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Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd patents


Recent patent applications related to Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd. Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd is listed as an Agent/Assignee. Note: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd may have other listings under different names/spellings. We're not affiliated with Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "Z" | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd-related inventors


Substrates with ultra fine pitch flip chip bumps

A method of attaching a chip to the substrate with an outer layer comprising via pillars embedded in a dielectric such as solder mask, with ends of the via pillars flush with said dielectric, the method comprising the steps of: (o) optionally removing organic varnish, (p) positioning a chip having... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd

Novel embedded packages

A structure consisting of at least one die embedded in a polymer matrix and surrounded by the matrix, and further consisting of at least one through via through the polymer matrix around perimeter of the die, wherein typically the at least one via has both ends exposed and where the... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd

Interposer frame with polymer matrix and methods of fabrication

An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd

Novel terminations

An electronic support structure comprising one or more layers of copper features such as copper routing layers, laminated within a dielectric material comprising continuous glass fibers in a polymer matrix wherein pairs of adjacent layers of copper features are coupled by a via layer, and where terminations on at least... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd

Chip package

An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd

Chip package

An embedded die package and method of manufacture, the die package comprising a die having I/O contact pads in a passivation layer wherein the die contact pads are coupled to a first side of a feature layer by an adhesion/barrier layer, and a layer of pillars extends from a second... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd

Chip package

An embedded die package comprising a die having die contract pads in a passivation layer, the die contact pads being coupled to a first side of a feature layer by an adhesive layer, a layer of pillars extending from a second side of the feature layer, the die, feature layer... Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co Ltd








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