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Xintec Inc patents


Recent patent applications related to Xintec Inc. Xintec Inc is listed as an Agent/Assignee. Note: Xintec Inc may have other listings under different names/spellings. We're not affiliated with Xintec Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "X" | Xintec Inc-related inventors


Chip package and method for forming the same

A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. ... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, an isolation layer on the bottom surface and the sidewall, a redistribution layer that is on the isolation layer and in electrical contact with a side surface of the conductive pad, and a passivation layer. The chip has a sensor, at least one conductive pad, a top surface, a bottom surface, and a sidewall. ... Xintec Inc

Laser beam control and delivery system

The present invention relates generally to surgical lasers and more specifically to a laser beam control and delivery system that accurately and efficiently directs a laser beam into an optical fiber. The laser beam control and delivery system also provides additional functions, including a connection for a fiber tip temperature control system and a tissue temperature sensing system. ... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. ... Xintec Inc

Chip package and method for forming the same

A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip, and the conducting pad protrudes from the side surface of the substrate. ... Xintec Inc

Inductor structure and manufacturing method thereof

A manufacturing method of an inductor structure includes the following steps. A protection layer is formed on a substrate, such that bond pads of the substrate are respectively exposed form protection layer openings of the protection layer. ... Xintec Inc

Chip package and method for forming the same

A chip package including a substrate that has a first surface and a second surface opposite thereto is provided. The substrate includes a chip region and a scribe line region that extends along the edge of the chip region. ... Xintec Inc

Chip package and method for forming the same

A chip package including a substrate is provided. A sensing region or device region of the substrate is electrically connected to a conducting pad. ... Xintec Inc

Chip scale sensing chip package

This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, comprising: a sensing device adjacent to the first top surface; and a plurality of conductive pads adjacent to first top surface and the sensing device; a wiring layer formed on the first bottom surface and connected to each of the conductive pads; a dam having a supporter with a first opening and a spacer with a second opening formed on the first top surface, wherein the supporter is within the second opening and adjacent to the spacer, and the spacer is higher than the supporter by a predetermined distance d; a lens formed on the first top surface exposed by the first opening and above the sensing device; and an optical filter deposed on the supporter and above the lens.. . ... Xintec Inc

Chip package and method for forming the same

A method for forming a chip package is provided. The method includes providing a first substrate and a second substrate. ... Xintec Inc

Semiconductor structure and manufacturing method thereof

A manufacturing method of a semiconductor structure includes the following steps. A first isolation layer is formed on a first surface of a wafer substrate. ... Xintec Inc

Chip package and method for forming the same

A chip package is provided. The chip package includes a first chip including a carrier substrate and a device substrate thereon. ... Xintec Inc

Chip package and method for forming the same

A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. ... Xintec Inc

Chip package and manufacturing method thereof

A chip package includes a chip, an insulating layer and a conductive layer. The chip includes a substrate, an epitaxy layer, a device region and a conductive pad. ... Xintec Inc

06/29/17 / #20170186712

Chip package and method for forming the same

A chip package including a substrate is provided. The substrate includes a front surface, a back surface, and a side surface. ... Xintec Inc

06/22/17 / #20170179330

Semiconductor structure and manufacturing method thereof

A semiconductor structure includes a silicon substrate, a protection layer, an electrical pad, an isolation layer, a redistribution layer, a conductive layer, a passivation layer, and a conductive structure. The silicon substrate has a concave region, a step structure, a tooth structure, a first surface, and a second surface opposite to the first surface. ... Xintec Inc

04/27/17 / #20170117242

Chip package and method for forming the same

A chip package is provided. The chip package includes a substrate. ... Xintec Inc

04/27/17 / #20170116458

Sensing device and method for forming the same

A method for forming a sensing device includes providing a first substrate. The first substrate has a first surface and a second surface opposite thereto. ... Xintec Inc

04/20/17 / #20170110641

Semiconductor package and manufacturing method thereof

A semiconductor package includes a substrate, at lest one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. ... Xintec Inc

