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Zhen Ding Technology Co Ltd patents


      
Recent patent applications related to Zhen Ding Technology Co Ltd. Zhen Ding Technology Co Ltd is listed as an Agent/Assignee. Note: Zhen Ding Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Zhen Ding Technology Co Ltd, we're just tracking patents.

ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "Z" | Zhen Ding Technology Co Ltd-related inventors




Count Application # Date Zhen Ding Technology Co Ltd patents (updated weekly) - BOOKMARK this page
12016015063505/26/16  new patent  Flexible printed circuit board and manufacturing same
22016013529505/12/16 Multi-layer circuit board
32016006154003/03/16 Heat dissipation device and manufacturing same
42016006641803/03/16 Part-embedded circuit structure and manufacturing same
52015038039112/31/15 Packaging substrate, manufacturing same, and chip packaging structure having same
62015037187312/24/15 Packaging substrate and manufacturing same
72015018973807/02/15 Flexible printed circuit board and manufacturing same
82015018976007/02/15 Flexible printed circuit board and manufacturing same
92015013645705/21/15 Interposer and manufacturing same
102015010178504/16/15 Heat dissipation device and a manufacturing same
112015010184704/16/15 Rigid-flexible printed circuit board, manufacturing same,and printed circuit board module
122015005346602/26/15 Printed circuit board and manufacturing same
132015004039202/12/15 Printed circuit board and manufacturing same
142015003436402/05/15 Flexible printed circuit board and making same
152015002455201/22/15 Substrate, chip package and manufacturing substrate
162015001484901/15/15 Coreless package structure and manufacturing same
172015000095901/01/15 Multilayer printed circuit board having anisotropy condictive film and manufacturing same
182014037415312/25/14 Printed circuit board and manufacturing same
192014037489412/25/14 Package on package structrue and manufacturing same
202014036143912/11/14 Packaging substrate and manufacturing same
212014035300612/04/14 Multilayer circuit board and manufacturing same
222014030000910/09/14 Package structure and manufacturing same
232014018289207/03/14 Printed circuit board with embedded component and manufactruing same
242014018525707/03/14 Printed circuit board with embedded component and manufacturing same
252014018525907/03/14 Packaging substrate, manufacturing same, and chip packaging structure having same
262014018526107/03/14 Screen display fixture
272014017564606/26/14 Package structure and manufacturing same
282014015840706/12/14 Printed circuit board with visible triangular shaped traces
292014015841006/12/14 Polyimide, copper-clad laminate, flexible printed circuit board, and manufacturing the flexible printed circuit board
302014014467505/29/14 Multi-layer printed circuit board and manufacturing same
312014014650405/29/14 Circuit board, package structure and manufacturing same
322014011755305/01/14 Packaging substrate, manufacturing same, and chip packaging body having same
332014011895105/01/14 Interposer and package on package structure
342014008374403/27/14 Printed circuit board and manufacturing same
352014008375703/27/14 Printed circuit board and manufacturing same
362014008583303/27/14 Chip packaging substrate, manufacturing same, and chip packaging structure having same
372014007870603/20/14 Packaging substrate, manufacturing same, and chip packaging body having same
382014006090203/06/14 Printed circuit baord and manufacturing same
392014006195103/06/14 Package on package structure and manufacturing same
402014005407502/27/14 Printed circuit baord and manufacturing same
412014003646502/06/14 Packaging substrate, manufacturing same, and chip packaging body having same
422014002789301/30/14 Circuit substrate for mounting chip, manufacturing same and chip package having same
432013034107312/26/13 Packaging substrate and manufacturing same
442013031878512/05/13 Method for manufacturing ic substrate
452013031300211/28/13 Multilayer printed circuit board and manufacturing same
462013028469210/31/13 Resin coated copper foil, manufacturing same and multi-layer circuit board
472012021126708/23/12 Printed circuit board substrate
482012017524907/12/12 Apparatus for plating flexible printed circuit board
492012016039806/28/12 Apparatus and pressing printed circuit board
502012016055406/28/12 Multilayer printed circuit board and making same
512012010352105/03/12 Etching apparatus with suction mechanism
522012009778404/26/12 Apparatus for transporting flexible printed circuit board strip



ARCHIVE: New 2016 2015 2014 2013 2012 2011 2010 2009



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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Zhen Ding Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Zhen Ding Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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