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Xintec Inc patents

Recent patent applications related to Xintec Inc. Xintec Inc is listed as an Agent/Assignee. Note: Xintec Inc may have other listings under different names/spellings. We're not affiliated with Xintec Inc, we're just tracking patents.

ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "X" | Xintec Inc-related inventors




Date Xintec Inc patents (updated weekly) - BOOKMARK this page
07/27/17Semiconductor structure and manufacturing method thereof
07/27/17Chip package and forming the same
07/27/17Chip scale sensing chip package
07/20/17Chip package and forming the same
07/20/17Chip package and forming the same
06/29/17Chip package and forming the same
06/29/17Chip package and manufacturing method thereof
06/22/17Semiconductor structure and manufacturing method thereof
05/25/17Chip package and forming the same
05/25/17Chip package and manufacturing method thereof
05/25/17Chip package and manufacturing method thereof
05/25/17Chip package and manufacturing method thereof
04/27/17Sensing device and forming the same
04/27/17Chip package and forming the same
04/20/17Chip package and manufacturing method thereof
04/20/17Semiconductor package and manufacturing method thereof
04/06/17Chip scale sensing chip package and a manufacturing method thereof
03/30/17Electronic device and manufacturing method thereof
03/30/17Chip package and forming the same
03/16/17Chip package and manufacturing method thereof
03/16/17Chip package and forming the same
02/23/17Sensing module and forming the same
02/16/17Chip package and fabrication method thereof
02/16/17Sensing chip package and a manufacturing method thereof
02/09/17Sensing chip package and a manufacturing method thereof
01/26/17Chip scale sensing chip package and a manufacturing method thereof
01/19/17Chip package and forming the same
01/12/17Chip package and manufacturing method thereof
12/29/16Touch panel-sensing chip package module complex and a manufacturing method thereof
12/29/16Image sensor chip package and fabricating method thereof
12/22/16Chip package and forming the same
12/08/16Chip package and manufacturing method thereof
12/01/16Image sensing device
12/01/16Chip package and manufacturing the same
11/24/16Chip package and manufacturing method thereof
11/10/16Semiconductor structure and manufacturing method thereof
11/03/16Chip package and fabrication method thereof
11/03/16Chip package and manufacturing method thereof
10/27/16Chip package and manufacturing method thereof
10/27/16Semiconductor electroplating system
10/27/16Chip package and manufacturing method thereof
10/20/16Wafer coating system and manufacturing chip package
09/29/16Chip scale sensing chip package and a manufacturing method thereof
09/15/16Chip scale sensing chip package and a manufacturing method thereof
09/01/16Spray coater and ring-shaped structure thereof
08/18/16Chip scale sensing chip package and a manufacturing method thereof
08/18/16Chip package and manufacturing method thereof
08/11/16Chip package and fabrication method thereof
08/11/16Chip package and forming the same
07/28/16Photosensitive module and forming the same
07/28/16Photosensitive module and forming the same
07/28/16Manufacturing semiconductor structure
07/21/16Chip module and forming the same
07/21/16Chip package and manufacturing method thereof
07/14/16Chip package and fabrication method thereof
06/30/16Chip package and fabrication method thereof
06/30/16Photosensitive module and forming the same
06/23/16Chip package and forming the same
06/16/16Chip package and fabrication method thereof
05/19/16Chip package and forming the same
05/19/16Chip package and forming the same
05/12/16Chip package and manufacturing method thereof
05/12/16Chip package and manufacturing method thereof
04/28/16Semiconductor package and manufacturing method thereof
04/21/16Chip package and manufacturing the same
Patent Packs
04/07/16Chip package and forming the same
03/24/16Chip package and forming the same
02/25/16Electronic device package and fabrication method thereof
02/18/16Chip package and manufacturing the same
02/11/16Chip package and method thereof
02/11/16Chip package and manufacturing the same
02/11/16Semiconductor structure and manufacturing method thereof
01/07/16Chip package and forming the same
11/26/15Semiconductor structure and manufacturing method thereof
11/26/15Manufacturing semiconductor structure
11/12/15Chip package and forming the same
11/12/15Chip package and forming the same
11/12/15Chip package and forming the same
11/05/15Semiconductor structure and manufacturing method thereof
10/29/15Stacked chip package and forming the same
Patent Packs
10/22/15Chip package and manufacturing the same
10/15/15Chip package and manufacturing the same
10/08/15Method for forming chip package
10/08/15Separation apparatus and a separating a cap layer from a chip package by means of the separation apparatus
10/08/15Chip package and forming the same
10/01/15Chip package and forming the same
10/01/15Manufacturing semiconductor structure
09/24/15Chip package and method thereof
