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Zhen Ding Technology Co Ltd patents


Recent patent applications related to Zhen Ding Technology Co Ltd. Zhen Ding Technology Co Ltd is listed as an Agent/Assignee. Note: Zhen Ding Technology Co Ltd may have other listings under different names/spellings. We're not affiliated with Zhen Ding Technology Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "Z" | Zhen Ding Technology Co Ltd-related inventors


Polyamic acid, polyimide, polyimide film and copper clad laminate using the same

A polyamic acid as a polymer of a dianhydride monomer and a diamine monomer is disclosed. The dianhydride monomer is an aromatic tetrabasic carboxylic acid dianhydride monomer. The diamine monomer comprises a diamine monomer containing pyrimidinyl and an aromatic diamine monomer. A polyimide, a polyimide film and a copper clad... Zhen Ding Technology Co Ltd

Resin composition, adhesive film, and circuit board using the same

A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts... Zhen Ding Technology Co Ltd

Photosensitive resin composition, and film and printed circuit board using same

A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that... Zhen Ding Technology Co Ltd

Package structure

A chip packaging structure includes a flexible circuit board, a first built-up structure, a second built-up structure, and a first solder resist layer. The flexible circuit board defines a bent area and a laminated area. The flexible circuit board includes a first dielectric layer. The first dielectric layer includes a... Zhen Ding Technology Co Ltd

Circuit board and making the same

A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by... Zhen Ding Technology Co Ltd

Ultrathin heat dissipation structure and a manufacturing same

An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes... Zhen Ding Technology Co Ltd

Resin composition and adhesive film and circuit board made of the same

A resin composition suitable as an adhesive layer and as a circuit board substrate includes an acrylic resin, a non-photosensitive resin with carboxyl groups, nano core-shell particles, a photoinitiator, and a solvent, such adhesive layer and circuit board substrate being high-strength and temperature-resistant whilst retaining flexibility. The acrylic resin is... Zhen Ding Technology Co Ltd

Flexible circuit board and manufacturing same

A flexible circuit board includes a first circuit substrate, a second circuit substrate and a bonding layer. The first circuit substrate includes a first base layer, a first circuit layer, a second circuit layer and metal coating layer. The first circuit layer includes a signal line and at least two... Zhen Ding Technology Co Ltd

Circuit board and manufacturing same

A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the... Zhen Ding Technology Co Ltd

Circuit board for radio transceiving and manufacturing same

A circuit board for radio transceiving includes a flexible base and an inductance unit. The flexible base has a first conductive hole. The inductance unit includes a first inductance coil located at a first side of the flexible base and a second inductance coil located at an opposite side of... Zhen Ding Technology Co Ltd

Chip package and manufacturing same

A chip package can include a chip, a plurality of metal posts, an encapsulating body and a redistribution layer. The plurality of metal posts surrounds the chip. The encapsulating body surrounds the chip and the plurality of metal posts. The redistribution layer is coupled to the encapsulating body and electrically... Zhen Ding Technology Co Ltd

Flexible circuit board and making the same

A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line... Zhen Ding Technology Co Ltd

Substrate, chip package with same and manufacturing same

A substrate includes a base layer, first and second circuit layers both coupled to the base layer, a third circuit layer, a fourth circuit layer and two solder resist layers. The first/second circuit layer defines a first/second opening. The third and fourth circuit layers are located at two sides of... Zhen Ding Technology Co Ltd

Circuit board and making the same

A circuit board includes at least two substrates and an adhesive film sandwiched between the two substrates. Each substrate includes a base board. The base board includes conductive wires. Each base board is connected to the other base board by the adhesive film. The adhesive film includes two first adhesive... Zhen Ding Technology Co Ltd

Flexible circuit board and manufacturing same

A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on... Zhen Ding Technology Co Ltd








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This listing is an abstract for educational and research purposes is only meant as a recent sample of applications filed, not a comprehensive history. Freshpatents.com is not affiliated or associated with Zhen Ding Technology Co Ltd in any way and there may be associated servicemarks. This data is also published to the public by the USPTO and available for free on their website. Note that there may be alternative spellings for Zhen Ding Technology Co Ltd with additional patents listed. Browse our Agent directory for other possible listings. Page by FreshPatents.com

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