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Advanced Semiconductor Engineering Inc patents


Recent patent applications related to Advanced Semiconductor Engineering Inc. Advanced Semiconductor Engineering Inc is listed as an Agent/Assignee. Note: Advanced Semiconductor Engineering Inc may have other listings under different names/spellings. We're not affiliated with Advanced Semiconductor Engineering Inc, we're just tracking patents.

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Semiconductor package device and method of manufacturing the same

A semiconductor device package includes a substrate, a package body, a conductive layer, a dielectric layer, a magnetic layer, a first insulating layer and a coil. The package body is disposed on the substrate. ... Advanced Semiconductor Engineering Inc

Semiconductor package device and method of manufacturing the same

An optical device includes a carrier including a light transmitting layer and a light shielding layer disposed on the light transmitting layer. The optical device further includes a light emitter disposed on the carrier and a light detector disposed on the carrier. ... Advanced Semiconductor Engineering Inc

Semiconductor device package and method of manufacturing the same

The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. ... Advanced Semiconductor Engineering Inc

Semiconductor substrate and semiconductor packaging device, and method for forming the same

A semiconductor substrate includes a first dielectric layer, a first patterned conductive layer disposed in the first dielectric layer, a second dielectric layer disposed on the first dielectric layer, and a first bump pad disposed in the second dielectric layer. The first bump pad is electrically connected to the first patterned conductive layer, and the first bump pad has a curved surface surrounded by the second dielectric layer.. ... Advanced Semiconductor Engineering Inc

Semiconductor device package and a method of manufacturing the same

At least some embodiments of the present disclosure relate to a substrate for packaging a semiconductor device. The substrate includes a first dielectric layer having a first surface, a first patterned conductive layer adjacent to the first surface of the first dielectric layer, and a conductive post. ... Advanced Semiconductor Engineering Inc

Semiconductor package structure and semiconductor process

A semiconductor process includes: applying an encapsulation material on an upper surface of a first substrate to encapsulate a die and first conductive parts, wherein the encapsulation material is a b-stage adhesive; forming a plurality of openings on the encapsulation material to expose the first conductive parts; pressing a second substrate onto the encapsulation material to adhere a lower surface of the second substrate to the encapsulation material, wherein the second substrate includes second conductive parts, and each of the first conductive parts contacts a corresponding one of the second conductive parts; and heating to fuse the first conductive parts and the corresponding second conductive parts to form a plurality of interconnection elements and solidify the encapsulation material to form a c-stage adhesive.. . ... Advanced Semiconductor Engineering Inc

Substrate structure, semiconductor package structure and method for manufacturing the same

A substrate structure includes a carrier, a first metal layer, a circuit layer and a dielectric layer. The carrier has a first surface and a second surface. ... Advanced Semiconductor Engineering Inc

Substrate, semiconductor package structure and manufacturing process

A substrate includes a first dielectric structure, a first circuit layer, a second dielectric structure and a second circuit layer. The first circuit layer is embedded in the first dielectric structure, and does not protrude from a first surface of the first dielectric structure. ... Advanced Semiconductor Engineering Inc

Semiconductor device package and a method of manufacturing the same

A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. ... Advanced Semiconductor Engineering Inc

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a first circuit layer having a first surface and a second surface opposite the first side, a first electronic component, a shielding element, a shielding layer and a molding layer. The first electronic component is disposed over the first surface of the first circuit layer, and electrically connected to the first circuit layer. ... Advanced Semiconductor Engineering Inc

Semiconductor packages

A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining a through hole extending from the first surface to the second surface, the through hole being further defined by a first sidewall and a second sidewall of the passivation layer; a first conductive layer on the first surface of the passivation layer and the first sidewall; a second conductive layer on the second surface of the passivation layer and the second sidewall; and a third conductive layer between the first conductive layer and the second conductive layer.. . ... Advanced Semiconductor Engineering Inc

Semiconductor package device and method of manufacturing the same

A semiconductor package device includes a substrate, a first package body, a permeable element and a coil. The substrate includes a first surface. ... Advanced Semiconductor Engineering Inc

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. ... Advanced Semiconductor Engineering Inc

Semiconductor package

A semiconductor package includes a substrate, a semiconductor chip and a heat dissipation structure. The semiconductor chip includes a first surface, a second surface opposite to the first surface, and at least one chip pad disposed adjacent to the first surface. ... Advanced Semiconductor Engineering Inc

07/26/18 / #20180213312

Microelectromechanical systems package structure

A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. ... Advanced Semiconductor Engineering Inc

07/19/18 / #20180205601

Method and apparatus for transmission over virtual tunnel

An electronic device for updating firmware in a target device over the air includes a dispatching module and a firmware over the air (fota) core. The dispatching module is configured to establish a communication link between the electronic device and the target device. ... Advanced Semiconductor Engineering Inc

07/19/18 / #20180204824

Electronic module and semiconductor package device

An electronic module includes a first sub-module and a second sub-module. The first sub-module includes a first substrate, a first electronic component disposed on the first substrate and a first electrode. ... Advanced Semiconductor Engineering Inc

