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Advanced Optoelectronic Technology Inc patents (2015 archive)


Recent patent applications related to Advanced Optoelectronic Technology Inc. Advanced Optoelectronic Technology Inc is listed as an Agent/Assignee. Note: Advanced Optoelectronic Technology Inc may have other listings under different names/spellings. We're not affiliated with Advanced Optoelectronic Technology Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Advanced Optoelectronic Technology Inc-related inventors


10/29/15 / #20150311413

Flip chip light emitting diode and method for manufacturing the same

A flip-chip light emitting diode, including a substrate, an n-type semiconductor layer, a light emitting layer and a p-type semiconductor layer series mounted along a height direction of the flip-chip light emitting diode. A p electrode is formed on the p-type semiconductor layer and an n electrode is formed on the n-type semiconductor. ... Advanced Optoelectronic Technology Inc

08/27/15 / #20150244161

Fault detection circuit and fault detection method

A fault detection circuit includes a micro processing unit configured to output a first pulse width modulation (pwm) signal, a driver electrically coupled to the micro processing unit, and a comparator configured to electrically connect the micro processing unit and the driver. The first pwm signal is configured to drive the driver to output a second pwm signal configured to drive the electrical device. ... Advanced Optoelectronic Technology Inc

08/27/15 / #20150243861

Semiconductor lighting module package

A semiconductor lighting module package includes a substrate, a lead frame located on the substrate, and a semiconductor lighting element. The lead frame has a carrier portion and a connecting portion spaced from the carrier portion. ... Advanced Optoelectronic Technology Inc

07/02/15 / #20150188013

Photoelectric device

A photoelectric device includes a base, an led (light emitting diode) element and a zener diode. The base includes a first electrode and a second electrode. ... Advanced Optoelectronic Technology Inc

07/02/15 / #20150188005

Light emitting diode package and method of manufacturing same

A method for packaging an light emitting diode, includes: arranging one or more light emitting diode dies on a film; encapsulating the one or more light emitting diode dies on the film; removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies; forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; and forming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies.. . ... Advanced Optoelectronic Technology Inc

06/25/15 / #20150179902

Led package

The present invention is related to a light emitting diode (led) package. The led package includes a blue led chip, a first electrode, a second electrode and a phosphor layer. ... Advanced Optoelectronic Technology Inc

06/18/15 / #20150171139

Photoelectric device and method of manufacturing the same

A photoelectric device includes an electrode structure, an led (light emitting diode) element, a zener diode and a reflective cup. The led element, the zener diode and the reflective cup are arranged on the electrode structure. ... Advanced Optoelectronic Technology Inc

06/11/15 / #20150162498

Light emitting diode package and method for manufacturing the same

A light emitting diode package (led) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an led die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the led die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. ... Advanced Optoelectronic Technology Inc

06/11/15 / #20150162497

Light emitting diode package and method for manufacuring the same

A light emitting diode package (led) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an led die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the led die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. ... Advanced Optoelectronic Technology Inc

05/21/15 / #20150140701

Method for manufacturing light emitting diode package

A method for manufacturing an led (light emitting diodes) package includes providing a substrate having electrodes; providing an led chip, the led chip arranged on the substrate and electrically contacting the electrodes; providing an uv-curing adhesive layer, the uv-curing adhesive layer arranged on the substrate and entirely packaging the led chip and the electrodes therein, and then the uv-curing adhesive layer being solidified.. . ... Advanced Optoelectronic Technology Inc

04/30/15 / #20150115218

Optoelectronic module and method for manufacturing the same

An optoelectronic module includes a substrate, an led and a laser led formed on the substrate, simultaneously. A method for manufacturing an optoelectronic module includes following steps: providing a sapphire substrate, and forming two adoped gan layers, an n-type gan layer, an active layer and a p-type gan layer on the sapphire substrate in sequence; providing a substrate and forming a metallic adhering layer on the substrate; forming an ohmic contact layer and a reflecting layer on the p-type gan layer in series; arranging the reflecting layer on the adhering layer; stripping the sapphire substrate and the two doped gan layers from the n-type gan layer to form a semiconductor structure; etching a top end of the semiconductor structure to divide the semiconductor structure into a laser led region and an led region; forming two n-type electrodes on the led region and an led region, respectively.. ... Advanced Optoelectronic Technology Inc

03/26/15 / #20150087099

Method for manufacturing light emitting diode

A method for manufacturing a light emitting diode includes following steps: providing a substrate; forming a buffer layer on the substrate; forming a transitional layer on the buffer layer, the buffer layer being made of ingan; forming an epitaxial layer on the transitional layer; activating the transitional layer by a way of radiating the transitional layer using laser; and when radiated with a laser, the transitional layer separates from the epitaxial layer.. . ... Advanced Optoelectronic Technology Inc

03/12/15 / #20150069441

Light emitting diode package

A light emitting diode (led) package includes a substrate, a first electrode and a second electrode mounted on opposite sides of the substrate, an led chip mounted on a top surface of one of the electrodes and electrically connecting the first electrode and the second electrode by wire bonding, and a reflecting cup enclosing an outer periphery of the first electrode and the second electrode to expose top surfaces of the first electrode and the second electrode and bottom surfaces of the first electrode and the second electrode.. . ... Advanced Optoelectronic Technology Inc

03/12/15 / #20150069323

Single photon source die and method of manufacturing the same

A single photon source die includes a first semiconductor layer, a plurality of columnar structures formed on the first semiconductor layer, a second semiconductor layer formed on the columnar structures. Each columnar structure includes a bottom layer, a single photon point layer and a connecting layer. ... Advanced Optoelectronic Technology Inc

03/05/15 / #20150062930

Led module

An light emitting diode (led) module includes a circuit board, a plurality of led chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the led chips, a plurality of first recesses defined in a first surface of the circuit board.. . ... Advanced Optoelectronic Technology Inc