09/10/15Chip package and manufacturing the same
09/10/15Chip package and fabricating the same
08/13/15Chip package and forming the same
08/13/15Chip package and forming the same
07/30/15Passive component structure and manufacturing method thereof
07/23/15Semiconductor device and manufacturing method thereof
06/25/15Semiconductor structure and manufacturing method thereof
06/11/15Chip package and forming the same
05/28/15Chip package and forming the same
05/21/15Chip package and forming the same
05/14/15Fabrication methods of chip device packages
05/07/15Semiconductor structure and manufacturing method thereof
05/07/15Chip device packages and fabrication methods thereof
04/09/15Inductor structure and manufacturing method thereof
04/09/15Chip package and fabricating the same
04/09/15Chip package and forming the same
04/09/15Method of fabricating wafer-level chip package
03/05/15Electronic device package and fabrication method thereof
02/26/15Semiconductor structure and manufacturing method thereof
02/26/15Inductor structure and manufacturing method thereof
02/12/15Chip package and fabrication method thereof
02/05/15Chip package and fabrication method thereof
Social Network Patent Pack
01/01/15Chip package
10/23/14Chip package and manufacturing method thereof
10/23/14Wafer level array of chips and method thereof
10/16/14Chip package and fabricating the same
09/18/14Chip package structure and manufacturing method thereof
09/18/14Chip package and forming the same
09/11/14Fabrication wiring structure for improving crown-like defect
09/11/14Chip package and forming the same
09/11/14Semiconductor structure and manufacturing method thereof
08/28/14Wafer packaging method
Patent Packs
08/21/14Chip package and forming the same
08/14/14Chip scale package structure and manufacturing method thereof
08/14/14Chip package
07/31/14Wafer packaging method
07/24/14Semiconductor chip package and manufacturing thereof
07/24/14Chip package and forming the same
07/17/14Package structure and manufacturing thereof
07/17/14Chip package and forming the same
07/17/14Chip package and forming the same
07/10/14Image sensor chip package and fabricating method thereof
07/10/14Electronic device package and fabrication method thereof
06/05/14Image sensor chip package and forming the same
06/05/14Chip package and forming the same
04/24/14Chip package and fabrication method thereof
04/03/14Ic wafer having electromagnetic shielding effects and making the same
03/27/14Chip package and forming the same
03/13/14Chip package and manufacturing method thereof
03/06/14Chip package and fabrication method thereof
02/27/14Chip package and forming the same
01/16/14High-reflection submount for light-emitting diode package and fabrication method thereof
01/16/14Chip package and fabrication method thereof
12/05/13Chip package and forming the same
12/05/13Chip package and forming the same
11/28/13Chip package and forming the same
11/28/13Chip package and fabrication method thereof
11/21/13Chip package and forming the same
11/21/13Chip package and forming the same
11/21/13Chip package and forming the same
11/21/13Chip package and forming the same
11/07/13Chip package and forming the same
Patent Packs
09/26/13Chip package and forming the same
08/15/13Chip package structure and manufacturing method thereof
08/01/13Power mosfet package
08/01/13Semiconductor package and fabricating the same
08/01/13Chip package and fabrication method thereof
07/25/13Semiconductor stacked package and fabricating the same
07/04/13Semiconductor package and fabrication method thereof
07/04/13Semiconductor stack structure and fabrication method thereof
06/20/13Chip package and forming the same
06/20/13Chip package and forming the same
05/23/13Electronic device package and forming the same
05/23/13Semiconductor package and fabricating the same
05/23/13Electronic device package and forming the same
05/23/13Chip package and fabrication method thereof
05/16/13Chip package, forming the same, and package wafer
05/16/13Semiconductor element and fabrication method thereof
05/16/13Chip package
03/14/13Electronic device package
02/21/13Method for fabricating electronic device package
01/24/13Chip package structure and forming the same
Social Network Patent Pack
05/24/12Wiring structure for improving crown-like defect and fabrication method thereof
09/02/10Photosensitizing chip package & manufacturing method thereof
03/04/10Chip package module heat sink
11/26/09Electronics device package and fabrication method thereof
11/26/09Light emitting device package structure and fabricating method thereof
11/26/09Electronic device package and fabrication method thereof
11/19/09Semiconductor device and manufacturing method thereof
02/26/09Electronic device wafer level scale packges and fabrication methods thereof
02/26/09Electronic device wafer level scale packages and fabrication methods thereof







ARCHIVE: New 2017 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Xintec Inc in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Xintec Inc with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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