07/05/18 / #20180190629

Semiconductor package device and method of manufacturing the same

An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. ... Advanced Semiconductor Engineering Inc

07/05/18 / #20180190553

Semiconductor device package and a method of manufacturing the same

A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.. ... Advanced Semiconductor Engineering Inc

06/28/18 / #20180182913

Optical device, optical module structure and manufacturing process

An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.. . ... Advanced Semiconductor Engineering Inc

06/28/18 / #20180182704

Semiconductor package device and method of manufacturing the same

The disclosure relates to an electronic module and a manufacturing method of the same. The electronic module includes a substrate, an electronic component, a first package body, a magnetic layer, a coil and a second package body. ... Advanced Semiconductor Engineering Inc

06/21/18 / #20180174981

Semiconductor package and semiconductor process for manufacturing the same

A semiconductor package includes a substrate, a dielectric layer, at least one conductive pillar and an electrical device. The dielectric layer is disposed on the substrate and defines at least one through hole corresponding to the respective first pad of the substrate. ... Advanced Semiconductor Engineering Inc

06/21/18 / #20180174954

Wiring structure, semiconductor package structure and semiconductor process

A wiring structure includes a main body, a first dielectric layer, a first circuit layer and a second dielectric layer. The first dielectric layer is disposed on the main body, and defines a plurality of first grooves and at least one receiving portion between two first grooves. ... Advanced Semiconductor Engineering Inc

06/14/18 / #20180166370

Semiconductor device and method of manufacturing the same

A semiconductor substrate includes an interconnection structure and a dielectric layer. The dielectric layer surrounds the interconnection structure and defines a first cavity. ... Advanced Semiconductor Engineering Inc

06/07/18 / #20180158783

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes: (1) a carrier; (2) an electronic component disposed over a top surface of the carrier; (3) a package body disposed over the top surface of the carrier and covering the electronic component; and (4) a shield layer, including a first magnetically permeable layer disposed over the package body, a first electrically conductive layer disposed over the first magnetically permeable layer, and a second magnetically permeable layer disposed over the first electrically conductive layer. The first electrically conductive layer is interposed between the first magnetically permeable layer and the second magnetically permeable layer. ... Advanced Semiconductor Engineering Inc

06/07/18 / #20180158766

Semiconductor package device and method of manufacturing the same

A method of manufacturing a semiconductor package includes: (a) providing a carrier; (b) disposing a dielectric layer and a conductive pad on the carrier; (c) disposing a redistribution layer on the dielectric layer to electrically connect to the conductive pad; (d) connecting a die to the redistribution layer; (e) removing at least a portion of the carrier to expose the conductive pad; and (f) disposing an electrical contact to electrically connect to the conductive pad.. . ... Advanced Semiconductor Engineering Inc

05/31/18 / #20180151485

Semiconductor device package including filling mold via

A semiconductor device package includes a substrate, a package body, a via and an interconnect. The substrate includes a surface and a pad on the first surface. ... Advanced Semiconductor Engineering Inc

05/31/18 / #20180151478

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes an electronic device, a conductive frame and a first molding layer. The conductive frame is disposed over and electrically connected to the electronic device, and the conductive frame includes a plurality of leads. ... Advanced Semiconductor Engineering Inc

05/24/18 / #20180145060

Semiconductor package and semiconductor process

A semiconductor package includes a first semiconductor die, a first encapsulant, a first redistribution layer, a second encapsulant and a patterned conductive layer. The first encapsulant encloses the first semiconductor die and has a top surface and a lateral surface. ... Advanced Semiconductor Engineering Inc

05/24/18 / #20180145037

Semiconductor package structure and fabrication method thereof

A semiconductor package structure and a fabrication method thereof are provided. The fabrication method comprises: providing a substrate strip, the substrate strip comprising a plurality of substrate units which comprise a substrate unit; disposing a plurality of chips on the plurality of substrate units; disposing a packaging encapsulant on the substrate strip to encapsulate the chips; forming a warp-resistant layer on a top surface of the packaging encapsulant; and dividing the substrate strip to separate the plurality of substrate units to further fabricate a plurality of semiconductor package structures which comprise a semiconductor package structure comprising the substrate unit, wherein the warp-resistant layer is formed of a selected material with a selected thickness to make a variation of warpage of the semiconductor package structure at a temperature between 25° c. ... Advanced Semiconductor Engineering Inc

05/24/18 / #20180145017

Semiconductor substrate including embedded component and method of manufacturing the same

A semiconductor substrate includes a multi-layered structure, a component and a first conductive via. The multi-layered structure includes a plurality of dielectric layers and a plurality of patterned conductive layers. ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138262

Semiconductor device packages

A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138148

Compartment shielding for warpage improvement

A semiconductor device package comprises a substrate, a first component, a second component, a package body and a conductive material. The substrate has a surface. ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138115

