided. The chip package includes a substrate. The substrate includes a sensing region or device region. The chip package also includes a first conducting structure disposed on the substrate. The first conducting structure is electrically connected to the sensing region or device region. The chip package... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, a dam element, and a height-increasing element. The chip has an image sensing area, a first surface, and a second surface opposite to the first surface. The image sensing area is located on the first surface of the chip. The dam element is located... Xintec Inc

Semiconductor package and manufacturing method thereof

A semiconductor package includes a substrate, at lest one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first... Xintec Inc

Chip scale sensing chip package and a manufacturing method thereof

This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, wherein the first top surface has a first insulating layer formed thereon, and the sensing chip comprises a sensing device adjacent to... Xintec Inc

Electronic device and manufacturing method thereof

An electronic device includes an image sensor that has a device layer and a MEMS device that is located on the image sensor and includes a MEMS element, a cap element, and a cover layer. The MEMS element having plural hollow regions is located on the device layer, such that... Xintec Inc

Chip package and forming the same

A chip package is provided. The chip package includes a first substrate including a sensing region or device region. The chip package also includes a second substrate. The first substrate is mounted on the second substrate and is electrically connected to the second substrate. The ratio of the thickness of... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, a laser stopper, an isolation layer, a redistribution layer, an insulating layer, and a conductive structure. The chip has a conductive pad, a first surface, and a second surface opposite to the first surface. The conductive pad is located on the first surface. The... Xintec Inc

Chip package and forming the same

A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing region. A cover plate is on the first surface and covers the sensing region. A shielding layer covers a sidewall of the cover plate and... Xintec Inc

Sensing module and forming the same

A sensing module is provided. The sensing module includes a sensing device. The sensing device includes a first substrate having a first surface and a second surface opposite thereto. The sensing device also includes a sensing region adjacent to the first surface and a conducting pad on the first surface.... Xintec Inc

Chip package and fabrication method thereof

A chip package included a chip, a first though hole, a laser stop structure, a first isolation layer, a second though hole and a conductive layer. The first though hole is extended from the second surface to the first surface of the chip to expose a conductive pad, and the... Xintec Inc

Sensing chip package and a manufacturing method thereof

This present invention provides a novel sensing chip package and a manufacturing method thereof, and in particular provides a proximity sensing chip package and a manufacturing thereof, which is characterized by forming a light blocking layer surrounding the light emitting device of the sensor to block the lateral light emitted... Xintec Inc

Sensing chip package and a manufacturing method thereof

This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each... Xintec Inc

Chip scale sensing chip package and a manufacturing method thereof

This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each... Xintec Inc

Chip package and forming the same

A chip package is provided. The chip package includes a sensing device. The chip package also includes a first conductive structure disposed on the sensing device and electrically connected to the sensing device. The chip package further includes a chip and a second conductive structure disposed on the sensing device.... Xintec Inc

Chip package and manufacturing method thereof

A manufacturing method of a chip package includes the following steps. A patterned solder paste layer is printed on a patterned conductive layer of a wafer. Plural solder balls are disposed on the solder paste layer that is on a first portion of the conductive layer. A reflow process is... Xintec Inc








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Xintec Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Xintec Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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