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Advanced Optoelectronic Technology Inc patents (2016 archive)


Recent patent applications related to Advanced Optoelectronic Technology Inc. Advanced Optoelectronic Technology Inc is listed as an Agent/Assignee. Note: Advanced Optoelectronic Technology Inc may have other listings under different names/spellings. We're not affiliated with Advanced Optoelectronic Technology Inc, we're just tracking patents.

ARCHIVE: New 2018 2017 2016 2015 2014 2013 2012 2011 2010 2009 | Company Directory "A" | Advanced Optoelectronic Technology Inc-related inventors


Lens for light emitting device

A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. ... Advanced Optoelectronic Technology Inc

Photoelectric device and method of manufacturing the same

A photoelectric device includes an electrode structure, an led (light emitting diode) element, a zener diode and a reflective cup. The led element, the zener diode and the reflective cup are arranged on the electrode structure. ... Advanced Optoelectronic Technology Inc

Light emitting diode package and method thereof

The present disclosure provides a light emitting diode package including a substrate, a first electrode and a second electrode located on a first surface of the substrate, a plurality of light emitting diodes (leds) located between the first electrode and the second electrode, a plurality of retaining ring located on the first surface of the substrate. The leds are surrounded by the retaining ring therein. ... Advanced Optoelectronic Technology Inc

Fault detection apparatus and fault detection method thereof

A fault detection apparatus coupling with a lamp module includes a current detector and a controlling module. The controlling module is coupled with the current detector. ... Advanced Optoelectronic Technology Inc

Light emitting diode module and method of manufacturing the same

A light emitting diode module includes a substrate, a first soldering section, a second soldering section, a block and a light emitting diode die. The substrate has a top surface and includes a circuit structure. ... Advanced Optoelectronic Technology Inc

Led die

An led die includes a base, and an n-typed semiconductor layer, an active layer and a p-typed semiconductor layer formed on the base that order. The led die also includes an n-electrode and a p-electrode. ... Advanced Optoelectronic Technology Inc

Led package with reflecting cup

The present disclosure provides an led package which includes electrodes, an led die electrically connected with the electrodes, an encapsulation covering the led die; and a casing surrounding the encapsulation and the led die. The casing includes a base, a reflecting cup and a supporting portion. ... Advanced Optoelectronic Technology Inc

Light emitting diode and method for manufacturing the same

A light emitting diode includes a base and a semiconductor structure mounted on the base. The base includes a substrate that has a first surface and a second surface located opposite to the first surface. ... Advanced Optoelectronic Technology Inc

Light emitting diode (led) die module, led element with the led die module and method of manufacturing the led die module

A light emitting diode (led) die module includes an led die and a guiding layer formed on the led die. The guiding layer includes a first portion, a second portion and a third portion. ... Advanced Optoelectronic Technology Inc

Light emitting diode die and manufacturing method thereof

An led die includes a substrate, a pre-growth layer, a first insulating layer and a light emitting structure. The pre-growth layer, the first insulating layer and the light emitting structure are formed on the structure that order. ... Advanced Optoelectronic Technology Inc

Light emitting diode chip and method of manufacturing same

A light emitting diode (led) chip includes a first semiconductor layer, a first light emitting layer formed on the first semiconductor layer, a second light emitting layer formed on the first light emitting layer, and a second semiconductor layer formed on the second light emitting layer. The first light emitting layer emits light having a first color. ... Advanced Optoelectronic Technology Inc

Led package and manufacturing method thereof

A light emitting diode package includes a substrate, several light emitting diodes mounted on the substrate, and a package member enveloping the light emitting diodes. The light emitting diodes are electrically coupled to the substrate. ... Advanced Optoelectronic Technology Inc

Light emitting diode package and manufacturing method thereof

A light emitting diode package includes a substrate, a light emitting diode mounted on the substrate by flip chip bonding and a protective layer. The light emitting diode includes an epitaxial layer, a first electrode and a second electrode on the epitaxial layer. ... Advanced Optoelectronic Technology Inc

Light emitting diode and method for manufacturing the same

A light emitting diode includes a first electrode, a second electrode and an epitaxial structure. The epitaxial structure is arranged on the first electrode, and electrically connects with the first electrode and the second electrode. ... Advanced Optoelectronic Technology Inc

03/03/16 / #20160064606

Epitaxial substrate, method of manufacturing the epitaxial substrate and light emitting diode having epitaxial substrate

An epitaxial substrate for growing a lighting emitting structure of a light emitting diode, includes a transparent base, a first buffer layer and a second buffer layer formed on the transparent base. The transparent base includes a first surface and a second surface opposite to the first surface. ... Advanced Optoelectronic Technology Inc

03/03/16 / #20160064605

Led die and method of manufacturing the same

An led die includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, a transparent conductive layer, a first electrode and a second electrode. The first semiconductor layer, the active layer, the second semiconductor layer and the transparent conductive layer are successively formed on the substrate. ... Advanced Optoelectronic Technology Inc

03/03/16 / #20160064604

Flip chip light emitting diode packaging structure

A flip chip light emitting diode (led) packaging structure, including a substrate, an led chip including a p electrode and a n electrode. A protruding platform is formed in a center of the substrate. ... Advanced Optoelectronic Technology Inc

03/03/16 / #20160064595

Method for manufacturing light emitting diode package

A method for manufacturing a light emitting diode (led) package, the method includes providing an led chip and forming electrodes on a top surface of the led chip; forming a first electric insulation layer on the top surface of the led chip, the first electric insulation layer adapted to enclose the electrodes therein; etching the first electric insulation layer to define a plurality of second through holes; forming a substrate on a top surface of the first electric insulation layer, the substrate adapted to fill in the plurality of second through holes, the substrate directly contacting the electrodes; dividing the substrate into a plurality of spaced heat dissipation parts; and forming a packaging layer on a bottom surface of the substrate, the packaging layer adapted to enclose the led chip therein.. . ... Advanced Optoelectronic Technology Inc

03/03/16 / #20160061412

Reflector and light emitting diode illumination device having the same

A reflector configured for reflecting light emitted from a light emitting diode (led) toward a desired area is provided. The reflector defines a groove therein for accommodating the led. ... Advanced Optoelectronic Technology Inc

03/03/16 / #20160061408

Lens and light emitting device having the same

A lens includes a substrate, a light concentrating portion mounted on the substrate. The substrate includes a first substrate and a second substrate, the light concentrating portion includes a first light concentrating portion and a second light concentrating portion. ... Advanced Optoelectronic Technology Inc

01/28/16 / #20160027983

Lead frame and light emitting diode package having the same

An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. ... Advanced Optoelectronic Technology Inc








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