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a dielectric structure defining a plurality of through holes, wherein each of the through holes includes a first portion defined by a first sidewall portion and a second portion defined by a second sidewall portion substantially coplanar with the first sidewall portion. The semiconductor package structure further includes a redistribution layer structure disposed on a first surface of the dielectric structure, including a plurality of conductive pads and a plurality of first conductive traces, wherein each of the conductive pads is disposed in a respective through hole, and a sidewall of the conductive pad contacts the first sidewall portion of the through hole, a semiconductor die electrically connected to the redistribution layer structure, and a plurality of conductive structures each disposed on a respective one of the conductive pads and disposed in the second portion of the through hole, wherein a sidewall of the conductive structure and the second sidewall portion of the through hole define a gap.. ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138114

Substrate, semiconductor package structure and manufacturing process

A substrate includes a first conductive structure, a second conductive structure attached to the first conductive structure and a third conductive structure attached to the second conductive structure. The first conductive structure includes a first dielectric layer and a first circuit layer embedded in the first dielectric layer. ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138113

Semiconductor system and device package including interconnect structure

A semiconductor device package includes a semiconductor chip, a glass substrate having a first surface facing the semiconductor chip and a second surface opposite to the first surface, the glass substrate defining a hole that traverses the glass substrate from the first surface to the second surface, an interconnect structure disposed in the hole, and a conductive bump disposed adjacent to the interconnect structure and protruded from the second surface, wherein the conductive bump and the interconnect structure include a same material.. . ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138105

Thermal dissipation device and semiconductor package device including the same

A thermal dissipation device includes a main body and a support member. The main body has an upper surface, a lower surface opposite to the upper surface, and a lateral surface. ... Advanced Semiconductor Engineering Inc

05/17/18 / #20180138099

Semiconductor device package structure

A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180131094

Semiconductor device package and method of manufacturing the same

Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180130937

Electronic module and method for manufacturing the same, and thermoelectric device including the same

An electronic module includes a first base layer and at least one via. The first base layer has a first surface and a second surface opposite the first surface, and defines at least one first hole. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180130759

Semiconductor package and semiconductor manufacturing process

A semiconductor package includes a semiconductor substrate structure, a semiconductor die and an encapsulant. The semiconductor substrate structure includes a dielectric structure, a first patterned conductive layer, a first insulation layer and a conductive post. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180130758

Semiconductor package device and method of manufacturing the same

The present disclosure provides a semiconductor package device comprising: (1) a substrate comprising a first area and a second area; (2) a semiconductor device on the first area of the substrate; (3) an antenna pattern on the second area of the substrate; (4) a first electronic component on the antenna pattern; and (5) a first package body encapsulating the first area of the substrate and the semiconductor device and exposing the antenna pattern, the first electronic component and the second area of the substrate. An upper surface of the first package body is non-coplanar with the antenna pattern on the second area of the substrate.. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180130719

Semiconductor device packages and method of manufacturing the same

A semiconductor device package includes a carrier, a lid, an electronic component and a sealant. The carrier has a first surface and a second surface opposite the first surface, and defines a hole extending from the first surface to the second surface. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180129062

Collimator, optical device and method of manufacturing the same

According to various embodiments, a collimator includes a substrate defining a plurality of channels through the substrate. The substrate includes a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

05/10/18 / #20180128612

Measurement equipment

The measurement equipment includes a rack, a first image capturing device, a second image capturing device, a third image capturing device and a fourth image capturing device. Wherein, the first image capturing device and the second image capturing device capture an entire image of a to-be-measured object, the third image capturing device and the fourth image capturing device capture a plurality of local images of a plurality of local areas of the to-be-measured object, and the entire image and the local images and are simultaneously captured.. ... Advanced Semiconductor Engineering Inc

05/03/18 / #20180122761

Semiconductor device package and method for forming the same

A semiconductor device package ready for assembly includes: a semiconductor substrate; a first under-bump-metallurgy (ubm) layer disposed on the semiconductor substrate; a first conductive pillar disposed on the first ubm layer; and a second conductive pillar disposed on the first conductive pillar. A material of the first conductive pillar is different from a material of the second conductive pillar, and the material of the second conductive pillar includes an antioxidant.. ... Advanced Semiconductor Engineering Inc

05/03/18 / #20180122750

Semiconductor package structure and method of manufacturing the same

Various embodiments relate to a semiconductor package structure. The semiconductor package structure includes a first chip having a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

05/03/18 / #20180122749

Semiconductor wafer, semiconductor package and method for manufacturing the same

A semiconductor wafer includes a substrate structure, a first insulation layer, a conductive layer and a second insulation layer. The substrate structure defines a via. ... Advanced Semiconductor Engineering Inc

04/19/18 / #20180108634

Semiconductor package, interposer and semiconductor process for manufacturing the same

A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first main body, at least one first columnar portion and at least one first conductive layer. ... Advanced Semiconductor Engineering Inc

