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Ziptronix Inc patents


Recent patent applications related to Ziptronix Inc. Ziptronix Inc is listed as an Agent/Assignee. Note: Ziptronix Inc may have other listings under different names/spellings. We're not affiliated with Ziptronix Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "Z" | Ziptronix Inc-related inventors


Stacked dies and methods for forming bonded structures

In various embodiments, a method for forming a bonded structure is disclosed. The method can comprise mounting a first integrated device die to a carrier. After mounting, the first integrated device die can be thinned. The method can include providing a first layer on an exposed surface of the first... Ziptronix Inc

3d ic

A method of three-dimensionally integrating elements such as singulated die or wafers and an integrated structure having connected elements such as singulated dies or wafers. Either or both of the die and wafer may have semiconductor devices formed therein. A first element having a first contact structure is bonded to... Ziptronix Inc

Heterogeneous annealing

A method of integrating a first substrate having a first surface with a first insulating material and a first contact structure with a second substrate having a second surface with a second insulating material and a second contact structure. The first insulating material is directly bonded to the second insulating... Ziptronix Inc

Systems and methods for efficient transfer of semiconductor elements

Systems and methods for efficient transfer of elements are disclosed. A film which supports a plurality of diced integrated device dies can be provided. The plurality of diced integrated device dies can be disposed adjacent one another along a surface of the film. The film can be positioned adjacent the... Ziptronix Inc

Increased contact alignment tolerance for direct bonding

A bonded device structure including a first substrate having a first set of conductive contact structures, preferably connected to a device or circuit, and having a first non-metallic region adjacent to the contact structures on the first substrate, a second substrate having a second set of conductive contact structures, preferably... Ziptronix Inc

Three dimensional device integration method and integrated device

A method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a substrate used for thermal spreading, impedance matching... Ziptronix Inc

Conductive barrier direct hybrid bonding

A method for forming a direct hybrid bond and a device resulting from a direct hybrid bond including a first substrate having a first set of metallic bonding pads, preferably connected to a device or circuit, capped by a conductive barrier, and having a first non-metallic region adjacent to the... Ziptronix Inc








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