04/20/17 / #20170110495

Chip package and manufacturing method thereof

A chip package includes a chip, a dam element, and a height-increasing element. The chip has an image sensing area, a first surface, and a second surface opposite to the first surface. ... Xintec Inc

04/06/17 / #20170098678

Chip scale sensing chip package and a manufacturing method thereof

This present invention provides a chip scale sensing chip package, comprising: a sensing chip with a first top surface and a first bottom surface opposite to each other, wherein the first top surface has a first insulating layer formed thereon, and the sensing chip comprises a sensing device adjacent to the first top surface and a plurality of conductive pads formed within the first insulating and adjacent to the sensing device, and a wiring layer formed on the first bottom surface to respectively connect to each of the conductive pads; and a dam formed on the first insulating layer adjacent to the sensing device.. . ... Xintec Inc

03/30/17 / #20170092607

Chip package and method for forming the same

A chip package is provided. The chip package includes a first substrate including a sensing region or device region. ... Xintec Inc

03/30/17 / #20170088417

Electronic device and manufacturing method thereof

An electronic device includes an image sensor that has a device layer and a mems device that is located on the image sensor and includes a mems element, a cap element, and a cover layer. The mems element having plural hollow regions is located on the device layer, such that a first cavity is formed between the mems element and the image sensor. ... Xintec Inc

03/30/17 / #20170086923

Contact laser ablation of tissue

Apparatus and methods are described for laser ablation of tissue. The apparatus and methods utilize a laser source coupled to a fiberoptic laser delivery device and a laser driver and control system with features for protection of the laser delivery device, the patient, the operator and other components of the laser treatment system. ... Xintec Inc

03/16/17 / #20170077158

Chip package and method for forming the same

A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. ... Xintec Inc

03/16/17 / #20170076981

Chip package and manufacturing method thereof

A chip package includes a chip, a laser stopper, an isolation layer, a redistribution layer, an insulating layer, and a conductive structure. The chip has a conductive pad, a first surface, and a second surface opposite to the first surface. ... Xintec Inc

02/23/17 / #20170053848

Sensing module and method for forming the same

A sensing module is provided. The sensing module includes a sensing device. ... Xintec Inc

02/16/17 / #20170047455

Sensing chip package and a manufacturing method thereof

This present invention provides a novel sensing chip package and a manufacturing method thereof, and in particular provides a proximity sensing chip package and a manufacturing thereof, which is characterized by forming a light blocking layer surrounding the light emitting device of the sensor to block the lateral light emitted by the light emitting device to reduce the interference of the lateral light and enhance the sensitivity of the light sensing device.. . ... Xintec Inc

02/16/17 / #20170047300

Chip package and fabrication method thereof

A chip package included a chip, a first though hole, a laser stop structure, a first isolation layer, a second though hole and a conductive layer. The first though hole is extended from the second surface to the first surface of the chip to expose a conductive pad, and the laser stop structure is disposed on the conductive pad exposed by the first through hole, which an upper surface of the laser stop structure is above the second surface. ... Xintec Inc

02/09/17 / #20170040372

Sensing chip package and a manufacturing method thereof

This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first protective layer on the wiring layer; removing the temporary carrier substrate and the second adhesive layer; forming a second protective layer on the second top surface; removing the first protective layer; scribing the chip areas to generate a plurality of individual chip scale sensing chip package; and removing the second protective layer.. . ... Xintec Inc

01/26/17 / #20170025370

Chip scale sensing chip package and a manufacturing method thereof

This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first protective layer on the wiring layer; removing the temporary carrier substrate and the second adhesive layer; forming a second protective layer on the second top surface; removing the first protective layer; scribing the chip areas to generate a plurality of individual chip scale sensing chip package; and removing the second protective layer.. . ... Xintec Inc

01/19/17 / #20170018590

Chip package and method for forming the same

A chip package is provided. The chip package includes a sensing device. ... Xintec Inc

01/12/17 / #20170012081

Chip package and manufacturing method thereof

A manufacturing method of a chip package includes the following steps. A patterned solder paste layer is printed on a patterned conductive layer of a wafer. ... Xintec Inc








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