04/19/18 / #20180108619

Substrate structure, packaging method and semiconductor package structure

A substrate structure includes a substrate body, at least one first mold area and at least one second mold area. The substrate body has a first surface and a second surface opposite to the first surface, and defines at least one first through hole extending through the substrate body. ... Advanced Semiconductor Engineering Inc

04/19/18 / #20180108602

Fan-out ball grid array package structure and process for manufacturing the same

A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

04/12/18 / #20180102325

Semiconductor package device and method of manufacturing the same

A semiconductor package device includes a substrate, a die, a package body, a shielding layer, a solder mask layer, an insulating film and an interconnection element. The die is disposed on a top surface of the substrate. ... Advanced Semiconductor Engineering Inc

03/29/18 / #20180090466

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a substrate, electronic components disposed over a surface of the substrate, an encapsulant encapsulating the electronic components, and a conductive compartment structure. The conductive compartment structure separates at least one first electronic component from at least one second electronic component. ... Advanced Semiconductor Engineering Inc

03/22/18 / #20180083341

Semiconductor package including antenna substrate and manufacturing method thereof

A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device.. . ... Advanced Semiconductor Engineering Inc

03/15/18 / #20180076177

Semiconductor package structure and method for manufacturing the same

A method for manufacturing a semiconductor package structure includes: (a) disposing at least one semiconductor element on a conductive structure, wherein the conductive structure includes at least one insulation layer and at least one circuit layer; (b) disposing an encapsulant on the conductive structure to cover the semiconductor element; (c) attaching a supporting structure on the conductive structure to surround the semiconductor element; and (d) disposing an upper element on the encapsulant, wherein a coefficient of thermal expansion of the upper element is in a range of variation less than or equal to about ±20% of a coefficient of thermal expansion of the circuit layer, and a bending modulus of the upper element is in a range of variation less than or equal to about ±35% of a bending modulus of the circuit layer.. . ... Advanced Semiconductor Engineering Inc

03/15/18 / #20180076122

Interposer, semiconductor package structure, and semiconductor process

A semiconductor process includes: (a) attaching a metal layer on a carrier; (b) removing a portion of the metal layer to form a through hole and at least one metal via, wherein the at least one metal via is disposed in the through hole, and the at least one metal via is separated from a side wall of the through hole by a space; and (c) forming a redistribution layer on the metal layer, wherein the redistribution layer is electrically connected to the at least one metal via.. . ... Advanced Semiconductor Engineering Inc

03/15/18 / #20180076118

Semiconductor device package

A semiconductor device package includes a copper lead frame, a copper oxide compound layer and an encapsulant. The copper oxide compound layer is in contact with a surface of the copper lead frame. ... Advanced Semiconductor Engineering Inc

03/15/18 / #20180072563

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes: (1) a carrier; (2) a sensor element disposed on or within the carrier; and (3) a cover including a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface, and the penetrating hole exposing the sensor element. The semiconductor device package is characterized such that (i) the inner sidewall is divided into an upper portion and a lower portion, the upper portion is substantially perpendicular to the top surface, and the lower portion is tilted; or (ii) the entire inner sidewall is tilted. ... Advanced Semiconductor Engineering Inc

03/08/18 / #20180068962

Semiconductor package device and method of manufacturing the same

In one or more embodiments, a micro-electromechanical systems (mems) package structure comprises a mems die, a conductive pillar adjacent to the mems die, a package body and a binding layer on the package body. The package body encapsulates the mems die and the conductive pillar, and exposes a top surface of the conductive pillar. ... Advanced Semiconductor Engineering Inc

03/08/18 / #20180066982

Optical device and method of manufacturing the same

The present disclosure relates to an optical device. The optical device comprises an electronic component, a plurality of light conducting pillars and an opaque layer. ... Advanced Semiconductor Engineering Inc

03/01/18 / #20180061815

Semiconductor package device and method of manufacturing the same

A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. ... Advanced Semiconductor Engineering Inc

03/01/18 / #20180061813

Semiconductor device package and a method of manufacturing the same

A semiconductor device package including a first encapsulation layer, a redistribution layer disposed on the first encapsulation layer, a first die disposed on the redistribution layer, a second encapsulation layer covering the first die and the redistribution layer, and an electrical connection terminal electrically connected to the redistribution layer. The first encapsulation layer has a first surface and a second surface different from the first surface. ... Advanced Semiconductor Engineering Inc

03/01/18 / #20180061805

Semiconductor package and method for manufacturing the same

A semiconductor package structure includes at least one semiconductor die, at least one conductive pillar, an encapsulant and a circuit structure. The semiconductor die has an active surface. ... Advanced Semiconductor Engineering Inc

03/01/18 / #20180061776

Semiconductor device package and a method of manufacturing the same

A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.. . ... Advanced Semiconductor Engineering Inc

03/01/18 / #20180061767

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. ... Advanced Semiconductor Engineering Inc

