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Adlink Technology Inc patents


Recent patent applications related to Adlink Technology Inc. Adlink Technology Inc is listed as an Agent/Assignee. Note: Adlink Technology Inc may have other listings under different names/spellings. We're not affiliated with Adlink Technology Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Adlink Technology Inc-related inventors


Lora mobile unit for allowing a mobile device to directly access lora information packets and data transmission method of same

A lora mobile unit includes a main control circuit with a central processing unit, a lora communication module including a lora communication circuit electrically coupled to the central processing unit for wireless communication with an external lora wireless sensor network for transmitting and receiving lora information packets, and a wireless communication circuit electrically coupled to the central processing unit. When the lora communication module receives a lora information packet from the lora wireless sensor network, the central processing unit converts the lora information packet into a formatted information packet readable by the bluetooth module, wi-fi module, mobile communication module or nfc module of the wireless communication circuit for wireless transmission to an external mobile device so that an external mobile device within the signal coverage is cable to directly access lora information packets.. ... Adlink Technology Inc

Chip heater and heating aid arrangement

A chip heater and heating air arrangement includes a circuit module including a circuit board, chip unit mounted on the circuit board and locating member mounted around the chip unit, heating aid including flat heat-transfer base panel, locating structure mounted in the flat heat-transfer base panel and attached to the chip unit and mounting structure outwardly extended from the flat heat-transfer base panel and fastened to the locating member, heater fastened to the locating structure of the heating aid, and heat dissipating mechanism including a heat-transfer holder plate attached to the heater. If the temperature of the chip unit goes below 0° c., the heater is turned on to generate heat and enabling generated heat to be transferred through the heating aid to heat the chip unit to the normal operating temperature level, enabling the computer device that uses the chip heater and heating air arrangement to work under cold environment.. ... Adlink Technology Inc

Intelligent test robot system

The present invention provides intelligent test robot system, which operation platform of intelligent robot body connected storage module for storing test script, operation platform respectively connected signal output unit and image input unit, further connected network communication module linked remote console computer. When operation platform automatically performs tests accordance test script, e.g., power switches, string inputs through keyboard, mouse cursor movements, clicks etc., it is possible to send instructions contained test script to test object via signal output unit for action controls, image input unit receives images outputted by test object and returns them to operation platform, then automatic graphic recognitions can be performed on captured images according to image recognition instructions in test script. ... Adlink Technology Inc

Memory heater and heating aid arrangement

A memory heater and heating air arrangement includes circuit module including circuit board, a plurality of memory modules mounted at the circuit board, memory heat sink wrapped around each memory module and locating member mounted at the circuit board around the memory modules, heating aid including flat heat-transfer base panel bonded to top side of the memory heat sinks, mounting structure located at the border of the flat heat-transfer panel and affixed to the locating member to secure the heating aid to the circuit module, and a heater attached to a top surface of the flat heat-transfer base panel of the heating aid and controllable by the circuit module to emit heat to the memory modules via the heating aid, enabling the memory modules to work under a cold environment. Subject to the functioning of the heating aid, one single heater is sufficient to heat the memories, saving the cost.. ... Adlink Technology Inc

Thermal conducting structure applied to network control automation system

A thermal conducting structure applied to a network control automation system includes a circuit module and a heat dissipation structure. Copper foil layers are horizontally disposed on bare copper regions disposed at top and bottom sides of circuit board. ... Adlink Technology Inc

Cooling mechanism of high mounting flexibility

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.. . ... Adlink Technology Inc

Cooling mechanism of high mounting flexibility

A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.. . ... Adlink Technology Inc

Data storage device mounting structure

A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.. ... Adlink Technology Inc

Thermal conducting structure applied to network control automation system

The present disclosure provides a thermal conducting structure applied to a network control automation system and including a circuit module and a heat dissipation structure. The circuit module defines bare copper regions disposed at two opposite side ends thereof, and copper foil layers are disposed on the bare copper regions. ... Adlink Technology Inc

Thermal conducting structure applied to network control automation system

The present disclosure provides a thermal conducting structure applied to a network control automation system. A circuit board defines bare copper regions located at two opposite sides thereof, and copper foil layers are disposed on bare copper regions and cover sliding edges on two side panels to form a thermal conducting path. ... Adlink Technology Inc

Assembly structure for industrial cameras

An assembly structure for industrial camera has a camera module including an electric circuit board and a sensor component configured on the electric circuit board, a base of a camera seat combined onto the electric circuit board, a protrusive and hollow engaging portion installed on the surface of the base, an installation hole combined with a predetermined lens installed in the engaging portion, and a lens hole creating a closure state configured at the bottom of the installation hole. Thus capable of further combining the camera module and the lens seat into the accommodation space within the housing and extending to outside by the engaging portion of the lens seat via the through-hole in the housing, there is no need to develop different molds for the housing with regard to the sensor components of various sizes in the camera module, but simply alter the camera seat having different lens hole size in correspondence with the sensor component for assemblages, thus further achieving the effects of stable structure, mass production and reduced production costs.. ... Adlink Technology Inc

Circuit chip module heat dissipation structure

A circuit chip module heat dissipation structure includes a circuit module including a circuit board and a chip unit mounted at the circuit board, and a heat dissipation device consisting of a plurality of heat-transfer blocks bonded to the surface of the circuit board and abutted against the peripheral walls of the chip unit to create a heat-transfer path for transferring heat from the chip unit for quick dissipation.. . ... Adlink Technology Inc








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