03/05/15 / #20150060935

Led module

An light emitting diode (led) module includes a circuit board, a set of led chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the led chips, a set of first recesses defined in a top surface of the encapsulant.. . ... Advanced Optoelectronic Technology Inc

03/05/15 / #20150060912

Light emitting diode package having zener diode covered by reflective material

An exemplary light emitting diode package includes a substrate comprising a first electrode, a second electrode and an insulation layer electrically insulating the first electrode from the second electrode; a light emitting diode is located on the substrate, and electrically connects with the first and second electrodes; a zener diode is located on the substrate, and electrically connects with the first and second electrodes; and a reflecting layer is formed on the zener diode to reflect light emitted from the light emitting diode and toward the zener diode. The disclosure also relates to a method for manufacturing the light emitting diode package.. ... Advanced Optoelectronic Technology Inc

02/26/15 / #20150054012

Led die and method of manufacturing the same

An led die includes a substrate, a first buffer layer, a second buffer layer, a plurality of nanospheres, a first semiconductor layer, an active layer and a second semiconductor layer. The first buffer layer, the second buffer layer, the first semiconductor layer, the active layer and the second semiconductor layer are formed successively on the substrate. ... Advanced Optoelectronic Technology Inc

02/26/15 / #20150054009

Light emitting diode package and method for manufacturing same

An led packaging includes a substrate having a top surface and a bottom surface opposite to the top surface, a recess defined in the top surface, an led mounted on the top surface of the substrate, a zener diode received in the recess, and a reflecting layer formed in the recess and enclosing the zener diode therein.. . ... Advanced Optoelectronic Technology Inc

02/19/15 / #20150049496

Light emitting diode lamp

A light emitting diode (led) lamp includes a hollow connector, an led module mounted on the connector, and a fin unit received in the connector. The connector has an inlet and an outlet couple to the inlet. ... Advanced Optoelectronic Technology Inc

02/19/15 / #20150048305

Led die and method of manufacturing the same

An led die includes a substrate, a light emitting structure, electrodes, a first transparent protecting layer, a reflection layer, and a second transparent protecting layer. The light emitting structure includes a first semiconductor layer, an active layer, a second semiconductor layer successively formed on the substrate. ... Advanced Optoelectronic Technology Inc

02/19/15 / #20150048302

Light emitting diode having carbon nanotubes therein and method for manufacturing the same

A light emitting diode includes a substrate, an un-doped gan layer, a plurality of carbon nanotubes, an n-type gan layer, an active layer formed on the n-type gan layer, and a p-type gan layer formed on the active layer. The substrate includes a first surface and a second surface opposite and parallel to the first surface. ... Advanced Optoelectronic Technology Inc

02/12/15 / #20150041823

Led die and method of manufacturing the same

An led die includes a substrate, a first buffer layer, a second buffer layer, a plurality of nanospheres, a first semiconductor layer, an active layer and a second semiconductor layer. The first buffer layer, the second buffer layer, the first semiconductor layer, the active layer and the second semiconductor layer are formed successively on the substrate. ... Advanced Optoelectronic Technology Inc

02/05/15 / #20150036351

Light emitting diode lamp

A light emitting diode (led) lamp includes a substrate, a plurality of led elements arranged on the substrate, and a reflector arranged on the substrate. The reflector includes a plurality of reflecting sheets obliquely extending upward from a center of the substrate. ... Advanced Optoelectronic Technology Inc

02/05/15 / #20150036342

Light emitting diode lamp

A light emitting diode (led) lamp includes a substrate, a plurality of led elements arranged on the substrate, and a reflector arranged on the substrate. The reflector includes a plurality of reflecting sheets obliquely extending upward and outward from a center of the substrate. ... Advanced Optoelectronic Technology Inc

02/05/15 / #20150036321

Optical lens and backlight module incorporating the same

An optical lens includes a first optical surface located at a bottom thereof, a third optical surface located at a top thereof and arranged oppositely to the first optical surface, and a second optical surface extending between the first optical surface and the third optical surface. The third optical surface is recessed downwardly towards the first optical surface. ... Advanced Optoelectronic Technology Inc

02/05/15 / #20150034965

Light emitting diode and method for manufacturing same

An led includes a substrate and a semiconductor structure mounted on the substrate. A plurality of first holes and a plurality of second holes are defined in the semiconductor structure. ... Advanced Optoelectronic Technology Inc

01/29/15 / #20150028755

Light emitting diode illumination device

An led illumination device includes an led package and a switch electrically connecting the led package. The led package includes a first lamp group and a second lamp group installed in parallel. ... Advanced Optoelectronic Technology Inc

01/15/15 / #20150015134

Led lamp

An led lamp includes an envelope, a circuit board, a plurality of leds, a lamp body and a lamp holder. The leds are arranged on the circuit board. ... Advanced Optoelectronic Technology Inc

01/08/15 / #20150009680

Lens and light emitting element using the same

An exemplary lens includes a bottom surface, a first light exit surface extending upwardly from an outer periphery of the bottom surface, a second light exit surface extending upwardly from a top of the first light exit surface, and a reflecting surface extending inwardly and downwardly from a top of the second light exit surface towards the bottom surface to have a funnel-shaped configuration. A receiving space is defined in the bottom surface to receive a light source therein. ... Advanced Optoelectronic Technology Inc

01/01/15 / #20150003080

Light emitting diode module

An led module includes a pcb with a first electrode and a second electrode formed thereon, an led mounted on the pcb, a lens mounted on the pcb and covering the led. The led includes a base, an led die mounted on the base, and a packaging layer arranged on the base and covering the led die therein. ... Advanced Optoelectronic Technology Inc








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