03/01/18 / #20180061727

Semiconductor device package and a method of manufacturing the same

A semiconductor device package comprises an adhesive layer, a die on the adhesive layer, a first encapsulation layer encapsulating the die and the adhesive layer, and a second encapsulation layer adjacent to the first encapsulation layer and the adhesive layer. The second encapsulation layer has a first surface and a second surface different from the first surface. ... Advanced Semiconductor Engineering Inc

02/22/18 / #20180053705

Semiconductor device package and a method of manufacturing the same

At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a first substrate, an electrical component disposed on the first substrate, a second substrate disposed over the electrical component, an adhesive layer, a spacer, and an encapsulation layer. ... Advanced Semiconductor Engineering Inc

02/22/18 / #20180052281

Substrate, semiconductor device and semiconductor package structure

A substrate for a semiconductor device includes a polymer material filling at least one through hole extending through the substrate. And at least one optical waveguide disposed within the through hole and extending through the polymer material. ... Advanced Semiconductor Engineering Inc

02/15/18 / #20180047651

Molding for large panel fan-out package

The present disclosure relates to wafer level packages including one or more semiconductor dies and a method of manufacturing the same. A method comprises: providing a carrier having a predetermined area, disposing a semiconductor device on the predetermined area, and forming a sacrificial wall on a periphery of the predetermined area.. ... Advanced Semiconductor Engineering Inc

02/15/18 / #20180047571

Semiconductor device packages and stacked package assemblies including high density interconnections

A semiconductor device package includes an electronic device and a redistribution stack. The redistribution stack includes a dielectric layer disposed over an active surface of the electronic device and defining an opening exposing at least a portion of a contact pad of the electronic device. ... Advanced Semiconductor Engineering Inc

02/01/18 / #20180033719

Semiconductor substrate, semiconductor module and method for manufacturing the same

A semiconductor substrate includes: (1) a first dielectric structure having a first surface and a second surface opposite the first surface; (2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure defining a through hole extending from the third surface to the fourth surface, wherein a cavity is defined by the through hole and the first dielectric structure; (3) a first patterned conductive layer, disposed on the first surface of the first dielectric structure; and (4) a second patterned conductive layer, disposed on and contacting the second surface of the first dielectric structure and including at least one conductive trace, wherein the first dielectric structure defines at least one opening, and a periphery of the opening corresponds to a periphery of the through hole of the second dielectric structure.. . ... Advanced Semiconductor Engineering Inc

01/18/18 / #20180019221

Semiconductor package device and method of manufacturing the same

A semiconductor package device includes a first die, an adhesive layer, and an encapsulant layer. The first die comprises a first electrode at a first surface of the first die and a second electrode at a second surface of the first die opposite to the first surface of the first die. ... Advanced Semiconductor Engineering Inc

01/18/18 / #20180019175

Semiconductor package device and method of manufacturing the same

A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.. ... Advanced Semiconductor Engineering Inc

01/18/18 / #20180017741

Semiconductor package device and method of manufacturing the same

An optical module includes a carrier, a light emitter disposed on the carrier, a light detector disposed on the carrier, and a housing disposed on the carrier. The housing defines a first opening that exposes the light emitter and a second opening that exposes the light detector. ... Advanced Semiconductor Engineering Inc

01/04/18 / #20180005846

Substrate, semiconductor package including the same, and method for manufacturing the same

A substrate includes a dielectric layer having a first surface and a second surface opposite to the first surface, a first circuit layer and at least one second conductive element. The first circuit layer is disposed adjacent to the first surface of the dielectric layer, and includes at least one trace and at least one first conductive element connected to the trace. ... Advanced Semiconductor Engineering Inc

01/04/18 / #20180003894

Semiconductor device packages

A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. ... Advanced Semiconductor Engineering Inc

12/21/17 / #20170365543

Semiconductor device package

A semiconductor device package includes a first conductive base, a first insulation layer and a second insulation layer. The first conductive base has a first surface, a second surface opposite to the first surface and a lateral surface extended between the first surface and the second surface. ... Advanced Semiconductor Engineering Inc

12/21/17 / #20170365542

Semiconductor device package

A semiconductor device package includes a first conductive base, a first semiconductor die, a dielectric layer, a first patterned conductive layer, and a second patterned conductive layer. The first conductive base defines a first cavity. ... Advanced Semiconductor Engineering Inc

12/21/17 / #20170365515

Semiconductor package structure and method of manufacturing the same

The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

12/21/17 / #20170363682

Testing system, method for testing an integrated circuit and a circuit board including the same

A testing system includes a subtractor and a divider. The subtractor is configured to receive a first voltage of a circuit being tested and a second voltage of the circuit, and to derive a difference between the first voltage and the second voltage. ... Advanced Semiconductor Engineering Inc

12/14/17 / #20170359925

Shield box, shield box assembly and apparatus for testing a semiconductor device

A shield box includes a top portion, a bottom portion and a socket. The top portion defines an aperture and includes at least one first ridge and at least one first groove. ... Advanced Semiconductor Engineering Inc

12/14/17 / #20170358527

Interposer, semiconductor package structure, and semiconductor process

An interposer includes an interconnection structure and a redistribution layer. The interconnection structure includes a metal layer, at least one metal via and an isolation material. ... Advanced Semiconductor Engineering Inc

12/14/17 / #20170358518

Semiconductor devices and methods of manufacturing the same

A semiconductor package includes a first semiconductor component, a second semiconductor component, and a connecting element. The first semiconductor component includes a first substrate, and a first bonding pad disposed adjacent to a first surface of the first substrate, and at least one conductive via structure extending from a second surface of the first substrate to the first bonding pad. ... Advanced Semiconductor Engineering Inc

11/23/17 / #20170336561

Semiconductor device packages

A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. ... Advanced Semiconductor Engineering Inc

11/16/17 / #20170330870

Semiconductor device package and a method of manufacturing the same

A semiconductor package comprises a substrate, a pad, a first isolation layer, an interconnection layer, and a conductive post. The substrate has a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

11/16/17 / #20170330851

Double plated conductive pillar package substrate

The present disclosure relates to a package substrate. The package substrate includes a patterned conductive layer and conductive pillars. ... Advanced Semiconductor Engineering Inc

11/16/17 / #20170330825

Low loss substrate for high data rate applications

In one or more embodiments, a substrate includes a patterned conductive layer and a reference layer. The patterned conductive layer includes a pair of first conductive traces, a pair of second conductive traces and a reference trace between the pair of first conductive traces and the pair of second conductive traces. ... Advanced Semiconductor Engineering Inc

10/12/17 / #20170294564

Semiconductor package device and method of manufacturing the same

A semiconductor package device includes an electronic device. The electronic device includes a first carrier, a first electronic component, a second carrier, a second electronic component, an encapsulant, and a lens. ... Advanced Semiconductor Engineering Inc

10/12/17 / #20170294560

Semiconductor device package and a method of manufacturing the same

At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. ... Advanced Semiconductor Engineering Inc

10/12/17 / #20170294389

Semiconductor package structure, package on package structure and packaging method

A semiconductor package structure includes a substrate, a first semiconductor device, a first encapsulant and a second encapsulant. The substrate has a first coefficient of thermal expansion cte1. ... Advanced Semiconductor Engineering Inc

10/12/17 / #20170294361

Lid array panel, package with lid and method of making the same

A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. ... Advanced Semiconductor Engineering Inc

10/05/17 / #20170287871

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a conductive structure, a semiconductor element disposed on and electrically connected to the conductive structure, a supporting structure, an encapsulant, and a metal layer. The supporting structure is disposed on the conductive structure and surrounds the semiconductor element. ... Advanced Semiconductor Engineering Inc

10/05/17 / #20170287863

Semiconductor die, semiconductor wafer and method for manufacturing the same

A semiconductor die includes a semiconductor body, an insulating layer, a conductive circuit layer and at least one conductive bump. The semiconductor body has a first surface, a second surface and a side surface extending between the first surface and the second surface. ... Advanced Semiconductor Engineering Inc

10/05/17 / #20170287738

Fan-out wafer level packaging structure

A semiconductor device includes a first die including a first pad and a first passivation layer, a second die including a second pad and a second passivation layer, and an encapsulant surrounding the first die and the second die. Surfaces of the first die are not coplanar with corresponding surfaces of the second die. ... Advanced Semiconductor Engineering Inc

09/28/17 / #20170278823

Package process and package structure

A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.. . ... Advanced Semiconductor Engineering Inc

09/28/17 / #20170278814

Semiconductor devices and semiconductor packages

A semiconductor device includes a semiconductor element, a trace disposed adjacent to a surface of the semiconductor element, a bonding pad disposed adjacent to the surface of the semiconductor element and connected to the trace, and a pillar disposed on the bonding pad. The pillar includes a first end wall, a second end wall opposite the first end wall, a first side wall, and a second side wall opposite the first side wall. ... Advanced Semiconductor Engineering Inc

09/14/17 / #20170263589

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a package substrate, a first electronic device, a second electronic device and a first molding layer. The package substrate includes a first surface, a second surface opposite to the first surface, and an edge. ... Advanced Semiconductor Engineering Inc

09/07/17 / #20170256508

Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same

A semiconductor device includes a substrate main body, a plurality of first bump pads, and redistribution layer (rdl). The first bump pads are disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile. ... Advanced Semiconductor Engineering Inc

09/07/17 / #20170254956

Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same

The present disclosure relates to an optical fiber structure, an optical communication apparatus and a manufacturing process for manufacturing the same. The optical fiber structure includes a core portion and a cladding portion. ... Advanced Semiconductor Engineering Inc

08/24/17 / #20170243813

Semiconductor device and method for manufacturing the same

The present disclosure relates to a semiconductor device and a method for manufacturing the same. The semiconductor device includes a substrate, a first package body and at least one connecting element. ... Advanced Semiconductor Engineering Inc

08/10/17 / #20170231093

Reduced-dimension via-land structure and method of making the same

A package substrate includes a dielectric layer, a conductive via disposed in the dielectric layer, and a conductive pattern layer exposed from a first surface of the dielectric layer. The conductive pattern layer includes traces and a via land, the via land extends into the conductive via, and a circumferential portion of the via land is encompassed by the conductive via. ... Advanced Semiconductor Engineering Inc

08/10/17 / #20170229402

Double side via last method for double embedded patterned substrate

An interposer substrate includes a first circuit pattern embedded at a first surface of a dielectric layer and a second circuit pattern embedded at a second surface of the dielectric layer; a middle patterned conductive layer in the dielectric layer between the first circuit pattern and the second circuit pattern; first conductive vias, where each first conductive via includes a first end adjacent to the first circuit pattern and a second end adjacent to the middle patterned conductive layer, wherein a width of the first end is greater than a width of the second end; second conductive vias, where each second conductive via including a third end adjacent to the second circuit pattern and a fourth end adjacent to the middle patterned conductive layer, wherein a width of the third end is greater than a width of the fourth end.. . ... Advanced Semiconductor Engineering Inc

08/10/17 / #20170229393

Semiconductor devices

A semiconductor device includes a substrate and at least one inductor on the substrate. The inductor includes top portions separated from one another, bottom portions separated from one another, and side portions separated from one other. ... Advanced Semiconductor Engineering Inc

08/03/17 / #20170222093

Led packages and related methods

An led package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion.. ... Advanced Semiconductor Engineering Inc

08/03/17 / #20170221805

Semiconductor package device

An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. ... Advanced Semiconductor Engineering Inc

07/20/17 / #20170207352

Electronic device, package structure and method of manufacturing the same

An electronic device includes a light source, a light receiver, a first light guide structure, and a second light guide structure. The first light guide structure faces a light emitting surface of the light source and faces a lateral wall of the light receiver. ... Advanced Semiconductor Engineering Inc

07/20/17 / #20170207153

Semiconductor package device and method of manufacturing the same

In one or more embodiments, a semiconductor package includes a redistribution layer, a conductive pad, a dielectric layer, a silicon layer, and a conductive contact. The redistribution layer includes a first surface and a second surface opposite to the first surface. ... Advanced Semiconductor Engineering Inc

07/20/17 / #20170207151

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a conductive structure, at least two semiconductor elements and an encapsulant. The conductive structure has a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

07/13/17 / #20170200702

Power and ground design for through-silicon via structure

In one or more embodiments, a semiconductor device includes a substrate, a first dielectric layer and a first conductive layer. The substrate includes a first surface and a second surface opposite the first surface. ... Advanced Semiconductor Engineering Inc

07/13/17 / #20170200682

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a carrier, an electronic component disposed over a top surface of the carrier, and a package body disposed over the top surface of the carrier and covering the electronic component. The semiconductor device package further includes a shield layer, which in turn includes a first electrically conductive layer, a first magnetically permeable layer, and a second electrically conductive layer, where the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer.. ... Advanced Semiconductor Engineering Inc

05/18/17 / #20170141257

Semiconductor package structures and method of manufacturing the same

An optical device includes a substrate, a light emitter, a light detector, a conductive structure, and an opaque material. The light emitter, the light detector and the conductive structure are disposed on a surface of the substrate and are electrically connected to traces on the surface of the substrate. ... Advanced Semiconductor Engineering Inc

05/18/17 / #20170141007

Filler compositions and underfill compositions and molding compounds including the same for preparing semiconductor packages

The present disclosure relates to a filler composition for a semiconductor package. The filler composition comprises carbon and silica.. ... Advanced Semiconductor Engineering Inc

05/18/17 / #20170138566

Optical device package and method of manufacturing the same

In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. ... Advanced Semiconductor Engineering Inc

05/11/17 / #20170133360

Semiconductor device and process of making the same

A semiconductor device includes a substrate, a seed layer, a first patterned metal layer, a dielectric layer and a second metal layer. The seed layer is disposed on a surface of the substrate. ... Advanced Semiconductor Engineering Inc

05/11/17 / #20170133311

Semiconductor package and manufacturing method thereof

The present disclosure relates to a semiconductor package and a manufacturing method thereof the semiconductor package includes a semiconductor element including a main body, a plurality of conductive vias, and at least one filler. The conductive vias penetrate through the main body. ... Advanced Semiconductor Engineering Inc

05/04/17 / #20170125310

Semiconductor process

The present disclosure relates to a semiconductor process, which includes: (a) providing a semiconductor element; (b) attaching the semiconductor element to a carrier by an adhesive layer, so that the adhesive layer is sandwiched between the semiconductor element and the carrier; and (c) cutting the semiconductor element to form a plurality of semiconductor units. Thereby, the gaps between the semiconductor units are fixed after the cutting process, so as to facilitate testing the semiconductor units.. ... Advanced Semiconductor Engineering Inc

04/27/17 / #20170117240

Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same

The present disclosure relates to redistribution layer structures useful in semiconductor substrate packages, semiconductor package structures, and chip structures. In an embodiment, a redistribution layer structure includes a dielectric layer, an anti-plating layer, and a conductive material. ... Advanced Semiconductor Engineering Inc

04/27/17 / #20170113922

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a carrier, a sensor element disposed on or within the carrier, a cover and a filter. The cover includes a base substrate and a periphery barrier. ... Advanced Semiconductor Engineering Inc

04/20/17 / #20170110426

Lid structure and semiconductor device package including the same

The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. ... Advanced Semiconductor Engineering Inc

04/20/17 / #20170110392

Semiconductor package structure and method for manufacturing the same structure

A semiconductor package structure includes a first semiconductor substrate, a second semiconductor substrate, a semiconductor die electrically connected to the first semiconductor substrate, an interconnection element and an encapsulant. The first semiconductor substrate includes a first top pad, and the second semiconductor substrate includes a second bottom pad. ... Advanced Semiconductor Engineering Inc

04/20/17 / #20170108357

Optical module and manufacturing process thereof

The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. ... Advanced Semiconductor Engineering Inc

04/13/17 / #20170103946

Semiconductor device and method for manufacturing the same

A semiconductor device includes a substrate, at least one integrated passive device, a first redistribution layer, a second redistribution layer, and conductive vias. The at least one integrated passive device includes at least one capacitor disposed adjacent to a first surface of the substrate. ... Advanced Semiconductor Engineering Inc

03/23/17 / #20170082485

Optical device, electrical device and passive optical component

An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.. ... Advanced Semiconductor Engineering Inc

03/16/17 / #20170077039

Semiconductor package device and method of manufacturing the same

The present disclosure provides a semiconductor package device and a method for manufacturing the same. In embodiments of the present disclosure, a semiconductor package device includes a carrier, a first antenna, a second antenna, a package body and a first shield. ... Advanced Semiconductor Engineering Inc

03/16/17 / #20170077023

Semiconductor substrate, semiconductor module and method for manufacturing the same

A semiconductor substrate includes: 1) a first dielectric structure having a first surface and a second surface opposite the first surface; 2) a second dielectric structure having a third surface and a fourth surface opposite the third surface, wherein the fourth surface faces the first surface, the second dielectric structure defining a through hole extending from the third surface to the fourth surface, wherein a cavity is defined by the through hole and the first dielectric structure; 3) a first patterned conductive layer, disposed on the first surface of the first dielectric structure; and 4) a second patterned conductive layer, disposed on the second surface of the first dielectric structure and including at least one conductive trace. The first dielectric structure defines at least one opening to expose a portion of the second patterned conductive layer.. ... Advanced Semiconductor Engineering Inc

03/16/17 / #20170073221

Semiconductor device package and method of manufacturing the same

A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. ... Advanced Semiconductor Engineering Inc

02/16/17 / #20170047276

Semiconductor device package and method of manufacturing the same

The present disclosure relates to a semiconductor device package and a method for manufacturing the same. The semiconductor device package comprises a substrate, a first patterned conductive layer, an insulator layer, a second patterned conductive layer, and a dielectric layer. ... Advanced Semiconductor Engineering Inc

02/09/17 / #20170040279

Semiconductor device and semiconductor package

The present disclosure relates to bonding structures useful in semiconductor packages. In an embodiment, a semiconductor device includes a semiconductor element, two pillar structures, and an insulation layer. ... Advanced Semiconductor Engineering Inc

01/26/17 / #20170025363

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. ... Advanced Semiconductor Engineering Inc

01/26/17 / #20170025322

Fan-out wafer level packaging structure

A semiconductor device includes a first die including a first pad and a first passivation layer, a second die including a second pad and a second passivation layer, and an encapsulant surrounding the first die and the second die. Surfaces of the first die are not coplanar with corresponding surfaces of the second die. ... Advanced Semiconductor Engineering Inc

01/19/17 / #20170019993

Semiconductor substrate, semiconductor module and method for manufacturing the same

The present disclosure relates to a semiconductor substrate, a semiconductor module and a method for manufacturing the same. The semiconductor substrate includes a first dielectric structure, a second dielectric structure, a first patterned conductive layer and a second patterned conductive layer. ... Advanced Semiconductor Engineering Inc

01/19/17 / #20170018550

Semiconductor device and method of manufacturing the same

A semiconductor device and a method for manufacturing the same is described. The semiconductor device includes a substrate, a first capacitor and a second capacitor. ... Advanced Semiconductor Engineering Inc

01/12/17 / #20170012007

Semiconductor packages with thermal-enhanced conformal shielding and related methods

The semiconductor package includes a substrate, a die, a first metal layer, a second metal layer and an optional seed layer. The package body at least partially encapsulates the die on the substrate. ... Advanced Semiconductor Engineering Inc

01/05/17 / #20170005042

Semiconductor device packages

The present disclosure relates to a semiconductor device package and a method for manufacturing the semiconductor device package. The semiconductor device package includes a substrate, a grounding element, a component, a package body and a conductive layer. ... Advanced Semiconductor Engineering Inc








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